CN115280526A - 层叠压电元件 - Google Patents

层叠压电元件 Download PDF

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Publication number
CN115280526A
CN115280526A CN202180020130.XA CN202180020130A CN115280526A CN 115280526 A CN115280526 A CN 115280526A CN 202180020130 A CN202180020130 A CN 202180020130A CN 115280526 A CN115280526 A CN 115280526A
Authority
CN
China
Prior art keywords
piezoelectric
layer
laminated
film
piezoelectric thin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202180020130.XA
Other languages
English (en)
Chinese (zh)
Inventor
香川裕介
芦川辉男
平口和男
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujifilm Corp
Original Assignee
Fujifilm Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujifilm Corp filed Critical Fujifilm Corp
Publication of CN115280526A publication Critical patent/CN115280526A/zh
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/88—Mounts; Supports; Enclosures; Casings
    • H10N30/883—Additional insulation means preventing electrical, physical or chemical damage, e.g. protective coatings
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R7/00—Diaphragms for electromechanical transducers; Cones
    • H04R7/02—Diaphragms for electromechanical transducers; Cones characterised by the construction
    • H04R7/04—Plane diaphragms
    • H04R7/06—Plane diaphragms comprising a plurality of sections or layers
    • H04R7/10—Plane diaphragms comprising a plurality of sections or layers comprising superposed layers in contact
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/50—Piezoelectric or electrostrictive devices having a stacked or multilayer structure
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R17/00—Piezoelectric transducers; Electrostrictive transducers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R17/00—Piezoelectric transducers; Electrostrictive transducers
    • H04R17/005—Piezoelectric transducers; Electrostrictive transducers using a piezoelectric polymer
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R31/00—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
    • H04R31/003—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor for diaphragms or their outer suspension
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/09—Forming piezoelectric or electrostrictive materials
    • H10N30/092—Forming composite materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/20—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/50—Piezoelectric or electrostrictive devices having a stacked or multilayer structure
    • H10N30/501—Piezoelectric or electrostrictive devices having a stacked or multilayer structure having a non-rectangular cross-section in a plane parallel to the stacking direction, e.g. polygonal or trapezoidal in side view
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/50—Piezoelectric or electrostrictive devices having a stacked or multilayer structure
    • H10N30/508—Piezoelectric or electrostrictive devices having a stacked or multilayer structure adapted for alleviating internal stress, e.g. cracking control layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/88—Mounts; Supports; Enclosures; Casings
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R2499/00—Aspects covered by H04R or H04S not otherwise provided for in their subgroups
    • H04R2499/10—General applications
    • H04R2499/15—Transducers incorporated in visual displaying devices, e.g. televisions, computer displays, laptops
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/85—Piezoelectric or electrostrictive active materials
    • H10N30/852—Composite materials, e.g. having 1-3 or 2-2 type connectivity
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/87—Electrodes or interconnections, e.g. leads or terminals
    • H10N30/872—Interconnections, e.g. connection electrodes of multilayer piezoelectric or electrostrictive devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Composite Materials (AREA)
  • Materials Engineering (AREA)
  • Multimedia (AREA)
  • Piezo-Electric Transducers For Audible Bands (AREA)
CN202180020130.XA 2020-03-30 2021-02-25 层叠压电元件 Pending CN115280526A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020-059969 2020-03-30
JP2020059969 2020-03-30
PCT/JP2021/007032 WO2021199800A1 (ja) 2020-03-30 2021-02-25 積層圧電素子

Publications (1)

Publication Number Publication Date
CN115280526A true CN115280526A (zh) 2022-11-01

Family

ID=77930299

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202180020130.XA Pending CN115280526A (zh) 2020-03-30 2021-02-25 层叠压电元件

Country Status (7)

Country Link
US (1) US20230007400A1 (https=)
EP (1) EP4132007A4 (https=)
JP (1) JPWO2021199800A1 (https=)
KR (1) KR20220140577A (https=)
CN (1) CN115280526A (https=)
TW (1) TW202137591A (https=)
WO (1) WO2021199800A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115486095A (zh) * 2020-05-07 2022-12-16 富士胶片株式会社 压电元件及压电扬声器

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR3081907B1 (fr) * 2018-05-31 2022-03-04 Saint Gobain Vitrage ayant des performances acoustiques ameliorees
CN113508605B (zh) * 2019-03-07 2023-05-09 富士胶片株式会社 电声换能器
KR20230077176A (ko) * 2021-11-25 2023-06-01 엘지디스플레이 주식회사 장치
CN114339552B (zh) * 2021-12-31 2025-02-21 瑞声开泰科技(武汉)有限公司 一种发声装置
CN114695644B (zh) * 2022-02-15 2025-05-09 广东粤化新材料技术开发有限公司 一种压电复合材料的制备方法
KR102849415B1 (ko) * 2023-11-15 2025-08-21 단국대학교 산학협력단 압전 필름 다면체 조이스틱 장치 및 이의 작동방법

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09153649A (ja) * 1995-12-01 1997-06-10 Sony Corp 積層型圧電素子の製造方法
JP2009094259A (ja) * 2007-10-09 2009-04-30 Denso Corp 積層型圧電素子とその製造方法
CN101765926A (zh) * 2007-09-18 2010-06-30 京瓷株式会社 层叠型压电元件、具有其的喷射装置及燃料喷射系统
JP2014068141A (ja) * 2012-09-25 2014-04-17 Teijin Ltd 圧電スピーカー
WO2019078053A1 (ja) * 2017-10-18 2019-04-25 パナソニックＩｐマネジメント株式会社 圧電デバイス及びその製造方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4659368B2 (ja) * 2004-01-28 2011-03-30 京セラ株式会社 積層型電子部品の製法
JP6005089B2 (ja) 2013-03-29 2016-10-12 富士フイルム株式会社 電気音響変換フィルム
JP2019169640A (ja) * 2018-03-23 2019-10-03 パナソニックＩｐマネジメント株式会社 圧電デバイス
EP4124066A4 (en) * 2020-03-19 2023-09-06 FUJIFILM Corporation LAMINATED PIEZOELECTRIC ELEMENT AND ELECTROACOUSTIC TRANSDUCER

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09153649A (ja) * 1995-12-01 1997-06-10 Sony Corp 積層型圧電素子の製造方法
CN101765926A (zh) * 2007-09-18 2010-06-30 京瓷株式会社 层叠型压电元件、具有其的喷射装置及燃料喷射系统
JP2009094259A (ja) * 2007-10-09 2009-04-30 Denso Corp 積層型圧電素子とその製造方法
JP2014068141A (ja) * 2012-09-25 2014-04-17 Teijin Ltd 圧電スピーカー
WO2019078053A1 (ja) * 2017-10-18 2019-04-25 パナソニックＩｐマネジメント株式会社 圧電デバイス及びその製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115486095A (zh) * 2020-05-07 2022-12-16 富士胶片株式会社 压电元件及压电扬声器

Also Published As

Publication number Publication date
JPWO2021199800A1 (https=) 2021-10-07
KR20220140577A (ko) 2022-10-18
EP4132007A4 (en) 2023-08-30
EP4132007A1 (en) 2023-02-08
US20230007400A1 (en) 2023-01-05
TW202137591A (zh) 2021-10-01
WO2021199800A1 (ja) 2021-10-07

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