CN115426789A - PCB with bonding pads formed by electroplating board edges and manufacturing method thereof - Google Patents

PCB with bonding pads formed by electroplating board edges and manufacturing method thereof Download PDF

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Publication number
CN115426789A
CN115426789A CN202211208566.4A CN202211208566A CN115426789A CN 115426789 A CN115426789 A CN 115426789A CN 202211208566 A CN202211208566 A CN 202211208566A CN 115426789 A CN115426789 A CN 115426789A
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CN
China
Prior art keywords
pcb
treatment
board
electroplating
bonding pad
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Pending
Application number
CN202211208566.4A
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Chinese (zh)
Inventor
施德林
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Gultech Suzhou Electronics Co ltd
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Gultech Suzhou Electronics Co ltd
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Application filed by Gultech Suzhou Electronics Co ltd filed Critical Gultech Suzhou Electronics Co ltd
Priority to CN202211208566.4A priority Critical patent/CN115426789A/en
Publication of CN115426789A publication Critical patent/CN115426789A/en
Pending legal-status Critical Current

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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/40Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/403Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0201Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203Cooling of mounted components
    • H05K1/0204Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/40Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4007Surface contacts, e.g. bumps
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/40Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42Plated through-holes or plated via connections
    • H05K3/421Blind plated via connections

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

The application provides a method for manufacturing a PCB with a bonding pad formed by electroplating plate edges. The method comprises the following steps: obtaining a substrate generated after at least two layers of circuit boards are pressed; performing pre-fishing treatment on the preset position of the substrate to generate a PCB after primary treatment; and carrying out board edge electroplating on the PCB subjected to the primary treatment to form a bonding pad treatment, and generating the PCB which is finally manufactured. Therefore, the interconnected channels between the circuit boards are improved, the quality of transmission signals is improved, and the integration space is increased.

