CN115307469B - Multi-source driven high-power loop heat pipe radiating device - Google Patents
Multi-source driven high-power loop heat pipe radiating device Download PDFInfo
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- CN115307469B CN115307469B CN202210949782.8A CN202210949782A CN115307469B CN 115307469 B CN115307469 B CN 115307469B CN 202210949782 A CN202210949782 A CN 202210949782A CN 115307469 B CN115307469 B CN 115307469B
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- 229910052751 metal Inorganic materials 0.000 claims description 17
- 238000002156 mixing Methods 0.000 claims description 16
- 239000000843 powder Substances 0.000 claims description 16
- 230000007246 mechanism Effects 0.000 claims description 11
- 239000011148 porous material Substances 0.000 claims description 9
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 8
- 238000001035 drying Methods 0.000 claims description 6
- 238000010438 heat treatment Methods 0.000 claims description 6
- 239000003795 chemical substances by application Substances 0.000 claims description 4
- 238000005245 sintering Methods 0.000 claims description 4
- 238000001816 cooling Methods 0.000 claims description 3
- 239000008367 deionised water Substances 0.000 claims description 3
- 229910021641 deionized water Inorganic materials 0.000 claims description 3
- 238000000465 moulding Methods 0.000 claims description 3
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- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical group [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 description 2
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- 230000035939 shock Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- WYTGDNHDOZPMIW-RCBQFDQVSA-N alstonine Natural products C1=CC2=C3C=CC=CC3=NC2=C2N1C[C@H]1[C@H](C)OC=C(C(=O)OC)[C@H]1C2 WYTGDNHDOZPMIW-RCBQFDQVSA-N 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
- F28D15/043—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure forming loops, e.g. capillary pumped loops
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/06—Control arrangements therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20381—Thermal management, e.g. evaporation control
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D2015/0291—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes comprising internal rotor means, e.g. turbine driven by the working fluid
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention discloses a multi-source driven high-power loop heat pipe radiating device which is used for radiating a chip and comprises an evaporator, a condenser and a control component, wherein the evaporator is used for absorbing heat radiated by the chip and comprises a shell and a capillary core, the capillary core can be filled with working media, the shell is provided with a sealing cavity, the capillary core is arranged in the sealing cavity and isolates the sealing cavity into a compensation cavity and a steam channel, the steam channel is connected with a first ejector and a second ejector, the compensation cavity is respectively communicated with the first ejector and the second ejector, one end of the condenser is respectively connected with the first ejector and the second ejector, the other end of the condenser is respectively communicated with the compensation cavity, the control component is respectively connected with the second ejector and the chip, and the control component can control the on-off of the second ejector according to the temperature and the power of the chip. The heat dissipation device can increase the driving pressure of steam and reduce the temperature in the evaporator, so that the temperature of the evaporator can meet the standard, and the heat dissipation requirement of a high-power chip is met.
Description
Technical Field
The invention relates to the technical field of electronic element heat dissipation, in particular to a multi-source driven high-power loop heat pipe heat dissipation device.
Background
The loop heat pipe has strong heat transfer capability, long heat transfer distance and strong anti-gravity running capability, and has great prospect in the aspect of heat management of a high heat flux chip. But the maximum heat transfer power of the loop heat pipe is limited by the wick. The "heat leak" of the evaporator to the compensation chamber can cause start-up pulse, temperature fluctuation and even start-up failure. In the prior art, through the thought of coupling the ejector and the loop heat pipe, the booster characteristic of the ejector is utilized to provide additional circulating driving force, and the ejector characteristic is utilized to solve the problem of heat leakage of the compensation cavity.
But loop heat pipes are driven by a single ejector, and at high heat flux density, the evaporator can generate a large amount of steam. Because the steam flow is limited by the minimum sectional area of the steam nozzle of the ejector, the steam cannot be rapidly discharged from the bottom plate of the evaporator, the steam partial pressure in the steam channel is continuously increased, the temperature of the bottom plate under the high heat flux density exceeds the standard, and the heat dissipation requirement of the high-power chip cannot be met. Although the steam discharge amount can be improved by expanding the minimum sectional area (throat or outlet) of the steam nozzle of the ejector or increasing the number of the ejectors, and the temperature of the bottom plate of the evaporator under high power is reduced, the outlet of the steam nozzle can not reach sonic speed or supersonic speed during low power, so that the ejectors lose ejection and boosting performance in a low power operation interval, the heat transfer performance and stability of the loop heat pipe under low power are seriously affected, the variable load operation requirement of a chip can not be met, and high-power equipment can not be ensured to operate under low power.
