CN115323342B - Control system and method for pipeline coating based on magnetron sputtering - Google Patents
Control system and method for pipeline coating based on magnetron sputtering Download PDFInfo
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- CN115323342B CN115323342B CN202211142385.6A CN202211142385A CN115323342B CN 115323342 B CN115323342 B CN 115323342B CN 202211142385 A CN202211142385 A CN 202211142385A CN 115323342 B CN115323342 B CN 115323342B
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/54—Controlling or regulating the coating process
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
Abstract
The embodiment of the invention provides a control system and a method for pipeline coating based on magnetron sputtering, wherein the control system comprises the following components: the magnetron sputtering device comprises a magnetron sputtering furnace body, an electromagnet arranged outside the magnetron sputtering furnace body in a surrounding manner, a pipeline to be coated arranged in the magnetron sputtering furnace body, and a target material penetrating through the pipeline to be coated; one end of the target material is electrically connected with one end of the bias power supply, and one end of the pipeline to be coated is electrically connected with one end of the bias power supply; when coating, the electromagnet is electrified to form a uniform magnetic field outside the magnetron sputtering furnace body, and meanwhile, the bias power supply supplies power for the target; under the action of a magnetic field, atoms on the surface of the target material escape and are sputtered to the inner wall of the pipeline to be coated to form a film; through the air inlet pipeline and the air exhaust pipeline which are arranged at the two ends of the target, the ventilation volume of the coating gas in the magnetron sputtering furnace body is controlled during coating, so that the air pressure in the magnetron sputtering furnace body is in the air pressure range required by glow discharge, the uniformity of coating is improved, and the coating quality is improved.
Description
Technical Field
The invention relates to the technical field of magnetron sputtering coating, in particular to a control system and a method for pipeline coating based on magnetron sputtering.
Background
Under special conditions, such as in nuclear measurement systems used in reactors, it is necessary to deposit the radioactive metal uniformly on the inner wall of the cylindrical metal tube, which has a thickness of about 40mm, a uniformity of up to 10%, a thickness of between 600 and 1500nm and a coating bond strength of greater than 10Mpa.
When preparing a metal film on the inner wall of a tube with a smaller inner diameter, a magnetron sputtering coating mode is generally adopted in order to ensure strong bonding force, high coating speed and low coating impurity content of the film. The magnetron sputtering coating process is based on glow discharge of gas, and the atmosphere is a key factor of the glow discharge. For magnetron sputtering coating on the inner wall of a small-aperture pipe, the condition of nonuniform atmosphere often occurs in the pipe due to blocking of the pipe wall, and the direct consequence is that the frequency of sparking discharge in the coating process is increased, the glow discharge is nonuniform, the coating is nonuniform, and the bonding strength is low.
In the film plating process of the inner wall of the small-caliber pipe, the local heat release of the glow discharge process between the sputtering target and the inner wall of the pipe interferes with the uniformity and stability of the atmosphere, the atmosphere of the inner wall of the pipe cannot be regulated rapidly and effectively by adopting the current common atmosphere control method (adopting a form of directly supplying air and exhausting air by a single vacuum pipeline), so that the air pressure of different areas of the inner wall of the pipe changes to a certain extent, the difference of the air pressure can cause the difference of intensity of glow discharge, finally the phenomenon of increasing the firing frequency occurs in the film plating process, the film thickness change of the different areas is obvious, and the film plating binding force is poor.
Disclosure of Invention
The invention aims to provide a control system and a control method for pipeline coating based on magnetron sputtering, so as to improve the uniformity of coating and the quality of coating.
In order to solve the technical problems, the technical scheme of the invention is as follows:
a control system for pipeline coating based on magnetron sputtering comprises:
a magnetron sputtering furnace body; an electromagnet is arranged outside the magnetron sputtering furnace body in a surrounding manner, and a uniform magnetic field is formed outside the magnetron sputtering furnace body after the electromagnet is electrified;
the pipeline to be coated is arranged in the magnetron sputtering furnace body;
the target material penetrates through the pipeline to be coated in the magnetron sputtering furnace body; one end of the target is provided with an air inlet pipeline, and the other end of the target is provided with an air exhaust pipeline;
one end of the bias power supply is electrically connected with the target material, and the other end of the bias power supply is electrically connected with a pipeline to be coated;
controlling the air inlet pipeline to input coating gas into the magnetron sputtering furnace body, and controlling the air exhaust pipeline to exhaust the coating gas from the magnetron sputtering furnace body, so that the air pressure in the magnetron sputtering furnace body is in an air pressure range required by glow discharge; the bias power supply supplies power to the target, and atoms on the surface of the target escape and are sputtered to the inner wall of the pipeline to be coated to form a film under the action of the magnetic field.
