CN115442955A - PCB applied to battery module and preparation method thereof - Google Patents
PCB applied to battery module and preparation method thereof Download PDFInfo
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- CN115442955A CN115442955A CN202211062696.1A CN202211062696A CN115442955A CN 115442955 A CN115442955 A CN 115442955A CN 202211062696 A CN202211062696 A CN 202211062696A CN 115442955 A CN115442955 A CN 115442955A
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- 238000002360 preparation method Methods 0.000 title abstract description 10
- 229910052751 metal Inorganic materials 0.000 claims abstract description 42
- 239000002184 metal Substances 0.000 claims abstract description 42
- 239000002041 carbon nanotube Substances 0.000 claims abstract description 33
- 229910021393 carbon nanotube Inorganic materials 0.000 claims abstract description 33
- 239000002131 composite material Substances 0.000 claims abstract description 26
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 15
- 239000011889 copper foil Substances 0.000 claims abstract description 15
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 11
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 11
- 239000002245 particle Substances 0.000 claims description 18
- 239000003575 carbonaceous material Substances 0.000 claims description 17
- 239000011248 coating agent Substances 0.000 claims description 16
- 238000000576 coating method Methods 0.000 claims description 16
- 238000004519 manufacturing process Methods 0.000 claims description 11
- 238000010438 heat treatment Methods 0.000 claims description 10
- 239000002904 solvent Substances 0.000 claims description 8
- 238000001035 drying Methods 0.000 claims description 6
- 238000003825 pressing Methods 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 5
- 238000000034 method Methods 0.000 claims description 5
- 238000000889 atomisation Methods 0.000 claims description 4
- 230000001680 brushing effect Effects 0.000 claims description 4
- 238000005520 cutting process Methods 0.000 claims description 4
- 239000003973 paint Substances 0.000 claims description 4
- 238000007650 screen-printing Methods 0.000 claims description 4
- 239000003960 organic solvent Substances 0.000 claims description 3
- CDAWCLOXVUBKRW-UHFFFAOYSA-N 2-aminophenol Chemical group NC1=CC=CC=C1O CDAWCLOXVUBKRW-UHFFFAOYSA-N 0.000 claims description 2
- 239000011261 inert gas Substances 0.000 claims description 2
- 230000017525 heat dissipation Effects 0.000 abstract description 10
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical group [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 16
- 239000000758 substrate Substances 0.000 description 9
- 229910021389 graphene Inorganic materials 0.000 description 7
- JAYCNKDKIKZTAF-UHFFFAOYSA-N 1-chloro-2-(2-chlorophenyl)benzene Chemical compound ClC1=CC=CC=C1C1=CC=CC=C1Cl JAYCNKDKIKZTAF-UHFFFAOYSA-N 0.000 description 6
- 101100084627 Neurospora crassa (strain ATCC 24698 / 74-OR23-1A / CBS 708.71 / DSM 1257 / FGSC 987) pcb-4 gene Proteins 0.000 description 6
- 239000000919 ceramic Substances 0.000 description 5
- 239000011810 insulating material Substances 0.000 description 5
- 230000003014 reinforcing effect Effects 0.000 description 5
- 239000011347 resin Substances 0.000 description 5
- 229920005989 resin Polymers 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 4
- 239000011259 mixed solution Substances 0.000 description 4
- 238000009792 diffusion process Methods 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 238000004321 preservation Methods 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 2
- 238000000137 annealing Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 229910003460 diamond Inorganic materials 0.000 description 2
- 239000010432 diamond Substances 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 238000010998 test method Methods 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 239000002390 adhesive tape Substances 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- WPYVAWXEWQSOGY-UHFFFAOYSA-N indium antimonide Chemical compound [Sb]#[In] WPYVAWXEWQSOGY-UHFFFAOYSA-N 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 238000007719 peel strength test Methods 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
- 229910052724 xenon Inorganic materials 0.000 description 1
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0207—Cooling of mounted components using internal conductor planes parallel to the surface for thermal conduction, e.g. power planes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
- H01M50/20—Mountings; Secondary casings or frames; Racks, modules or packs; Suspension devices; Shock absorbers; Transport or carrying devices; Holders
- H01M50/258—Modular batteries; Casings provided with means for assembling
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
- H01M50/50—Current conducting connections for cells or batteries
- H01M50/502—Interconnectors for connecting terminals of adjacent batteries; Interconnectors for connecting cells outside a battery casing
- H01M50/519—Interconnectors for connecting terminals of adjacent batteries; Interconnectors for connecting cells outside a battery casing comprising printed circuit boards [PCB]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Carbon And Carbon Compounds (AREA)
Abstract
The invention provides a PCB circuit board applied to a battery module and a preparation method thereof; the PCB circuit board includes: the metal base layer, the heat conduction layer and the circuit layer are sequentially stacked; the metal base layer is made of aluminum, the heat conduction layer is made of a graphene-carbon nanotube composite material, and the circuit layer is made of an electrolytic copper foil; according to the invention, the power device is adhered to the circuit layer of the PCB, so that heat generated by the power device is conducted to the heat conduction layer through the circuit layer, then conducted to the metal base layer through the heat conduction layer, and finally diffused to the outside of the battery module through the metal base layer, and the heat dissipation of the power device is realized.