Disclosure of Invention
Based on this, it is necessary to provide a multi-source driven heat dissipation device for a high-power loop heat pipe, which can solve the technical problem that the temperature of an evaporator exceeds standard under high heat flux density and cannot meet the heat dissipation requirement of a high-power chip due to the driving of a single ejector in the prior art.
The invention provides a multi-source driven high-power loop heat pipe radiating device, which is used for radiating a chip and comprises the following components:
the evaporator is used for absorbing heat emitted by the chip and comprises a shell and a capillary core, the capillary core can be filled with working medium, the shell is provided with a sealing cavity, the capillary core is arranged in the sealing cavity and isolates the sealing cavity into a compensation cavity and a steam channel, the steam channel is connected with a first ejector and a second ejector, and the compensation cavity is respectively communicated with the first ejector and the second ejector;
one end of the condenser is respectively connected with the first ejector and the second ejector, and the other end of the condenser is communicated with the compensation cavity; and
The control assembly is respectively connected with the second ejector and the chip, and can control the on-off of the second ejector according to the temperature and the power of the chip.
Further, the heat dissipation device further comprises a conveying mechanism, the conveying mechanism is respectively connected with the compensation cavity, the steam channel, the first ejector, the second ejector and the condenser, and the conveying mechanism is used for supplying working medium and steam to circularly flow between the compensation cavity, the steam channel, the first ejector, the second ejector and the condenser.
Further, the conveying mechanism comprises a first steam pipeline, a second steam pipeline, a first liquid pipeline and a second liquid pipeline, one end of the first steam pipeline is connected with the steam pipeline, the other end of the first steam pipeline is connected with the second liquid pipeline, the first ejector is arranged in the first steam pipeline, one end of the second steam pipeline is connected with the steam pipeline, the other end of the second steam pipeline is connected with the second liquid pipeline, the second ejector is arranged in the second steam pipeline, one end of the first liquid pipeline is communicated with the compensation cavity, the other ends of the first liquid pipeline are respectively connected with the first ejector and the second ejector, one end of the second liquid pipeline away from the first ejector is communicated with the compensation cavity, and the condenser is arranged in the second liquid pipeline.
Further, the control assembly comprises a controller and an electromagnetic valve, the controller is respectively connected with the electromagnetic valve and the chip, the electromagnetic valve is connected with the second ejector, and the controller is used for controlling the opening or closing of the electromagnetic valve according to the temperature and the power of the chip so as to control the on-off of the second ejector.
Further, the control assembly further comprises temperature sensors, the temperature sensors are respectively connected with the controller, the temperature sensors are arranged on the chip, the temperature sensors are used for acquiring temperature signals of the chip and transmitting the temperature signals to the controller, and the controller receives the temperature signals transmitted by the temperature sensors and controls the electromagnetic valve to be opened or closed according to the temperature signals.
Further, the judging step of the controller includes:
when the temperature of the chip is greater than a first threshold value and the power of the chip is greater than a second threshold value, the controller opens the second ejector;
when the temperature of the chip is smaller than a first threshold value and the power of the chip is larger than a second threshold value, the controller controls the second ejector to be in an open state;
when the temperature of the chip is smaller than a first threshold value and the power of the chip is smaller than a second threshold value, the controller controls the second ejector to be in a closed state.
Further, the average pore diameter of the capillary core is smaller than 5 mu m, and the capillary core is formed by sintering metal powder.
Further, the preparation steps of the capillary core comprise:
uniformly spreading metal powder with the particle size smaller than 20 mu m into a die after drying in an oven;
mixing a pore-forming agent of 50-100 mu m into the metal powder;
cold press molding is carried out on the metal powder in the die through a tablet press, and demoulding is carried out after cold press, wherein the cold press pressure is more than 200MPa;
placing the demoulded intermediate into a nitrogen atmosphere furnace for sintering, wherein the heating rate is 10 ℃/min, and preserving the temperature for 30-90 min, and taking out the intermediate after cooling to room temperature;
and (3) placing the intermediate cooled to room temperature into deionized water for ultrasonic cleaning, and drying the cleaned intermediate to form the capillary core.