Optionally, the air inlet pipeline includes:
the target comprises an air inlet channel and a first annular channel communicated with the air inlet channel, wherein the first annular channel surrounds the first end of the target.
Optionally, the diameter of the first annular channel is larger than the diameter of the pipeline to be coated.
Optionally, the first annular channel is uniformly provided with a plurality of first through holes; the aperture of the first through hole is smaller than the diameter of the pipeline to be coated.
Optionally, the air extraction pipeline includes:
the second annular channel surrounds the second end of the target.
Optionally, the diameter of the second annular channel is larger than the diameter of the pipeline to be coated.
Optionally, a plurality of second through holes are uniformly formed in the second annular channel, and the aperture of the second through holes is smaller than the diameter of the pipeline to be coated.
Optionally, the target material and the pipeline to be coated are coaxially arranged.
The embodiment of the invention also provides a control method for pipeline coating based on magnetron sputtering, which is applied to the control system, and comprises the following steps:
providing a target;
the target material penetrates through a pipeline to be coated;
supplying power to an electromagnet wound outside the magnetron sputtering furnace body, and forming a uniform magnetic field outside the magnetron sputtering furnace body after the electromagnet is electrified;
controlling an air inlet pipeline to input coating gas into the magnetron sputtering furnace body, and controlling an air exhaust pipeline to exhaust the coating gas from the magnetron sputtering furnace body, so that the air pressure in the magnetron sputtering furnace body is in an air pressure range required by glow discharge;
and controlling a bias power supply to supply power to the target, wherein atoms on the surface of the target escape under the action of the magnetic field and are sputtered to the inner wall of the pipeline to be coated to form a film.
Optionally, the control method for performing pipeline coating based on magnetron sputtering further comprises:
and continuously controlling the air inlet pipeline to input coating gas into the magnetron sputtering furnace body and controlling the air exhaust pipeline to exhaust the coating gas from the magnetron sputtering furnace body within a preset time period after coating is finished, so that the air pressure in the magnetron sputtering furnace body is within a preset air pressure range.
The scheme of the invention at least comprises the following beneficial effects:
according to the scheme, the control system for pipeline coating based on magnetron sputtering comprises a magnetron sputtering furnace body; an electromagnet is arranged outside the magnetron sputtering furnace body in a surrounding manner, and a uniform magnetic field is formed outside the magnetron sputtering furnace body after the electromagnet is electrified; the pipeline to be coated is arranged in the magnetron sputtering furnace body; the target material penetrates through the pipeline to be coated in the magnetron sputtering furnace body; one end of the target is provided with an air inlet pipeline, and the other end of the target is provided with an air exhaust pipeline; one end of the bias power supply is electrically connected with the target material, and the other end of the bias power supply is electrically connected with a pipeline to be coated; controlling the air inlet pipeline to input coating gas into the magnetron sputtering furnace body, and controlling the air exhaust pipeline to exhaust the coating gas from the magnetron sputtering furnace body, so that the air pressure in the magnetron sputtering furnace body is in an air pressure range required by glow discharge; the bias power supply supplies power to the target, atoms on the surface of the target escape under the action of the magnetic field and are sputtered to the inner wall of the pipeline to be coated to form a film, so that the uniformity of coating is improved, and the quality of coating is improved.
Drawings
FIG. 1 is a schematic structural diagram of a control system for pipeline coating provided by an embodiment of the invention;
FIG. 2 is a perspective view of a first annular channel or a second annular channel provided in an embodiment of the present invention;
fig. 3 is a front view of the inner wall of the first annular channel or the second annular channel according to the embodiment of the present invention.