Description
Technical Field
The invention belongs to the technical field of PCB (printed circuit board), and particularly relates to a PCB applied to a battery module and a preparation method thereof.
Background
With the continuous pursuit of the electric automobile for the endurance mileage and the performance, the capacity and the power density of a battery system need to be increased under a certain volume, and the corresponding battery systemThe worse the charging and discharging working condition of the system is, the current is increased sharply due to the increase of power, and the current is increased sharply according to Q = I 2 RT, the heat production also sharply increases, to some very little circuit components and parts of volume size, if not dispel the heat in time, can lead to the inaccuracy of information collection, can destroy its structure when serious.
The traditional battery module PCB integrated circuit assembly board comprises a resin substrate, an FR4 ceramic-based insulating material reinforcing plate and a copper foil which are sequentially arranged from bottom to top, wherein all the layers of the resin substrate, the FR4 ceramic-based insulating material reinforcing plate and the copper foil are bonded together through glue; the PCB integrated circuit assembly board has low heat dissipation efficiency (the heat conductivity coefficient is 0.3-1W/m.K) and high thermal resistance, so that heat generated by a high-power device cannot be effectively dissipated in time; and the mechanical property is weaker (the peeling strength between the resin substrate and the FR4 ceramic-based insulating material reinforcing plate is 0.5-1N/mm); therefore, it is very important to provide a PCB applied to a battery module with high heat dissipation efficiency and good mechanical properties.
Disclosure of Invention
Aiming at the defects of the prior art, the invention aims to provide a PCB circuit board applied to a battery module; the PCB circuit board comprises the metal base layer, the heat conduction layer and the circuit layer which are sequentially stacked, and the power device is adhered to the circuit layer of the PCB circuit board, so that heat generated by the power device is conducted to the heat conduction layer through the circuit layer, then conducted to the metal base layer through the heat conduction layer, and finally diffused to the outside of the battery module through the metal base layer, and heat dissipation of the power device is achieved.
In order to achieve the above object, a first aspect of the present invention provides a PCB applied to a battery module, which adopts the following technical solutions:
a PCB circuit board applied to a battery module, comprising: the metal base layer, the heat conduction layer and the circuit layer are sequentially stacked; the metal base layer is made of aluminum, the heat conduction layer is made of graphene-carbon nanotube composite materials, and the circuit layer is made of electrolytic copper foil.
The circuit layer is arranged to realize the assembly and connection of the power device, and the power device comprises: resistors, capacitors, inductors, mos tubes, AFE acquisition chips, etc.; an aluminum substrate is adopted as a metal base layer to replace a resin substrate in the prior art, and can bear higher current under the condition of the same line width and the same thickness; the heat conduction layer made of the graphene-carbon nanotube composite material is used for replacing an FR4 ceramic-based insulating material reinforcing plate in the prior art, the graphene-carbon nanotube composite material has a diamond structure and a graphite structure, so that the graphene-carbon nanotube composite material has ultrahigh heat conductivity, and the heat conduction capability of the heat conduction layer made of the graphene-carbon nanotube composite material is higher than that of an aluminum substrate (the heat conduction coefficient is 237W/m.K), so that the heat propagation is changed from single one-way downward propagation into diffusion propagation and one-way downward propagation, and the heat dissipation capability of the PCB is greatly improved. Therefore, compared with the circuit board in the prior art, the PCB circuit board can bear more electric current and has stronger heat dissipation capacity, so that more electronic devices can be borne.
