CN115343594A - Test device for SIP packaging NB-IoT chip - Google Patents
Test device for SIP packaging NB-IoT chip Download PDFInfo
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- CN115343594A CN115343594A CN202210723452.7A CN202210723452A CN115343594A CN 115343594 A CN115343594 A CN 115343594A CN 202210723452 A CN202210723452 A CN 202210723452A CN 115343594 A CN115343594 A CN 115343594A
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- 238000012360 testing method Methods 0.000 title claims abstract description 75
- 238000004806 packaging method and process Methods 0.000 title abstract description 12
- 238000010438 heat treatment Methods 0.000 claims abstract description 27
- 102100037069 Doublecortin domain-containing protein 1 Human genes 0.000 claims description 17
- 101000954712 Homo sapiens Doublecortin domain-containing protein 1 Proteins 0.000 claims description 17
- 102100037070 Doublecortin domain-containing protein 2 Human genes 0.000 claims description 13
- 101000954709 Homo sapiens Doublecortin domain-containing protein 2 Proteins 0.000 claims description 13
- 238000012544 monitoring process Methods 0.000 claims description 10
- HEZMWWAKWCSUCB-PHDIDXHHSA-N (3R,4R)-3,4-dihydroxycyclohexa-1,5-diene-1-carboxylic acid Chemical compound O[C@@H]1C=CC(C(O)=O)=C[C@H]1O HEZMWWAKWCSUCB-PHDIDXHHSA-N 0.000 claims description 6
- 230000005611 electricity Effects 0.000 claims 1
- 238000005538 encapsulation Methods 0.000 claims 1
- 238000010276 construction Methods 0.000 abstract description 3
- 239000004973 liquid crystal related substance Substances 0.000 description 9
- 101000941170 Homo sapiens U6 snRNA phosphodiesterase 1 Proteins 0.000 description 3
- 102100031314 U6 snRNA phosphodiesterase 1 Human genes 0.000 description 3
- 238000013461 design Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000001413 cellular effect Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 1
- 230000008447 perception Effects 0.000 description 1
- 238000005070 sampling Methods 0.000 description 1
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/2856—Internal circuit aspects, e.g. built-in test features; Test chips; Measuring material aspects, e.g. electro migration [EM]
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
- G01R31/2863—Contacting devices, e.g. sockets, burn-in boards or mounting fixtures
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
- G01R31/2874—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature
- G01R31/2875—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature related to heating
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2896—Testing of IC packages; Test features related to IC packages
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Environmental & Geological Engineering (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Tests Of Electronic Circuits (AREA)
Abstract
The invention discloses a testing device for SIP packaging NB-IoT chips, which comprises a testing module and a switching module, wherein the switching module comprises a socket base for mounting chips, and the back of the socket base is provided with a heating resistor. The test device provided by the invention adopts a split structure and comprises the test module and the switching module, when NB-I oT chips with different packaging sizes need to be replaced, the test module can be shared, only the switching module and the socket base need to be replaced, and the sharing property is increased. The heating device for supplying power independently is arranged, so that the problem of a heat source required by testing in a high-temperature environment is solved; a huge constant temperature box is not needed, meanwhile, the construction of a test interface is simpler, and heat-resistant objects and non-heat-resistant objects do not need to be distinguished specially.
Description
Technical Field
The invention belongs to the technical field of chip testing, and particularly relates to a testing device for SIP packaging of NB-IoT chips.
Background
Because the SIP packaging grade NB-IoT chip is much smaller than the traditional NB-IoT module in size, the original tool jig testing mode is not suitable for the refined SIP packaging grade NB-IoT chip, the design scheme of the SOCKET base is changed into the new design idea to replace an awkward clamp, the space is reduced, and the portable carrying is realized.
At present, the power supply range of an NB-IoT chip in the market is generally between 2.1 and 4.5V, a common testing device is a fixed power supply voltage, such as 3.3V or 3.6V, when the performance of different power supply voltages is tested, an external adjustable power supply is often needed, and the adjustable power supply is very inconvenient to carry in some special sites such as outdoor or exhibition demonstration.
