CN115279011A - Circuit board and circuit board processing method - Google Patents

Circuit board and circuit board processing method Download PDF

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Publication number
CN115279011A
CN115279011A CN202111356798.XA CN202111356798A CN115279011A CN 115279011 A CN115279011 A CN 115279011A CN 202111356798 A CN202111356798 A CN 202111356798A CN 115279011 A CN115279011 A CN 115279011A
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CN
China
Prior art keywords
circuit board
component
height
solder
solder ball
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202111356798.XA
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Chinese (zh)
Inventor
王雄虎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sky Chip Interconnection Technology Co Ltd
Original Assignee
Sky Chip Interconnection Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sky Chip Interconnection Technology Co Ltd filed Critical Sky Chip Interconnection Technology Co Ltd
Priority to CN202111356798.XA priority Critical patent/CN115279011A/en
Publication of CN115279011A publication Critical patent/CN115279011A/en
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components

Abstract

The application discloses circuit board and circuit board processing method, the circuit board includes: a package substrate; the welding points are arranged on one side surface of the packaging substrate and used for welding components; the support piece is arranged on the surface of the packaging substrate, which is provided with the welding points, and the support piece and the welding points are arranged in a separated mode; wherein, support piece is used for supporting components and parts when carrying out reflow soldering. This application is through setting up at least one support piece on packaging substrate to make support piece effectively support components and parts when carrying out reflow soldering, can avoid the tin ball to collapse the deformation under the weight oppression of components and parts, thereby avoided the emergence of abnormal conditions such as short circuit, improved the product yield then.

Description

Circuit board and circuit board processing method
Technical Field
The application relates to the field of circuit board processing, in particular to a circuit board and a circuit board processing method.
Background
With the development of 5G technology and microelectronic technology, the integration level of chips is higher and higher, and system level high integration products are applied to various fields more and more.
In the prior art, a solder ball formed by liquid solder paste is usually used to connect a component and a package substrate to realize electrical interconnection.
However, because the temperature during reflow soldering is high, the solder ball is in a molten state, and if the mass of the component soldered on the solder ball is high, the solder ball will be collapsed to be deformed under the weight of the component with high mass, so that abnormal conditions such as short circuit occur, and the product yield is low.
Disclosure of Invention
The technical problem mainly solved by the application is to provide a circuit board and a circuit board processing method, and the problem of low product yield caused by abnormal collapse of solder balls can be solved.
In order to solve the above technical problem, a first technical solution adopted by the present application is to provide a circuit board, including: a package substrate; the welding points are arranged on the surface of one side of the packaging substrate and used for welding components; the supporting piece is arranged on the surface of the packaging substrate, which is provided with the welding points, and the supporting piece and the welding points are arranged in a separated mode; wherein, support piece is used for supporting components and parts when carrying out reflow soldering.
The circuit board further comprises components; and a solder ball is arranged on one side surface of the component and is bonded with the welding point through solder paste.
The height of the supporting piece is not more than a first set height and not less than a second set height; the first set height is the height of the solder ball before collapse, and the second set height is the lowest height of the solder ball which collapses but can not deform.
The supporting piece is bonded with the packaging substrate through the curing glue.
Wherein the curing temperature of the curing adhesive is 70-80 ℃.
Wherein the support comprises a ceramic support or a metal support.
In order to solve the above technical problem, a second technical solution adopted by the present application is to provide a circuit board processing method, including: acquiring a circuit board to be processed, wherein the circuit board to be processed comprises a packaging substrate; processing a plurality of welding points on a first set position on one side surface of the packaging substrate; wherein, the welding point is used for welding the component; attaching at least one supporting piece to a second set position on the surface of the packaging substrate, wherein the surface is provided with the welding point, and the second set position and the first set position are arranged in a separated mode; wherein, support piece is used for supporting components and parts when carrying out reflow soldering.
Wherein, at least one support piece is attached to the second setting position on the surface that the packaging substrate is provided with the welding point, and the step that the second setting position and first setting position separated set up specifically includes: dispensing the second set position; attaching a support member to a second set position at a set temperature; wherein the set temperature is 70-80 ℃.