Description

PCB with bonding pads formed by electroplating board edges and manufacturing method thereof
Technical Field
The application relates to the technical field of PCB manufacturing, in particular to a PCB with a bonding pad formed by electroplating plate edges and a manufacturing method thereof.
Background
In the prior art, the circuit boards are generally connected by components or wires. Currently, as in chinese patent No.: the invention discloses a manufacturing method of a side wall bonding pad in CN112399728A, which comprises the following steps: s1: preparing a first substrate and a second substrate which are coated with copper on two sides; s2: cutting and drilling are sequentially carried out on the first substrate and the second substrate, and the drilling comprises the following steps: presetting the size and the position of a side wall bonding pad, wherein the preset side wall bonding pad comprises a horizontal plane and a vertical plane, the circle center of a drilled hole is positioned on a boundary line connecting the horizontal plane and the vertical plane, the diameter of the drilled hole is smaller than the length of the boundary line, and blind holes are formed in the first substrate and the second substrate after drilling and are half holes; s3: and filling holes in the blind holes, electroplating, and then performing outer layer pattern I, etching I and external inspection on the first substrate and the second substrate to obtain the side wall bonding pad. S4: pressing; s5: drilling, electroplating, etching a second outer layer pattern and etching the laminated PCB; s6: and (5) performing a post-process. The side wall bonding pad manufactured by the invention has good quality, high yield and easily controlled process, and is suitable for batch production.
In the process of realizing the prior art, the inventor finds that:
the existing side wall bonding pad is designed with an upper layer of blind holes and a lower layer of blind holes, is not conducted up and down and is not connected with an inner layer circuit of a circuit board, and cannot be conducted with the inner layer circuit of the circuit board through the side wall bonding pad, so that the circuit connection performance between the circuit boards is reduced.
Therefore, it is desirable to provide a circuit connection performance between circuit boards capable of improving the circuit connection performance between the circuit boards so as to solve the problem that the circuit connection performance between the circuit boards is reduced due to the non-conduction between the side wall bonding pad and the inner layer circuit of the board in the prior art.
Disclosure of Invention
The embodiment of the application provides a circuit connection performance between circuit boards can be improved so as to solve the problem that in the prior art, a side wall bonding pad is not conducted with an inner-layer circuit of a board, and the circuit connection performance between the circuit boards is reduced.
In a first aspect, the present invention provides a method for manufacturing a PCB board with pads formed by board edge plating, comprising the steps of:
obtaining a substrate generated after at least two layers of circuit boards are pressed;
performing pre-fishing treatment on the preset position of the substrate to generate a PCB after primary treatment;
and carrying out board edge electroplating on the PCB subjected to the primary treatment to form a bonding pad treatment, and generating the PCB which is finally manufactured.
Further to the PCB board after preliminary treatment carries out the electroplating of flange limit and forms the pad and handle, generates the PCB board of final preparation, specifically includes:
electroplating the PCB subjected to the primary treatment to generate a PCB subjected to intermediate first treatment;
processing the PCB after the intermediate first processing to generate a PCB which is finally manufactured;
and electroplating the PCB subjected to the primary treatment, wherein the electroplating treatment at least comprises the end surface of the PCB and the edge of the PCB.
Further, processing the intermediate first processed PCB to generate a final manufactured PCB, specifically including:
performing graphic electroplating treatment on the end face of the PCB subjected to the intermediate first treatment to generate an intermediate second-treated PCB with a surface bonding pad etched;
and drilling holes at preset positions of the holes on the board edges of the PCB subjected to the second treatment in the middle of the etched surface bonding pad to generate the PCB finally manufactured with the bonding pad formed by electroplating the board edges.
Further, the drilling at the preset drilling position is performed on the board edge of the PCB board after the second treatment of the middle part of the etched surface bonding pad, and the drilling specifically includes:
the drill hole is located between the surface pads at a predetermined position.
Furthermore, before the substrate is formed by laminating at least two layers of circuit boards, an inner-layer circuit which is pre-arranged at the position where the edge of the board is electroplated to form the bonding pad is arranged between the circuit boards.
Further, after the board edge electroplating is performed on the PCB board after the preliminary treatment to form a pad treatment, and a final manufactured PCB board is generated, the method further includes:
and carrying out post-processing treatment on the finally manufactured PCB.
Wherein the post-processing treatment at least comprises solder mask treatment.
In a second aspect, an embodiment of the present application further provides a PCB board with pads formed by board edge electroplating, which is manufactured by using any one of the methods in the first aspect.
The technical scheme provided by the embodiment of the application at least has the following beneficial effects: according to the PCB board with the pads formed by electroplating the board edges and the manufacturing method thereof, the pads on the surface of the PCB board manufactured by the method can be connected with the circuit in the inner layer of the board and the pads on the other surface through the pads on the side wall, the pads on the same layer are not conducted, and components can be welded; different circuit boards can be directly welded through the bonding pads on the side walls of the boards and can be conducted through different circuits. In addition, the side wall bonding pad can also be used for heat dissipation of the inner layer circuit, so that heat in the circuit board is conducted to the side wall bonding pad along the inner layer circuit for heat dissipation (the inner layer circuit and the side wall bonding pad are both made of copper, and the heat conductivity is very high); the side wall bonding pad can conduct a circuit or dissipate heat inside the circuit board according to design requirements.
Drawings
The accompanying drawings, which are included to provide a further understanding of the application and are incorporated in and constitute a part of this application, illustrate embodiment(s) of the application and together with the description serve to explain the application and not to limit the application. In the drawings:
fig. 1 is a schematic flow chart of a method for manufacturing a PCB board with a pad formed by plating a board edge according to an embodiment of the present disclosure.
FIG. 2 is a schematic diagram of a PCB structure with pads formed by plating board edges according to an embodiment of the present disclosure;
FIG. 3 isbase:Sub>A cross-sectional A-A schematic view ofbase:Sub>A PCB withbase:Sub>A sidewall pad according to the present invention shown in FIG. 2;
number in the figure: 100-PCB board with pads formed by board edge electroplating; 1-a surface pad; 2-inner layer circuit; 3-sidewall pads.
Detailed Description
In order to make the objects, technical solutions and advantages of the present application more apparent, the technical solutions of the present application will be described in detail and completely with reference to the following specific embodiments of the present application and the accompanying drawings. It should be apparent that the described embodiments are only a few embodiments of the present application, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
The embodiment of the invention provides a method for manufacturing a PCB (printed circuit board) with a bonding pad formed by electroplating board edges, which comprises the following steps of:
s110: and obtaining a substrate generated after at least two layers of circuit boards are pressed.
Specifically, at least two layers of circuit boards are pressed to form the substrate. The pressing can be realized by a hot press or other pressing modes. It can be understood that at least two layers of circuit boards, namely the expression substrate, are formed by laminating two or more layers of circuit boards.
Further, in a preferred embodiment provided by the present application, before the at least two layers of circuit boards are pressed to form the substrate, an inner layer circuit pre-placed at a position where a pad is formed on a board edge by electroplating is further disposed between the circuit boards.