Reference numerals illustrate: 1. a magnetron sputtering furnace body; 21. an air intake passage; 22. a first annular channel; 221. a first through hole; 31. an air extraction channel; 32. a second annular channel; 3221. a second through hole; 4. a target material; 5. a bias power supply; 6. an electromagnet; 7. and (5) a pipeline to be coated.
Detailed Description
Exemplary embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. While exemplary embodiments of the present disclosure are shown in the drawings, it should be understood that the present disclosure may be embodied in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art.
As shown in fig. 1, an embodiment of the present invention provides a control system for performing pipeline coating based on magnetron sputtering, including:
a magnetron sputtering furnace body 1; an electromagnet 6 is arranged outside the magnetron sputtering furnace body 1 in a surrounding manner, and a uniform magnetic field is formed outside the magnetron sputtering furnace body 1 after the electromagnet 6 is electrified;
the pipeline 7 to be coated is arranged in the magnetron sputtering furnace body 1;
the target material 4 penetrates through the pipeline 7 to be coated and is arranged in the magnetron sputtering furnace body 1; one end of the target material 4 is provided with an air inlet pipeline, and the other end of the target material 4 is provided with an air exhaust pipeline;
the bias power supply 5, one end of the bias power supply 5 is electrically connected with the target 4, and the other end of the bias power supply 5 is electrically connected with the pipeline 7 to be coated;
controlling the air inlet pipeline to input coating gas into the magnetron sputtering furnace body 1, and controlling the air exhaust pipeline to exhaust the coating gas from the magnetron sputtering furnace body 1, so that the air pressure in the magnetron sputtering furnace body 1 is in the air pressure range required by glow discharge; the bias power supply 5 supplies power to the target material 4, and atoms on the surface of the target material 4 escape and are sputtered to the inner wall of the pipeline 7 to be coated to form a film under the action of the magnetic field.
In this embodiment, the magnetron sputtering furnace body 1 may be a cylinder or a cuboid, to provide a closed environment required by the film plating for the to-be-plated pipe 7, a plurality of electromagnets 6 are uniformly and annularly arranged outside the magnetron sputtering furnace body 1, when the film plating is required, the electromagnets 6 are electrified, and after the electrification, a uniform magnetic field can be formed on the periphery of the magnetron sputtering furnace body 1; meanwhile, the electromagnet 6 is arranged outside the magnetron sputtering furnace body 1, so that the influence of operations such as temperature rise in the furnace during film coating on a magnetic field can be avoided, and meanwhile, the disassembly, inspection and maintenance are convenient.
The pipeline 7 to be coated and the target 4 can be fixedly connected to the upper end or the lower end inside the magnetron sputtering furnace body 1 through the clamp, the target 4 is set to be a cylinder, the diameter of the pipeline 7 to be coated is larger than that of the target 4, and when the magnetron sputtering furnace is installed, the pipeline 7 to be coated is sleeved outside the target 4, so that the inner wall of the pipeline 7 to be coated is coated, deposition on the outer wall of the pipeline is avoided, pollution on the outer wall of the pipeline in the coating process is reduced, the utilization rate of the target is improved, and the coating efficiency is improved.
One end of the target material 4 is provided with an air inlet pipeline, one end of the air inlet pipeline is arranged at one end of the target material 4, and the other end of the air inlet pipeline is fixedly connected with the magnetron sputtering furnace body 1 and extends out of the magnetron sputtering furnace body 1 and is connected with an air charging device;
the other end of the target material 4 is provided with an air extraction pipeline 3, one end of the air extraction pipeline is arranged at the other end of the target material 4, and the air extraction pipeline is fixedly connected with the magnetron sputtering furnace body 1 and extends out of the magnetron sputtering furnace body 1 and is connected with an air extraction device; preferably, the air inlet pipeline and the air exhaust pipeline have the same size and shape, and are only arranged at different positions;
when coating is carried out, coating gas is input into the magnetron sputtering furnace body 1 at a constant speed through the air inlet pipeline, and meanwhile, the coating gas is pumped out of the magnetron sputtering furnace body 1 at a constant speed through the air exhaust pipeline; through the air inlet pipeline and the air exhaust pipeline, the air inflation and the air exhaust are mutually matched, so that the air pressure in the magnetron sputtering furnace body 1 can be rapidly controlled to reach the air pressure range required by glow discharge during film coating, and meanwhile, the stability of the air pressure can be maintained, the uniformity of film coating is further ensured, and the film coating quality is improved.