The NB-IoT chip generally has large performance difference at high temperature, the maximum working temperature of the NB-IoT chip is generally +85 ℃, and in order to more comprehensively understand and show the performance of the NB-IoT chip at high temperature, a constant temperature box is often required to be heated when testing the performance at high temperature, and a mains supply is required to be equipped for supplying power to the constant temperature box. Because some objects in the test kit can not be placed at a high temperature of 85 ℃, such as a SIM card, and the interfaces of equipment and instruments used for testing still need to be placed outside the incubator, the objects to be tested in the incubator and the matched tests need to be connected through wiring in the whole test scheme, and the wiring environment is more complex. These problems result in being largely unsatisfactory when displayed outdoors or in an exhibition.
Disclosure of Invention
The invention mainly solves the technical problem of providing a testing device for SIP packaging NB-IoT chips, solves the problem of inconvenient testing at present, and is simple and portable.
In order to solve the above technical problems, one technical solution adopted by the present invention is as follows:
a testing device for SIP packaging NB-IoT chips comprises a testing module and a switching module, wherein the testing module is electrically connected with the switching module;
the switching module comprises a socket base arranged on a PCB, a chip is arranged on the socket base, and a heating resistor is arranged on the back surface of the PCB at the socket base;
the testing module is provided with a first power supply port and a second power supply port, the first power supply port is used for supplying power to the chip, and the second power supply port is used for supplying power to the heating resistor.
Further, the first power supply port and/or the second power supply port are/is a USB power supply port.
Furthermore, the output end of the first power supply port is connected with a DCDC1, the output end of the DCDC1 is connected with the socket base, a switch is arranged between the DCDC1 and the socket base, and the DCDC1 is further connected with a potentiometer 1 for adjusting the output voltage of the DCDC 1.
Further, the output voltage range of the DCDC1 is 2.1V-4.5V.
Furthermore, the output end of the second power supply port is connected with a DCDC2, the output end of the DCDC2 is connected with the heating resistor, and the DCDC2 is also connected with a potentiometer 2 for adjusting the output voltage of the potentiometer.
Furthermore, the test module comprises a USB-to-UART unit, the USB-to-UART unit is powered by the first power supply port, and the USB-to-UART unit is connected with the socket base.
Further, the test module comprises a monitoring unit, and the monitoring unit is powered by the first power supply port;
the monitoring unit comprises a sensor and a display device, wherein the sensor is connected with the MCU, and the sensor is used for acquiring the temperature of the heating resistor and the ambient temperature and/or humidity.
Furthermore, the output of the first power supply port is connected with an LDO module, and the output of the LDO module is connected with the USB-to-UART unit and the monitoring unit.
Furthermore, the switching module is provided with a connecting seat and an SMA radio frequency head, the connecting seat is used for being electrically connected with the test module, and the SMA radio frequency head is connected with the socket base.
The invention has the beneficial effects that:
the test device adopts a split structure and comprises the test module and the switching module, when NB-IoT chips with different packaging sizes need to be replaced, the test module can be shared, only the switching module and the socket base need to be replaced, and the sharing performance is improved. The heating device for supplying power independently is arranged, so that the problem of a heat source required by testing in a high-temperature environment is solved; a huge constant temperature box is not needed, meanwhile, the construction of a test interface is simpler, and heat-resistant objects and non-heat-resistant objects do not need to be distinguished specially. The whole set of test environment realizes light-weight load and is suitable for most conventional scenes.
The device can provide all supportable power supply voltages of the NB-IoT chip in a convenient USB power supply mode without carrying adjustable power supply equipment.
The foregoing description is only an overview of the technical solutions of the present invention, and in order to make the technical solutions of the present invention more clearly understood and to implement them in accordance with the contents of the description, the following detailed description is given with reference to the preferred embodiments of the present invention and the accompanying drawings.
Drawings
FIG. 1 is a logic block diagram of a test apparatus of the present invention;
FIG. 2 is a schematic diagram of the arrangement of components of the testing apparatus of the present invention;
FIG. 3 is a schematic diagram of the structure of a heating resistor and a sensor according to the present invention;
the parts in the drawings are marked as follows:
a test module 1; a first power supply port 11; a second power supply port 12; a USB to UART unit 13; an MCU141; a sensor 142; a display device 143; a switch 15; a switching module 2; an SMA radio head 22; a chip 3; socket base 4.
Detailed Description
The following detailed description of the preferred embodiments of the present invention, taken in conjunction with the accompanying drawings, will make the advantages and features of the present invention more comprehensible to those skilled in the art, and will thus provide a clear and concise definition of the scope of the present invention.