Further, the first ejector comprises a first steam nozzle and a first liquid nozzle, a first mixing cavity is formed in the first ejector, the first steam nozzle and the first liquid nozzle are communicated with the first mixing cavity, the steam channel is communicated with the first steam nozzle, so that steam in the steam channel can enter the first steam nozzle, and the first liquid pipeline is communicated with the first mixing cavity.
Further, the first steam nozzle is a converging nozzle.
According to the multi-source driven high-power loop heat pipe radiating device provided by the invention, heat is generated when a chip works, the heat is transferred to the capillary core, the temperature of working medium in the capillary core rises after absorbing the heat, steam is formed, the steam enters the first ejector and the second ejector through the steam channel, and the control component can control the on-off of the second ejector according to the temperature and the power of the chip. When the temperature and the power of the chip are higher, the control component starts the second ejector, and the driving pressure of steam can be increased through the simultaneous operation of the first ejector and the second ejector, so that the steam in the evaporator can be rapidly discharged, the partial pressure of the steam in the evaporator is reduced, and the temperature in the evaporator is reduced; when the temperature and the power of the chip are lower, the control component closes the second ejector, steam enters the condenser through the first ejector, so that the steam nozzle outlet reaches sonic speed or supersonic speed during low power, the ejector keeps ejecting and boosting performance in a low power operation interval, the heat transfer performance and stability of the loop heat pipe under low power are guaranteed, the variable load operation requirement of the chip is met, namely the heat dissipation of the high-power chip operated under low power is met, the temperature of the evaporator can meet the standard, and the high-power chip can meet the heat dissipation requirement during high-power and low-power operation.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and other drawings may be obtained according to the structures shown in these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic diagram of a heat dissipation device with a multi-source driven high-power loop heat pipe according to an embodiment of the present invention;
FIG. 2 is a schematic diagram of another structure of a multi-source driven heat pipe heat dissipation device with high power loop according to an embodiment of the present invention;
FIG. 3 is a control method diagram of a controller according to an embodiment of the present invention;
FIG. 4 is a schematic diagram of a capillary wick bubble breaking in accordance with an embodiment of the present invention;
FIG. 5 is a microstructure of a metal powder sintered capillary wick according to an embodiment of the present invention;
FIG. 6 is a graph showing pore size distribution of a sintered metal powder wick according to an embodiment of the present invention.
The main components are as follows:
100. an evaporator; 110. a housing; 120. a capillary wick; 130. a steam channel; 140. a compensation chamber; 301. a capillary meniscus; 200. a first ejector; 210. a first steam nozzle; 220. a first liquid nozzle; 230. a first mixing chamber; 300. a second ejector; 310. a first steam nozzle; 320. a second liquid nozzle; 330. a second mixing chamber; 400. a condenser; 410. a second fin; 420. a fan; 510. a controller; 520. an electromagnetic valve; 530. a temperature sensor; 610. a first steam pipe; 620. a second steam pipe; 630. a first liquid conduit; 631. a first fin; 640. a second liquid conduit; 700. a chip; 800. a thermal interface material.
The achievement of the objects, functional features and advantages of the present invention will be further described with reference to the accompanying drawings, in conjunction with the embodiments.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all embodiments of the invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
It should be noted that all directional indicators (such as up, down, left, right, front, and rear … …) in the embodiments of the present invention are merely used to explain the relative positional relationship, movement, etc. between the components in a particular posture (as shown in the drawings), and if the particular posture is changed, the directional indicator is changed accordingly.
Furthermore, the description of "first," "second," etc. in this disclosure is for descriptive purposes only and is not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In addition, "and/or" throughout this document includes three schemes, taking a and/or B as an example, including a technical scheme, a technical scheme B, and a technical scheme that both a and B satisfy; in addition, the technical solutions of the embodiments may be combined with each other, but it is necessary to base that the technical solutions can be realized by those skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should be considered to be absent and not within the scope of protection claimed in the present invention.
