CN1154420C - 风扇散热器连接夹板 - Google Patents
风扇散热器连接夹板 Download PDFInfo
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- A—HUMAN NECESSITIES
- A44—HABERDASHERY; JEWELLERY
- A44B—BUTTONS, PINS, BUCKLES, SLIDE FASTENERS, OR THE LIKE
- A44B99/00—Subject matter not provided for in other groups of this subclass
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F7/00—Elements not covered by group F28F1/00, F28F3/00 or F28F5/00
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4093—Snap-on arrangements, e.g. clips
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
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- H—ELECTRICITY
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- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T24/00—Buckles, buttons, clasps, etc.
- Y10T24/44—Clasp, clip, support-clamp, or required component thereof
- Y10T24/44017—Clasp, clip, support-clamp, or required component thereof with specific mounting means for attaching to rigid or semirigid supporting structure or structure-to-be-secured
- Y10T24/44026—Clasp, clip, support-clamp, or required component thereof with specific mounting means for attaching to rigid or semirigid supporting structure or structure-to-be-secured for cooperating with aperture in supporting structure or structure-to-be-secured
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Abstract
夹板(10)连接散热器(12)柱片和风扇(11)。夹板包括具有能够插入散热器(12)散热片间的一定宽度的框架,翅片由框架向下延伸靠在散热器散热片上用于连接散热器和框架,夹板(10)通过向上延伸的舌啮合在散热器(12)上某一位置上,当夹板(10)向自由方向推动时,可以松脱。
Description
发明的技术领域
本发明涉及一种连接风扇和需冷却的散热器的连接夹板。
背景技术
一些半导体装置在运转过程中产生的热量必须散去以避免损坏装置。一些相类似的装置中在散去内部产生的热量或由于避免正常的或局限热量降低和内部的故障,在很大程度决定了具有功率小的局限性。
在一些半导体装置中,内部产生的热量通过外壳、顶端或连线装置即可以完全散去。然而,在很多半导体装置中,用散热器帮助来散去内部产生的热量还是必要的。各种各样的散热器设计可用于由半导体装置构成的电子设备。对于本发明的目的,提供一种安装在电子设备上用于传递半导体装置内部产生的热量并通过传导、对流、热辐射方式快速地散去热量的由金属或类似材料制成的散热器。
美国专利4,884,331-Hinshaw公开了一种具有广泛用途的散热器,通常归类于柱片式散热器。散热器的柱片是直立的,行和列是平行的。散热器首先压成直立且平行的片,然后横向切割成具有行和列的柱片。
这些装置常常被适当地用于电子设备上,然而,在很多应用上,在散热器上面加一个使冷空气流动的风扇是理想的。首选的技术方案是在风扇的装配孔和散热器柱片之间插入螺丝或连接件,但这不能令人满意,因为通常散热器上的柱片之间的空间与风扇的装配孔不在一条直线上,本发明的连接夹板解决了这些问题。
发明内容
本发明的目的是提供一种使风扇装配更加容易的装置。
