CN115442955B - PCB (printed circuit board) applied to battery module and preparation method thereof - Google Patents
PCB (printed circuit board) applied to battery module and preparation method thereof Download PDFInfo
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0207—Cooling of mounted components using internal conductor planes parallel to the surface for thermal conduction, e.g. power planes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
- H01M50/20—Mountings; Secondary casings or frames; Racks, modules or packs; Suspension devices; Shock absorbers; Transport or carrying devices; Holders
- H01M50/258—Modular batteries; Casings provided with means for assembling
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
- H01M50/50—Current conducting connections for cells or batteries
- H01M50/502—Interconnectors for connecting terminals of adjacent batteries; Interconnectors for connecting cells outside a battery casing
- H01M50/519—Interconnectors for connecting terminals of adjacent batteries; Interconnectors for connecting cells outside a battery casing comprising printed circuit boards [PCB]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Carbon And Carbon Compounds (AREA)
Abstract
The invention provides a PCB (printed circuit board) applied to a battery module and a preparation method thereof; the PCB circuit board includes: the metal base layer, the heat conducting layer and the circuit layer are sequentially laminated; the metal base layer is made of aluminum, the heat conduction layer is made of graphene-carbon nano tube composite material, and the circuit layer is made of electrolytic copper foil; according to the invention, the power device is adhered to the circuit layer of the PCB, so that heat generated by the power device is conducted to the heat conducting layer through the circuit layer, then conducted to the metal base layer through the heat conducting layer, and finally diffused to the outside of the battery module through the metal base layer, and heat dissipation of the power device is realized.
Description
Technical Field
The invention belongs to the technical field of PCB (printed circuit board), and particularly relates to a PCB applied to a battery module and a preparation method thereof.
Background
Along with continuous pursuit of electric automobile to continuation of journey mileage and performance, battery system needs increase capacity and power density under certain volume, and corresponding battery system charge-discharge operating mode is also more abominable, because the power increases, leads to the electric current to increase sharply, according to Q=I 2 RT, the heat generation capacity also increases sharply, and if heat dissipation is not timely carried out on some circuit components with small volume size, inaccuracy of information acquisition can be caused, and the structure of the circuit components can be destroyed in severe cases.
The traditional battery module PCB integrated circuit assembly board comprises a resin base plate, an FR4 ceramic-based insulating material reinforcing plate and a copper foil which are sequentially arranged from bottom to top, wherein all the layers of the base plate are bonded together through glue; the PCB integrated circuit assembly board has lower heat dissipation efficiency (the heat conductivity coefficient is 0.3-1W/m.K) and higher thermal resistance, so that heat generated by a high-power device cannot be effectively and timely dissipated; and the mechanical property is weaker (the peeling strength between the resin substrate and the FR4 ceramic-based insulating material reinforcing plate is 0.5-1N/mm); therefore, it is important to provide a PCB circuit board with high heat dissipation efficiency and good mechanical performance, which is applied to a battery module.
Disclosure of Invention
Aiming at the defects and the shortcomings existing in the prior art, the invention aims to provide a PCB (printed circuit board) applied to a battery module; the PCB circuit board comprises a metal base layer, a heat conducting layer and a circuit layer which are sequentially laminated, and the heat generated by the power device is conducted to the heat conducting layer through the circuit layer by sticking the power device on the circuit layer of the PCB circuit board, then conducted to the metal base layer through the heat conducting layer, and finally diffused to the outside of the battery module through the metal base layer, so that the heat dissipation of the power device is realized.
In order to achieve the above object, a first aspect of the present invention provides a PCB circuit board applied to a battery module, which adopts the following technical scheme:
a PCB circuit board applied to a battery module, comprising: the metal base layer, the heat conducting layer and the circuit layer are sequentially laminated; the metal base layer is made of aluminum, the heat conduction layer is made of graphene-carbon nano tube composite materials, and the circuit layer is made of electrolytic copper foil.
