CN115376841B - Automatic capacitor stacking equipment and stacking method thereof - Google Patents
Automatic capacitor stacking equipment and stacking method thereof Download PDFInfo
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- CN115376841B CN115376841B CN202210834215.8A CN202210834215A CN115376841B CN 115376841 B CN115376841 B CN 115376841B CN 202210834215 A CN202210834215 A CN 202210834215A CN 115376841 B CN115376841 B CN 115376841B
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- jig
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- 239000003990 capacitor Substances 0.000 title claims abstract description 158
- 238000000034 method Methods 0.000 title claims abstract description 16
- 230000007246 mechanism Effects 0.000 claims abstract description 160
- 230000007306 turnover Effects 0.000 claims abstract description 47
- 238000009826 distribution Methods 0.000 claims abstract description 5
- 239000000853 adhesive Substances 0.000 claims description 15
- 230000001070 adhesive effect Effects 0.000 claims description 15
- 238000005476 soldering Methods 0.000 claims description 6
- 239000011248 coating agent Substances 0.000 claims description 4
- 238000000576 coating method Methods 0.000 claims description 4
- 239000004973 liquid crystal related substance Substances 0.000 claims description 4
- 238000004026 adhesive bonding Methods 0.000 claims description 2
- 239000003292 glue Substances 0.000 claims description 2
- 229920000297 Rayon Polymers 0.000 claims 1
- 230000008569 process Effects 0.000 abstract description 8
- 238000011084 recovery Methods 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 5
- 239000003985 ceramic capacitor Substances 0.000 description 3
- 230000007547 defect Effects 0.000 description 3
- 230000009471 action Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000004064 recycling Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G13/00—Apparatus specially adapted for manufacturing capacitors; Processes specially adapted for manufacturing capacitors not provided for in groups H01G4/00 - H01G11/00
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C13/00—Means for manipulating or holding work, e.g. for separate articles
- B05C13/02—Means for manipulating or holding work, e.g. for separate articles for particular articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
- B05C5/0208—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work for applying liquid or other fluent material to separate articles
- B05C5/0212—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work for applying liquid or other fluent material to separate articles only at particular parts of the articles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/38—Multiple capacitors, i.e. structural combinations of fixed capacitors
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
The utility model provides a capacitor automatic stacking equipment and stacking method thereof, includes turnover tool, first capacitor chip feed mechanism, point gum machine constructs, second capacitor chip feed mechanism, conveying mechanism and control mechanism. The turnover jig comprises a jig body, a stacking groove which downwards extends from the top of the jig body and is used for stacking the capacitor chips, and a fixing mechanism which is arranged inside the jig body and is used for fixing the capacitor chips. The control mechanism comprises a display mechanism and a power distribution control cabinet. When the capacitor stacking device is used, the turnover jig moves along with the conveying mechanism, sequentially passes through the first capacitor chip feeding mechanism, the dispensing mechanism and the second capacitor chip feeding mechanism, and then passes through the control mechanism, parameters of each mechanism are adjusted in the process of capacitor automatic stacking, smooth operation of an automatic stacking work flow is guaranteed, the operation is convenient, automatic stacking of the capacitors is realized, manual participation is not needed in the process, labor cost of enterprises is reduced, and stacking efficiency is improved.
Description
Technical Field
The invention belongs to the field of capacitors, and mainly relates to automatic capacitor stacking equipment and a turnover jig thereof.
Background
Along with the rapid and continuous development of science and technology, the requirements of small-size, large-capacity and high-power capacitors in the fields of power supply, industry, automobile, military industry, aerospace and the like are increasingly increased, the traditional single-chip ceramic capacitor is required to have large capacity, a bottleneck is reached in design and equipment, technological breakthrough is difficult to realize in a short period, the requirements of the market at the present stage on large capacity cannot be met, and therefore, the requirement of the capacitor on large capacity is met by a mode of parallel assembling a plurality of ceramic capacitors, and at present, a plurality of defects exist only by means of manual stacking by manpower: firstly, the positioning accuracy is low, and the stacked products often have the skew condition; secondly, the consistency of the products is poor, and different staff have differences in technical level and technique, so that the consistency of the products is difficult to maintain; third, the efficiency is low, the cost of labor is high, the market demand for large-capacity ceramic capacitors is increasing in multiple, enterprises must put more manpower into, the increase of the cost of labor is necessarily caused, and the efficiency of stacking the manpower is low.