As shown in fig. 1 and 2, in some embodiments, a multi-source driven high-power loop heat pipe heat dissipating device is used for dissipating heat of a chip 700, and includes an evaporator 100, a condenser 400 and a control component, the evaporator 100 is used for absorbing heat dissipated by the chip 700, the evaporator 100 includes a housing 110 and a capillary core 120, the capillary core 120 can be filled with working medium, the housing 110 has a sealed cavity, the capillary core 120 is disposed in the sealed cavity and isolates the sealed cavity into a compensation cavity 140 and a steam channel 130, the steam channel 130 is connected with a first ejector 200 and a second ejector 300, and the compensation cavity 140 is respectively communicated with the first ejector 200 and the second ejector 300. One end of the condenser 400 is connected to the first ejector 200 and the second ejector 300, respectively, and the other end is communicated with the compensation chamber 140. The control assembly is respectively connected with the second ejector 300 and the chip 700, and can control the on-off of the second ejector 300 according to the temperature and the power of the chip 700.
The chip 700 can produce heat when working, and the heat transfer reaches the capillary core 120, and the temperature rises after the working medium in the capillary core 120 absorbs the heat, forms steam, and steam passes through the steam channel 130 and gets into first ejector 200 and second ejector 300, and the control assembly can control the break-make of second ejector 300 according to the temperature and the power of chip 700. When the temperature and power of the chip 700 are low, the control assembly closes the second ejector 300 and steam enters the condenser 400 through the first ejector 200. When the temperature and the power of the chip 700 are higher, the control assembly opens the second ejector 300, and the driving pressure of the steam can be increased by simultaneously working the first ejector 200 and the second ejector 300, so that the steam in the evaporator 100 can be rapidly discharged, the partial pressure of the steam in the evaporator 100 is reduced, and the temperature in the evaporator 100 is reduced, so that the temperature of the evaporator 100 can meet the standard, and the heat dissipation requirement of the high-power chip 700 is met. In addition, when the high-power chip works, the through-flow capacity of steam can be greatly improved through the first ejector 200 and the second ejector 300, so that the loop heat pipe heat radiator can be compatible with low-boiling-point working media, the application and storage environment temperature range of the loop heat pipe heat radiator are expanded, the safety and reliability of the loop heat pipe heat radiator in the use process are improved, when the low-power chip works, the first ejector 200 and the second ejector work simultaneously, the sectional area of a steam nozzle is enlarged, the outlet of the steam nozzle cannot reach sonic speed or supersonic speed, and the high-power equipment and the low-power operation effect can be realized through the cooperation of a control component.
Furthermore, the loop heat pipe radiator meets the storage and operation requirements of high and low temperature environments (-40 to +40 ℃), and the civil field also requires that the working medium is nontoxic and nonflammable. The requirement for high-low temperature storage eliminates the water which is a working medium with excellent heat exchange performance, and the requirement for non-toxicity and non-inflammability eliminates the alcohol and ammonia working medium. The low boiling point working medium (such as electronic fluorinated liquids HFE7100, FC72, freons R134a, R22 and the like) can simultaneously meet the requirements. However, the vaporization latent heat of the low boiling point working medium is generally in the range of 1/10 to 1/20 of that of the water working medium, and under the same heat dissipation power, the low boiling point working medium will generate a large amount of steam, and the single ejector scheme will not meet the steam through-flow and dissipation requirements, which easily causes the temperature of the evaporator 100 to rise sharply.
In addition, the multi-source driven high-power loop heat pipe heat dissipation device can greatly improve the steam through-flow capacity, so that the low-boiling-point working medium can be compatible, the application and storage environment temperature range of the loop heat pipe are expanded, and the safety and reliability of the loop heat pipe heat dissipation device in the use process are improved (the low-boiling-point working medium has the advantages of high insulativity, no toxicity, incombustibility and the like).
According to the multi-source driven high-power loop heat pipe heat dissipation device, only the first ejector 200 is started under the low power of the chip 700, so that the heat transfer property and stability of the loop heat pipe under the low power of the chip 700 are ensured. The second ejector 300 is opened under the high power of the chip 700, so that the flow rates of steam and cold liquid are greatly improved, and the heat transfer limit of the loop heat pipe and the heat dissipation performance under the high power chip 700 are effectively improved. Therefore, the multi-source driven high-power loop heat pipe can meet the heat dissipation requirement of the variable-load operation of the high-power chip 700.