The arrangement of the circuit layer is used for realizing the assembly and connection of the power device, and the power device comprises: resistance, capacitance, inductor, mos tube, AFE acquisition chip, etc.; an aluminum substrate is used as a metal base layer to replace a resin substrate in the prior art, and can bear higher current under the same line width and thickness; the heat conducting layer prepared by adopting the graphene-carbon nano tube composite material as the raw material replaces the FR4 ceramic-based insulating material reinforcing plate in the prior art, and the graphene-carbon nano tube composite material has ultrahigh heat conductivity due to the diamond structure and the graphite structure, and the heat conducting capability of the prepared heat conducting layer is higher than that of an aluminum substrate (the heat conducting coefficient is 237W/m.K), so that the heat transmission is changed from single unidirectional downward transmission to unidirectional downward transmission and unidirectional downward transmission, and the heat radiation capability of the PCB is greatly improved. Therefore, compared with the circuit board in the prior art, the PCB provided by the invention can bear more electronic devices due to the fact that the PCB can bear more current and has stronger heat dissipation capacity.
In the above-mentioned PCB circuit board applied to the battery module, as a preferred embodiment, the thickness of the metal base layer is 0.1mm-0.5mm (e.g., 0.15mm, 0.2mm, 0.25mm, 0.3mm, 0.35mm, 0.4mm, 0.45 mm).
In the above-mentioned PCB circuit board applied to the battery module, as a preferred embodiment, the thickness of the heat conductive layer is 0.1mm to 0.2mm (e.g., 0.12mm, 0.14mm, 0.15mm, 0.17mm, 0.19 mm).
In the above-mentioned PCB circuit board applied to the battery module, as a preferred embodiment, the thickness of the circuit layer is 0.1mm to 0.3mm (e.g., 0.15mm, 0.18mm, 0.2mm, 0.25mm, 0.28 mm).
In the above-mentioned PCB circuit board applied to the battery module, as a preferred embodiment, the thermal conductivity of the thermal conductive layer is 800-1200W/m·k (e.g., 850W/m·k, 900W/m·k, 950W/m·k, 1000W/m·k, 1100W/m·k).
In the above-mentioned PCB circuit board applied to the battery module, as a preferred embodiment, the lateral thermal conductivity of the PCB circuit board is 200-250W/m·k (e.g., 210W/m·k, 220W/m·k, 230W/m·k, 240W/m·k), and the longitudinal thermal conductivity is 150-200W/m·k (e.g., 160W/m·k, 170W/m·k, 180W/m·k, 190W/m·k); preferably, the peel strength between the metal base layer and the thermally conductive layer is 5-10N/mm (e.g., 6N/mm, 7N/mm, 8N/mm, 9N/mm).
The peeling strength in the invention refers to the maximum force required by peeling the contact surface of the metal base layer and the heat conducting layer with unit width, and represents the bonding strength (mechanical property) of the material; the transverse heat conductivity coefficient refers to heat directly conducted in unit temperature difference and unit time when a unit longitudinal section of the material propagates along the length direction, and the longitudinal section refers to a plane parallel to the width and the height of the PCB when the PCB is horizontally placed; the longitudinal heat conductivity coefficient refers to heat directly conducted by a unit cross section of a material in unit temperature difference and unit time when the material propagates along the length direction, and the cross section refers to a plane parallel to the length and the width of the PCB when the PCB is horizontally placed.
The second aspect of the present invention provides a method for manufacturing a PCB circuit board applied to a battery module, comprising:
carrying out heating treatment and atomization treatment on the graphene-carbon nano tube composite material to obtain carbon material particles, and then dissolving the carbon material particles in a solvent to obtain a coating;
coating the coating on the upper surface of the metal base layer, and then drying and cutting to obtain the metal base layer provided with the heat conducting layer;
and thirdly, placing the electrolytic copper foil on the metal base layer provided with the heat conducting layer, then performing high-temperature lamination treatment, then brushing insulating paint on the upper surface of the electrolytic copper foil, and performing screen printing to obtain the PCB.
In the above preparation method, as a preferred embodiment, the preparation method further includes: and fourthly, adhering the power device to the PCB.
In the above preparation method, as a preferred embodiment, in the first step, the heating treatment is performed under an inert gas at a temperature of 1000-1200 ℃ (e.g. 1050 ℃, 1100 ℃, 1150 ℃, 1180 ℃) for a period of 20-40s (e.g. 25s, 30s, 35s, 38 s); preferably, the atomization treatment is performed in an ultrasonic atomizer; preferably, the carbon material particles have a particle size of 1-10 μm (e.g. 2 μm, 5 μm, 7 μm, 9 μm).