Disclosure of Invention
The invention aims to overcome the defects of the prior art and provide automatic capacitor stacking equipment and a stacking method thereof, which have the advantages of high production efficiency, high product precision and convenient operation.
The invention adopts the following technical scheme:
the capacitor comprises a first capacitor chip, a second capacitor chip and an adhesive, wherein the first capacitor chip and the second capacitor chip are stacked up and down, the adhesive is arranged between the first capacitor chip and the second capacitor chip, and the capacitor comprises a turnover jig, a first capacitor chip feeding mechanism, an adhesive dispensing mechanism, a second capacitor chip feeding mechanism, a conveying mechanism and a control mechanism;
the turnover jig is used for stacking a first capacitor chip and a second capacitor chip and comprises a jig body, a stacking groove which extends downwards from the top of the jig body and is used for stacking the capacitor chips, and a fixing mechanism which is arranged inside the jig body and is used for fixing the capacitor chips;
the first capacitor chip feeding mechanism is used for stacking the first capacitor chips on the turnover jig;
the dispensing mechanism is used for coating adhesive on the top of the first capacitor chip;
the second capacitor chip feeding mechanism is used for stacking the second capacitor chip on the first capacitor chip;
the conveying mechanism is used for conveying the turnover jig to sequentially pass through the first capacitor chip feeding mechanism, the dispensing mechanism and the second capacitor chip feeding mechanism;
and the control system is respectively connected with the first capacitor chip feeding mechanism, the dispensing mechanism, the second capacitor chip feeding mechanism and the conveying mechanism so as to respectively control the mechanisms to work.
Further, the fixing mechanism comprises a first magnet and a second magnet which are arranged in the jig body and positioned on two adjacent contact surfaces of the stacking groove.
Further, the jig body is formed with a first mounting hole for mounting the first magnet and a second mounting hole for mounting the second magnet.
Further, the first magnet is located at the bottom of the stacking groove, and the second magnet is located at the side wall of the stacking groove.
Further, the first capacitor chip feeding mechanism comprises a first feeding disc used for placing the first capacitor chip, a first pickup device located above the conveying mechanism and used for clamping the first capacitor chip, a first motor connected with and controlling the first pickup device to move left and right, and a second motor connected with and controlling the first pickup device to move up and down.
Further, the dispensing mechanism comprises a dispensing cylinder, a vacuum dispensing device, an air pipe, a third motor and a fourth motor, wherein the dispensing cylinder is positioned above the conveying mechanism and used for gluing, the vacuum dispensing device is used for controlling the amount of glue to be discharged, the air pipe is connected between the dispensing cylinder and the vacuum dispensing device, the third motor is connected with and controls the dispensing cylinder to move left and right, and the fourth motor is connected with and controls the dispensing cylinder to move up and down.
Further, the second capacitor chip feeding mechanism comprises a second feeding disc for placing the second capacitor chip, a second pickup device, a fifth motor and a sixth motor, wherein the second pickup device is positioned above the conveying mechanism and used for clamping the second capacitor chip, the fifth motor is connected with and controls the second pickup device to move left and right, and the sixth motor is connected with and controls the second pickup device to move up and down.
Further, the control mechanism comprises a display mechanism and a power distribution control cabinet, and the display mechanism comprises a liquid crystal display screen.
Further, the jig feeding mechanism is arranged in front of the first capacitor chip feeding mechanism and comprises a jig feeding disc for storing a plurality of turnover jigs.
Further, the recycling tray is arranged behind the second capacitor chip feeding mechanism and used for recycling the turnover jig.
The capacitor stacking method of the capacitor automatic stacking device comprises the following steps:
the turnover jig is placed in a conveying mechanism, after the turnover jig is started, the conveying mechanism conveys the turnover jig forward to the position below a first capacitor chip feeding mechanism, and the first capacitor chip feeding mechanism places the first capacitor chip in a stacking groove;
then, the conveying mechanism continues to work, the turnover jig and the first capacitor chip on the turnover jig are conveyed to the lower part of the dispensing mechanism, and the dispensing mechanism coats adhesive on the top of the first capacitor chip;
then, the conveying mechanism continues to convey forwards, the turnover jig is conveyed to the lower part of the second capacitor chip feeding mechanism, and the second capacitor chip is stacked on the top of the first capacitor chip by the second capacitor chip feeding mechanism;
and finally, carrying out adhesive curing on the stacked finished products through reflow soldering, wherein the temperature of the reflow soldering is 150 ℃, and obtaining the capacitor finished products after curing.