Specifically, before the multilayer circuit board is pressed to form the substrate, the inner-layer circuit between the circuit board and the circuit board is placed to the position where the pad is formed by electroplating on the board edge, so that the pad formed by electroplating on the subsequent board edge can be connected with the inner-layer circuit to realize the conduction function.
S120: performing pre-fishing treatment on the preset position of the substrate to generate a PCB after primary treatment;
specifically, after the pressing of the substrate is completed, the pre-fishing treatment is carried out at the preset position of the substrate. The predetermined position of the substrate is the area to be plated on the edge of the plate. It can be understood that the pre-fishing treatment is to perform cutting treatment on the circuit board by adopting machining fishing, and then the PCB after primary treatment is generated. It can be understood that the pre-fishing treatment is performed on the preset position of the substrate, and the pre-fishing treatment performed on the preset position of the substrate mainly refers to the position where the pad is formed on the edge of the plate by electroplating,
s130: and carrying out board edge electroplating on the PCB subjected to the primary treatment to form a bonding pad treatment, and generating the PCB which is finally manufactured.
Further, in a preferred embodiment provided by the present application, the board edge electroplating is performed on the primarily processed PCB board to form a pad, so as to generate a finally manufactured PCB board, which specifically includes: electroplating the PCB subjected to the primary treatment to generate a PCB subjected to intermediate first treatment; processing the PCB after the intermediate first processing to generate a PCB which is finally manufactured; and electroplating the PCB subjected to the primary treatment at least comprises the end surface of the PCB and the plate edge of the PCB.
Specifically, the PCB after the primary treatment is subjected to electroplating treatment, mainly for copper cladding on the board edge to form a conducting layer. It can be understood that after the first processed PCB board is generated, the circuits of the inner layer pre-placed to the position where the board edge is electroplated to form the pad in the first processed PCB board are electrically connected with the surface pad.
It can be understood that the position of the electroplating treatment mainly comprises the end face of the PCB and the edge of the PCB, so as to realize the subsequent electroplating of the edge of the PCB to form the PCB of the bonding pad.
The electroplating treatment is a process of plating a thin layer of other metals or alloys on the surface of some metals by using the principle of electrolysis, and is a process of adhering a metal mold on the surface of a metal or other material workpiece by using the action of electrolysis so as to play roles of preventing corrosion, improving wear resistance, conductivity and light reflection, improving appearance and the like.
During electroplating, plating metal or other insoluble materials are used as an anode, a workpiece to be plated is used as a cathode, and cations of the plating metal are reduced on the surface of the workpiece to be plated to form a plating layer. In order to eliminate the interference of other cations and make the coating uniform and firm, a solution containing the metal cations of the coating is used as an electroplating solution to keep the concentration of the metal cations of the coating constant. The purpose of electroplating is to plate a metal coating on a substrate, altering the surface properties or dimensions of the substrate. Electroplating can enhance the corrosion resistance of metal (the plating metal is mostly corrosion-resistant metal), increase the hardness, prevent abrasion, and improve the conductivity, lubricity, heat resistance and surface beauty.
Further, in a preferred embodiment provided by the present application, the processing the PCB after the intermediate first processing to generate a finally manufactured PCB specifically includes: carrying out graphic electroplating treatment on the end face of the PCB subjected to the middle first treatment to generate a PCB subjected to the middle second treatment and etched to form a surface bonding pad; and drilling holes at preset positions of the holes on the board edges of the PCB subjected to the second treatment in the middle of the etched surface bonding pad to generate the PCB finally manufactured with the bonding pad formed by electroplating the board edges.
Specifically, the pattern plating process is mainly to etch out the surface pads. The pattern electroplating refers to a mode of electrolyzing copper ions into copper ions through a phosphor-copper ball under a sulfuric acid chemical reaction after copper deposition and full-plate copper electroplating processes, and performing directional charge movement by utilizing standard electrode potential difference. The method is a process that metallic copper ions in the electroplating bath solution are reduced into metal atoms through electrode reaction under the action of an external electric field and metal deposition is carried out on a cathode. And reserving the formed pattern layer and the hole copper layer after the outer layer circuit is developed, and plating copper again to ensure that the circuit and the hole copper meet the copper thickness specified by a customer. And plating protective tin after copper plating, and etching the protective circuit in the subsequent process.
Further, in a preferred embodiment provided by the present application, the drilling at the predetermined drilling position is performed on the board edge of the PCB board after the second processing in the middle of the etched surface pad, and specifically includes: the drill hole is located between the surface pads at a predetermined position.
Specifically, the board edge of the PCB board after the second treatment in the middle of the etched surface bonding pad is a conduction layer formed by electroplating copper, that is, the surface bonding pad is connected and conducted with the inner layer circuit. On the basis, drilling processing is carried out at the preset position of the plate edge drilling. It can be understood that the conducting layer formed by the copper-clad plate on the plate edge is drilled, and the drilling preset position is also positioned between the surface bonding pads, namely the side wall bonding pads connected with the upper surface bonding pads and the lower surface bonding pads are formed by the plating layer on the plate edge after the drilling treatment.
Further, in a preferred embodiment provided by the present application, after performing board edge electroplating on the primarily processed PCB to form a pad, and generating a finally manufactured PCB, the method further includes: and carrying out post-processing treatment on the finally manufactured PCB. Wherein the post-processing treatment at least comprises solder mask treatment. Specifically, after the final manufactured PCB is manufactured, post-processing may be performed on the final manufactured PCB. The post-processing treatment at least comprises solder mask treatment, surface treatment, electrical measurement treatment and the like.
The present application further provides a PCB board with a pad formed by plating a board edge, as shown in fig. 2 to 3, which is a PCB board 100 with a pad formed by plating a board edge, manufactured by the PCB board manufacturing method with a pad formed by plating a board edge. The PCB comprises a PCB and is characterized in that a circuit board surface bonding pad 1 is arranged on the surface of the PCB, an inner layer circuit 2 which is pre-placed to the position where a bonding pad is formed by electroplating on the edge of a board is arranged between circuit boards in the PCB, and a side wall bonding pad 3 is arranged on the edge of the board of the PCB. The PCB board manufactured by the PCB board manufacturing method for forming the bonding pad by electroplating the board edge can realize that the surface bonding pad can be connected with the inner layer circuit of the board and the bonding pad on the other surface through the side wall bonding pad, the bonding pads on the same layer are not conducted, and components can be welded. Two different circuit boards can be directly welded through the bonding pad on the side wall of the board and can be conducted through different circuits. In addition, the side wall bonding pad can also be used for heat dissipation of the inner layer circuit, and heat in the circuit board is conducted to the side wall bonding pad along the inner layer circuit to dissipate heat (the inner layer circuit and the side wall bonding pad are both made of copper, and the heat conductivity is very high). The side wall bonding pad can conduct a circuit or dissipate heat inside the circuit board according to design requirements.
The above description is only an example of the present application and is not intended to limit the present application. Various modifications and changes may occur to those skilled in the art. Any modification, equivalent replacement, improvement or the like made within the second principles of the present application shall be included in the scope of the claims of the present application.