Specifically, the heat dissipating device further includes a conveying mechanism, where the conveying mechanism is respectively connected to the compensation chamber 140, the steam channel 130, the first ejector 200, the second ejector 300, and the condenser 400, and the conveying mechanism is used for supplying working medium and steam to circulate between the compensation chamber 140, the steam channel 130, the first ejector 200, the second ejector 300, and the condenser 400.
More specifically, the conveying mechanism includes a first steam pipe 610, a second steam pipe 620, a first liquid pipe 630 and a second liquid pipe 640, one end of the first steam pipe 610 is connected with the steam channel 130, the other end is connected with the second liquid pipe 640, the first ejector 200 is disposed in the first steam pipe 610, one end of the second steam pipe 620 is connected with the steam channel 130, the other end is connected with the second liquid pipe 640, the second ejector 300 is disposed in the second steam pipe 620, one end of the first liquid pipe 630 is communicated with the compensation chamber 140, the other end is connected with the first ejector 200 and the second ejector 300, one end of the second liquid pipe 640 far from the first ejector 200 is communicated with the compensation chamber 140, and the condenser 400 is disposed in the second liquid pipe 640. Specifically, the first liquid pipe 630 is further provided with a first fin 631.
In operation, the steam in the steam channel 130 enters the first steam pipeline 610 and the second steam pipeline 620 at the same time and enters the first ejector 200 and the second ejector 300 respectively, the cold liquid in the compensation chamber 140 enters the first ejector 200 and the second ejector 300 respectively through the first steam pipeline 630, the cold liquid is evaporated and pressurized through the first ejector 200 and the second ejector 300 to form high-speed steam, the high-speed steam and the cold liquid are mixed in the first ejector 200 and the second ejector 300 to form a supersonic gas-liquid two-phase flow, and condensation shock waves are formed in the first ejector 200 and the second ejector 300, so that the high-pressure hot liquid is discharged from the first ejector 200 and the second ejector 300 and is converged into the second liquid pipeline 640 through the first steam pipeline 610 and the second steam pipeline 620 respectively, the cold liquid is formed after condensation through the condenser 400, and the cold liquid flows into the compensation chamber 140. The cold liquid flowing into the compensating chamber 140 mostly flows into the first ejector 200 and the second ejector 300 under the suction of the first ejector 200 and the second ejector 300, and absorbs heat and takes away bubbles on the upper surface of the capillary wick 120. A small portion of the cold fluid passes through the capillary core 120 under the action of capillary force and gravity to become a filling working medium of the capillary core 120, and the working medium in the capillary core 120 evaporates into steam under the action of heat emitted from the chip 700, so that the steam and the liquid circulate among the compensation chamber 140, the evaporation channel, the first ejector 200, the second ejector 300 and the condenser 400.
Specifically, the condenser 400 is a serpentine condenser. The second liquid pipe 640 is further provided with a second fin 410 and a fan 420 to increase the condensing effect of the condenser 400. The bottom of the evaporator 100 is closely attached to the chip 700 by the thermal interface material 800. More specifically, the first ejector 200 is identical in structure to the second ejector 300.
Further, the first ejector 200 includes a first steam nozzle 210 and a first liquid nozzle 220, the first ejector 200 is provided with a first mixing chamber 230, the first steam nozzle 210 and the first liquid nozzle 220 are both communicated with the first mixing chamber 230, the first liquid nozzle 220 is disposed at the outer side of the first steam nozzle 210, the steam channel 130 is communicated with the first steam nozzle 210, so that steam in the steam channel 130 can enter the first steam nozzle 210, and the first liquid channel 630 is communicated with the first mixing chamber 230.
Further, the second ejector 300 includes a second steam nozzle 310 and a second liquid nozzle 320, the second ejector 300 is provided with a second mixing chamber 330, the second steam nozzle 310 and the second liquid nozzle 320 are both communicated with the second mixing chamber 330, the second liquid nozzle 320 is disposed outside the second steam nozzle 310, the steam channel 130 is communicated with the second steam nozzle 310, so that steam in the steam channel 130 can enter the second steam nozzle 310, and the second liquid pipeline 640 is communicated with the second mixing chamber 330.
