CN115336254A - 摄像装置及电子设备 - Google Patents

摄像装置及电子设备 Download PDF

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Publication number
CN115336254A
CN115336254A CN202180024385.3A CN202180024385A CN115336254A CN 115336254 A CN115336254 A CN 115336254A CN 202180024385 A CN202180024385 A CN 202180024385A CN 115336254 A CN115336254 A CN 115336254A
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CN
China
Prior art keywords
transistor
circuit
layer
electrically connected
drain
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202180024385.3A
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English (en)
Chinese (zh)
Inventor
广濑丈也
米田诚一
井上广树
池田隆之
山崎舜平
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Semiconductor Energy Laboratory Co Ltd
Original Assignee
Semiconductor Energy Laboratory Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Semiconductor Energy Laboratory Co Ltd filed Critical Semiconductor Energy Laboratory Co Ltd
Publication of CN115336254A publication Critical patent/CN115336254A/zh
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/70—SSIS architectures; Circuits associated therewith
    • H04N25/71—Charge-coupled device [CCD] sensors; Charge-transfer registers specially adapted for CCD sensors
    • H04N25/75—Circuitry for providing, modifying or processing image signals from the pixel array
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/70—SSIS architectures; Circuits associated therewith
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/70—SSIS architectures; Circuits associated therewith
    • H04N25/703—SSIS architectures incorporating pixels for producing signals other than image signals
    • H04N25/705—Pixels for depth measurement, e.g. RGBZ
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/70—SSIS architectures; Circuits associated therewith
    • H04N25/76—Addressed sensors, e.g. MOS or CMOS sensors
    • H04N25/77—Pixel circuitry, e.g. memories, A/D converters, pixel amplifiers, shared circuits or shared components
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/70—SSIS architectures; Circuits associated therewith
    • H04N25/76—Addressed sensors, e.g. MOS or CMOS sensors
    • H04N25/78—Readout circuits for addressed sensors, e.g. output amplifiers or A/D converters
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/803—Pixels having integrated switching, control, storage or amplification elements
    • H10F39/8037—Pixels having integrated switching, control, storage or amplification elements the integrated elements comprising a transistor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/811—Interconnections

Landscapes

  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
  • Thin Film Transistor (AREA)
  • Image Processing (AREA)
CN202180024385.3A 2020-03-27 2021-03-15 摄像装置及电子设备 Pending CN115336254A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020-057810 2020-03-27
JP2020057810 2020-03-27
PCT/IB2021/052110 WO2021191719A1 (ja) 2020-03-27 2021-03-15 撮像装置および電子機器

Publications (1)

Publication Number Publication Date
CN115336254A true CN115336254A (zh) 2022-11-11

Family

ID=77890986

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202180024385.3A Pending CN115336254A (zh) 2020-03-27 2021-03-15 摄像装置及电子设备

Country Status (5)

Country Link
US (3) US12041366B2 (https=)
JP (3) JP7603059B2 (https=)
KR (1) KR20220160007A (https=)
CN (1) CN115336254A (https=)
WO (1) WO2021191719A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12147888B2 (en) * 2020-11-12 2024-11-19 Samsung Electronics Co., Ltd. Neural computer including image sensor capable of controlling photocurrent
JP2024011770A (ja) * 2022-07-15 2024-01-25 日本放送協会 撮像素子、撮像装置および撮像素子の製造方法

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3642591B2 (ja) * 1994-11-29 2005-04-27 株式会社日立メディコ 画像処理装置
US7151844B2 (en) * 2001-12-06 2006-12-19 General Motors Corporation Image sensor method and apparatus having hardware implemented edge detection processing
US7215370B2 (en) * 2003-07-23 2007-05-08 Alphaplus Semiconductor Inc. Pseudo-BJT based retinal focal-plane sensing system
JP2008199414A (ja) 2007-02-14 2008-08-28 Matsushita Electric Ind Co Ltd 光電変換装置、イメージセンサ及びイメージングシステム
EP1971129A1 (en) 2007-03-16 2008-09-17 STMicroelectronics (Research & Development) Limited Improvements in or relating to image sensors
KR101645680B1 (ko) 2009-11-06 2016-08-04 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치
JP2012175259A (ja) 2011-02-18 2012-09-10 Olympus Corp 固体撮像装置
US9762834B2 (en) * 2014-09-30 2017-09-12 Qualcomm Incorporated Configurable hardware for computing computer vision features
US9773832B2 (en) 2014-12-10 2017-09-26 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and electronic device
WO2016179533A1 (en) * 2015-05-06 2016-11-10 Indiana University Research And Technology Corporation Sensor signal processing using an analog neural network
JP2017063420A (ja) * 2015-09-25 2017-03-30 株式会社半導体エネルギー研究所 半導体装置
KR102631381B1 (ko) * 2016-11-07 2024-01-31 삼성전자주식회사 컨볼루션 신경망 처리 방법 및 장치
US11039099B2 (en) 2016-11-24 2021-06-15 Sony Semiconductor Solutions Corporation Solid-state imaging element, solid-state imaging apparatus, and method for controlling solid-state imaging element
CN114628425A (zh) 2017-05-26 2022-06-14 株式会社半导体能源研究所 摄像装置及电子设备
JP7144413B2 (ja) 2017-07-14 2022-09-29 株式会社半導体エネルギー研究所 撮像装置
JP6975606B2 (ja) 2017-10-11 2021-12-01 浜松ホトニクス株式会社 固体撮像装置

Also Published As

Publication number Publication date
US12238435B2 (en) 2025-02-25
JP2026026156A (ja) 2026-02-16
JPWO2021191719A1 (https=) 2021-09-30
JP7603059B2 (ja) 2024-12-19
JP2025026614A (ja) 2025-02-21
US20250168527A1 (en) 2025-05-22
US12041366B2 (en) 2024-07-16
JP7781246B2 (ja) 2025-12-05
KR20220160007A (ko) 2022-12-05
US20230109524A1 (en) 2023-04-06
US20240305909A1 (en) 2024-09-12
WO2021191719A1 (ja) 2021-09-30

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