Wherein, the supporting piece is attached to a second set position at a set temperature; wherein, after the step of setting the temperature to be 70-80 ℃, the method also comprises the following steps: obtaining a component, wherein a solder ball is arranged on one side surface of the component; and soldering the solder balls on the soldering points by using solder paste so as to attach the component on the circuit board to be processed.
Wherein, after the step of soldering the solder ball on the solder joint by using the solder paste, the method further comprises the following steps: and performing reflow soldering on the circuit board to be processed, on which the components are attached, so that the support piece supports the components when the solder balls collapse.
The beneficial effect of this application is: the circuit board and the circuit board processing method are different from the prior art, at least one supporting piece is arranged on the packaging substrate, the supporting piece effectively supports the component during reflow soldering, the solder ball can be prevented from collapsing and deforming under the weight pressure of the component, abnormal conditions such as short circuit are avoided, and the product yield is improved.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
FIG. 1 is a schematic structural diagram of a first embodiment of the wiring board of the present application;
FIG. 2 is a schematic structural diagram of a second embodiment of the wiring board of the present application;
FIG. 3 is a schematic structural diagram of a third embodiment of the wiring board of the present application;
fig. 4 is a schematic flow chart of an embodiment of the circuit board processing method of the present application.
Detailed Description
The technical solutions in the embodiments of the present application will be described clearly and completely with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only some embodiments of the present application, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
The terminology used in the embodiments of the present application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. As used in the examples of this application and the appended claims, the singular forms "a", "an", and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise, the "plural" includes at least two in general, but does not exclude the presence of at least one.
It should be understood that the term "and/or" as used herein is merely one type of association that describes an associated object, meaning that three relationships may exist, e.g., a and/or B may mean: a exists alone, A and B exist simultaneously, and B exists alone. In addition, the character "/" herein generally indicates that the former and latter associated objects are in an "or" relationship.
It should be understood that the terms "comprises," "comprising," or any other variation thereof, as used herein, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrases "comprising 8230; \8230;" comprises 8230; "does not exclude the presence of additional like elements in a process, method, article, or apparatus that comprises the element.
In the prior art, a solder ball formed by liquid solder paste is usually used to connect a component and a package substrate to realize electrical interconnection. However, since the temperature during reflow soldering is high, the solder ball is in a molten state, and if the mass of the component soldered on the solder ball is high, the solder ball will be crushed to deform under the weight of the high-mass component, so that abnormal conditions such as short circuit occur, and the product yield is low.
Based on the situation, the circuit board and the circuit board processing method can solve the problem that the yield of products is low due to abnormal collapse of the solder balls.
Referring to fig. 1, fig. 1 is a schematic structural diagram of a first embodiment of a circuit board according to the present application. As shown in fig. 1, in the present embodiment, a wiring board 100 includes a package substrate 101; a plurality of pads 102, the pads 102 being disposed on one side surface of the package substrate 101 for bonding the component 105; a plurality of supporting members 104, wherein the supporting members 104 are disposed on the surface of the package substrate 101 where the solder joints 102 are disposed, and the supporting members 104 are disposed separately from the solder joints 102, wherein the supporting members 104 are used for supporting the component 105 during the reflow soldering.
Wherein the component 105 is a high mass component.
Wherein, a solder ball 106 is disposed on a surface of one side of the component 105, and the solder ball 106 is bonded to the solder joint 102 through solder paste.
The supporting member 104 is bonded to the package substrate 101 through the adhesive layer 103, wherein the adhesive layer 103 is made of a curing adhesive, and the curing temperature of the curing adhesive is 70-80 ℃.
Specifically, the curing adhesive used in the embodiment is a low-temperature curing adhesive, and the component of the curing adhesive is a single-component thermosetting epoxy resin adhesive, which is also called as a low-temperature curing epoxy adhesive. The low-temperature curing epoxy glue has the bonding strength and the humidity and heat resistance and cold and heat cycle performance which are far higher than those of acrylic UV glue. The curing temperature is low, the curing speed is high, the temperature-sensitive device cannot be damaged, the optimal adhesive force can be formed among various materials in a very short time, the impact resistance is excellent, the service life is long, and the storage stability is high.
