CN115446480A - In-situ hole repairing ultrafast laser micropore machining method - Google Patents
In-situ hole repairing ultrafast laser micropore machining method Download PDFInfo
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- CN115446480A CN115446480A CN202211324552.9A CN202211324552A CN115446480A CN 115446480 A CN115446480 A CN 115446480A CN 202211324552 A CN202211324552 A CN 202211324552A CN 115446480 A CN115446480 A CN 115446480A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
Abstract
The invention provides an in-situ hole repairing ultrafast laser micropore processing method, relates to the field of laser micropore processing, aims at the problems that the optimization of the geometrical shape of a micropore is difficult and a recasting layer adhered on a hole wall exists in a laser punching process, performs hole expanding modification after hole machining, optimizes the geometrical shape of the through hole by a two-step in-situ hole repairing method, can process a micropore with high roundness and small taper and a large-area micropore array, and improves the processing efficiency while ensuring the dimensional accuracy of the micropore.
Description
Technical Field
The invention relates to the field of laser micropore processing, in particular to an in-situ hole repairing ultrafast laser micropore processing method.
Background
The laser micropore machining has the advantages of high speed, high efficiency, low cost, high precision, environmental protection and the like, and is suitable for complex machining of turbine blade materials such as high-temperature alloy, ceramic composite materials and the like. In the laser processing process, a recast layer and an oxide layer are easy to appear on the hole wall, and microcracks are caused and directly spread to a material matrix, so that the performance and the service life of the turbine blade are influenced. The pulse time of the ultrafast laser is extremely short, reaches the magnitude of picoseconds and femtoseconds, and under the same single pulse energy, the greatly improved peak power can be obtained, so that the interaction mechanism of the ultrafast laser and a material is fundamentally changed, the material removing process is not a hot melting process any more, and theoretically, high-precision, high-quality micropore machining without a heat influence area, a recast layer and microcracks can be realized, but tests show that the ultrafast laser cannot completely realize real cold machining. Simply reducing the pulse width to picosecond or femtosecond level still has difficulty in effectively preventing the generation of heat affected zone, recast layer, pore and micro-pit, and may have problems of micro-pore shape deformation and large taper caused by polarization, and the processing efficiency is low.
At present, the processing size of micropores is continuously reduced from micron level to submicron level, even nanometer level. The laser drilling process has the problems of difficulty in optimizing the geometrical shape of the micropore and a viscous recast layer on the pore wall, and in the practical application of the micropore, the machining precision and the machining efficiency are difficult to simultaneously consider under different scales.
Disclosure of Invention
The invention aims to provide an in-situ hole repairing ultrafast laser micropore processing method aiming at the defects in the prior art, wherein the through hole is firstly processed and then is subjected to reaming modification, the geometric shape of the through hole is optimized by a two-step in-situ hole repairing method, micropores with high roundness and small taper and a large-area micropore array can be processed, and the processing efficiency is improved while the dimensional accuracy of the micropores is ensured.
In order to achieve the purpose, the following scheme is adopted:
an in-situ hole repairing ultrafast laser micropore machining method comprises the following steps:
processing a through hole: focusing laser on the upper surface of the target material, and processing a through hole by circular cutting scanning and axial feeding;
adjusting laser to focus on the middle part of the target material in the through hole;
reaming and modifying: the lower part and the outlet area of the through hole are machined through circular cutting scanning and axial feeding to modify the appearance and the size of the through hole, so that the roundness of the outlet of the through hole, the appearance of the wall of the through hole and the taper of the through hole meet the set requirements.
Further, in the through hole processing stage and the reaming modification stage, the through hole is processed in a nested circular cutting scanning mode.
Further, the diameter of the inner ring of the laser processing area in the reaming modification stage is larger than that of the inner ring of the laser processing area in the through hole processing stage, and the number of circular cutting scanning turns in the reaming modification stage is reduced.
Furthermore, the outer ring diameters of the laser processing areas corresponding to the reaming modification stage and the through hole processing stage are equal and equal to the set diameter of the through hole.
Further, in the through hole processing stage and the reaming modification stage, the shape and the size of the inlet and the outlet of the through hole are detected, and after the shape and the size meet the set requirements, the subsequent steps are carried out.
Further, the axial feeding is performed step by step, and after the axial one-step circular cutting scanning is completed, the next circular cutting scanning is performed.
Further, in the reaming modification stage, the number of times of single-layer circular cutting scanning and the overlapping rate of light spots are increased so as to modify the roundness of the outlet of the through hole, the appearance of the wall of the through hole and reduce the taper of the through hole.