Further, the first steam nozzle 210 and the second steam nozzle 310 are preferably tapered nozzles, which aim to prevent the condensation of steam during expansion from affecting the heat dissipation performance of the loop heat pipe, mainly because: the steam generated by the evaporator 100 is generally in a saturated state, for example, an ejector using steam as primary fluid and a steam nozzle as a scaling structure is adopted, after the saturated steam flows through the throat of the scaling nozzle, supercooling is most likely to occur in the expansion section due to shock wave generation, so that part of the steam is condensed in the steam nozzle, the performance of the ejector is greatly affected, and the performance of the loop heat pipe is further affected.
Further, the control assembly includes a controller 510 and an electromagnetic valve 520, the controller 510 is connected with the electromagnetic valve 520 and the chip 700 respectively, the electromagnetic valve 520 is connected with the second ejector 300, the electromagnetic valve 520 is disposed on the second steam pipe 620 and is located between the steam channel 130 and the second ejector 300, and the controller 510 is used for controlling the opening or closing of the electromagnetic valve 520 according to the temperature and the power of the chip 700, so as to control the on-off of the second ejector 300. Specifically, the controller 510 may be, but is not limited to being, a PID controller 510.
Further, the control assembly further includes temperature sensors 530, the temperature sensors 530 are respectively connected to the controller 510, and the temperature sensors 530 are disposed on the chip 700, the temperature sensors 530 are configured to obtain temperature signals of the chip 700 and transmit the temperature signals to the controller 510, and the controller 510 receives the temperature signals transmitted by the temperature sensors 530 and controls the solenoid valve 520 to be opened or closed according to the temperature signals. Specifically, the temperature sensor 530 may be provided in plurality, and the plurality of temperature sensors 530 simultaneously acquire the temperature signal of the chip 700 and take an average value thereof, thereby improving the accuracy of temperature measurement. Preferably, the temperature sensor 530 may be provided in two.
In some embodiments, the determining step of the controller 510 includes:
when the temperature of the chip 700 is greater than the first threshold and the power of the chip 700 is greater than the second threshold, the controller 510 opens the second ejector 300;
when the temperature of the chip 700 is less than the first threshold and the power of the chip 700 is greater than the second threshold, the controller 510 controls the second ejector 300 to be in an open state;
when the temperature of the chip 700 is less than the first threshold and the power of the chip 700 is less than the second threshold, the controller 510 controls the second ejector 300 to be in a closed state. Wherein the first threshold is 85 ℃.
As shown in fig. 3, specifically, when the heating power Q of the chip 700 is greater than the second threshold Q1, and the arithmetic average value Tave of the temperature T1 measured by the first temperature sensor 530 and the temperature T2 measured by the second temperature sensor 530 is greater than 85 ℃, the PID controller 510 sends a pulse signal to open the electromagnetic valve 520, the first ejector 200 and the second ejector 300 simultaneously operate, the loop heat pipe radiator enters a dual ejector operating mode, the steam flow capacity is greatly improved, and the temperature of the chip 700 is rapidly reduced. When Tave <85 ℃, Q > Q1, the PID controller 510 continues to operate, maintaining the solenoid valve 520 in a normally open state. When Tave is less than 85 ℃ and Q is less than Q1, the PID controller 510 does not send out pulse signals, the valve 9 is maintained in a normally closed state, the first ejector 200 is opened, the second ejector 300 is closed, and the loop heat pipe heat dissipation device enters a single ejector working mode.
The mathematical expression of the PID controller 510 is
In the formula (1): e (t) is the systematic deviation, kp is the proportional control parameter, KI is the integral control parameter, and Kd is the differential control parameter. The three parameters are optimized and selected according to the actual loop heat pipe heat dissipation device.
Further, in the feedback loop of the PID controller 510, the input signal is the average temperature Teva and the heating power Q of the chip 700, and the output signal is a pulse electric signal for controlling the opening or closing of the solenoid valve 520.
As shown in fig. 4, the low boiling point working medium tends to have a low surface tension (about 1/4 to 1/5 of that of water), and according to Young-Laplace equation (formula 2), when the same capillary wick 120 is used (the effective aperture is the same), the "bubble breaking pressure" is far lower than that of water, and part of the vapor easily passes through the capillary wick 120 and enters the compensation chamber 140, so that the vapor-liquid separation of the evaporator 100 cannot be realized, and the problems of start pulse, temperature fluctuation, start failure and the like are easily caused. The lower capillary force of the low boiling insulating liquid means that the head on the liquid side of capillary meniscus 301 is smaller as the working fluid changes phase between the pores of capillary wick 120. At high heating power, the gas side partial pressure is higher than the liquid side partial pressure (i.e., capillary head), and the capillary meniscus 301 will move toward the compensation chamber 140, forming a "bubble breaking" phenomenon. The "bubble breaking" causes the compensating chamber 140 to increase in pressure and temperature, affecting the liquid back flow, eventually leading to a loop heat pipe failure to start.