It is understood that the melting point of the solder paste is generally between 138 ℃ and 227 ℃, and the curing temperature of the curing adhesive is lower than the melting point of the solder paste, so that the curing adhesive does not melt the solder paste when curing to form the adhesive layer 103, and the formed adhesive layer 103 can well adhere the supporting member 104 to the package substrate 101.
In this embodiment, the support 104 comprises a ceramic support or a metal support. Wherein the metal support comprises a copper support.
It is understood that the melting point of the ceramic is 3000 c and the melting point of the copper is 1083.4 c, which are both greater than the maximum temperature (approximately 250 c) at the time of reflow soldering, and thus the support 104 is not melted at the time of reflow soldering.
Further, the height of the support 104 is not greater than the first set height, and not less than the second set height. The first set height is the height of the solder ball 106 before collapse, and the second set height is the lowest height of the solder ball 106 which is collapsed but not deformed.
Specifically, the height of the solder ball 106 before collapsing refers to the original height of the solder ball 106 before reflow soldering, that is, the soldering height required for the component 105. During reflow soldering, since the maximum temperature of reflow soldering exceeds the melting point of the solder ball 106, the solder ball 106 is in a molten state, and the solder ball 106 in the molten state will inevitably collapse to a certain height compared with the solder ball 106 in a solidified state, so that the minimum height of the solder ball 106 that will not deform even though it collapses is required to be determined, and as long as the height of the solder ball 106 after collapsing is higher than the minimum height, abnormal situations such as short circuit will not occur.
In a specific implementation scenario, the height of the solder ball 106 before collapse is 100 μm, and the minimum height of the solder ball 106 that is collapsed but not deformed is 80 μm, then the height of the support 104 is 80-100 μm.
It can be understood that the height of the supporting member 104 is not greater than the height of the solder ball 106 before collapse, which does not affect the soldering of the component 105, and more importantly, the height of the supporting member 104 is not less than the minimum height of the solder ball 106 which is collapsed but not deformed, so that the component 105 can be effectively supported when the solder ball 106 is in a molten state, and the component 105 is prevented from collapsing the solder ball 106 to be deformed, thereby avoiding the occurrence of abnormal conditions such as short circuit, and the like, and further improving the yield of products.
In the prior art, the copper core ball is sometimes adopted to replace a solder ball, however, the copper core ball needs a special welding spot, the preparation cost of the copper core ball is high, and the production cost can be increased. In the present embodiment, the supporting members 104 are disposed around the solder joints 102 in a distributed manner, so that the distribution of the solder joints 102 is not affected, and the solder balls 106 are not affected by the positions corresponding to the edge positions of the component 105. More importantly, the supporting member 104 in the present embodiment is easily available, and has a low manufacturing cost, which can reduce the production cost.
In one embodiment, the plurality of supporting members 104 are disposed corresponding to four corners of the device 105, and the solder balls 106 are disposed in a central region of the device 105.
In other embodiments, the supporting member can be correspondingly arranged at any idle position of the component without the solder ball, and the arrangement mode is diversified. Specifically, please refer to fig. 2 and fig. 3, wherein fig. 2 is a schematic structural diagram of a second embodiment of the circuit board of the present application, and fig. 3 is a schematic structural diagram of a third embodiment of the circuit board of the present application.
As shown in fig. 2, in the present embodiment, the wiring board 200 includes a package substrate 201; a plurality of soldering points 202, the soldering points 202 being disposed on one side surface of the package substrate 201 for soldering the component 205; a plurality of supporting members 204, wherein the supporting members 204 are disposed on the surface of the package substrate 201 where the solder joints 202 are disposed, and the supporting members 204 are disposed separately from the solder joints 202, wherein the supporting members 204 are used for supporting the component 205 during the reflow soldering.
In this embodiment, the supporting members 204 and the bonding pads 202 are disposed in a staggered manner, solder balls 206 are disposed on a surface of one side of the component 205, and the solder balls 206 are bonded to the bonding pads 202 through solder paste.
