CN1074584C - 散热件固定组件 - Google Patents

散热件固定组件 Download PDF

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CN1074584C
CN1074584C CN94105223A CN94105223A CN1074584C CN 1074584 C CN1074584 C CN 1074584C CN 94105223 A CN94105223 A CN 94105223A CN 94105223 A CN94105223 A CN 94105223A CN 1074584 C CN1074584 C CN 1074584C
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heat sink
assembly
attachment assembly
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CN1104320A (zh
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W·D·乔丹
M·C·施米瑟斯
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Thermalloy Inc
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4093—Snap-on arrangements, e.g. clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T24/00—Buckles, buttons, clasps, etc.
    • Y10T24/44—Clasp, clip, support-clamp, or required component thereof
    • Y10T24/44017—Clasp, clip, support-clamp, or required component thereof with specific mounting means for attaching to rigid or semirigid supporting structure or structure-to-be-secured
    • Y10T24/44026—Clasp, clip, support-clamp, or required component thereof with specific mounting means for attaching to rigid or semirigid supporting structure or structure-to-be-secured for cooperating with aperture in supporting structure or structure-to-be-secured
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/4935—Heat exchanger or boiler making
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49826—Assembling or joining
    • Y10T29/49908—Joining by deforming
    • Y10T29/49925—Inward deformation of aperture or hollow body wall

Abstract

一种装配弹性夹，用以将散热件固定到器件封装件上。该弹性夹通过将其中间体放在一个夹子中固定到散热件上。夹子紧压在散热件的槽中。夹子由柔韧材料制成，带有一半圆形的支撑座，并从其两边伸出两个耳朵。压住耳朵可使支撑座直径减小，从而夹住中间体，且使耳朵中产生弹力，以使夹子夹在翅片与散热件间。弹性夹为一细长体，其两端由中间体轴线伸出。该两端可夹在底座或固定封装件的插座的承接件中，使散热件紧靠器件封装件固定。