The embodiment is as follows:
the English noun mentioned in the present embodiment is explained as follows:
PCB: printed Circuit Board, circuit Board;
socket base: a base/pedestal for mounting a connector of a chip in a plug-in manner;
NB-IoT: narrow Band Internet of Things (IoT), which is constructed in a cellular network, only consumes about 180kHz bandwidth, and can be directly deployed in a GSM network, a UMTS network or an LTE network, so as to reduce the deployment cost and realize smooth upgrade;
DCDC: a DC-to-DC power supply module;
MCU: microcontroller Unit, a micro control Unit;
USB to UART: the USB is converted into a serial port, and the conversion from a USB interface of the computer to a universal serial port is realized.
A test apparatus for SIP packaging NB-IoT chips, as shown in fig. 1 to 3: the test device comprises a test module 1 and a switching module 2, wherein the test module is electrically connected with the switching module, and in the embodiment, the test module and the switching module are connected through a connecting wire and are flexibly connected, so that the test device is more convenient;
the switching module comprises a socket base 4 arranged on a PCB, a chip 3 is arranged on the socket base, and a heating resistor is arranged on the back surface of the PCB at the socket base;
the testing module is provided with a first power supply port 11 and a second power supply port 12, the first power supply port is used for supplying power to the chip, and the second power supply port is used for supplying power to the heating resistor.
In this embodiment, a PCB (circuit board) in the adaptor module is defined as an adaptor board, and a PCB in the test module is defined as a bottom board, that is, in this embodiment, the socket base is disposed on the adaptor board, and the first power supply port and the second power supply port are disposed on the bottom board.
The test device adopts a split structure and comprises the test module and the switching module, when NB-IoT chips with different packaging sizes need to be replaced, the test module can be shared, only the switching module and the socket base need to be replaced, and the sharing performance is improved. The heating device for supplying power independently is arranged, so that the problem of a heat source required by testing in a high-temperature environment is solved; a huge constant temperature box is not needed, meanwhile, the construction of a test interface is simpler, and heat-resistant objects and non-heat-resistant objects do not need to be distinguished specially. The whole set of test environment realizes light-weight load and is suitable for most conventional scenes.
In this embodiment, the first power supply port and the second power supply port are USB power supply ports, as shown in fig. 1, the first power supply port is USB1, and the second power supply port is USB2.
DCDC1 is connected to the output of first power supply mouth, DCDC 1's output is connected the socket base, DCDC1 with be equipped with switch 15 between the socket base, DCDC1 still connects the potentiometre 1 that is used for adjusting its output voltage.
The output end of the second power supply port is connected with a DCDC2, the output end of the DCDC2 is connected with the heating resistor, and the DCDC2 is also connected with a potentiometer 2 for adjusting the output voltage of the potentiometer.
The test module comprises a USB-to-UART unit 13, the USB-to-UART unit is powered by the first power supply port, and the USB-to-UART unit is connected with the socket base.
The test module comprises a monitoring unit, and the monitoring unit is powered by the first power supply port;
the monitoring unit includes a sensor 142 connected to the MCU141 and a display device 143, where the sensor is used to obtain the temperature of the heating resistor and the ambient temperature and/or humidity, and the display device in this embodiment is a liquid crystal display.
The output of first power supply mouth still connects the LDO module, the output of LDO module is connected USB changes UART unit and the monitor cell.
The switching module is provided with a connecting seat and an SMA radio frequency head 22, the connecting seat is used for being electrically connected with the test module, and the SMA radio frequency head is connected with the socket base.
The bottom plate mainly provides a power supply interface, can adjust voltage, can test current at the same time, and provides a serial port, an SIM card interface and a connection interface with the adapter plate.
The adapter plate mainly leads out interfaces such as a power supply, a serial port and an SIM card of the NB-IoT chip to the connecting seat, leads out a radio frequency interface, welds an SMA head, leads out the whole chip package, installs a socket and provides a heating circuit.
In the embodiment, the chip is an SIP-level NB-IoT chip, and the model is an SNS521S chip;
the socket is a special socket for the SNS 521S;
the MCU is an HC32L136 chip;
the direct current conversion power supply DCDC is a SY8089A chip;
the LDO is an SPX3819M5-L-3-3 chip;
the USB-to-UART chip is an XR21V1412 chip;
the temperature and humidity sensor is an AMS ENS210 chip.