Claims (7)

1. A method for manufacturing a PCB with a pad formed by electroplating board edges is characterized by comprising the following steps:
obtaining a substrate generated after at least two layers of circuit boards are pressed;
performing pre-fishing treatment on the preset position of the substrate to generate a PCB after primary treatment;
and electroplating the edge of the PCB subjected to the primary treatment to form a bonding pad, and generating the finally manufactured PCB.
2. The method of claim 1, wherein the board edge electroplating process is performed on the PCB board after the preliminary treatment to form a pad, and a final manufactured PCB board is generated, and the method specifically comprises:
electroplating the PCB subjected to the primary treatment to generate a PCB subjected to intermediate first treatment;
processing the PCB after the intermediate first processing to generate a PCB which is finally manufactured;
and electroplating the PCB subjected to the primary treatment, wherein the electroplating treatment at least comprises the end surface of the PCB and the edge of the PCB.
3. The method of claim 2, wherein processing the intermediate first processed PCB to generate a final manufactured PCB comprises:
carrying out graphic electroplating treatment on the end face of the PCB subjected to the middle first treatment to generate a PCB subjected to the middle second treatment and etched to form a surface bonding pad;
and drilling holes at preset positions of the holes on the board edges of the PCB subjected to the second treatment in the middle of the etched surface bonding pad to generate the PCB finally manufactured with the bonding pad formed by electroplating the board edges.
4. The method according to claim 3, wherein the drilling process at the preset drilling position is performed on the board edge of the PCB board after the second processing of the middle part of the PCB board with the etched surface bonding pad, and the drilling process specifically comprises the following steps:
the drill hole is located between the surface pads at a predetermined position.
5. The method of claim 1, wherein before the at least two layers of circuit boards are laminated to form the substrate, the circuit boards are further provided with an inner layer of circuits which are pre-arranged at positions where the pads are formed by electroplating on the board edges.
6. The method of claim 1, wherein the board edge plating process is performed on the PCB board after the preliminary process to form a pad process, and after the final PCB board is generated, the method further comprises:
and carrying out post-processing treatment on the finally manufactured PCB.
Wherein the post-processing treatment at least comprises solder mask treatment.
7. A PCB board having pads formed by plating the edges of the board, wherein the PCB board is manufactured by the method of any one of claims 1 to 6.
CN202211208566.4A 2022-09-30 2022-09-30 PCB with bonding pads formed by electroplating board edges and manufacturing method thereof Pending CN115426789A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202211208566.4A CN115426789A (en) 2022-09-30 2022-09-30 PCB with bonding pads formed by electroplating board edges and manufacturing method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202211208566.4A CN115426789A (en) 2022-09-30 2022-09-30 PCB with bonding pads formed by electroplating board edges and manufacturing method thereof

Publications (1)

Publication Number Publication Date
CN115426789A true CN115426789A (en) 2022-12-02

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ID=84206523

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202211208566.4A Pending CN115426789A (en) 2022-09-30 2022-09-30 PCB with bonding pads formed by electroplating board edges and manufacturing method thereof

Country Status (1)

Country Link
CN (1) CN115426789A (en)

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