CN115428166B - 半导体装置、储层计算系统以及半导体装置的制造方法 - Google Patents
半导体装置、储层计算系统以及半导体装置的制造方法Info
- Publication number
- CN115428166B CN115428166B CN202080099700.4A CN202080099700A CN115428166B CN 115428166 B CN115428166 B CN 115428166B CN 202080099700 A CN202080099700 A CN 202080099700A CN 115428166 B CN115428166 B CN 115428166B
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- H—ELECTRICITY
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- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
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- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
- G06N3/00—Computing arrangements based on biological models
- G06N3/02—Neural networks
- G06N3/04—Architecture, e.g. interconnection topology
- G06N3/044—Recurrent networks, e.g. Hopfield networks
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- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
- G06N3/00—Computing arrangements based on biological models
- G06N3/02—Neural networks
- G06N3/06—Physical realisation, i.e. hardware implementation of neural networks, neurons or parts of neurons
- G06N3/063—Physical realisation, i.e. hardware implementation of neural networks, neurons or parts of neurons using electronic means
- G06N3/065—Analogue means
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- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
- H10D62/117—Shapes of semiconductor bodies
- H10D62/118—Nanostructure semiconductor bodies
- H10D62/119—Nanowire, nanosheet or nanotube semiconductor bodies
- H10D62/122—Nanowire, nanosheet or nanotube semiconductor bodies oriented at angles to substrates, e.g. perpendicular to substrates
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- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/80—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials
- H10D62/82—Heterojunctions
- H10D62/824—Heterojunctions comprising only Group III-V materials heterojunctions, e.g. GaN/AlGaN heterojunctions
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- H10D64/00—Electrodes of devices having potential barriers
- H10D64/111—Field plates
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- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D8/00—Diodes
- H10D8/01—Manufacture or treatment
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- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D8/00—Diodes
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- H10D8/75—Tunnel-effect PN diodes, e.g. Esaki diodes
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- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
- H10D84/01—Manufacture or treatment
- H10D84/0112—Integrating together multiple components covered by H10D8/00, H10D10/00 or H10D18/00, e.g. integrating multiple BJTs
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- H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
- H10D84/01—Manufacture or treatment
- H10D84/02—Manufacture or treatment characterised by using material-based technologies
- H10D84/05—Manufacture or treatment characterised by using material-based technologies using Group III-V technology
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- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
- H10D84/201—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of only components covered by H10D1/00 or H10D8/00, e.g. RLC circuits
- H10D84/204—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of only components covered by H10D1/00 or H10D8/00, e.g. RLC circuits of combinations of diodes or capacitors or resistors
- H10D84/221—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of only components covered by H10D1/00 or H10D8/00, e.g. RLC circuits of combinations of diodes or capacitors or resistors of only diodes
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- H—ELECTRICITY
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- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
- H10P14/24—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials using chemical vapour deposition [CVD]
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- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
- H10P14/27—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials using selective deposition, e.g. simultaneous growth of monocrystalline and non-monocrystalline semiconductor materials
- H10P14/271—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials using selective deposition, e.g. simultaneous growth of monocrystalline and non-monocrystalline semiconductor materials characterised by the preparation of substrate for selective deposition
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- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
- H10P14/27—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials using selective deposition, e.g. simultaneous growth of monocrystalline and non-monocrystalline semiconductor materials
- H10P14/271—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials using selective deposition, e.g. simultaneous growth of monocrystalline and non-monocrystalline semiconductor materials characterised by the preparation of substrate for selective deposition
- H10P14/272—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials using selective deposition, e.g. simultaneous growth of monocrystalline and non-monocrystalline semiconductor materials characterised by the preparation of substrate for selective deposition using mask materials other than SiO2 or SiN