按照本发明,该连接夹板具有能够插入散热器片之间一定宽度的框架,本连接夹板具有可靠的连接固定风扇和框架的装置,该装置包括直立角柱,用于啮合风扇和框架;框架插入散热器的柱片间并卡在适当的位置,框架长方形的形状刚好适合所述散热器的行和列。
框架是由弹性薄金属板材制成,叶片从框架向下延伸靠在散热器的散热片上,叶片可插入散热柱片的行和列交叉的空隙之间;叶片有向下的弧形缺口用于容纳线夹,该线夹连接器用于连接散热器和底座。
本发明的连接夹板,当将其安装于由横向切割成型的柱片列间时具有显著的优点,横向切割的柱片列间的间隙狭窄并且尺寸是一定的,因为这些,本发明的连接夹板总是可以提供较好的啮合并卡在散热器上。其它方面,压出柱片行间间隙都要依赖于散热器的尺寸。一种尺寸的连接夹板将不能插入所有的散热器压出的柱片。
本发明的插入柱片的呈横向间隙插入式连接夹板还具有另一个显著的优点,这种散热片在压出方向上具有很好的强度。同时提供了使连接夹板卡住的反作用力。
本发明的连接夹板可以适应不同尺寸的散热器,也可以适应不同尺寸的风扇。本发明的连接夹板能够插入相对来说较长或较短的散热器柱片间。在长柱片的散热器上,连接夹板不能到达底部,但是,可以牢固地卡在一定位置上。
这种连接夹板能够用于各种类型的风扇上,包括在角部带有孔或槽的风扇。进一步按照本发明,框架的叶片有弧形缺口,该弧形缺口用于将Z形连接夹夹在散热器上。这种Z形连接夹用于连接散热器和底座,可靠地连接电子设备上的散热器。
对于本发明上述内容和其它目的、特征和优点通过下面的更详细描述和权利要求将更加清楚。
附图说明
图1是本发明的风扇,散热器和连接夹板的立体分解图;
图2是本发明连接夹板的俯视图;
图2A是本发明连接夹板A-A视图;
图3是本发明连接夹板的前视图;
图4是本发明连接夹板的前侧视图;
图5是风扇,本发明连接夹板,Z形弹簧支架,柱片式散热器,电子装置和卡子的分解图;
具体实施方式
本发明连接夹板10包括具有能够插入散热器12片间宽度的框架,散热器12是按上述331-Hinshaw专利制成的那种类型,它一行上具有柱片14,16,…18并具有同样的片在其它平行的行上,散热器的行是工厂经过压制而成形,而后再横向切割成柱片,例如:柱片18,20,…在第一列,而且有连续平行的柱片列。
夹板10具有能够插入散热器平行柱片间的宽度。叶片24,26从架子向下延伸,(在下文的词“向上”和“向下”将用来描述图中的视图元素,依赖于那些方向的视图可以更清楚地理解相关主题)叶片24和26插入散热器柱片后牢固地靠在散热柱片和框架上,框架的侧边23、25插入相邻柱片的列间,27、28插入相邻柱片的行间。
接头30,32,34和36插入时卡在散热器柱架上。接头34延伸从叶片折线38(附图4)处向上向外弯出,接头对着离开散热器的方向运动而锁定啮合在散热片上,当向上的压力作用以便框架锁在散热器时,接头插入散热器柱片材料中。
连接夹板是由弹性材料制成,如不锈钢或电镀钢。连接夹板由弹性薄板材料成形,正如叶片24和26的薄片宽度介于柱片的列宽,每一叶片的间距等于一行或多行柱片的间距。
直立的角柱40-43将风扇11牢固啮合在连接夹板10上,在附图2A可以更好的观察,每个角柱是分叉的,以便在推入风扇的槽44时压住。角柱也可以推入风扇的装配孔。每个角柱上有倒勾47,48。倒勾迅速卡在风扇的槽44-46上锁住了风扇和夹板,换句话说当风扇的孔由槽替代时,倒勾插入孔中锁住风扇和夹板。
框架的两个边缘49是弯曲向上的加强筋,保证了框架的坚固性。
每个翅片有一个弧形缺口50。
弧形缺口50容纳在牢固连接散热器座线夹52(附图5)。产品目录中90-HS-11第15页-第29页谈到铁镍耐磨耐热合金,铁镍耐磨耐热合金半导体附件,表示与散热器连接的电子装置。Z形夹52是由连接夹板10上的叶片上的弧形缺口50夹住的,Z形夹是通过底座54上的突出物53插入的,在这种形式下,插座的装配件54,电子装置55,散热器12,连接夹板10和风扇11是结合在一起的。
其它具体实施方案都包括在本发明内的实质范围内。在后面的权利要求将覆盖这些具体方案。
Claims (15)
1.(修改〕用于可靠连接具有直立平行散热片的散热器和冷却风扇的连接夹板,所述的连接夹板包括以下配件:
具有能够插入所述散热器散热片的一定宽度的框架;
用于将所述风扇固定到所述框架的装置包括直立角柱,用于啮合风扇和框架;
叶片从框架向下延伸靠在散热器的散热片上,叶片有向下的弧形缺口用于容纳线夹,该线夹连接器用于连接散热器和底座。
2.按权利要求1所述的连接夹板,其特征在于上述框架包括两个向下伸出的叶片。
3.按权利要求1所述的连接夹板,其特征在于还包括:
所述散热器的散热片与框架间用于锁定的连接装置。
4.按权利要求3所述的夹板,其特征在于所述适于锁定的连接装置包括从所述叶片伸出的接头,所述接头沿着弯折线向上向外伸出,叶片的向外弯曲的接头克服向上方向的运动而啮合锁定在散热片上。
5.按权利要求1所述的连接夹板,其特征在于框架是弹性金属材料。