In the above PCB circuit board applied to the battery module, as a preferred embodiment, the thickness of the metal base layer is 0.1mm to 0.5mm (e.g., 0.15mm, 0.2mm, 0.25mm, 0.3mm, 0.35mm, 0.4mm, 0.45 mm).
In the PCB circuit board applied to the battery module, as a preferred embodiment, the thickness of the heat conductive layer is 0.1mm to 0.2mm (e.g., 0.12mm, 0.14mm, 0.15mm, 0.17mm, 0.19 mm).
In the above PCB circuit board applied to the battery module, as a preferred embodiment, the thickness of the circuit layer is 0.1mm to 0.3mm (e.g., 0.15mm, 0.18mm, 0.2mm, 0.25mm, 0.28 mm).
In the above-described PCB circuit board applied to the battery module, as a preferred embodiment, the heat conductive layer has a thermal conductivity of 800 to 1200W/m · K (e.g., 850W/m · K, 900W/m · K, 950W/m · K, 1000W/m · K, 1100W/m · K).
In the above-described PCB circuit board applied to the battery module, as a preferred embodiment, the PCB circuit board has a lateral thermal conductivity of 200-250W/m.k (e.g., 210W/m.k, 220W/m.k, 230W/m.k, 240W/m.k) and a longitudinal thermal conductivity of 150-200W/m.k (e.g., 160W/m.k, 170W/m.k, 180W/m.k, 190W/m.k); preferably, the peel force strength between the metal base layer and the heat conductive layer is 5-10N/mm (such as 6N/mm, 7N/mm, 8N/mm, 9N/mm).
The peeling strength refers to the maximum force required when the contact surface of the metal base layer and the heat conduction layer in unit width is peeled, and the bonding strength (mechanical property) of the material is embodied; the transverse heat conductivity coefficient refers to the heat directly conducted in unit temperature difference and unit time when a unit longitudinal section of the material is transmitted along the length direction, wherein the longitudinal section refers to a plane formed by the width multiplied by the height of a PCB when the PCB is horizontally placed; the longitudinal heat conductivity coefficient refers to the heat which is directly conducted under unit temperature difference and in unit time when the unit cross section of the material is transmitted along the length direction, and the cross section refers to a plane which is formed by the length multiplied by the width of the PCB when the PCB is horizontally placed.
The second aspect of the present invention provides a method for manufacturing a PCB circuit board applied to a battery module, including:
step one, carrying out heating treatment and atomization treatment on a graphene-carbon nanotube composite material to obtain carbon material particles, and then dissolving the carbon material particles in a solvent to prepare a coating;
coating the coating on the upper surface of the metal base layer, and then drying and cutting to obtain the metal base layer provided with the heat conduction layer;
and step three, placing the electrolytic copper foil on the metal base layer provided with the heat conduction layer, then carrying out high-temperature pressing treatment, then brushing insulating paint on the upper surface of the electrolytic copper foil, and then carrying out screen printing to obtain the PCB.
In the above production method, as a preferred embodiment, the production method further comprises: and step four, adhering the power device on the PCB.
In the above production method, as a preferred embodiment, in the first step, the heating treatment is carried out in an inert gas at a temperature of 1000 to 1200 ℃ (such as 1050 ℃, 1100 ℃, 1150 ℃, 1180 ℃) for 20 to 40s (such as 25s, 30s, 35s, 38 s); preferably, the atomization treatment is carried out in an ultrasonic sprayer; preferably, the carbon material particles have a particle size of 1 to 10 μm (e.g., 2 μm, 5 μm, 7 μm, 9 μm).