As can be seen from the above description of the present invention, compared with the prior art, the present invention has the following beneficial effects: through the technical scheme, when the capacitor stacking device is used, the turnover jig moves along with the conveying mechanism and sequentially passes through the first capacitor chip feeding mechanism, the dispensing mechanism, the second capacitor chip feeding mechanism and the recovery disc, and the automatic stacking of the capacitors is realized through the control system, so that manual participation is not needed in the process, the labor cost of enterprises is reduced, and the stacking efficiency is improved;
the stacking groove with the fixing mechanism is arranged on the turnover jig, so that the position of a capacitor chip can be fixed in the automatic capacitor stacking process, the stacked product is prevented from being skewed, and the product precision is improved;
through the control mechanism, parameters of each mechanism can be adjusted in the process of automatic stacking of the capacitors, smooth operation of an automatic stacking workflow is ensured, and the operation is convenient;
by utilizing the technical scheme of the invention, the stacking efficiency can be improved to a great extent, the labor cost is reduced, and the defects of the traditional capacitor stacking are overcome; the stacked capacitor finished product can not be inclined through the stacking groove provided with the fixing mechanism on the turnover jig, so that the precision of the product is ensured; parameters of each mechanism can be adjusted through the control mechanism, so that the automatic stacking workflow is ensured to be smoothly carried out, and the operation is convenient.
Drawings
FIG. 1 is a schematic diagram of an automatic capacitor stacking apparatus;
FIG. 2 is a schematic diagram of a turnover fixture of an automatic capacitor stacking apparatus;
in the figure: the device comprises a 1-turnover jig, 11-first capacitor chips, 12-second capacitor chips, a 13-jig body, 14-stacking grooves, a 15-fixing mechanism, 16-first magnets, 17-second magnets, 18-first mounting holes, 19-second mounting holes, a 2-first capacitor chip feeding mechanism, a 21-first feeding plate, a 22-first pick-up, a 23-first motor, a 24-second motor, a 3-dispensing mechanism, a 31-dispensing cylinder, a 32-vacuum dispenser, a 33-air pipe, a 34-third motor, a 35-fourth motor, a 4-second capacitor chip feeding mechanism, a 41-second feeding plate, a 42-second pick-up, a 43-fifth motor, a 44-sixth motor, a 5-conveying mechanism, a 51-conveying belt, a 52-driving motor, a 6-control mechanism, a 61-display mechanism, a 62-distribution control cabinet, a 63-liquid crystal display screen, a 7-jig feeding mechanism, a 71-jig feeding plate and an 8-recovery plate.
Detailed Description
The invention is further described below by means of specific embodiments.
The embodiment provides automatic capacitor stacking equipment, which comprises a turnover jig 1, a first capacitor chip feeding mechanism 2, a dispensing mechanism 3, a second capacitor chip feeding mechanism 4, a conveying mechanism 5, a control mechanism 6, a jig feeding mechanism 7 and a recovery disc.
The turnover jig 1 is made of a metal material and is used for stacking a first capacitor chip 11 and a second capacitor chip 12, and comprises a jig body 13, a stacking groove 14 which extends downwards from the top of the jig body 13 and is used for stacking the capacitor chips, and a fixing mechanism 15 which is arranged inside the jig body 13 and is used for fixing the capacitor chips; specifically, the fixing mechanism 15 includes a first magnet 16 and a second magnet 17 disposed in the jig body 13 at two adjacent contact surfaces of the stacking groove 14, and further, the jig body 13 is formed with a first mounting hole 18 for mounting the first magnet 16 and a second mounting hole 19 for mounting the second magnet; further, the first magnet 16 is located at the bottom of the stacking slot 14, and the second magnet 17 is located at the side wall of the stacking slot 14; when the turnover jig 1 is used, when the first capacitor chip 11 is stacked, the first capacitor chip 11 can be fixed to the turnover jig 1 through the first magnet 16 and the second magnet 17, so that the first capacitor chip 11 is prevented from shifting in the operation process, and the stacked finished product is ensured to be free from deflection.