6.按权利要求5所述的连接夹板,其特征在于所述框架是由所述弹性金属薄板成形的。
7.按权利要求6所述的连接夹板,其特征在于其中一定宽度的上述薄板材料形成的叶片适合插入散热器柱片列间。
8.按权利要求1所述的连接夹板,其特征在于上述叶片至少跨过两行柱片。
9.按权利要求1所述的连接夹板,其特征在于上述框架具有用于连接风扇的角柱,啮合在风扇上。
10.按权利要求9所述的连接夹板,其特征在于每个角柱是分叉的。
11.按权利要求10所述的连接夹板,其特征在于每个角柱顶部有倒勾。
12.按权利要求1所述的连接夹板,其特征在于上述框架的边缘有向上折起的加强筋,用于加固框架。
13.用于连接具有直立平行散热片的散热器和冷却所述散热器的风扇的连接夹板包括:
一个具有能够插入散热器散热片间的一定宽度的框架;
用于连接风扇的框架包括角柱,啮合在风扇上;
叶片由框架向下延伸支承在散热片上以将所述框架固定到该散热器上;由叶片延伸的接头把框架锁定在散热器的散热片间,该接头向上延伸并在折线处向外弯出,并阻止向上运动而啮合锁定在散热片上。
14.按权利要求13所述的夹板,其特征在于上述叶片下部有弧形缺口,用于容纳连接散热器与底座的线夹。
15.装配件包括:
一个具有平行散热柱片的散热器;
一个用于冷却散热器的风扇;
一个底座;
一个装于底座和散热器间的电子装置;
一个用于连接散热器和风扇的连接夹板,包括:
一个具有能够插入散热器散热片间的一定宽度的框架;
一个连接框架和风扇的装置;
一种叶片,叶片由框架向下延伸靠在散热器散热片上,下部有弧形缺口,用于容纳连接散热器与底座的线夹。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/482,011 | 1995-06-07 | ||
US08/482,011 US5590025A (en) | 1995-06-07 | 1995-06-07 | Fan attachment clip for heat sink |
Publications (2)
Publication Number | Publication Date |
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CN1187109A CN1187109A (zh) | 1998-07-08 |
CN1154420C true CN1154420C (zh) | 2004-06-23 |
Family
ID=23914279
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CNB961946466A Expired - Fee Related CN1154420C (zh) | 1995-06-07 | 1996-06-06 | 风扇散热器连接夹板 |
Country Status (9)
Country | Link |
---|---|
US (1) | US5590025A (zh) |
EP (1) | EP0833578B1 (zh) |
JP (1) | JPH11507764A (zh) |
KR (1) | KR19990022518A (zh) |
CN (1) | CN1154420C (zh) |
DE (1) | DE69623121T2 (zh) |
HK (1) | HK1016038A1 (zh) |
MY (1) | MY112056A (zh) |
WO (1) | WO1996039889A1 (zh) |
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CN101504689B (zh) * | 2009-03-26 | 2010-04-21 | 北京航空航天大学 | 散热器优化参数确定方法 |
US7895843B1 (en) | 2009-11-30 | 2011-03-01 | Whirlpool Corporation | Refrigerator with one piece fan motor mount |
CN102802378A (zh) * | 2011-05-27 | 2012-11-28 | 鸿富锦精密工业(深圳)有限公司 | 散热装置及使用该散热装置的电子装置 |
CN202231000U (zh) * | 2011-10-19 | 2012-05-23 | 中磊电子股份有限公司 | 以扣具固定的电子装置 |
CN103365365A (zh) * | 2012-03-28 | 2013-10-23 | 鸿富锦精密工业(深圳)有限公司 | 风扇固定装置 |
TW201422916A (zh) * | 2012-12-14 | 2014-06-16 | Hon Hai Prec Ind Co Ltd | 導風罩及散熱裝置 |