It is understood that the support 204 does not affect the distribution of the solder points 202, and thus does not affect the soldering of the solder balls 206.
In this embodiment, the supporting element 204 is bonded to the package substrate 201 through the adhesive layer 203, wherein the adhesive layer 203 is made of a curing adhesive, and the curing temperature of the curing adhesive is 70 to 80 ℃.
Wherein the support 204 comprises a ceramic support or a metal support. Wherein the metal support comprises a copper support.
Further, the height of the support 204 is not greater than the first set height and not less than the second set height. The first set height is the height of the solder ball 206 before collapse, and the second set height is the lowest height of the solder ball 206 which is collapsed but not deformed.
Specifically, the height of the solder ball 206 before collapsing refers to the original height of the solder ball 206 before reflow, i.e., the soldering height required for the component 205. During reflow soldering, since the highest temperature of reflow soldering exceeds the melting point of the solder ball 206, the solder ball 206 is in a molten state, and the solder ball 206 in the molten state will inevitably collapse to a certain height compared with the solder ball 206 in a solidified state, so that the minimum height at which the solder ball 206 collapses but does not deform needs to be determined, and abnormal conditions such as short circuit will not occur as long as the height of the solder ball 206 after collapsing is higher than the minimum height.
It can be understood that the height of the supporting member 204 is not greater than the height of the solder ball 206 before collapse, which does not affect the soldering of the component 205, and more importantly, the height of the supporting member 204 is not less than the minimum height of the solder ball 206 which is collapsed but not deformed, so that the component 205 can be effectively supported when the solder ball 206 is in a molten state, and the component 205 is prevented from collapsing the solder ball 206 to be deformed, thereby avoiding the occurrence of abnormal conditions such as short circuit, and the like, and further improving the yield of products.
As shown in fig. 3, in the present embodiment, the wiring board 300 includes a package substrate 301; a plurality of solder joints 302, the solder joints 302 being disposed on a side surface of the package substrate 301 for soldering the component 305; a support member 304, the support member 304 is disposed on the surface of the package substrate 301 where the solder joint 302 is disposed, and the support member 304 is spaced apart from the solder joint 302, wherein the support member 304 is used for supporting the component 305 during the reflow soldering.
In this embodiment, only one supporting member 30 is disposed at the center of the component 305, a solder ball 306 is disposed on one side surface of the component 305, and the solder ball 306 is bonded to the bonding pad 302 through solder paste.
It can be understood that when the size of the component 305 is moderate and the solder ball 306 is not disposed at the center, the component 305 can be better supported by disposing the support 304 at the center of the component 305 alone, and meanwhile, the manufacturing cost can be further reduced due to the reduction of the number of the supports 304.
In this embodiment, the supporting element 304 is bonded to the package substrate 301 through an adhesive layer 303, wherein the adhesive layer 303 is made of a curing adhesive, and the curing temperature of the curing adhesive is 70 to 80 ℃.
Wherein the support 304 comprises a ceramic support or a metal support. Wherein the metal support comprises a copper support.
Further, the height of the support 304 is not greater than the first set height and not less than the second set height. The first set height is the height of the solder ball 306 before collapse, and the second set height is the lowest height of the solder ball 306 which is collapsed but not deformed.
Specifically, the height of the solder ball 306 before collapse refers to the original height of the solder ball 306 before reflow, i.e., the soldering height required for the component 305. During reflow soldering, since the highest temperature of reflow soldering exceeds the melting point of the solder ball 306, the solder ball 306 is in a molten state, and the solder ball 306 in the molten state will inevitably collapse to a certain height compared with the solder ball 306 in a solidified state, so that the minimum height at which the solder ball 306 collapses but does not deform needs to be determined, and abnormal conditions such as short circuit will not occur as long as the height of the solder ball 306 after collapsing is higher than the minimum height.