In the above preparation method, as a preferred embodiment, in the first step, the mass of the carbon material particles accounts for 10wt% -30wt% (such as 12wt%, 15wt%, 18wt%, 20wt%, 25 wt%) of the mass of the coating; preferably, the solvent is an aminophenol organic solvent; preferably, the dissolution temperature of the carbon material in the solvent is 100-300 ℃ (such as 120 ℃, 150 ℃, 180 ℃, 200 ℃, 250 ℃) and the dissolution time is 1h-2h (such as 1.2h, 1.4h, 1.5h, 1.7h, 1.9 h).
In the above preparation method, as a preferred embodiment, in the second step, the coating material is coated on the upper surface of the metal base layer using a coater; preferably, the drying process is carried out at a temperature of 60-100deg.C (e.g., 70deg.C, 80deg.C, 90deg.C) for a time of 30s-60s (e.g., 35s, 40s, 50 s).
In the above preparation method, as a preferred embodiment, in the third step, the high temperature lamination treatment is performed in a vacuum lamination machine, the temperature of the high temperature lamination treatment is 800 ℃ -1200 ℃ (such as 900 ℃, 1000 ℃, 1100 ℃), the pressure is 1MPa-10MPa (such as 2MPa, 5MPa, 7MPa, 9 MPa), and the holding time is 30s-60s (such as 35s, 40s, 50s, 55 s).
Compared with the prior art, the invention has the following effective effects:
(1) According to the invention, the aluminum substrate is used as a metal base layer to replace a resin substrate in the prior art, and the aluminum substrate can bear higher current;
(2) According to the invention, the FR4 ceramic-based insulating material reinforcing plate in the prior art is replaced by the heat conducting layer prepared from the graphene-carbon nanotube composite material, the graphene-carbon nanotube composite material has ultrahigh heat conductivity, and the heat transmission is changed from single unidirectional downward transmission to unidirectional downward transmission and is changed into unidirectional downward transmission, so that the heat radiation capability of the PCB is greatly improved;
(3) Compared with the circuit board in the prior art, the PCB of the invention can bear more electronic devices with the same line width and thickness due to the fact that the PCB can bear more current and stronger heat dissipation capacity; the PCB circuit board has excellent mechanical property (the peeling strength between the metal base layer and the heat conducting layer is 5-10N/mm);
(4) The preparation method provided by the invention is simple and convenient, high in yield, high in reliability and low in preparation comprehensive cost.
Drawings
Fig. 1 is a schematic view of a battery module according to the present invention;
fig. 2 is a schematic structural view of a PCB circuit board applied to a battery module according to the present invention;
fig. 3 is a schematic cross-sectional structure of a PCB circuit board applied to a battery module according to the present invention;
fig. 4 is a schematic diagram of a heat dissipation operation of a PCB circuit board applied to a battery module according to the present invention;
FIG. 5 is a schematic molecular structure of a graphene-carbon nanotube composite material according to the present invention;
reference numerals illustrate: 1. a battery cell; 2. a cell pole; 3. aluminium bar; 4. a PCB circuit board; 41. a metal base layer; 42. a heat conducting layer; 43. a circuit layer; 5. a power device.
Detailed Description
The invention is described below with reference to the drawings and examples. It is to be understood that these examples are for the purpose of illustrating the invention only and are not to be construed as limiting the scope of the invention. It is to be understood that various changes and modifications may be made by those skilled in the art after reading the disclosure herein, and that such equivalents are intended to fall within the scope of the claims appended hereto.
In the description of the present invention, the terms "longitudinal", "transverse", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", etc. refer to the orientation or positional relationship based on that shown in the drawings, merely for convenience of description of the present invention and do not require that the present invention must be constructed and operated in a specific orientation, and thus should not be construed as limiting the present invention. The terms "coupled," "connected," and "configured" as used herein are to be construed broadly and may be, for example, fixedly connected or detachably connected; can be directly connected or indirectly connected through an intermediate component; either a wired electrical connection, a radio connection or a wireless communication signal connection, the specific meaning of which terms will be understood by those of ordinary skill in the art as the case may be.