Description

散热件固定组件
本发明总的说来涉及一种将电子零部件固定到到散热件上以进行散热而使用的器件。更具体地说，本发明涉及这样一种组合件，该组合件由弹性件和弹性夹组成，用以将散热件固定到电子器件封装件上，并固定成使散热件与电子器件封装件进行热交换。
随着微电子技术的发展，占用空间小又能履行多种电子功能的器件芯片的研制提到议事日程上来了。传统上，芯片是封装在外壳中使用的，外壳保护着芯片，使其免受周围环境的影响，并成了芯片与外部线路之间输入/输出联系的通路。由于封装插件不断朝微型化的方向发展，导致了这样的情况：在越来越小的空间产生了更多的热量，而封装件散热的构件却越来越少了。同样，应用化合物半导体的电子电路器件芯片的出现，进一步提高了对既能容纳工作温度更高的器件又能通过散热而控制器件温度的封装件的要求。
在许多器件封装件中，热量从芯片到封装件外面的传导是用高导热率的传热介质进行的，传热介质与芯片进行热交换，其散热表面靠近封装件表面。其它封装件有的只通过封装件本身传热。但无论如何，为了使封装件散热，器件封装件上必须固定一个外散热件。一般说来，散热件是由象金属之类导热率高的材料制成的。散热件通常至少有一个与器件封装件表面相邻配置的平的表面，还可以装有翅片、销或其它能将热量发散到周围大气中的构件。
为实际解决问题起见，散热件的占用空间应尽可能小，同时能散除最大量的热。此外，散热件最好不难从器件封装件上装卸，而且适宜与各种各样不同的器件封装件连接。在装配工艺中采用大量器件的情况下，为经济起见，要求装配工艺(包括散热件等的装配)简单，可以自动化，应用面广，而且可靠。因此用粘合剂、螺钉、螺栓等来固定散热件的作法都是不值得提倡的。同简单的夹子等进行固定倒是更可取的，因为这样做快速，而且通常非常容易。
过去试图将散热件固定到芯片或芯片外壳上的作法往往减小了可能有的散热表面积的大小，并且不能牢固地固定散热件。颁发给Blomqnist的题为“散热组件”的美国专利5,208,731和颁发给Koga的题为“散热件的安装方法”的日本专利71154中所公开的内容就是这方面的典型例子。在Koga和Blomquist的专利中，固定组件由搭锁式夹子组成，而安装这些夹子所需用的力必须施加在散热件的各个销子或各个翅片之间的平面内，因而散热件的销或翅片有损伤的危险。此外，固定组件并没有固定在散热件上，因此，散热件从芯片外壳上卸除时，夹子成了松散元件，如果掉下来就可能造成事故。此外，在上述专利公开的方案中，不可能预装配散热件和固定组件。否则，将固定组件固定到散热件上的工作必须和电路器件的安装同时进行。因此，需要有一种经过改进的、在装配到器件封装件之前就能固定到散热件上的、且在装配过程中可以减少散热件和器件封装件损伤风险的散热件固定组件。此外，还需要有一种占用空间极小使之不会对散热件的散热性能产生不利影响的固定组件。
按照本发明提供的散热件固定组件中，采用简单的弹性夹将散热件固定到一个插座、底座或其它固定支座上，以便将散热件固定到器件封装件上。用薄矩形金属片冲压成 形而制成的夹子将弹性夹安装件固定到散热件上。
Figure C9410522300052
的半圆形部分形成支撑座，从支撑座每端延伸的耳朵略向上转动，形成一个用以承接弹性夹的间隙。弹性夹有一个细长的放在夹子半圆形的支撑座上的基本部分，该部分横过散热件的一个表面。该组件一旦在散热件的各销子之间就位，销子就把夹子的耳朵推紧在一起，使两耳之间的间隙和支撑座的直径变小。通过支撑座直径和耳朵间隙的缩小，弹性夹的基本部分就被夹子夹紧，牢牢固定就位。由于无需修正散热件，因而使本散热件固定组件的造价降到最低程度。
本发明可取各种形式，而且适用于各种各样的装配作业中。用该固定组件固定到散热件上的方法简化了散热件的装配工作，因而既降低了费用又更加可靠。此外，还可以对此固定组件进行预装配。从下面参照所附权利要求书和附图所作的说明可以更清楚地了解本发明的其它特点和优点。附图中：
图1是由一个器件封装件、一个固定底座和采用本发明的散热件固定组件组成的组合件的部件分解视图；
图2是图1所示组合件的透视图；
图3是图1所示的散热件和散热件固定组件通过3-3线截取的片段剖视图；
图4是图1所示散热件固定组件的透视图。
图1和图2中结合散热件30、电子器件封装件10和装配底座20示出了本发明的最佳实施例。从图中可以看到，散热件固定组件50包括弹性夹41和夹子45。图示的散热件30的本体31由例如铝、铝合金、铜或诸如此类的导热材料制成，具有基本上为平的第一主表面35和从相对面伸出的细长销33。本最佳实施例中，销体33是通过横向切割预先在本体31中挤压形成的平行翅片或通过锯割本体31中的平行构槽而形成的。无论用哪一种方法进行制造，本体31至少总有多条平行沟槽或沟道34在第一方向上延伸，形成翅片33，用以将热量从本体31传到周围的大气中。
散热件固定组件的最佳实施例为弹性夹组件50，该组件包括一个弹性夹41，它有一段细长的中间本体部分42，形成主轴线。中间本体部分42带有两个夹臂43和44，它们在大致相反的方向上垂直于中间本体部分42的轴线延伸，形成基本上为Z字形的器件。各夹臂的端部43a和44a向上弯，并带有扁平的柄部43b和44b，供与一定位件接合之用。弹性夹41可以用任何既可挠曲又有回弹性的适当材料制成，例如钢、铝等制成的棒条或粗金属丝。夹子45由薄的矩形金属片制成，冲压成 形。应该指出的是，夹子45可以由任何既可挠曲又有回弹性的适当材料制成，例如钢、铝、塑料等等。
Figure C9410522300072
的半圆形部分形成支撑座47，从支撑座47两边伸出的耳朵46略为向上转动。耳朵46的外侧边形成支撑46a，以便顶往散热件30的翅片33。耳朵46和支撑座47的交界处形成两个边缘47a。两边缘47a之间的间隔形成间隙48。
在尚未装配的情况下，间隙48大于弹性夹41中间体部分42的直径，使中间体部分42可放入支撑座47中。弹性夹41放入支撑座47中后，散热件固定组件50就可以装到散热件30上，如图3中所示。可是要装配组件50，必须压住两个耳朵46以绕过散热件30的翅片33，因为在未装配情况下，两耳朵46的支撑面46a之间的间距大于散热件30的相邻翅片33之间的间距。压住耳朵46后，组件50就可以放到散热件30的沟槽34中。在装配好的情况下，耳朵46的支撑面46a就顶在相邻的翅片33的表面33a上，使支撑座47的间隙48和直径减小，从而使弹性夹41的细长的中间体42夹持在夹子45的支撑座47中。中间体部分42这样夹住后，弹性夹41就作为轴颈而夹在支撑座47中，于是在其中固定住。两端部分43、44放到主体31的相对两侧，而中间部分42由夹子45夹在翅片33之间。
图1和2示出了采用分组件30将散热件固定到电子器件封装件上的情况。在所示的实施例中，底座20有一敞开的中间部分22和一凹下去的凸缘23，该底座20将器件封装件10的周边支撑住。须知，底座20仅仅是用来将散热件30固定到器件封装件10上的，因此视封装件10的结构可取多种形式。举例说，底座20可以只承接封装件10的各角隅，或者取托板或夹子的形式而附加到器件封装件10周边的一部分上。底座20，无论其实际配置方式如何，都是用以承接弹性夹41的柄部43b、44b的。在所示的实施例中，在底座20的靠近对角线的角隅的相对两边各有一个横向向外延伸的凸出部分24。如图1和2中所示，器件封装件10安置在底座20内，散热件30的平面35紧靠器件封装件10的顶面。散热件组合件是通过将柄部43b、44b压入底座20上的凸出部分24下方而固定在一起的。
应该知道，将弹性夹41固定到散热件本体31上后，就可以作为一个单元分组件30而装运、搬运和装配。各部件固定在一起，不仅解决了与部件松散有关的许多问题，而且将分组件30固定到器件封装件10上就容易得多，甚至可以自动化进行。还应该知道的是，在电子器件配置在诸如插座之类的装配器材上的情况下，可以完全取消底座20。插座可以有象凸出部分24那样的供承接弹性夹的柄部43b、44b，或者可以将弹性夹的柄部43b、44b制成使其可装入装配器材内或下方的凹口中。利用本发明的分组件可以设计出将弹性夹的端部固定到装配器材上的各种其它方案。
虽然本发明是就固定到底座的Z形弹性夹进行说明的，但本发明的这一形式应视为说明其原理的例子而已。弹性夹41可以取其它各种形状，但必须能如本说明书所述的那样可以固定到散热件上。因此，不言而喻，这里所展示和说明的本发明的各种形式的细节应视为例子而已，在不脱离所附权利要求书中所述的本发明精神实质和范围的前提下是可以对这些实例进行种种更改、修改和重新安排的。