One end of the negative electrode of the bias power supply 5 is electrically connected with the target material 4, and one end of the positive electrode of the bias power supply 5 is electrically connected with a pipeline 7 to be coated; when coating, the bias power supply 5 supplies power to the target 4, and atoms on the surface of the target 4 can be caused to escape under the action of a magnetic field generated by the electromagnet 6 and are sputtered to the inner wall of the pipeline 7 to be coated to form a film;
preferably, the length of the target 4 is greater than the length of the pipe 7 to be coated, so as to ensure that film formation can be achieved on the inner wall of the pipe 7 to be coated.
In an alternative embodiment of the present invention, the target 4 is disposed coaxially with the pipe 7 to be coated. In this embodiment, the target 4 and the pipe 7 to be coated are coaxially disposed, and when coating, the target 4 rotates, so as to further ensure uniformity during coating; of course, in the actual installation process, when the to-be-coated pipe 7 is sleeved outside the target 4, the difference between the distances between the inner wall of the to-be-coated pipe 7 and the outer wall of the target 4 at different positions should be no more than 10%.
In an alternative embodiment of the present invention, the air intake pipe includes: an air inlet channel 21 and a first annular channel 22 communicated with the air inlet channel 21, wherein the first annular channel 22 surrounds the first end of the target 4.
In this embodiment, the first annular channel 22 and the air inlet channel 21 may be integrally formed, or may be fixed by welding, where one end of the air inlet channel 21 is fixedly connected to the magnetron sputtering furnace body 1 and extends out of the magnetron sputtering furnace body 1, and the other end is fixed and communicated with the first annular channel 22; the first annular channel 22 is annularly arranged at the first end of the target 4;
further, the diameter of the first annular channel 22 is larger than the diameter of the pipeline 7 to be coated; so as to ensure that the pipeline 7 to be coated can be fully contacted with the introduced coating gas, and ensure the uniformity of the atmosphere on the inner wall of the pipeline 7 to be coated in the subsequent coating process.
In an alternative embodiment of the present invention, the first annular channel 22 is uniformly provided with a plurality of first through holes 221; the aperture of the first through hole 221 is smaller than the diameter of the pipe 7 to be coated.
In this embodiment, the first annular channel 22 is provided with a plurality of first through holes 221, the plurality of first through holes 221 are uniformly arranged on the inner annular sidewall of the first annular channel 22, and the aperture of the first through holes 221 is smaller than the diameter of the to-be-coated pipe 7, so as to ensure uniformity and stability of the internal air pressure of the to-be-coated pipe 7; preferably, the first through hole 221 has a certain angle in the opening direction, specifically: the first through hole 221 may be formed within a 90-degree range where the axial direction and the radial direction of the inner ring side wall of the first annular channel 22 intersect, so as to ensure that the inner wall of the to-be-coated pipe 7 may be in a uniform coating gas atmosphere, and ensure uniformity of coating.
In an alternative embodiment of the present invention, the pumping line includes: the second annular channel 32 surrounds the second end of the target 4.
In this embodiment, the second annular channel 32 and the air extraction channel 31 may be integrally formed, or may be fixed by welding, where one end of the air extraction channel 31 is fixedly connected to the magnetron sputtering furnace body 1 and extends out of the magnetron sputtering furnace body 1, and the other end is fixed and communicated with the second annular channel 32; the second annular channel 32 is annularly arranged at the second end of the target 4;
further, the diameter of the second annular channel 32 is larger than the diameter of the pipe 7 to be coated; so as to ensure that the coating gas in the pipeline 7 to be coated can be uniformly extracted, and the uniformity and stability of the coating gas in the pipeline 7 to be coated are ensured by matching the air inlet channel 21 and the first annular channel 22, and the stability of the internal air pressure is further ensured, so that the uniformity and stability of the coating film are further ensured; preferably, the first annular channel 22 and the second annular channel 32 have the same shape and size, and the first through hole 221 and the second through hole 321 have the same shape and size, so as to ensure dynamic balance between air intake and air exhaust.