The first capacitor chip feeding mechanism 2 is used for stacking the first capacitor chips 11 on the turnover jig 1 and comprises a first feeding disc 21 used for placing the first capacitor chips 11, a first pickup 22 positioned above the conveying mechanism 5 and used for clamping the first capacitor chips 11, a first motor 23 connected with and controlling the first pickup to move left and right, and a second motor 24 connected with and controlling the first pickup 22 to move up and down; specifically, the first motor 23 and the second motor 24 can drive the first pickup 22 to move left and right or up and down through the screw-nut pair, and the structure that the motor and the screw-nut pair cooperate to drive the component to move is a common structure in the mechanical field, and the connection mode and the working principle thereof are not further described.
The dispensing mechanism 3 is used for coating adhesive on the top of the first capacitor chip 11, and comprises a dispensing cylinder 31 positioned above the conveying mechanism 5 and used for coating adhesive, a vacuum dispensing device 32 used for controlling the amount of adhesive, an air pipe 33 connected between the dispensing cylinder 31 and the vacuum dispensing device 32, a third motor 34 connected with and controlling the dispensing cylinder 31 to move left and right, and a fourth motor 35 connected with and controlling the dispensing cylinder 31 to move up and down; specifically, the third motor 34 and the fourth motor 35 can drive the dispensing drum 31 to move left and right or up and down through the screw-nut pair, and the structure that the motor and the screw-nut pair cooperate to drive the component to move is a common mechanism in the mechanical field, and the connection mode and the working principle thereof are not further described.
The second capacitor chip feeding mechanism 4 comprises a second feeding disc 41 for placing the second capacitor chip 12, a second pickup 42 positioned above the conveying mechanism 5 and used for clamping the second capacitor chip 12, a fifth motor 43 connected with and controlling the second pickup 42 to move left and right, and a sixth motor 44 connected with and controlling the second pickup 42 to move up and down; specifically, the fifth motor 43 and the sixth motor 44 can drive the second picker to move left and right or up and down through the screw-nut pair, and the structure that the motor and the screw-nut pair cooperate to drive the component to move is a structure commonly used in the mechanical field, and the specific connection mode and the working principle thereof will not be further described.
The conveying mechanism 5 is used for conveying the turnover jig 1 to sequentially pass through the first capacitor chip feeding mechanism 2, the dispensing mechanism 3 and the second capacitor chip feeding mechanism 4, and comprises a conveying belt 51 and a driving motor 52 for driving the conveying belt to operate.
The control mechanism 6 is respectively connected with the first capacitor chip feeding mechanism 2, the dispensing mechanism 3, the second capacitor chip feeding mechanism 4 and the conveying mechanism 5 so as to respectively control the work of the mechanisms, and comprises a display mechanism 61 and a power distribution control cabinet 62; specifically, the display mechanism 61 includes a liquid crystal display 63 for adjusting parameters of each mechanism, so that the automatic stacking of the capacitors is performed smoothly, and the operation is convenient.
The jig feeding mechanism 7 is arranged in front of the first capacitor chip feeding mechanism 2, and specifically, the jig feeding mechanism 7 comprises a jig feeding tray 71 for storing a plurality of turnover jigs 1.
And the recovery disc 8 is arranged behind the second capacitor chip feeding mechanism 4 and is used for recovering the turnover jig 1.
There is provided a stacking method of an automatic capacitor stacking apparatus, comprising the steps of:
after the turnover jig 1 is put into the conveying mechanism 5 and started, the conveying mechanism 6 conveys the turnover jig 1 forward to the position below the first capacitor chip feeding mechanism 2, the first motor 23 and the second motor 24 are matched to control the first pick-up 22 to clamp the first capacitor chip 11 from the first feeding disc 21, the first capacitor chip 11 is placed in the stacking groove 14, and the first capacitor chip 11 is fixed in the stacking groove 14 under the action of the first magnet 16 and the second magnet 17;
then, the conveying mechanism 5 continues to work, the turnover jig 1 and the first capacitor chip 11 on the turnover jig 1 are conveyed to the lower part of the dispensing mechanism 3, and the dispensing cylinder 31 is controlled by matching the third motor 34 with the fourth motor 35 to coat adhesive on the top of the first capacitor chip 11;
subsequently, the conveying mechanism 5 continues to convey forwards, the turnover jig 1 is conveyed below the second capacitor chip feeding mechanism 3, the fifth motor 43 and the sixth motor 44 are matched to control the second pickup 42 to clamp the second capacitor chip 12 from the second feeding disc 41, the second capacitor chip 12 is stacked on the top of the first capacitor chip 11, and the second capacitor chip 11 is fixed in the stacking groove 14 under the action of the adhesive, the first magnet 16 and the second magnet 17;
finally, the conveying mechanism 5 continues to convey the stacked finished products to the position of the recovery disc 8, the stacked finished products are taken out, the turnover jig 1 is sent into the recovery disc 8, the stacked finished products are subjected to adhesive curing through reflow soldering, the reflow soldering temperature is 150 ℃, and the capacitor finished products are obtained after curing.