It can be understood that the height of the supporting member 304 is not greater than the height of the solder ball 306 before collapse, which does not affect the soldering of the component 305, and more importantly, the height of the supporting member 304 is not less than the minimum height of the solder ball 306 which is collapsed but not deformed, so that the component 305 can be effectively supported when the solder ball 306 is in a molten state, and the component 305 is prevented from collapsing the solder ball 306 to be deformed, thereby avoiding the occurrence of abnormal conditions such as short circuit and the like, and further improving the yield of products.
Correspondingly, the application provides a circuit board processing method.
Specifically, please refer to fig. 4, fig. 4 is a schematic flow chart of an embodiment of the method for processing a circuit board according to the present application. As shown in fig. 4, in the present embodiment, the processing method includes:
s41: and obtaining the circuit board to be processed, wherein the circuit board to be processed comprises a packaging substrate.
S42: processing a plurality of welding points on a first set position on one side surface of the packaging substrate; wherein, the welding point is used for welding components and parts.
In this embodiment, the first set position is a position of a solder ball to which a component needs to be soldered.
The step of processing a plurality of welding points refers to printing solder paste on the first set position so as to bond with the solder balls through the solder paste.
In this embodiment, the component is a high-mass component.
S43: attaching at least one support piece to a second set position on the surface of the packaging substrate, wherein the surface is provided with the welding point, and the second set position and the first set position are arranged in a separated mode; wherein, support piece is used for supporting components and parts when carrying out reflow soldering.
In this embodiment, the second setting position is dispensed. Wherein the glue used for dispensing is curing glue, and the curing temperature of the curing glue is 70-80 ℃. Specifically, the curing adhesive used in the embodiment is a low-temperature curing adhesive, and the component of the curing adhesive is a single-component thermosetting epoxy resin adhesive, which is also called as a low-temperature curing epoxy adhesive. The low-temperature curing epoxy adhesive has the bonding strength far higher than that of acrylic UV adhesive, and has the humidity and heat resistance and cold and heat cycle performance. The curing temperature is low, the curing speed is high, the temperature sensitive device cannot be damaged, the optimal adhesive force can be formed among various materials in a very short time, the shock resistance is excellent, the service life is long, and the storage stability is high.
Further, the support member is attached to the second set position at the set temperature. Wherein the set temperature is 70-80 ℃. In one specific implementation scenario, the support member is attached at a second set position at 70 ℃. In another specific implementation scenario, the support member is attached at 75 ℃ to the second set position. In a further specific embodiment, the support is attached to the second setting at 80 ℃.
It can be understood that the melting point of the solder paste is generally between 138 ℃ and 227 ℃, and the curing temperature of the curing adhesive is lower than that of the solder paste, so that the curing adhesive does not melt the solder paste when cured to form the adhesive layer, and the formed adhesive layer can well attach the supporting member to the package substrate.
In this embodiment, the support member includes a ceramic support member or a metal support member. Wherein the metal support comprises a copper support. It will be appreciated that the melting point of the ceramic is 3000 c and the melting point of the copper is 1083.4 c, both of which are greater than the maximum temperature during reflow (close to 250 c) so that the support will not melt during subsequent reflow.
Further, the height of the support is not greater than the first set height and not less than the second set height. The first set height is the height of the solder ball before collapse, and the second set height is the lowest height of the solder ball which collapses but can not deform.
Specifically, the height of the solder ball before collapse refers to the original height of the solder ball before reflow soldering, that is, the soldering height required by the component. When reflow soldering is carried out, the highest temperature of reflow soldering exceeds the melting point of the solder ball, so the solder ball is in a molten state, the solder ball in the molten state is necessarily collapsed to a certain height compared with the solder ball in a solidified state, the minimum height of the collapsed solder ball which can not deform is required to be determined, and abnormal conditions such as short circuit and the like can not occur as long as the height of the collapsed solder ball is higher than the minimum height.
In a specific implementation scenario, the height of the solder ball before collapse is 100 μm, the lowest height of the solder ball which is collapsed but not deformed is 80 μm, and the height of the support is 80-100 μm.
The height of the supporting piece is not more than the height of the solder ball before collapse, welding of components is not affected, more importantly, the height of the supporting piece is not less than the lowest height of the solder ball which is collapsed but not deformed, the components can be effectively supported when the solder ball is in a molten state, the components are prevented from collapsing the solder ball to be deformed, accordingly, abnormal conditions such as short circuit are avoided, and the product yield is improved.