In an alternative embodiment of the present invention, a plurality of second through holes 321 are uniformly formed in the second annular channel 32, and the aperture of the second through holes 321 is smaller than the diameter of the to-be-coated pipe 7.
In this embodiment, the second annular channel 32 is provided with a plurality of second through holes 321, the plurality of second through holes 321 are uniformly arranged on the inner annular sidewall of the second annular channel 32, and the aperture of the second through holes 321 is smaller than the diameter of the to-be-coated pipeline 7, so as to ensure the uniformity and stability of the internal air pressure of the to-be-coated pipeline 7; preferably, the second through hole 321 has a certain angle, and specifically: the second through hole 321 may be formed within a 90-degree range where the axial direction and the radial direction of the inner ring side wall of the second annular channel 32 intersect, so as to ensure that the inner wall of the to-be-coated pipe 7 may be in a uniform coating gas atmosphere, and ensure uniformity of coating;
when coating, coating gas is uniformly input into the magnetron sputtering furnace body 1 through the air inlet channel 21 at a preset air inlet rate and uniformly sprayed onto the inner wall of the pipeline 7 to be coated through the plurality of first through holes 221 on the first annular channel 22; meanwhile, the second through holes 321 on the second annular channel 32 and the air extraction channel 31 cooperate with the air inlet channel 21 and the second annular channel 32 to extract the film plating gas at a constant speed at a preset air extraction rate, and the preset air inlet rate is matched with the preset air extraction rate so as to achieve dynamic balance of air inlet and air extraction, thereby ensuring the stability of the air pressure in the pipeline 7 to be plated and further ensuring the stability and uniformity of film plating; the preset air inlet rate and the preset air exhaust rate can be ventilation quantity in unit time, and the air pressure in the magnetron sputtering furnace body 1 is stabilized in an air pressure range required by a coating process by adjusting the preset air inlet rate and the preset air exhaust rate; preferably, the preset intake rate and the preset initial rate (ventilation amount) may be set in a range of 100 to 500sccm (flow rate of gas per minute per cubic centimeter in a standard state).
The embodiment of the invention also provides a control method for pipeline coating based on magnetron sputtering, which is applied to the control system according to any one of the embodiments, and the method comprises the following steps:
step 11, providing a target material 4;
step 12, the target material 4 is arranged through the pipeline 7 to be coated;
step 13, supplying power to the electromagnet 6 wound outside the magnetron sputtering furnace body 1, wherein a uniform magnetic field is formed outside the magnetron sputtering furnace body 1 after the electromagnet 6 is electrified;
step 14, controlling an air inlet pipeline to input coating gas into the magnetron sputtering furnace body 1, and controlling an air exhaust pipeline to exhaust the coating gas from the magnetron sputtering furnace body 1 so that the air pressure in the magnetron sputtering furnace body 1 is in an air pressure range required by glow discharge;
and 15, controlling a bias power supply 5 to supply power to the target 4, wherein atoms on the surface of the target 4 escape under the action of the magnetic field, and are sputtered to the inner wall of the pipeline to be coated 5 to form a film.
In this embodiment, the to-be-coated pipe 7 and the target 4 are fixedly connected to the upper end or the lower end inside the magnetron sputtering furnace body 1 through a fixture, and meanwhile, the to-be-coated pipe 7 is installed outside the target 4, and the to-be-coated pipe 7 and the target 4 are assembled coaxially; opening the air inlet pipeline and the air exhaust pipeline, adjusting the ventilation quantity, stabilizing the ventilation quantity within the range of 100-500 sccm, further ensuring that the air pressure in the furnace body is stabilized within the air pressure range required by glow discharge, and further ensuring the uniformity and stability of the air pressure in the cavity between the pipeline 7 to be coated and the target material 4 through the first through hole 221 and the second through hole 321, thereby ensuring the uniformity and stability during coating; simultaneously, the electromagnet 6 is powered, so that a uniform annular magnetic field can be formed outside the magnetron sputtering furnace body 1; the bias power supply 5 is turned on, the required coating current is regulated according to the ventilation quantity, and when the air pressure and glow discharge in the furnace are stable, the fixed ventilation quantity is not regulated any more; and under the action of stable and uniform air pressure range and the coating current, glow discharge occurs in the magnetron sputtering furnace body 1, ions generated by ionization of the coating gas bombard the target 4 and collide with atoms on the surface of the target 4, the atoms on the surface of the target 4 are collided and escaped from the surface of the target to form sputtering atoms, and the sputtering atoms can be uniformly deposited on the inner wall of the pipeline 7 to be coated to form a film in the magnetic field and the stable air pressure range.