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- H—ELECTRICITY
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- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
- H10P14/34—Deposited materials, e.g. layers
- H10P14/3402—Deposited materials, e.g. layers characterised by the chemical composition
- H10P14/3414—Deposited materials, e.g. layers characterised by the chemical composition being group IIIA-VIA materials
- H10P14/3421—Arsenides
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- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
- H10P14/34—Deposited materials, e.g. layers
- H10P14/3402—Deposited materials, e.g. layers characterised by the chemical composition
- H10P14/3414—Deposited materials, e.g. layers characterised by the chemical composition being group IIIA-VIA materials
- H10P14/3422—Antimonides
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- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
- H10P14/34—Deposited materials, e.g. layers
- H10P14/3438—Doping during depositing
- H10P14/3441—Conductivity type
- H10P14/3442—N-type
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- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
- H10P14/34—Deposited materials, e.g. layers
- H10P14/3438—Doping during depositing
- H10P14/3441—Conductivity type
- H10P14/3444—P-type
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- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
- H10P14/34—Deposited materials, e.g. layers
- H10P14/3451—Structure
- H10P14/3452—Microstructure
- H10P14/3462—Nanowires
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Biomedical Technology (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Biophysics (AREA)
- General Health & Medical Sciences (AREA)
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- Molecular Biology (AREA)
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- General Engineering & Computer Science (AREA)
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- Mathematical Physics (AREA)
- Neurology (AREA)
- Electrodes Of Semiconductors (AREA)
- Nanotechnology (AREA)
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- Semiconductor Memories (AREA)
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Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2020/016567 WO2021210095A1 (ja) | 2020-04-15 | 2020-04-15 | 半導体装置、リザバーコンピューティングシステム及び半導体装置の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN115428166A CN115428166A (zh) | 2022-12-02 |
| CN115428166B true CN115428166B (zh) | 2026-04-14 |
Family
ID=78083574
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202080099700.4A Active CN115428166B (zh) | 2020-04-15 | 2020-04-15 | 半导体装置、储层计算系统以及半导体装置的制造方法 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US12363968B2 (https=) |
| EP (1) | EP4138141A4 (https=) |
| JP (1) | JP7384273B2 (https=) |
| CN (1) | CN115428166B (https=) |
| WO (1) | WO2021210095A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US12592279B2 (en) * | 2022-06-28 | 2026-03-31 | The Government Of The United States Of America, As Represented By The Secretary Of The Navy | Neural network hardware device and system |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB9421138D0 (en) * | 1994-10-20 | 1994-12-07 | Hitachi Europ Ltd | Memory device |
| US7335908B2 (en) * | 2002-07-08 | 2008-02-26 | Qunano Ab | Nanostructures and methods for manufacturing the same |
| JP2008511985A (ja) * | 2004-08-31 | 2008-04-17 | エージェンシー フォー サイエンス,テクノロジー アンド リサーチ | ナノ構造体及びそれを製造する方法 |
| WO2010062644A2 (en) * | 2008-10-28 | 2010-06-03 | The Regents Of The University Of California | Vertical group iii-v nanowires on si, heterostructures, flexible arrays and fabrication |
| JP5652827B2 (ja) * | 2009-09-30 | 2015-01-14 | 国立大学法人北海道大学 | トンネル電界効果トランジスタおよびその製造方法 |
| KR20120099441A (ko) * | 2009-10-22 | 2012-09-10 | 솔 발테익스 에이비 | 나노와이어 터널 다이오드 및 이의 제조 방법 |
| EP2378557B1 (en) | 2010-04-19 | 2015-12-23 | Imec | Method of manufacturing a vertical TFET |
| CA2864212A1 (en) * | 2011-02-10 | 2012-08-16 | The Royal Institution For The Advancement Of Learning/Mcgill University | High efficiency broadband semiconductor nanowire devices and methods of fabricating without foreign metal catalysis |
| CN104603952B (zh) | 2012-07-06 | 2017-07-21 | 昆南诺股份有限公司 | 径向纳米线江崎二极管装置和方法 |
| US9012883B2 (en) * | 2012-12-21 | 2015-04-21 | Sol Voltaics Ab | Recessed contact to semiconductor nanowires |
| US9730596B2 (en) * | 2013-06-28 | 2017-08-15 | Stmicroelectronics, Inc. | Low power biological sensing system |
| DE102016013749A1 (de) * | 2016-11-18 | 2018-05-24 | Azur Space Solar Power Gmbh | Stapelförmige Halbleiterstruktur |
-
2020
- 2020-04-15 WO PCT/JP2020/016567 patent/WO2021210095A1/ja not_active Ceased
- 2020-04-15 CN CN202080099700.4A patent/CN115428166B/zh active Active
- 2020-04-15 EP EP20931249.5A patent/EP4138141A4/en active Pending
- 2020-04-15 JP JP2022514920A patent/JP7384273B2/ja active Active
-
2022
- 2022-09-28 US US17/954,385 patent/US12363968B2/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| US12363968B2 (en) | 2025-07-15 |
| US20230015231A1 (en) | 2023-01-19 |
| WO2021210095A1 (ja) | 2021-10-21 |
| JPWO2021210095A1 (https=) | 2021-10-21 |
| JP7384273B2 (ja) | 2023-11-21 |
| EP4138141A4 (en) | 2023-06-07 |
| EP4138141A1 (en) | 2023-02-22 |
| CN115428166A (zh) | 2022-12-02 |
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