More specifically, in the embodiment, the USB1 provides a 5V input power, and the input power is converted into 3.3V through the LDO in one path, and the power is supplied to the USB-to-UART chip, the MCU and the temperature and humidity sensor, respectively, and the output voltage of the DCDC1 is adjusted through the DCDC1 and the external adjustable potentiometer 1 in the other path, so as to supply power to the NB-IoT chip, where the power supply range is 2.1 to 4.5V.
When the output voltage of the DCDC1 is adjusted to be within the power supply range of the NB-IoT chip, closing the switch to supply power to the NB-IoT chip; the switch is disconnected in the process of adjusting the power supply voltage, so that the damage to the chip caused by uncertain change of the voltage in the adjusting process is avoided.
Meanwhile, the USB1 is converted into two paths of serial ports through a USB-UART chip, one path is used for firmware programming and AT communication of the NB chip, and the other path is used for grabbing work logs of the NB-IoT chip.
USB2 provides 5V input power, mainly used supplies power for heating resistor, as shown in fig. 3, heating resistor in this embodiment is provided with temperature regulation circuit, in order to adjust the electric current size of output, the heating to the chip is realized through the power resistance heat production principle that the electric current flows the little resistance, temperature and humidity sensor perception temperature back through MCU with the temperature display on the liquid crystal, existing temperature sensor also has the temperature display, can look over current temperature in real time, adjust the temperature to the required condition of test, the temperature control scope is that current ambient temperature is to between +85 ℃.
In actual design, the heating resistance circuit is located the back of the required heating chip, the output voltage of the DCDC2 is adjusted through the externally connected adjustable potentiometer 2 of the DCDC2, the current is controlled through controlling the voltage, the heating temperature is controlled, and if the heating is not needed, the USB2 can be out of use.
The adjustable voltage and the adjustable temperature are combined, so that the performance of the chip is measured under different voltages and different temperatures.
The MCU that this patent used adopts big HC32L136 series chip of china, mainly used AD sampling power output voltage, electric current, show the voltage value and the current value on the liquid crystal simultaneously.
The liquid crystal display is also used for acquiring the temperature of the heating circuit and displaying the temperature on the liquid crystal; the NB-IoT chip adopts a wu Yi Da SNS521S chip; DCDC adopts SilikeY 8089A, and adds adjustable resistor (potentiometer) to realize different voltage outputs; the LDO adopts EXAR SPX3819M5-L-3-3, supplies power for MCU and USB to UART chip stably at 3.3V; the USB-to-UART chip adopts an EXAR XR21V1412 to realize direct virtualization of two paths of serial ports of the NB-IoT chip to the PC; the temperature and humidity sensor adopts AMS ENS210, the current environmental temperature is collected through main facts, data are sent to the MCU through an I2C interface, and the MCU displays the temperature on the liquid crystal.
The MCU mainly uses 4 paths of ADCs and 2 paths of I2 Cs, 2 paths of ADs to respectively collect output voltages of DCDC1 and DCDC2, simultaneously displays the voltages on the liquid crystal through one path of liquid crystal of I2C communication, also needs 2 paths of ADs to collect output currents of DCDC1, namely actual current consumption of the NB-IoT chip, and also needs one path of I2C to be used for communicating with a temperature and humidity sensor, the temperature of the current sensor is displayed on the liquid crystal, the actual temperature of the NB-IoT chip is smaller than the current temperature measured by the sensor, the actual temperature of the NB-IoT chip can be read out through AT, then fine-adjusts the voltage output of the DCDC2, and the required temperature can be reached, and the deviation is within the range of +/-5 ℃.
The NB-IoT chip is connected to the test bottom plate through a socket, is externally connected with an SIM card and a radio frequency test interface, can be connected with an integrated tester to test items such as radio frequency, data and protocols, and can also be connected with an external antenna to test the existing network.
The above description is only an embodiment of the present invention, and not intended to limit the scope of the present invention, and all equivalent structural changes made by using the contents of the present specification and the drawings, or applied directly or indirectly to other related technical fields, are included in the scope of the present invention.