In the formula (2): ΔP-bubble breaking pressure, kPa; sigma-surface tension, N/m; θ—contact angle; r is (r) eff The effective pore size, m, of the wick 120.
In some embodiments, the capillary wick 120 has an average pore size of less than 5 μm and is sintered from a metal powder. According to formula (2), the small-aperture capillary wick 120 can generate a larger capillary pressure head, effectively prevent the bubble breaking phenomenon, and enable the low-boiling-point and low-surface-tension substance to be suitable for loop heat pipes.
Specifically, the preparation steps of the capillary wick 120 include:
s1, uniformly spreading metal powder with the particle size smaller than 20 mu m into a die after drying in an oven. The metal powder may be copper, nickel, stainless steel, or the like.
S2, in the metal powderA pore-forming agent of 50-100 μm is mixed to increase the porosity of the metal powder sintered capillary core 120. Wherein the pore-forming agent is NaCl or Na 2 CO 3 And salts which are readily soluble in water.
And S3, cold press molding is carried out on the metal powder in the die through a tablet press, and demoulding is carried out after cold press so as to ensure that the capillary core 120 has a smaller effective aperture. Wherein the pressure of cold pressing is more than 200MPa.
S4, placing the demoulded intermediate into a nitrogen atmosphere furnace for sintering, wherein the heating rate is 10 ℃/min, preserving heat for 30-90 min, and taking out the intermediate after cooling to room temperature.
And S5, placing the intermediate cooled to room temperature into deionized water for ultrasonic cleaning, and drying the cleaned intermediate to form the capillary 120.
As shown in fig. 5 and 6, the small pore diameter metal powder sintered capillary core 120 prepared by the above preparation steps has a compact pore structure, and the effective pore diameter is less than 5 μm, and most of micropores are distributed in the range of 1-2 μm, so that a larger capillary pressure head can be provided, and the phenomenon of 'foam breaking' is delayed.
The foregoing description is only of the preferred embodiments of the present invention and is not intended to limit the scope of the invention, and all equivalent structural changes made by the description of the present invention and the accompanying drawings or direct/indirect application in other related technical fields are included in the scope of the invention.
Claims (9)
1. A multi-source driven high power loop heat pipe heat dissipation device for dissipating heat from a chip, comprising:
the evaporator is used for absorbing heat emitted by the chip and comprises a shell and a capillary core, the capillary core can be filled with working medium, the shell is provided with a sealing cavity, the capillary core is arranged in the sealing cavity and isolates the sealing cavity into a compensation cavity and a steam channel, the steam channel is connected with a first ejector and a second ejector, and the compensation cavity is respectively communicated with the first ejector and the second ejector;
one end of the condenser is respectively connected with the first ejector and the second ejector, and the other end of the condenser is communicated with the compensation cavity; and
The control component is respectively connected with the second ejector and the chip and can control the on-off of the second ejector according to the temperature and the power of the chip;
the control assembly comprises a controller and an electromagnetic valve, the controller is respectively connected with the electromagnetic valve and the chip, the electromagnetic valve is connected with the second ejector, and the controller is used for controlling the opening or closing of the electromagnetic valve according to the temperature and the power of the chip so as to control the on-off of the second ejector.
2. The heat sink of claim 1 further comprising a delivery mechanism coupled to the compensation chamber, the steam channel, the first ejector, the second ejector, and the condenser, respectively, the delivery mechanism configured to circulate a working medium and steam between the compensation chamber, the steam channel, the first ejector, the second ejector, and the condenser.