Further, preparation before machining is performed before the through-hole machining stage:
fixing the target material on a working platform, and adjusting the position to enable the upper surface of the target material to be positioned at the laser focusing position;
and adjusting the technological parameters of laser circular cutting scanning, and preparing to process through holes by using a scanning galvanometer.
Furthermore, the laser circular cutting scanning process parameters comprise the diameter of a scanning inner ring, the diameter of a scanning outer ring, the scanning interval, the laser power, the scanning speed, the scanning times and the axial feeding interval.
And further, after the reaming modification of one through hole is finished, moving the target to the next through hole processing position, adjusting the laser to the initial processing position, and repeating the through hole processing and the reaming modification.
Compared with the prior art, the invention has the advantages and positive effects that:
(1) Aiming at the problems of difficulty in optimizing the geometrical shape of the micropores and a viscous recast layer on the wall of the hole in the laser drilling process, the hole is firstly processed and then is subjected to reaming modification, the geometrical shape of the through hole is optimized by a two-step in-situ hole repairing method, the micropores with high roundness and small taper and a large-area micropore array can be processed, and the processing efficiency is improved while the dimensional accuracy of the micropores is ensured.
(2) The through hole processing stage needs to be guaranteed, the through hole is processed, the roundness of an inlet reaches a preset size, the fastest processing efficiency is obtained, and the processing effect of the hole repairing stage is prevented from being influenced by the fact that laser incidence is obstructed due to the fact that the orifice is too small.
(3) The lower half part of the hole is mainly modified in a hole expanding modification stage, the hole is formed preliminarily in a through hole machining stage, the scanning diameter of the ring-cutting nested circular inner ring is reasonably selected according to the size of an outlet, the maximum laser utilization rate is obtained, and the machining efficiency is accelerated.
(4) The problems of deformation of the shape of a micropore and large taper of the ultrafast laser caused by low roundness of a light spot and galvanometer scanning are solved, repeated air scanning and excessive ablation of a processed area by a laser beam are avoided by reducing the number of circular cutting turns in a reaming modification stage, the laser utilization rate and the ultrafast laser micropore processing efficiency are effectively improved, and technical reference is provided for the ultrafast laser in the aspect of micro-nano processing.
(5) The machining platform and the laser source do not need to be replaced in the through hole machining stage and the reaming modification stage, the machining platform and the laser source can be achieved by optimizing process flows and parameters, secondary positioning and machining errors are avoided, and the machining platform is simple, easy and feasible and improves machining efficiency.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification, illustrate exemplary embodiments of the invention and together with the description serve to explain the invention and not to limit the invention.
Fig. 1 is a schematic flow chart of an in-situ hole repairing ultrafast laser micro-hole processing method in embodiments 1-4 of the present invention.
Fig. 2 is a schematic view of an apparatus for performing laser micro-via processing in embodiments 1 to 4 of the present invention.
Fig. 3 is a schematic view of the processing principle at the through hole processing stage in embodiments 1 to 4 of the present invention.
Fig. 4 is a schematic view of the processing principle of the reaming modification stage in embodiments 1-4 of the present invention.
Fig. 5 is a schematic diagram of a laser single-layer scanning path at the via processing stage in embodiments 1 to 4 of the present invention.
Fig. 6 is a schematic diagram of a laser monolayer scan path at a reaming modification stage in embodiments 1-4 of the present invention.
Fig. 7 is a schematic axial feed diagram of laser circular cutting in examples 1-4 of the present invention.
The system comprises a 1-ultrafast laser, a 2-optical shutter, a 3-first reflector, a 4-beam expander, a 5-second reflector, a 6-scanning galvanometer, a 7-focusing mirror, an 8-target, a 9-processing platform, a 10-CCD camera and an 11-processing control system.
Detailed Description
Example 1
In an exemplary embodiment of the present invention, a method for in-situ via repair ultrafast laser micro via machining is provided, as illustrated in fig. 1-7.
Laser micro-hole machining is widely studied as a new machining method and is one of the important application fields of laser machining technology. The pulse time of the ultrafast laser is extremely short, reaches the magnitude of picoseconds and femtoseconds, and under the same single pulse energy, the peak power which is greatly improved can be obtained, so that the interaction mechanism of the ultrafast laser and a material is fundamentally changed, the material removing process is not a hot melting process any more, and theoretically, the high-quality micropore processing which has high precision, no heat influence area, no recasting layer and no microcrack can be realized, but tests show that the ultrafast laser can not completely realize the real cold processing. Simply reducing the pulse width to picosecond or femtosecond level still has difficulty in effectively preventing the generation of heat affected zone, recast layer, pore and micro-pit, and may have problems of micro-pore shape deformation and large taper caused by polarization, and the processing efficiency is low.