Claims (9)
1. A test apparatus for SIP encapsulation of NB-IoT chips, characterized in that: the test system comprises a test module (1) and a switching module (2), wherein the test module is electrically connected with the switching module;
the switching module comprises a socket base (4) arranged on a PCB, a chip (3) is arranged on the socket base, and a heating resistor is arranged on the back surface of the PCB at the socket base;
the test module is provided with a first power supply port (11) and a second power supply port (12), wherein the first power supply port is used for supplying power to the chip, and the second power supply port is used for supplying power to the heating resistor.
2. The testing apparatus for the SIP package NB-IoT chip in accordance with claim 1, wherein: the first power supply port and/or the second power supply port are/is a USB power supply port.
3. The testing apparatus for SIP encapsulated NB-IoT chip according to claim 1 or 2, wherein: DCDC1 is connected to the output of first power supply mouth, DCDC 1's output is connected the socket base, DCDC1 with be equipped with the switch between the socket base, DCDC1 still connects the potentiometre 1 that is used for adjusting its output voltage.
4. The testing apparatus for the SIP encapsulated NB-IoT chip as claimed in claim 3, wherein: the output voltage range of the DCDC1 is 2.1V-4.5V.
5. A test apparatus for SIP-packaged NB-IoT chips in accordance with claim 1 or 2, characterized in that: the output end of the second power supply port is connected with a DCDC2, the output end of the DCDC2 is connected with the heating resistor, and the DCDC2 is also connected with a potentiometer 2 for adjusting the output voltage of the heating resistor.
6. A test apparatus for SIP-packaged NB-IoT chips in accordance with claim 1 or 2, characterized in that: the test module comprises a USB-to-UART unit (13), the USB-to-UART unit is powered by the first power supply port, and the USB-to-UART unit is connected with the socket base.
7. The testing apparatus for the SIP encapsulated NB-IoT chip as claimed in claim 6, wherein: the test module comprises a monitoring unit, and the monitoring unit is powered by the first power supply port;
the monitoring unit comprises a sensor (142) and a display device (143) which are connected with an MCU (141), and the sensor is used for acquiring the temperature of the heating resistor and the ambient temperature and/or humidity.
8. The testing apparatus for the SIP encapsulated NB-IoT chip as claimed in claim 7, wherein: the output of first power supply mouth is connected the LDO module, the output of LDO module is connected USB changes UART unit and the monitor cell.
9. The testing apparatus for SIP encapsulated NB-IoT chip according to claim 1 or 2, wherein: the switching module is equipped with connecting seat and SMA radio frequency head (22), the connecting seat be used for with the test module electricity is connected, SMA radio frequency head is connected the socket base.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210723452.7A CN115343594A (en) | 2022-06-24 | 2022-06-24 | Test device for SIP packaging NB-IoT chip |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202210723452.7A CN115343594A (en) | 2022-06-24 | 2022-06-24 | Test device for SIP packaging NB-IoT chip |
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| CN115343594A true CN115343594A (en) | 2022-11-15 |
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| CN108983760A (en) * | 2018-10-16 | 2018-12-11 | 昆明北方红外技术股份有限公司 | Function of the MCU and source current test device |
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| CN113702810A (en) * | 2021-09-01 | 2021-11-26 | 厦门优迅高速芯片有限公司 | MCU-based optical transceiver driver chip function test method and related equipment |
-
2022
- 2022-06-24 CN CN202210723452.7A patent/CN115343594A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20050087301A (en) * | 2004-02-26 | 2005-08-31 | (주)티에스이 | Socket managing system and test system having the socket managing system |
| CN205067685U (en) * | 2015-11-02 | 2016-03-02 | 万高(杭州)科技有限公司 | Verification device of chip |
| CN205982552U (en) * | 2016-09-09 | 2017-02-22 | 杭州万高科技股份有限公司 | IC testing arrangement |
| CN108169655A (en) * | 2018-02-02 | 2018-06-15 | 深圳市世坤科技实业有限公司 | A kind of image chip focuses heart test jack automatically |
| CN109033891A (en) * | 2018-06-21 | 2018-12-18 | 北京智芯微电子科技有限公司 | Equipment and its security attack test method for SPI interface chip secure attack test |
| CN108983760A (en) * | 2018-10-16 | 2018-12-11 | 昆明北方红外技术股份有限公司 | Function of the MCU and source current test device |
| CN113702810A (en) * | 2021-09-01 | 2021-11-26 | 厦门优迅高速芯片有限公司 | MCU-based optical transceiver driver chip function test method and related equipment |
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