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GB2204181B (en) * | 1987-04-27 | 1990-03-21 | Thermalloy Inc | Heat sink apparatus and method of manufacture |
US5309983B1 (en) * | 1992-06-23 | 1997-02-04 | Pcubid Computer Tech | Low profile integrated heat sink and fan assembly |
US5299632A (en) * | 1993-02-19 | 1994-04-05 | Lee Lien Jung | Fin device for an integrated circuit |
US5287249A (en) * | 1993-07-07 | 1994-02-15 | Global Win Technology Co., Ltd. | Fin assembly for an integrated circuit |
US5386338A (en) * | 1993-12-20 | 1995-01-31 | Thermalloy, Inc. | Heat sink attachment assembly |
US5421402A (en) * | 1994-11-22 | 1995-06-06 | Lin; Chuen-Sheng | Heat sink apparatus |
GB2298520B (en) * | 1995-03-03 | 1999-09-08 | Hong Chen Fu In | Heat sink device for integrated circuit |
-
1995
- 1995-06-07 US US08/482,011 patent/US5590025A/en not_active Expired - Lifetime
-
1996
- 1996-06-06 KR KR1019970708999A patent/KR19990022518A/ko active IP Right Grant
- 1996-06-06 DE DE69623121T patent/DE69623121T2/de not_active Expired - Fee Related
- 1996-06-06 EP EP96917257A patent/EP0833578B1/en not_active Expired - Lifetime
- 1996-06-06 WO PCT/US1996/009433 patent/WO1996039889A1/en active IP Right Grant
- 1996-06-06 CN CNB961946466A patent/CN1154420C/zh not_active Expired - Fee Related
- 1996-06-06 JP JP9501753A patent/JPH11507764A/ja active Pending
- 1996-06-07 MY MYPI96002299A patent/MY112056A/en unknown
-
1998
- 1998-11-24 HK HK98112258A patent/HK1016038A1/xx not_active IP Right Cessation
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102494551A (zh) * | 2011-12-30 | 2012-06-13 | 三花丹佛斯(杭州)微通道换热器有限公司 | 用于换热器的支架和换热器组件 |
Also Published As
Publication number | Publication date |
---|---|
MY112056A (en) | 2001-03-31 |
EP0833578B1 (en) | 2002-08-21 |
DE69623121D1 (de) | 2002-09-26 |
EP0833578A1 (en) | 1998-04-08 |
DE69623121T2 (de) | 2003-04-24 |
HK1016038A1 (en) | 1999-10-29 |
EP0833578A4 (en) | 1998-09-16 |
US5590025A (en) | 1996-12-31 |
JPH11507764A (ja) | 1999-07-06 |
WO1996039889A1 (en) | 1996-12-19 |
CN1187109A (zh) | 1998-07-08 |
KR19990022518A (ko) | 1999-03-25 |
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