CN115380382A - 发光基板和显示装置 - Google Patents

发光基板和显示装置 Download PDF

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Publication number
CN115380382A
CN115380382A CN202180000523.4A CN202180000523A CN115380382A CN 115380382 A CN115380382 A CN 115380382A CN 202180000523 A CN202180000523 A CN 202180000523A CN 115380382 A CN115380382 A CN 115380382A
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CN
China
Prior art keywords
electrode
light
substrate
layer
transistor
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Pending
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CN202180000523.4A
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English (en)
Inventor
龙春平
齐琪
赵欣欣
陈婉芝
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BOE Technology Group Co Ltd
Beijing BOE Technology Development Co Ltd
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BOE Technology Group Co Ltd
Beijing BOE Technology Development Co Ltd
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Publication date
Application filed by BOE Technology Group Co Ltd, Beijing BOE Technology Development Co Ltd filed Critical BOE Technology Group Co Ltd
Publication of CN115380382A publication Critical patent/CN115380382A/zh
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/36—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
    • H01L33/38—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes with a particular shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
    • H01L33/20—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular shape, e.g. curved or truncated substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/131—Interconnections, e.g. wiring lines or terminals

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroluminescent Light Sources (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

一种发光基板和显示装置。该发光基板(100)包括衬底基板(110)、电极平坦层(170)，位于衬底基板(110)上、电极层(180)位于电极平坦层(170)远离衬底基板(110)的一侧；电极层(180)包括第一电极(181)和第二电极(182)，第一电极(181)包括至少一个第一电极条(1810)，第二电极(182)包括至少一个第二电极条(1820)，至少一个第一电极条(1810)和至少一个第二电极条(1820)在第一方向上间隔且交替设置，各第一电极条(1810)和各第二电极条(1820)均沿第二方向延伸；电极平坦层(170)包括第一凹槽(171)，位于相邻的第一电极条(1810)和第二电极条(1820)之间；第一凹槽(171)被配置为容纳发光二极管(200)。该发光基板具有较高的发光效率、较高的寿命、较高的产品良率和较高的显示品质。

Description

PCT国内申请，说明书已公开。

Claims (18)

  1. PCT国内申请，权利要求书已公开。
CN202180000523.4A 2021-03-19 2021-03-19 发光基板和显示装置 Pending CN115380382A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2021/081847 WO2022193300A1 (zh) 2021-03-19 2021-03-19 发光基板和显示装置

Publications (1)

Publication Number Publication Date
CN115380382A true CN115380382A (zh) 2022-11-22

Family

ID=83321416

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202180000523.4A Pending CN115380382A (zh) 2021-03-19 2021-03-19 发光基板和显示装置

Country Status (4)

Country Link
US (1) US20230352624A1 (zh)
CN (1) CN115380382A (zh)
DE (1) DE112021001032T5 (zh)
WO (1) WO2022193300A1 (zh)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102402999B1 (ko) * 2015-08-31 2022-05-30 삼성디스플레이 주식회사 디스플레이 장치 및 이의 제조 방법
TWI668619B (zh) * 2017-07-07 2019-08-11 鴻海精密工業股份有限公司 微型led觸控顯示面板
KR102657126B1 (ko) * 2018-07-20 2024-04-16 삼성디스플레이 주식회사 발광 장치 및 이를 구비한 표시 장치
KR102581137B1 (ko) * 2018-08-29 2023-09-22 삼성디스플레이 주식회사 표시 장치
CN211265475U (zh) * 2020-02-20 2020-08-14 重庆康佳光电技术研究院有限公司 一种led显示器发光单元

Also Published As

Publication number Publication date
DE112021001032T5 (de) 2022-12-01
WO2022193300A1 (zh) 2022-09-22
US20230352624A1 (en) 2023-11-02

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