The test methods in the following examples are conventional methods, and may be carried out according to techniques or conditions described in the literature in the field or according to the specifications of the products, unless otherwise specified. The graphene-carbon nanotube composite material (the molecular structure of which is shown in fig. 5) is prepared from thermal expansion graphene oxide and carbon nanotubes as raw materials by preparing a mixed solution (30-50% of the thermal expansion graphene oxide, 5-25% of the carbon nanotubes and the balance of water in mass percent) and then heating the mixed solution under vacuum condition, wherein the temperature of the heating treatment is 1000-1200 ℃ and the heat preservation time is 60-100min; and then annealing at 200-500 ℃ for 2-5h to obtain the graphene-carbon nanotube composite material. Other starting materials described in the examples below are available from published commercial sources.
The embodiment of the invention provides a PCB (printed circuit board) applied to a battery module, referring to fig. 1, the battery module comprises a battery core 1, a plurality of battery core polar posts 2 are arranged above the battery core 1, and an aluminum bar 3 is arranged above the battery core polar posts 2; the battery cell pole posts 2 are distributed on two sides above the battery cell 1, and a PCB circuit board 4 is arranged above the battery cell 1 and positioned in the middle of the battery cell pole posts 2 on two sides; a plurality of power devices 5 are stuck above the PCB 4; referring to fig. 2 and 3, the pcb circuit board includes a metal base layer 41, a heat conductive layer 42, and a circuit layer 43, which are sequentially stacked from bottom to top; the metal base layer 41 is made of aluminum, the heat conduction layer 42 is made of graphene-carbon nano tube composite material, and the circuit layer 43 is made of electrolytic copper foil;
further, the thickness of the metal base layer 41 is 0.1mm to 0.5mm; the thickness of the heat conductive layer 42 is 0.1mm-0.2mm; the thickness of the wiring layer 43 is 0.1mm to 0.3mm.
Further, the thermal conductivity of the thermal conductive layer 42 is 800-1200W/mK.
Further, the transverse heat conductivity coefficient of the PCB 4 is 200-250W/m.K, the longitudinal heat conductivity coefficient is 150-200W/m.K, and the peeling strength between the metal base layer 41 and the heat conducting layer 42 is 5-10N/mm.
The preparation method of the PCB applied to the battery module comprises the following steps:
firstly, carrying out heating treatment on the graphene-carbon nano tube composite material, wherein the heating temperature is 1000-1200 ℃, the heating time is 20-40s, and then carrying out atomization treatment in an ultrasonic sprayer to obtain carbon material particles with the granularity of 1-10 mu m; then dissolving carbon material particles in an amine phenol-based organic solvent to prepare a coating, wherein the mass of the carbon material particles accounts for 10-30wt% of the mass of the coating, the dissolution temperature of the carbon material in the solvent is 100-300 ℃, and the dissolution time is 1-2 h;
step two, coating the paint on the upper surface of the metal base layer 41, and then drying at 60-100 ℃ for 30-60s and cutting to obtain the metal base layer 41 coated with the heat conducting layer 42;
placing the electrolytic copper foil on the upper surface of the heat conducting layer 42, then performing high-temperature lamination treatment, wherein the temperature of the high-temperature lamination treatment is 800-1200 ℃, the pressure is 1-10 MPa, the heat preservation and pressure maintaining time is 30-60s, then brushing insulating paint on the upper surface of the electrolytic copper foil, and performing screen printing to obtain a PCB (printed Circuit Board) 4;
and fourthly, adhering the power device 5 to the PCB 4.
Referring to fig. 4, the graphene-carbon nanotube composite material has an ultra-high thermal conductivity due to the diamond structure and the graphite structure, and the thermal conductive layer 42 prepared by using the graphene-carbon nanotube composite material has a thermal conductive capability higher than that of the aluminum substrate, so that the heat transmission from single unidirectional downward transmission to diffusion-oriented transmission and unidirectional downward transmission is changed, and the heat dissipation capability of the PCB circuit board 4 is greatly improved.
The present invention will be described in further detail with reference to specific examples.