In the above production method, as a preferred embodiment, in the step one, the mass of the carbon material particles accounts for 10wt% to 30wt% (e.g., 12wt%, 15wt%, 18wt%, 20wt%, 25 wt%) of the mass of the dope; preferably, the solvent is an aminophenol organic solvent; preferably, the carbon material is dissolved in the solvent at a temperature of 100 to 300 ℃ (e.g., 120 ℃, 150 ℃, 180 ℃, 200 ℃, 250 ℃) for 1h to 2h (e.g., 1.2h, 1.4h, 1.5h, 1.7h, 1.9 h).
In the above manufacturing method, as a preferred embodiment, in the second step, the coating is applied to the upper surface of the metal base layer by using a coater; preferably, the drying treatment is carried out at a temperature of 60-100 deg.C (e.g. 70 deg.C, 80 deg.C, 90 deg.C) for a period of 30-60s (e.g. 35s, 40s, 50 s).
In the above-mentioned preparation method, as a preferred embodiment, in the third step, the high temperature press bonding treatment is performed in a vacuum press bonding machine, the temperature of the high temperature press bonding treatment is 800 ℃ to 1200 ℃ (such as 900 ℃, 1000 ℃, 1100 ℃), the pressure is 1MPa to 10MPa (such as 2MPa, 5MPa, 7MPa, 9 MPa), and the holding time and pressure are 30s to 60s (such as 35s, 40s, 50s, 55 s).
Compared with the prior art, the invention has the following effective effects:
(1) The aluminum substrate is used as the metal base layer to replace a resin substrate in the prior art, and can bear higher current;
(2) According to the invention, the heat conduction layer made of the graphene-carbon nanotube composite material is adopted to replace an FR4 ceramic-based insulating material reinforcing plate in the prior art, the graphene-carbon nanotube composite material has ultrahigh heat conductivity, and by utilizing the heat conduction layer made of the graphene-carbon nanotube composite material, the heat propagation is changed from single one-way downward propagation into diffusion-oriented propagation and one-way downward propagation, so that the heat dissipation capability of the PCB is greatly improved;
(3) Compared with the circuit board in the prior art, the PCB circuit board can bear more electric current and stronger heat dissipation capacity, and can bear more electronic devices with the same line width and the same thickness; the PCB circuit board has excellent mechanical property (the peeling strength between the metal base layer and the heat conduction layer is 5-10N/mm);
(4) The preparation method is simple and convenient, and has high excellent rate, high reliability and low comprehensive preparation cost.
Drawings
Fig. 1 is a schematic structural view of a battery module according to the present invention;
fig. 2 is a schematic structural view of a PCB applied to a battery module according to the present invention;
fig. 3 is a schematic cross-sectional view of a PCB applied to a battery module according to the present invention;
fig. 4 is a schematic diagram of the heat dissipation operation of the PCB applied to the battery module according to the present invention;
FIG. 5 is a schematic view of the molecular structure of the graphene-carbon nanotube composite material according to the present invention;
description of the reference numerals: 1. an electric core; 2. a battery cell pole column; 3. aluminum bars; 4. a PCB circuit board; 41. a metal base layer; 42. a heat conductive layer; 43. a circuit layer; 5. a power device.
Detailed Description
The invention is described below with reference to the figures and examples. It should be understood that these examples are only for illustrating the present invention and are not intended to limit the scope of the present invention. It should be understood that various changes and modifications can be made by one skilled in the art after reading the disclosure of the present invention, and equivalents fall within the scope of the invention as defined by the appended claims.
In the description of the present invention, the terms "longitudinal", "lateral", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, which are for convenience of description of the present invention only and do not require that the present invention must be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. The terms "connected," "connected," and "disposed" as used herein are intended to be broadly construed, and may include, for example, fixed and removable connections; can be directly connected or indirectly connected through intermediate components; the connection may be a wired electrical connection, a radio electrical connection, or a wireless communication signal connection, and a person of ordinary skill in the art may understand the specific meaning of the above terms according to specific situations.