Meanwhile, with the continuous improvement of the level of manufacturing industry, the structural design requirement is continuously improved, and the processing size of the micropore is continuously reduced from micron level to submicron level or even nano level. Laser drilling techniques have several problems that remain unsolved, two of the most significant of which are optimization of the pore geometry and viscous recast on the walls of the pores. In addition, in the practical application of the micropore, the processing precision and the processing efficiency are difficult to be simultaneously considered under different scales, so that the development process of the ultrafast laser in the micropore processing direction is restricted.
Based on this, the embodiment provides an in-situ hole repairing ultrafast laser micro-hole processing method, which can process micro-holes with high roundness and small taper and large-area micro-hole arrays by a two-step in-situ hole repairing strategy, thereby improving the processing efficiency while ensuring the dimensional accuracy of the micro-holes.
Firstly, processing a through hole, focusing laser on the surface of the upper part of the target material, and processing the through hole by circular cutting scanning and axial feeding;
then adjusting laser, and adjusting the laser to focus on the middle part of the target material in the through hole;
and finally, carrying out reaming modification, and processing the lower part and the outlet area of the through hole through circular cutting scanning and axial feeding to modify the appearance and the size of the through hole, so that the roundness of the outlet of the through hole, the appearance of the wall of the through hole and the taper of the through hole meet the set requirements.
The in-situ hole-repairing ultrafast laser micro-hole processing method in the present embodiment will be described in detail below with reference to the accompanying drawings.
Referring to fig. 2, it is a schematic diagram of an apparatus capable of performing the in-situ hole repairing ultrafast laser micro-hole machining method in the present embodiment, which employs a conventional laser micro-hole machining apparatus.
Including ultrafast laser 1, optical gate 2, first speculum 3, beam expanding lens 4, second speculum 5, the scanning mirror 6 that shakes and focusing mirror 7 that set gradually along the light path, the scanning shakes and can export annular scanning laser to pass 7 postloadings on the focusing mirror of focusing mirror and act on the target 8 on the processing platform 9. The CCD camera 10 is arranged at the laser processing position to acquire the processing position image, the CCD camera 10 and the processing platform 9 are respectively connected to the processing control system 11, and the processing control system 11 controls the action of the processing platform 9.
Referring to fig. 1, in order to improve the shape and size precision of the micro-hole machining and the machining efficiency of the ultrafast laser, a two-step in-situ hole repairing laser circular cutting micro-hole machining strategy is adopted in this embodiment, which mainly includes a through hole machining stage and a hole expanding modification stage, and the specific steps are as follows:
s1: fixing a workpiece to be processed on the working platform, and moving the working platform after positioning to enable the workpiece to be positioned in a focal plane of the laser beam;
s2: setting the optimal laser circular cutting process parameters according to the material properties and the sample thickness, and performing laser processing by using a scanning galvanometer;
s3: and a through hole processing stage: adopting a nested circular cutting scanning mode, as shown in fig. 5, focusing laser on the surface of the target material in an axial feeding mode to process a primary through hole, as shown in fig. 3;
s4: detecting the appearance of the inlet and the outlet of the micropore by using a real-time monitoring device, and carrying out the next step when the requirement is met;
s5: the laser beam descends to the middle of the target along the Z-axis direction;
s6: and (3) reaming modification stage: the shapes and the sizes of the lower part of the micropore and the outlet are mainly modified by increasing the number of single-layer scanning times and the overlapping rate of light spots, as shown in figures 4 and 6, the purposes of modifying the roundness and the hole wall shape of the outlet and reducing the taper of the micropore are achieved, and the next step is carried out when the outlet shape is detected to meet the requirements;
s7: and moving the target to the next machining position, adjusting the laser beam to the initial machining setting, and repeatedly machining the micropores.
In this embodiment, the upper portion, the middle portion and the exit stage are relative to the feeding direction in ultrafast laser micro-hole machining as shown in fig. 2, the upper portion is the surface position of the target material on the side close to the scanning galvanometer, and the position forms the entrance of the through hole after machining; the lower part is the surface position of the target material far away from one side of the scanning galvanometer, and the position forms an outlet of the through hole after processing; the area between the inlet and the outlet of the through hole is the middle part of the target material.