Further, based on the steps 11-15, the method may further include:
and step 16, continuously controlling the air inlet pipeline to input coating gas into the magnetron sputtering furnace body 1 and controlling the air exhaust pipeline to exhaust the coating gas from the magnetron sputtering furnace body 1 within a preset time period after coating is finished, so that the air pressure in the magnetron sputtering furnace body 1 is within a preset air pressure range.
In this embodiment, after the film plating is finished, air intake and air exhaust are continuously performed in the preset time period, and the air pressure in the magnetron sputtering furnace body 1 is stabilized within a preset air pressure range, so that the stability of depositing the sputtering atoms on the inner wall surface of the to-be-plated film pipeline 7 is ensured, and the preset time period can be determined according to the activity degree of the material of the to-be-plated film pipeline 7;
in an alternative embodiment of the present invention, the deposited film thickness may be evaluated by the film thickness relative standard deviation; when the relative standard deviation of the film thickness is smaller than a preset threshold value, relevant process parameters (such as ventilation capacity, film coating current and the like) during film coating can meet the requirement of film coating; when the relative standard deviation of the film thickness is larger than or equal to the preset threshold value, the relevant process parameters of the film coating are required to be adjusted again, so that the uniformity and stability of the deposited film are ensured; the preset and threshold values can be set according to the actual requirements of the coating film;
preferably, the film thickness relative standard deviation can be calculated by the following formula:
where RSD represents the relative standard deviation of film thickness, di represents the film thickness at each sampling point,the film thickness average value of the sampling points is represented, i represents the i-th sampling point in n sampling points, i=1, 2, …, n, n is positiveAn integer;
in a specific example, after the method of the above embodiment is implemented for a plurality of times, the film thicknesses of sampling points of different areas on the inner wall of the pipe 7 to be coated are obtained, and the relative standard deviation of the film thicknesses is calculated to obtain the result values shown in the following table,
| project | 1 st time | 2 nd time | 3 rd time | Fourth time |
| Film thickness sampling point | 9 | 9 | 8 | 8 |
| RSD(％) | 2.8 | 2.6 | 2.8 | 2.5 |
TABLE 1 relative standard deviation of film thickness at sampling points of different regions
The table shows that the calculated relative standard deviation of the film thickness is less than 3% of the preset threshold value, which indicates that the method and the related technological parameters meet the coating requirement;
according to the embodiment of the invention, the first through hole and the second through hole are respectively formed in the air inlet pipeline and the exhaust pipeline, and the ventilation quantity during film coating is regulated by combining the structures of the first through hole and the second through hole, so that the uniformity and the stability of the atmosphere in the magnetron sputtering furnace body 1 can be quickly and efficiently maintained, the stable atmosphere of the inner wall of the pipeline 7 to be coated is further ensured, the uniform film coating of the inner wall of the pipeline 7 to be coated can be realized, the sparking and discharging frequency is greatly reduced, the uniformity of the film coating is further improved, and the film coating quality is improved.
While the foregoing is directed to the preferred embodiments of the present invention, it will be appreciated by those skilled in the art that various modifications and adaptations can be made without departing from the principles of the present invention, and such modifications and adaptations are intended to be comprehended within the scope of the present invention.