The test methods in the following examples are conventional methods unless otherwise specified, and may be carried out according to the techniques or conditions described in the literature in the art or according to the product specifications. The graphene-carbon nanotube composite material (a schematic molecular structure diagram of the graphene-carbon nanotube composite material is shown in fig. 5) used in the embodiment of the invention is prepared by using thermal expansion graphene oxide and carbon nanotubes as raw materials, firstly preparing a mixed solution (in the mixed solution, by mass percentage, 30% -50% of the thermal expansion graphene oxide, 5% -25% of the carbon nanotubes and the balance of water), and then performing heating treatment under a vacuum condition, wherein the temperature of the heating treatment is 1000-1200 ℃, and the heat preservation time is 60-100min; and then annealing at 200-500 ℃ for 2-5h to obtain the graphene-carbon nanotube composite material. Other starting materials described in the examples below are commercially available from the open literature.
The specific embodiment of the invention provides a PCB circuit board applied to a battery module, referring to fig. 1, the battery module includes a battery cell 1, a plurality of battery cell poles 2 and an aluminum bar 3 disposed above the battery cell poles 2 are disposed above the battery cell 1; the cell poles 2 are distributed on two sides above the cell 1, and the PCB 4 is arranged above the cell 1 and is positioned in the middle of the cell poles 2 on the two sides; a plurality of power devices 5 are adhered above the PCB 4; referring to fig. 2 and 3, the pcb includes a metal base layer 41, a heat conduction layer 42, and a circuit layer 43 sequentially stacked from bottom to top; the metal base layer 41 is made of aluminum, the heat conduction layer 42 is made of a graphene-carbon nanotube composite material, and the circuit layer 43 is made of an electrolytic copper foil;
further, the thickness of the metal base layer 41 is 0.1mm-0.5mm; the thickness of the heat conduction layer 42 is 0.1mm-0.2mm; the thickness of the wiring layer 43 is 0.1mm to 0.3mm.
Further, the heat conductive layer 42 has a thermal conductivity of 800 to 1200W/m.K.
Further, the transverse thermal conductivity of the PCB 4 is 200-250W/m.K, the longitudinal thermal conductivity is 150-200W/m.K, and the peeling strength between the metal base layer 41 and the heat conduction layer 42 is 5-10N/mm.
The preparation method of the PCB applied to the battery module comprises the following steps:
step one, heating the graphene-carbon nanotube composite material at 1000-1200 ℃ for 20-40s, and then atomizing in an ultrasonic sprayer to obtain carbon material particles with the particle size of 1-10 microns; then dissolving carbon material particles in an amine phenol-based organic solvent to prepare a coating, wherein the mass of the carbon material particles accounts for 10-30 wt% of the mass of the coating, the dissolving temperature of the carbon material in the solvent is 100-300 ℃, and the dissolving time is 1-2 h;
step two, coating the coating on the upper surface of the metal base layer 41, and then performing drying treatment and cutting treatment at the temperature of 60-100 ℃ for 30-60s to obtain the metal base layer 41 coated with the heat conduction layer 42;
thirdly, placing the electrolytic copper foil on the upper surface of the heat conduction layer 42, then carrying out high-temperature pressing treatment, wherein the temperature of the high-temperature pressing treatment is 800-1200 ℃, the pressure is 1-10 MPa, the heat preservation and pressure maintaining time is 30-60s, then brushing insulating paint on the upper surface of the electrolytic copper foil, and then carrying out screen printing to obtain a PCB 4;
and step four, adhering the power device 5 on the PCB 4.
Referring to fig. 4, the graphene-carbon nanotube composite material has a diamond structure and a graphite structure, so that the graphene-carbon nanotube composite material has ultrahigh thermal conductivity, and the thermal conductivity of the thermal conductive layer 42 prepared from the graphene-carbon nanotube composite material is higher than that of the aluminum substrate, so that the heat propagation is changed from single unidirectional downward propagation to unidirectional downward propagation, and the heat dissipation capability of the PCB 4 is greatly improved.
The present invention will be described in further detail with reference to specific examples.