In the processing process, after the target material penetrates through the through hole processing stage, the reaming modification stage is carried out, and the reaming modification stage can be divided into a single step or multiple steps and is determined according to the thickness of the target material. For thicker target materials, the roundness of the outlet of the through hole, the morphology of the wall of the through hole and the taper of the through hole can meet the requirements only by repeated reaming modification, and for thinner target materials which can meet the requirements of the through hole by single reaming modification, the reaming modification stage can be completed in one step, so that the processing efficiency is improved.
When the optimal laser circular cutting technological parameters are set according to the material attributes and the sample thickness, the laser processing parameters are set according to the following principles: the through hole is required to be processed in the through hole processing stage, the roundness of an inlet reaches a preset size, the fastest processing efficiency is obtained, and the processing effect of the hole repairing stage is prevented from being influenced by the fact that the laser is prevented from being incident due to too small orifices.
In addition, excessive repeated machining and feeding cannot effectively modify the appearance of the outlet, and over-ablation is formed on the surface of the inlet and the wall of the hole to generate a recast layer, so that the size of the outlet is enlarged. Therefore, in this embodiment, the through hole is reamed and modified from the middle of the through hole and the outlet position, as shown in fig. 4.
Since the shape of the micro-hole is deformed due to the scanning galvanometer processing, particularly the outlet is easy to be in an oval shape, the lower half part of the hole is mainly modified in the reaming modification stage, as shown in fig. 4 and 6. Through the through-hole processing stage, the through-hole has tentatively formed, rationally selects the scanning diameter of circle cutting nested circle inner circle according to the size of export, saves the scanning route of the part that has become the hole, obtains the biggest laser utilization ratio and accelerates machining efficiency.
In the process of keeping axial feeding scanning, increasing the number of single-layer scanning is an effective means for modifying the hole pattern, and changing the number of single-layer scanning means adjusting the number of circular cutting scanning in a process step after one process step of axial feeding as shown in fig. 7; after one axial feed step, at least one circular cut scan is performed. In the reaming modification stage, the number of circular cutting scans after one step of axial feed can be increased appropriately. In addition, the laser scanning speed can be adjusted to adjust the overlapping rate of light spots, and the laser power can be adjusted to perfect the hole repairing effect aiming at different materials.
And adjusting the laser beam to an initial trial processing position, adjusting the focusing position of the laser beam to return to the surface of the target, adjusting the laser scanning speed, the single-layer scanning time and other process parameters, and selecting automatic focusing or manual focusing according to the flatness of the surface of the target to meet the requirement of a new micropore processing flow.
The scanning galvanometer is used for micropore processing, two image layers can be established in the image making process, the in-situ secondary processing of the first step of through hole processing and the second step of modification reaming is realized, the secondary operation time can be reduced, and the processing efficiency is accelerated. The purpose of in-situ hole repairing can be achieved by using the two-step circular cutting laser processing method, a processing platform and a laser source do not need to be replaced, the hole repairing can be achieved by optimizing process flows and parameters, secondary positioning and processing errors are avoided, and the hole repairing method is simple and feasible.
The problems of deformation of the shape of the micropore and large taper of the ultrafast laser caused by low roundness of the light spot and scanning of the galvanometer are solved, repeated empty scanning and excessive ablation of the laser beam on a processed area are avoided by reducing the number of circular cutting circles in the second step, the laser utilization rate and the ultrafast laser micropore processing efficiency are effectively improved, and technical reference is provided for the application of the ultrafast laser in the aspect of micro-nano processing.
When the processing parameters are set, the feeding times, the single-layer scanning time and the number of the ring-cutting scanning nested circles are the keys for ensuring the processing precision and the processing efficiency of the micropore size, and the optimal values need to be repeatedly verified and ensured.
Example 2
In another exemplary embodiment of the present invention, a method for in-situ via repair ultrafast laser micro via machining is provided, as shown in FIGS. 1-7.