Example 1
A PCB circuit board to which a battery module is applied, comprising: the metal base layer, the heat conducting layer and the circuit layer are sequentially stacked from bottom to top; wherein, the material of the metal base layer is aluminum, the thickness is 0.3mm, the raw material of the heat conduction layer is graphene-carbon nano tube composite material, the thickness is 0.15mm, the heat conduction coefficient is 1000W/m.K, the circuit layer is electrolytic copper foil, and the thickness is 0.2mm; the preparation method of the graphene-carbon nano tube composite material comprises the following steps: (1) Preparing a mixed solution (in the mixed solution, 50% of the thermally-expanded graphene oxide, 25% of the carbon nanotubes and the balance of water) by taking the thermally-expanded graphene oxide and the carbon nanotubes as raw materials; (2) Heating under vacuum condition at 1000deg.C for 70min; (3) And (3) carrying out annealing treatment, wherein the temperature of the annealing treatment is 250 ℃ and the time is 3 hours, and preparing the graphene-carbon nano tube composite material.
A preparation method of a PCB (printed circuit board) applied to a battery module comprises the following steps:
firstly, carrying out heating treatment on the graphene-carbon nano tube composite material, wherein the heating temperature is 1000 ℃, the heating time is 30s, and then carrying out atomization treatment in an ultrasonic sprayer to obtain carbon material particles with the granularity of 5 mu m; then dissolving carbon material particles in a 4-maleimide phenol solvent to prepare a coating; wherein the mass of the carbon material particles accounts for 20wt% of the mass of the coating, the dissolution temperature is 150 ℃, and the dissolution time is 60min.
Coating the coating on the upper surface of the metal base layer, and then drying at 60 ℃ for 30 seconds and cutting to obtain the metal base layer coated with the heat conducting layer;
placing the electrolytic copper foil on the metal base layer coated with the heat conducting layer, then performing high-temperature lamination treatment, wherein the temperature of the high-temperature lamination treatment is 1000 ℃, the pressure is 3MPa, the heat preservation and pressure maintaining time is 30s, then brushing insulating paint on the upper surface of the electrolytic copper foil, and performing screen printing to obtain a PCB (printed circuit board);
and fourthly, adhering the power device to the PCB.
Comparative example 1
In the preparation method of the PCB circuit board in comparative example 1, the graphene-carbon nanotube composite material in the step one of example 1 is replaced by a mechanical mixture of thermal expansion graphene oxide and carbon nanotubes (the thermal expansion graphene oxide and the carbon nanotubes are directly and mechanically mixed, and the mass ratio of the thermal expansion graphene oxide to the carbon nanotubes is 2:1), and the rest is the same as that in example 1.
Performance testing
The method for measuring the longitudinal heat conductivity coefficient and the transverse heat conductivity coefficient of the PCB in the embodiment 1 and the PCB in the comparative embodiment 1 (measuring when a power device is not adhered) comprises the steps of heating one end surface of a sample by using a xenon lamp to generate pulse with energy of 10J/plus by a laser pulse method, generating instantaneous temperature rise, simultaneously using liquid nitrogen to cool an InSb infrared detector to detect the temperature change of the other end surface of the sample, obtaining a curve of temperature change along with time, and analyzing the speed of the temperature rise to obtain the thermal diffusivity; and the thermal conductivity is related to the thermal diffusivity, the thermal conductivity K =ραC p Wherein alpha is the thermal diffusivity, ρ is the material density, C p For hot melting, the transverse heat conductivity coefficient of the PCB circuit board in the embodiment 1 is 230W/m.K, and the longitudinal heat conductivity coefficient is 200W/m.K; the PCB in comparative example 1 had a lateral thermal conductivity of 210W/mK and a longitudinal thermal conductivity of 200W/mK; the peel strength test is carried out on the metal base layer and the heat conducting layer of the PCB circuit board in the embodiment 1, the test method comprises the steps of clamping two ends of a sample in an upper clamp and a lower clamp of equipment respectively by using an adhesive tape peel strength tester, and then setting the test speed to be 300mm/min for peeling, so that the peel strength between the metal base layer and the heat conducting layer in the embodiment 1 is 8N/mm, and the bonding strength between the metal base layer and the heat conducting layer in the PCB circuit board is good and the reliability is high.