Claims (4)
1. Control system based on magnetron sputtering carries out pipeline coating film, characterized by comprising:
a magnetron sputtering furnace body (1); an electromagnet (6) is arranged outside the magnetron sputtering furnace body (1) in a surrounding mode, and a uniform magnetic field is formed outside the magnetron sputtering furnace body (1) after the electromagnet (6) is electrified;
the pipeline (7) to be coated is arranged in the magnetron sputtering furnace body (1);
a target material (4) which is arranged in the magnetron sputtering furnace body (1) and penetrates through the pipeline (7) to be coated; one end of the target material (4) is provided with an air inlet pipeline, and the other end of the target material (4) is provided with an air exhaust pipeline;
the bias power supply (5), one end of the bias power supply (5) is electrically connected with the target (4), and the other end of the bias power supply is electrically connected with a pipeline (7) to be coated;
controlling the air inlet pipeline to input coating gas into the magnetron sputtering furnace body (1), and controlling the air exhaust pipeline to exhaust the coating gas from the magnetron sputtering furnace body (1) so that the air pressure in the magnetron sputtering furnace body (1) is in an air pressure range required by glow discharge; the bias power supply (5) supplies power to the target (4), and atoms on the surface of the target (4) escape under the action of the magnetic field and are sputtered to the inner wall of the pipeline to be coated (7) to form a film;
wherein, the air inlet pipeline includes: an air inlet channel (21) and a first annular channel (22) communicated with the air inlet channel (21), wherein the first annular channel (22) surrounds the first end of the target (4); the diameter of the first annular channel (22) is larger than that of the pipeline (7) to be coated;
the first annular channel (22) is uniformly provided with a plurality of first through holes (221); the aperture of the first through hole (221) is smaller than the diameter of the pipeline (7) to be coated;
the air extraction pipeline comprises: a gas extraction channel (31) and a second annular channel (32) communicated with the gas extraction channel (31), wherein the second annular channel (32) surrounds the second end of the target (4); the diameter of the second annular channel (32) is larger than that of the pipeline (7) to be coated;
and a plurality of second through holes (321) are uniformly formed in the second annular channel (32), and the aperture of the second through holes (321) is smaller than the diameter of the pipeline (7) to be coated.
2. The control system for pipe coating based on magnetron sputtering according to claim 1, characterized in that the target (4) is arranged coaxially to the pipe (7) to be coated.
3. A control method for pipeline coating based on magnetron sputtering, which is applied to the control system as claimed in any one of claims 1-2, and comprises the following steps:
providing a target (4);
the target material (4) penetrates through a pipeline (7) to be coated;
the magnetron sputtering device comprises a magnetron sputtering furnace body (1), an electromagnet (6) wound outside the magnetron sputtering furnace body (1) is powered on, and a uniform magnetic field is formed outside the magnetron sputtering furnace body (1) after the electromagnet (6) is electrified;
controlling an air inlet pipeline to input coating gas into the magnetron sputtering furnace body (1), and controlling an air exhaust pipeline to exhaust the coating gas from the magnetron sputtering furnace body (1) so that the air pressure in the magnetron sputtering furnace body (1) is in an air pressure range required by glow discharge;
controlling a bias power supply (5) to supply power to the target (4), wherein atoms on the surface of the target (4) escape under the action of the magnetic field, and are sputtered to the inner wall of the pipeline to be coated (7) to form a film;
when coating, coating gas is input into the magnetron sputtering furnace body (1) at a constant speed at a preset air inlet rate through the air inlet channel (21), and is uniformly sprayed onto the inner wall of the pipeline (7) to be coated through a plurality of first through holes (221) on the first annular channel (22); simultaneously, a plurality of second through holes (321) on the second annular channel (32) and the air exhaust channel (31) are matched with the air inlet channel (21) and the second annular channel (32) to exhaust the film coating gas at a constant speed at a preset air exhaust rate, the preset air inlet rate is matched with the preset air exhaust rate, so that dynamic balance of air inlet and air exhaust is achieved, the stability of air pressure in the to-be-coated pipeline (7) is ensured, and the stability and uniformity of film coating are further ensured; the preset air inlet rate and the preset air exhaust rate can be ventilation quantity in unit time, and the air pressure in the magnetron sputtering furnace body (1) is stabilized in an air pressure range required by a coating process by adjusting the preset air inlet rate and the preset air exhaust rate.
4. The method for controlling pipeline coating based on magnetron sputtering according to claim 3, further comprising:
and continuously controlling the air inlet pipeline to input coating gas into the magnetron sputtering furnace body (1) within a preset time period after coating is finished, and controlling the air exhaust pipeline to exhaust the coating gas from the magnetron sputtering furnace body (1) so that the air pressure in the magnetron sputtering furnace body (1) is within a preset air pressure range.
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