Example 1
A PCB circuit board applying a battery module, comprising: the metal base layer, the heat conduction layer and the circuit layer are sequentially stacked from bottom to top; the metal base layer is made of aluminum and is 0.3mm thick, the heat conducting layer is made of a graphene-carbon nano tube composite material and is 0.15mm thick, the heat conducting coefficient is 1000W/m.K, the circuit layer is an electrolytic copper foil and is 0.2mm thick; the preparation method of the graphene-carbon nanotube composite material comprises the following steps: (1) Preparing a mixed solution by using thermal expansion graphene oxide and carbon nano tubes as raw materials (in the mixed solution, by mass percentage, 50% of the thermal expansion graphene oxide, 25% of the carbon nano tubes and the balance of water); (2) Heating under vacuum at 1000 deg.C for 70min; (3) And (3) annealing at 250 ℃ for 3h to obtain the graphene-carbon nanotube composite material.
A preparation method of a PCB circuit board applied to a battery module comprises the following steps:
step one, heating the graphene-carbon nanotube composite material at 1000 ℃ for 30s, and then atomizing in an ultrasonic sprayer to obtain carbon material particles with the particle size of 5 microns; then dissolving carbon material particles in a 4-maleimide phenol solvent to prepare a coating; wherein the mass of the carbon material particles accounts for 20wt% of the mass of the coating, the dissolving temperature is 150 ℃, and the dissolving time is 60min.
Step two, coating the coating on the upper surface of the metal base layer, and then performing drying treatment and cutting treatment at the temperature of 60 ℃ for 30s to obtain the metal base layer coated with the heat conduction layer;
placing an electrolytic copper foil on the metal base layer coated with the heat conduction layer, then carrying out high-temperature pressing treatment, wherein the temperature of the high-temperature pressing treatment is 1000 ℃, the pressure is 3MPa, the heat preservation and pressure maintaining time is 30s, then brushing insulating paint on the upper surface of the electrolytic copper foil, and then carrying out screen printing to obtain a PCB;
and step four, adhering the power device on the PCB.
Comparative example 1
The PCB circuit board of comparative example 1 was prepared by replacing the graphene-carbon nanotube composite material obtained in the first step of example 1 with a thermal expansion graphene oxide/carbon nanotube mixture (the thermal expansion graphene oxide/carbon nanotube mixture was directly mechanically mixed, and the mass ratio of the thermal expansion graphene oxide/carbon nanotube mixture was 2:1), and the rest was the same as example 1.
Performance testing
The PCB circuit board in the embodiment 1 and the PCB circuit board in the comparative example 1 are subjected to longitudinal heat conductivity coefficient and transverse heat conductivity coefficient measurement (measurement when no power device is adhered), the measurement method comprises the steps of heating from one end face of a sample by using a pulse with energy of 10J/plus generated by a xenon lamp by adopting a laser pulse method to generate instantaneous temperature rise, simultaneously detecting the temperature change of the other end face of the sample by using an InSb infrared detector cooled by liquid nitrogen to obtain a curve of temperature change along with time, and analyzing the speed of temperature rise to obtain the thermal diffusivity; the thermal conductivity is related to the thermal diffusion coefficient, and K = rho alpha C p Wherein alpha is thermal diffusion coefficient, rho is material density, C p The transverse thermal conductivity of the PCB circuit board obtained in the embodiment 1 is 230W/m.K and the longitudinal thermal conductivity is 200W/m.K for hot melting; the transverse thermal conductivity of the PCB circuit board in the comparative example 1 is 210W/m.K, and the longitudinal thermal conductivity is 200W/m.K; the metal base layer and the heat conduction layer of the PCB circuit board in the embodiment 1 of the invention are subjected to peel strength test, the test method is that an adhesive tape peel strength tester is adopted to clamp two ends of a sample in an upper clamp and a lower clamp of equipment respectively, then the test speed is set to be 300mm/min for peeling, and the peel strength between the metal base layer and the heat conduction layer in the embodiment 1 is obtained to be 8N/mm, so that the invention is embodied that the bonding strength between the metal base layer and the heat conduction layer in the PCB circuit board is good, and the reliability is high.
The above description is only exemplary of the invention and should not be taken as limiting the invention, as any modification, equivalent replacement, or improvement made within the spirit and principle of the invention is intended to be covered by the appended claims.