3. The heat dissipating device according to claim 2, wherein the conveying mechanism comprises a first steam pipe, a second steam pipe, a first liquid pipe and a second liquid pipe, one end of the first steam pipe is connected with the steam pipe, the other end is connected with the second liquid pipe, the first ejector is arranged on the first steam pipe, one end of the second steam pipe is connected with the steam pipe, the other end is connected with the second liquid pipe, the second ejector is arranged on the second steam pipe, one end of the first liquid pipe is communicated with the compensation cavity, the other end is respectively connected with the first ejector and the second ejector, one end of the second liquid pipe far away from the first ejector is communicated with the compensation cavity, and the condenser is arranged on the second liquid pipe.
4. The heat dissipating device according to claim 1, wherein the control assembly further comprises temperature sensors, the temperature sensors are respectively connected with the controller, the temperature sensors are arranged on the chip, the temperature sensors are used for acquiring temperature signals of the chip and transmitting the temperature signals to the controller, and the controller receives the temperature signals transmitted by the temperature sensors and controls the electromagnetic valve to be opened or closed according to the temperature signals.
5. The heat dissipating device of claim 1, wherein the step of determining by the controller comprises:
when the temperature of the chip is greater than a first threshold value and the power of the chip is greater than a second threshold value, the controller opens the second ejector;
when the temperature of the chip is smaller than a first threshold value and the power of the chip is larger than a second threshold value, the controller controls the second ejector to be in an open state;
when the temperature of the chip is smaller than a first threshold value and the power of the chip is smaller than a second threshold value, the controller controls the second ejector to be in a closed state.
6. The heat sink of claim 1 wherein the wick has an average pore size of less than 5 μm and is sintered from metal powder.
7. The heat sink of claim 6, wherein the step of preparing the wick comprises:
uniformly spreading metal powder with the particle size smaller than 20 mu m into a die after drying in an oven;
mixing a pore-forming agent of 50-100 mu m into the metal powder;
cold press molding is carried out on the metal powder in the die through a tablet press, and demoulding is carried out after cold press, wherein the cold press pressure is more than 200MPa;
placing the demoulded intermediate into a nitrogen atmosphere furnace for sintering, wherein the heating rate is 10 ℃/min, and preserving the temperature for 30-90 min, and taking out the intermediate after cooling to room temperature;
and (3) placing the intermediate cooled to room temperature into deionized water for ultrasonic cleaning, and drying the cleaned intermediate to form the capillary core.
8. The heat sink of claim 3 wherein the first ejector comprises a first steam nozzle and a first liquid nozzle, the first ejector defines a first mixing chamber, the first steam nozzle and the first liquid nozzle are in communication with the first mixing chamber, the steam channel is in communication with the first steam nozzle such that steam in the steam channel can enter the first steam nozzle, and the first liquid conduit is in communication with the first mixing chamber.
9. The heat sink of claim 8, wherein the first steam nozzle is a converging nozzle.
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|---|---|---|---|---|
| CN102359745A (en) * | 2011-07-06 | 2012-02-22 | 罗勰 | Moderate and low temperature mixed working medium thermal and electrical combined cycle based on brown cycle |
| DE202017100039U1 (en) * | 2017-01-06 | 2017-03-14 | Shanghai Ocean University | Jet self-cascade refrigeration system for residual heat recovery of a tuna fishing boat |
| CN112179188A (en) * | 2020-09-25 | 2021-01-05 | 西安交通大学 | Flat plate type loop heat pipe capable of stably running under high heat leakage and using method |
| CN114772674A (en) * | 2022-05-09 | 2022-07-22 | 南京工业大学 | Low-carbon running saline wastewater treatment system and method applying solar energy and loop heat pipe |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN109855456B (en) * | 2019-03-12 | 2020-06-19 | 西安交通大学 | Loop heat pipe radiator with vapor-liquid two-phase flow jet boosting device |
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Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102359745A (en) * | 2011-07-06 | 2012-02-22 | 罗勰 | Moderate and low temperature mixed working medium thermal and electrical combined cycle based on brown cycle |
| DE202017100039U1 (en) * | 2017-01-06 | 2017-03-14 | Shanghai Ocean University | Jet self-cascade refrigeration system for residual heat recovery of a tuna fishing boat |
| CN112179188A (en) * | 2020-09-25 | 2021-01-05 | 西安交通大学 | Flat plate type loop heat pipe capable of stably running under high heat leakage and using method |
| CN114772674A (en) * | 2022-05-09 | 2022-07-22 | 南京工业大学 | Low-carbon running saline wastewater treatment system and method applying solar energy and loop heat pipe |
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