A solid femtosecond laser with the wavelength of 1035nm and the power of 40W is used as a laser processing source 1 to process nickel-based high-temperature alloy micropores with the thickness of 1.30mm and the aperture of 0.60 mm. The nickel-based superalloy target material 8 is ultrasonically cleaned and dried, then is fixed on a working platform 9, and is provided with machining technological parameters, and through hole machining and in-situ hole repairing are sequentially carried out. A first through hole processing stage: the focus is fixed on the material surface, as shown in fig. 3; the diameter of the inner circle and the diameter of the outer circle of the nested circle scanning are respectively 0.10mm and 0.60mm (as shown in figure 5); the axial feeding is carried out for 4 times, and the axial feeding distance is set to be 0.15mm (shown in figure 7); the scanning interval is 0.02mm, the laser power is 24W, the laser scanning speed is 300mm/S, the single-layer scanning frequency is 80 times, and after the first-step processing is finished, a primary test hole with the taper of about 3 degrees and the roundness of an inlet of more than 99.8 percent can be obtained, and the roundness of an outlet is about 85 percent at the moment. A second step of in-situ reaming: the lower half part of the micropore is processed, the roundness of the outlet is improved, the taper of the micropore is reduced, the processing focus is firstly reduced to the middle part of the target, as shown in figure 4, a through hole is formed at the moment, in order to improve the processing efficiency, the diameter of an inner ring of a nested circle scanning is 0.40mm (as shown in figure 6), the number of single-layer scanning is increased to 120 times, other parameters are unchanged, the roundness of the outlet after processing can reach more than 99.5%, and the taper is 0.8-1.1 degrees. Compared with the processing result of the one-step method without hole trimming process, the micro-hole processed by the method has the advantages that the roundness of the outlet can be improved by 10 percent, the taper can be reduced by 4 percent, and the efficiency can be improved by 30 percent.
Example 3
In another exemplary embodiment of the present invention, as shown in fig. 1-7, a method for in-situ via repair ultrafast laser micro-via machining is provided.
A solid femtosecond laser with the wavelength of 1035nm and the power of 40W is used as a laser processing source 1 to process nickel-based high-temperature alloy micropores with the thickness of 2.20mm and the aperture of 0.60 mm. The nickel-based superalloy target material 8 is ultrasonically cleaned and dried, then is fixed on a working platform 9, and is provided with machining technological parameters, and through hole machining and in-situ hole repairing are sequentially carried out. A first through hole processing stage: the focus is fixed on the surface of the material, as shown in FIG. 3; the diameter of the inner circle of the nested circle scanning is 0.06mm, and the diameter of the outer circle is 0.50mm (as shown in figure 5); axial feeding is carried out for 3 times, and the axial feeding distance is set to be 0.1mm (shown in figure 7); the scanning interval is 0.02mm, the laser power is 20W, the laser scanning speed is 350mm/s, the single-layer scanning frequency is 80 times, and after the first step of processing is finished, a primary test hole with the taper of about 6 degrees and the roundness of an inlet of more than 99.5 percent can be obtained, and the roundness of an outlet is about 80 percent at the moment. And a second in-situ reaming stage: the processing focus is lowered to the middle of the target, as shown in figure 4, the diameter of the nested circle scanning inner ring is 0.35mm (as shown in figure 6), the number of single-layer scanning times is increased to 100, the scanning speed is 250mm/s, the roundness of an outlet after the processing is finished can reach more than 99.0%, the taper is 1.0-1.5 degrees, and the defects of a heat-affected zone, a recast layer, a microcrack and the like are avoided.
Example 4
In another exemplary embodiment of the present invention, a method for in-situ via repair ultrafast laser micro via machining is provided, as shown in FIGS. 1-7.
A picosecond laser with the wavelength of 1064nm and the power of 30W is used as a laser processing source 1 to process the CMC-SiC ceramic matrix composite micropore with the thickness of 2.3mm and the pore diameter of 0.60 mm. And (3) ultrasonically cleaning and drying the target material 8, fixing the target material on the working platform 9, setting processing technological parameters, and sequentially performing through hole processing and in-situ hole repairing. A first through hole processing stage: the focus is fixed on the surface of the material, as shown in FIG. 3; the diameter of the inner circle of the nested circle scanning is 0.06mm, and the diameter of the outer circle is 0.60mm (as shown in figure 5); the axial feeding is carried out for 10 times, and the axial feeding distance is set to be 0.10mm (shown in figure 7); the scanning interval is 0.02mm, the laser power is 30W, the laser scanning speed is 400mm/s, the single-layer scanning frequency is 120 times, and after the first step of processing is finished, a primary test hole with the taper of about 4-5 degrees and the roundness of an inlet of more than 98.0 percent can be obtained, and the roundness of an outlet is about 80 percent at the moment. And a second in-situ reaming stage: and (3) reducing the processing focus to the middle part of the target, feeding for 10 times, as shown in figure 4, scanning the inner ring with the diameter of 0.20mm (as shown in figure 6) by a nested circle, increasing the single-layer scanning for 120 times, scanning the inner ring at the speed of 350mm/s, keeping other parameters unchanged, and finishing the processing to obtain the ceramic matrix composite micropore with the inlet roundness reaching 99.7%, the outlet roundness reaching more than 94.7% and the taper of about 3.0 degrees. The ceramic matrix composite micropore processed by the method can obviously improve the roundness and the taper of the micropore, the inlet roundness can be improved by 2%, the outlet roundness can be improved by 14%, and the taper is reduced by 2 degrees. Aiming at the difficult-to-machine materials similar to the ceramic matrix composite, hole repairing steps and multi-step sectional hole repairing can be added according to the depth-diameter ratio requirement of the hole to be machined, so that the aim of improving the micropore machining precision is fulfilled.