In summary, by means of the above technical solution of the present invention, a complete production line for automatically stacking capacitors can be implemented by the turnover jig 1, the first capacitor chip feeding mechanism 2, the dispensing mechanism 3, the second capacitor chip feeding mechanism 4, the conveying mechanism 5, the control mechanism 6 and the recovery tray 8, and the production line does not need to be manually involved, so that labor cost of enterprises is reduced, and stacking efficiency is improved; in addition, the stacking groove 14 provided with the fixing mechanism 15 on the turnover jig 1 can fix the position of the first capacitor chip 11 in the automatic capacitor stacking process, so that the stacked products are prevented from being skewed, and the product precision is improved; in addition, in the stacking process, parameters of each mechanism can be controlled through the control mechanism 6, and when a production line has a problem, the parameters can be manually adjusted, so that the smooth operation of the production line is ensured, and the operation is convenient.
The foregoing description is only illustrative of the preferred embodiments of the present invention and is not to be construed as limiting the scope of the invention, i.e., the invention is not to be limited to the details of the claims and the description, but rather is to cover all modifications which are within the scope of the invention.
Claims (7)
1. The utility model provides an automatic equipment of stacking of electric capacity, electric capacity includes first piece electric capacity chip and second piece electric capacity chip that stacks from top to bottom and sets up the viscose between first piece electric capacity chip and second piece electric capacity chip, its characterized in that: the device comprises a turnover jig, a first capacitor chip feeding mechanism, a dispensing mechanism, a second capacitor chip feeding mechanism, a conveying mechanism and a control mechanism;
the turnover jig is used for stacking a first capacitor chip and a second capacitor chip and comprises a jig body, a stacking groove which extends downwards from the top of the jig body and is used for stacking the capacitor chips, and a fixing mechanism which is arranged inside the jig body and is used for fixing the capacitor chips;
the first capacitor chip feeding mechanism is used for stacking the first capacitor chips on the turnover jig;
the dispensing mechanism is used for coating adhesive on the top of the first capacitor chip;
the second capacitor chip feeding mechanism is used for stacking the second capacitor chip on the first capacitor chip;
the conveying mechanism is used for conveying the turnover jig to sequentially pass through the first capacitor chip feeding mechanism, the dispensing mechanism and the second capacitor chip feeding mechanism;
the control mechanism is respectively connected with the first capacitor chip feeding mechanism, the dispensing mechanism, the second capacitor chip feeding mechanism and the conveying mechanism so as to respectively control the work of each component;
the first capacitor chip feeding mechanism comprises a first feeding disc for placing the first capacitor chip, a first pickup device positioned above the conveying mechanism and used for clamping the first capacitor chip, a first motor connected with and controlling the first pickup device to move left and right, and a second motor connected with and controlling the first pickup device to move up and down;
the dispensing mechanism comprises a dispensing cylinder, a vacuum dispensing device, an air pipe, a third motor and a fourth motor, wherein the dispensing cylinder is positioned above the conveying mechanism and used for gluing, the vacuum dispensing device is used for controlling the quantity of glue to be discharged, the air pipe is connected between the dispensing cylinder and the vacuum dispensing device, the third motor is connected with and controls the dispensing cylinder to move left and right, and the fourth motor is connected with and controls the dispensing cylinder to move up and down;
the second capacitor chip feeding mechanism comprises a second feeding disc for placing a second capacitor chip, a second pickup device, a fifth motor and a sixth motor, wherein the second pickup device is positioned above the conveying mechanism and used for clamping the second capacitor chip, the fifth motor is connected with and controls the second pickup device to move left and right, and the sixth motor is connected with and controls the second pickup device to move up and down.
2. The automatic capacitor stacking apparatus of claim 1, wherein: the fixing mechanism comprises a first magnet and a second magnet which are arranged in the jig body and positioned on two adjacent contact surfaces of the stacking groove.
3. An automatic capacitor stacking apparatus according to claim 2, wherein: the jig body is formed with a first mounting hole for mounting the first magnet and a second mounting hole for mounting the second magnet.