Claims (10)
1. The utility model provides a be applied to PCB circuit board of battery module which characterized in that includes: the metal base layer, the heat conduction layer and the circuit layer are sequentially stacked; the metal base layer is made of aluminum, the heat conduction layer is made of graphene-carbon nanotube composite materials, and the circuit layer is made of electrolytic copper foil.
2. The PCB circuit board applied to a battery module according to claim 1, wherein the metal base layer has a thickness of 0.1mm to 0.5mm; preferably, the thickness of the heat conduction layer is 0.1mm-0.2mm; preferably, the thickness of the circuit layer is 0.1mm-0.3mm.
3. The PCB circuit board applied to the battery module according to claim 1 or 2, wherein the heat conductive layer has a thermal conductivity of 800-1200W/m-K.
4. The PCB circuit board for a battery module according to any one of claims 1 to 3, wherein the PCB circuit board has a transverse thermal conductivity of 200-250W/m-K and a longitudinal thermal conductivity of 150-200W/m-K; preferably, the peel strength between the metal base layer and the heat conduction layer is 5-10N/mm.
5. A method for preparing a PCB circuit board for a battery module according to any one of claims 1 to 4, comprising:
step one, carrying out heating treatment and atomization treatment on a graphene-carbon nanotube composite material to obtain carbon material particles, and then dissolving the carbon material particles in a solvent to prepare a coating;
coating the coating on the upper surface of the metal base layer, and then drying and cutting to obtain the metal base layer provided with the heat conduction layer;
and step three, placing the electrolytic copper foil on the metal base layer provided with the heat conduction layer, then carrying out high-temperature pressing treatment, then brushing insulating paint on the upper surface of the electrolytic copper foil, and then carrying out screen printing to obtain the PCB.
6. The method of manufacturing according to claim 5, further comprising: and step four, adhering the power device on the PCB.
7. The method according to claim 5 or 6, wherein in the first step, the heating treatment is carried out in an inert gas at a temperature of 1000 to 1200 ℃ for a time of 20 to 40s; preferably, the atomization treatment is carried out in an ultrasonic atomizer; preferably, the particle size of the carbon material particles is 1 to 10 μm.
8. The production method according to any one of claims 5 to 7, wherein in step one, the mass of the carbon material particles accounts for 10wt% to 30wt% of the mass of the dope; preferably, the solvent is an aminophenol organic solvent; preferably, the carbon material is dissolved in the solvent at the temperature of 100-300 ℃ for 1-2 h.
9. The production method according to any one of claims 5 to 8, wherein in the second step, the coating material is applied to the upper surface of the metal base layer by using a coater; preferably, the temperature of the drying treatment is 60-100 ℃ and the time is 30-60 s.
10. The production method according to any one of claims 5 to 9, wherein in the third step, the high-temperature press-fitting treatment is performed in a vacuum press-fitting machine, the temperature of the high-temperature press-fitting treatment is 800 ℃ to 1200 ℃, the pressure is 1MPa to 10MPa, and the holding time is 30s to 60s.
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| CN202211062696.1A CN115442955B (en) | 2022-08-31 | 2022-08-31 | PCB (printed circuit board) applied to battery module and preparation method thereof |
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| CN202211062696.1A CN115442955B (en) | 2022-08-31 | 2022-08-31 | PCB (printed circuit board) applied to battery module and preparation method thereof |
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| CN115442955B CN115442955B (en) | 2023-06-20 |
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Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106888548A (en) * | 2017-03-07 | 2017-06-23 | 常州轻工职业技术学院 | A kind of aluminium-based copper-clad laminate and its painting method with graphene/carbon nano-tube composite radiating coating |
| US20190116657A1 (en) * | 2017-10-18 | 2019-04-18 | Stryke Industries, LLC | Thermally enhanced printed circuit board architecture for high power electronics |
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Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106888548A (en) * | 2017-03-07 | 2017-06-23 | 常州轻工职业技术学院 | A kind of aluminium-based copper-clad laminate and its painting method with graphene/carbon nano-tube composite radiating coating |
| US20190116657A1 (en) * | 2017-10-18 | 2019-04-18 | Stryke Industries, LLC | Thermally enhanced printed circuit board architecture for high power electronics |
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