The foregoing description of the preferred embodiments of the invention is not intended to limit the invention to the particular embodiments disclosed, but on the contrary, the intention is to cover all modifications, equivalents, and alternatives falling within the spirit and scope of the invention as defined by the appended claims.
Claims (13)
1. Be applied to battery module's PCB circuit board, its characterized in that includes: the metal base layer, the heat conducting layer and the circuit layer are sequentially laminated; the metal base layer is made of aluminum, the heat conduction layer is made of graphene-carbon nano tube composite material, and the circuit layer is made of electrolytic copper foil;
the heat conduction coefficient of the heat conduction layer is 850-1200W/m.K, the transverse heat conduction coefficient of the PCB is 200-250W/m.K, and the longitudinal heat conduction coefficient of the PCB is 150-200W/m.K; the peel strength between the metal base layer and the heat conducting layer is 5-10N/mm;
the preparation method of the PCB applied to the battery module comprises the following steps:
carrying out heating treatment and atomization treatment on the graphene-carbon nano tube composite material to obtain carbon material particles, and then dissolving the carbon material particles in a solvent to obtain a coating; wherein the heating treatment is carried out in inert gas, the heating temperature is 1000-1200 ℃, and the heating time is 20-40s;
coating the coating on the upper surface of the metal base layer, and then drying and cutting to obtain the metal base layer provided with the heat conducting layer;
and thirdly, placing the electrolytic copper foil on the metal base layer provided with the heat conducting layer, then performing high-temperature lamination treatment, then brushing insulating paint on the upper surface of the electrolytic copper foil, and performing screen printing to obtain the PCB.
2. The PCB circuit board for a battery module according to claim 1, wherein the thickness of the metal base layer is 0.1mm to 0.5mm.
3. The PCB circuit board applied to a battery module according to claim 1, wherein the thickness of the heat conductive layer is 0.1mm to 0.2mm.
4. The PCB circuit board applied to a battery module according to claim 1, wherein the thickness of the circuit layer is 0.1mm to 0.3mm.
5. The PCB circuit board applied to a battery module according to claim 1, wherein the manufacturing method further comprises: and fourthly, adhering the power device to the PCB.
6. The PCB of claim 1 or 5, wherein in step one, the atomizing treatment is performed in an ultrasonic atomizer.
7. The PCB circuit board for a battery module according to claim 6, wherein in the first step, the carbon material particles have a particle size of 1-10 μm.
8. The PCB circuit board applied to a battery module according to claim 7, wherein in the first step, the mass of the carbon material particles is 10wt% to 30wt% of the mass of the paint.
9. The PCB of claim 7, wherein the solvent is an aminophenol organic solvent.
10. The PCB of claim 7, wherein the dissolution temperature of the carbon material in the solvent is 100-300 ℃ and the dissolution time is 1-2 h.
11. The PCB for a battery module according to claim 1, wherein in the second step, the coating material is coated on the upper surface of the metal base layer using a coater.
12. The PCB circuit board for a battery module according to claim 11, wherein the drying process is performed at a temperature of 60-100 ℃ for a time of 30-60 s.
13. The PCB according to any one of claims 1, 5, 7 to 12, wherein in the third step, the high temperature lamination process is performed in a vacuum lamination machine, the high temperature lamination process is performed at a temperature of 800 ℃ to 1200 ℃, the pressure is 1MPa to 10MPa, and the holding time is 30s to 60s.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202211062696.1A CN115442955B (en) | 2022-08-31 | 2022-08-31 | PCB (printed circuit board) applied to battery module and preparation method thereof |
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| CN202211062696.1A CN115442955B (en) | 2022-08-31 | 2022-08-31 | PCB (printed circuit board) applied to battery module and preparation method thereof |
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| CN115442955B true CN115442955B (en) | 2023-06-20 |
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| CN106888548B (en) * | 2017-03-07 | 2018-11-13 | 常州轻工职业技术学院 | A kind of aluminium-based copper-clad laminate and its painting method with graphene/carbon nano-tube composite radiating coating |
| US20190116657A1 (en) * | 2017-10-18 | 2019-04-18 | Stryke Industries, LLC | Thermally enhanced printed circuit board architecture for high power electronics |
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