4. An automatic capacitor stacking apparatus according to claim 2, wherein: the first magnet is located at the bottom of the stacking groove, and the second magnet is located on the side wall of the stacking groove.
5. The automatic capacitor stacking apparatus of claim 1, wherein: the control mechanism comprises a display mechanism and a power distribution control cabinet, and the display mechanism comprises a liquid crystal display screen.
6. The automatic capacitor stacking apparatus of claim 1, wherein: the jig feeding mechanism is arranged in front of the first capacitor chip feeding mechanism and comprises a jig feeding tray for storing a plurality of turnover jigs.
7. A stacking method of the automatic capacitor stacking apparatus as claimed in any one of claims 1 to 6, characterized in that: comprises the following steps:
the turnover jig is placed in a conveying mechanism, after the turnover jig is started, the conveying mechanism conveys the turnover jig forward to the position below a first capacitor chip feeding mechanism, and the first capacitor chip feeding mechanism places the first capacitor chip in a stacking groove;
then, the conveying mechanism continues to work, the turnover jig and the first capacitor chip on the turnover jig are conveyed to the lower part of the dispensing mechanism, and the dispensing mechanism coats adhesive on the top of the first capacitor chip;
then, the conveying mechanism continues to convey forwards, the turnover jig is conveyed to the lower part of the second capacitor chip feeding mechanism, and the second capacitor chip is stacked on the top of the first capacitor chip by the second capacitor chip feeding mechanism;
and finally, carrying out adhesive curing on the stacked finished products through reflow soldering, wherein the temperature of the reflow soldering is 150 ℃, and obtaining the capacitor finished products after curing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210834215.8A CN115376841B (en) | 2022-07-14 | 2022-07-14 | Automatic capacitor stacking equipment and stacking method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210834215.8A CN115376841B (en) | 2022-07-14 | 2022-07-14 | Automatic capacitor stacking equipment and stacking method thereof |
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| Publication Number | Publication Date |
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| CN115376841A CN115376841A (en) | 2022-11-22 |
| CN115376841B true CN115376841B (en) | 2023-06-27 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202210834215.8A Active CN115376841B (en) | 2022-07-14 | 2022-07-14 | Automatic capacitor stacking equipment and stacking method thereof |
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Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4757759A (en) * | 1986-03-05 | 1988-07-19 | Tam Ceramics, Inc. | Multilayer ceramic bar printing and assembling apparatus |
| KR100796580B1 (en) * | 2007-07-11 | 2008-01-21 | 추대흥 | The sheet editing frame device for array and a laminated of condenser sheet |
| CN209103981U (en) * | 2018-12-26 | 2019-07-12 | 中山一特自动化设备有限公司 | A kind of capacitor assembly machine |
| CN110061301A (en) * | 2019-05-05 | 2019-07-26 | 陈保成 | A kind of method and its production line for realizing that positive/negative plate quickly overlaps |
| CN212990935U (en) * | 2020-07-06 | 2021-04-16 | 昆山新美润电子科技有限公司 | Capacitor chip mounting equipment |
| CN113501267A (en) * | 2021-07-01 | 2021-10-15 | 苏州艾亚达智能科技有限公司 | Full-automatic capacitor plate laying equipment |
-
2022
- 2022-07-14 CN CN202210834215.8A patent/CN115376841B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4757759A (en) * | 1986-03-05 | 1988-07-19 | Tam Ceramics, Inc. | Multilayer ceramic bar printing and assembling apparatus |
| KR100796580B1 (en) * | 2007-07-11 | 2008-01-21 | 추대흥 | The sheet editing frame device for array and a laminated of condenser sheet |
| CN209103981U (en) * | 2018-12-26 | 2019-07-12 | 中山一特自动化设备有限公司 | A kind of capacitor assembly machine |
| CN110061301A (en) * | 2019-05-05 | 2019-07-26 | 陈保成 | A kind of method and its production line for realizing that positive/negative plate quickly overlaps |
| CN212990935U (en) * | 2020-07-06 | 2021-04-16 | 昆山新美润电子科技有限公司 | Capacitor chip mounting equipment |
| CN113501267A (en) * | 2021-07-01 | 2021-10-15 | 苏州艾亚达智能科技有限公司 | Full-automatic capacitor plate laying equipment |
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| CN115376841A (en) | 2022-11-22 |
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