The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (10)
1. An in-situ hole repairing ultrafast laser micropore machining method is characterized by comprising the following steps:
processing a through hole: focusing laser on the upper surface of the target material, and processing a through hole by circular cutting scanning and axial feeding;
adjusting laser to focus on the middle part of the target material in the through hole;
reaming and modifying: the lower part and the outlet area of the through hole are machined through circular cutting scanning and axial feeding to modify the appearance and the size of the through hole, so that the roundness of the outlet of the through hole, the appearance of the wall of the through hole and the taper of the through hole meet the set requirements.
2. The in-situ hole-repairing ultrafast laser micro hole processing method of claim 1, wherein the through hole is processed in a nested circular cutting scanning manner at a through hole processing stage and a hole-expanding modification stage.
3. The in-situ trimming ultrafast laser micro hole processing method of claim 1 or 2, wherein the diameter of the inner ring of the laser processing area at the reaming modification stage is larger than that of the inner ring of the laser processing area at the through hole processing stage, and the number of ring-cut scans at the reaming modification stage is reduced.
4. The in-situ trimming ultrafast laser micro hole processing method of claim 3, wherein the outer ring diameters of the laser processing regions corresponding to the reaming modification stage and the through hole processing stage are equal to the set diameter of the through hole.
5. The in-situ hole-repairing ultrafast laser micropore machining method of claim 1, wherein in both the through hole machining stage and the hole-expanding modification stage, the shapes and sizes of the inlet and the outlet of the through hole are detected, and after the shapes and sizes meet set requirements, the subsequent steps are performed.
6. The in-situ hole-repairing ultrafast laser micro hole processing method of claim 1, wherein the axial feeding is performed step by step, and after completing the axial one-step circular cutting scanning, the next circular cutting scanning is performed.
7. The in-situ hole repairing ultrafast laser micro hole processing method of claim 1 or 6, wherein in a hole expanding modification stage, single-layer circular cutting scanning times and light spot overlapping rates are increased to modify the roundness of a through hole outlet, the shape of a through hole wall and reduce the taper of the through hole.
8. The in-situ via repair ultrafast laser micro-via processing method of claim 1, wherein preparation before processing is performed before the via processing stage:
fixing the target on a working platform, and adjusting the position to enable the upper surface of the target to be positioned at the laser focusing position;
and adjusting the technological parameters of laser circular cutting scanning, and preparing to process through holes by using a scanning galvanometer.
9. The in-situ hole-repairing ultrafast laser micro hole processing method of claim 8, wherein the laser circular cutting scanning process parameters include scanning inner ring diameter, scanning outer ring diameter, scanning interval, laser power, scanning speed, scanning times, axial feeding interval.
10. The in-situ via-repairing ultrafast laser micro-hole processing method of claim 1 or 9, wherein after the via-hole-enlarging modification of one via-hole is completed, the target material is moved to a next via-hole processing position, the laser is adjusted to an initial processing position, and the via-hole processing and the via-hole-enlarging modification are repeated.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211324552.9A CN115446480A (en) | 2022-10-27 | 2022-10-27 | In-situ hole repairing ultrafast laser micropore machining method |
| PCT/CN2022/130050 WO2024087248A1 (en) | 2022-10-27 | 2022-11-04 | Ultrafast laser micro-hole machining method for in-situ hole trimming |
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| CN202211324552.9A CN115446480A (en) | 2022-10-27 | 2022-10-27 | In-situ hole repairing ultrafast laser micropore machining method |
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| CN115446480A true CN115446480A (en) | 2022-12-09 |
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| WO (1) | WO2024087248A1 (en) |
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- 2022-10-27 CN CN202211324552.9A patent/CN115446480A/en active Pending
- 2022-11-04 WO PCT/CN2022/130050 patent/WO2024087248A1/en unknown
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