Claims (9)

1．一种散热件固定组件，包括：
(a)一个散热件，其本体由导热材料制成，具有至少一个基本上为平的第一主表面和一个基本上平行于所述第一主表面的第二主表面，从该第二主表面上至少有两个翅片伸出，且基本上垂直于所述第一主表面延伸；
(b)一个装配器件，其中间部分细长；
(c)一个夹子，安置和固定在所述翅片之间，用以在所述散热件内承接并夹住所述装配器件的所述中间部分；
(d)一个电子器件封装件，该封装件有一大致平的主表面，安置成靠近所述散热件的第一主表面，以便与所述第一主表面进行热交换；和
(e)一个装配器材，与所述装配器件配合工作，以便将所述散热件固定到所述电子器件封装件上。
2．如权利要求1所述的散热件固定组件，其特征在于，所述夹子有一个通常呈半圆形用以承接所述装配器件的中间部分的支撑座和从所述支撑座两边伸出的两个耳朵，其间形成一个开口，所述两耳朵夹紧到一起时，该开口的尺寸减小。
3．如权利要求1所述的散热件固定组件，其特征在于，所述散热件有多个翅片从所述第二主表面伸出，形成多个平行于所述翅片并处在所述翅片之间的沟槽。
4．如权利要求3所述的散热件固定组件，其特征在于，所述翅片由成排的柱体形成。
5．如权利要求1所述的散热件固定组件，其特征在于，所述装配器件有一个细长的中间部分，形成第一轴线，和两个端部部分，从所述中间部分在基本上垂直于所述中间部分轴线的方向上延伸。
6．如权利要求1所述的散热件固定组件，其特征在于，所述装配器件是由弹性材料制成的细长体，有一个中间体部分和从所述中间体部分以大致相反的方向延伸的两个端部。
7．如权利要求1所述的散热件固定组件，其特征在于，所述装配器材包括一个插座，用以接纳从所述电子器件封装件伸出的输入/输出引线。
8．如权利要求1所述的散热件固定组件，其特征在于，所述装配器材包括一个开口的底座，用以围绕其周边承接和支撑电子器件封装件。
9．如权利要求1所述的散热件固定组件，其特征在于，所述装配器件包括由弹性材料制成的细长的本体，具有中间体部分和从该中间体部分向基本上相反的方向延伸的两端。
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CN103206873A (zh) * 2012-01-14 2013-07-17 优杰精密机械(苏州)有限公司 一种散热器及其加工工艺
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GB2284937A (en) 1995-06-21
TW332721U (en) 1998-05-21
HK1006631A1 (en) 1999-03-05
GB2284937B (en) 1997-05-28
US5386338A (en) 1995-01-31
GB9409748D0 (en) 1994-07-06
US5428897A (en) 1995-07-04
DE4445541A1 (de) 1995-06-22
JP3426368B2 (ja) 2003-07-14
DE4445541B4 (de) 2007-01-04
JPH07202091A (ja) 1995-08-04
KR950023262A (ko) 1995-07-28

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