In this embodiment, the second setting position does not affect the distribution of the first setting position, and the second setting position corresponds to a position where no solder ball is disposed on the component, which is not limited in the present application. In a specific implementation scenario, the second setting positions are dispersedly disposed in the peripheral region of the first setting position, and are disposed corresponding to four corners of the component. In another specific implementation scenario, the second setting position is staggered with the first setting position. In a further specific embodiment, the second setting position corresponds to a central region of the component.
And further, obtaining the component, arranging a solder ball on one side surface of the component, and soldering the solder ball on the soldering point by using the solder paste so as to mount the component on the circuit board to be processed. And then carrying out reflow soldering on the circuit board to be processed, on which the components are attached, so that the support piece supports the components when the solder balls collapse.
Be different from prior art, this application is through setting up at least one support piece on packaging substrate to make support piece effectively support components and parts when carrying out reflow soldering, can avoid the tin ball to collapse under the weight oppression of components and parts and warp, thereby avoided the emergence of abnormal conditions such as short circuit, then improved the product yield.
The above description is only an embodiment of the present application, and is not intended to limit the scope of the present application, and all equivalent structures or equivalent processes performed by the present application and the contents of the attached drawings, which are directly or indirectly applied to other related technical fields, are also included in the scope of the present application.

Claims (10)

1. A circuit board, comprising:
a package substrate;
the welding points are arranged on the surface of one side of the packaging substrate and used for welding components;
at least one supporting member disposed on the surface of the package substrate on which the solder joints are disposed, the supporting member being spaced apart from the solder joints; the supporting piece is used for supporting the component during reflow soldering.
2. The circuit board of claim 1, further comprising the component; and a solder ball is arranged on the surface of one side of the component and is bonded with the welding point through solder paste.
3. The circuit board according to claim 2, wherein the height of the support member is not greater than a first set height and not less than a second set height; the first set height is the height of the solder ball before collapse, and the second set height is the lowest height of the solder ball which is collapsed but not deformed.
4. The circuit board of claim 1, wherein the support member is bonded to the package substrate by a cured adhesive.
5. The wiring board of claim 4, wherein the curing temperature of the curing glue is 70-80 ℃.
6. The cord plate of claim 1, wherein the support comprises a ceramic support or a metal support.
7. A circuit board processing method is characterized by comprising the following steps:
acquiring a circuit board to be processed, wherein the circuit board to be processed comprises a packaging substrate;
processing a plurality of welding points on a first set position on one side surface of the packaging substrate; the welding point is used for welding a component;
attaching at least one support member to a second set position of the surface of the package substrate where the solder joint is disposed, the second set position being spaced apart from the first set position; the support piece is used for supporting the component during reflow soldering.
8. The method for processing a circuit board according to claim 7, wherein the step of attaching at least one supporting member at a second predetermined position on the surface of the package substrate where the solder joints are disposed, the second predetermined position being spaced apart from the first predetermined position, specifically comprises:
dispensing the second set position;
attaching the support member to the second set position at a set temperature; wherein the set temperature is 70-80 ℃.
9. The method for processing a circuit board according to claim 8, wherein the supporting member is attached to the second set position at a set temperature; wherein, after the step of setting the temperature to be 70-80 ℃, the method also comprises the following steps:
obtaining the component, wherein a solder ball is arranged on one side surface of the component;
and soldering the solder balls on the soldering points by using solder paste so as to attach the component on the circuit board to be processed.
10. The method for processing a wiring board according to claim 9, wherein after the step of soldering the solder ball to the solder pad with solder paste, the method further comprises:
and carrying out reflow soldering on the circuit board to be processed, on which the component is mounted, so that the support member supports the component when the solder balls collapse.
CN202111356798.XA 2021-11-16 2021-11-16 Circuit board and circuit board processing method Pending CN115279011A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202111356798.XA CN115279011A (en) 2021-11-16 2021-11-16 Circuit board and circuit board processing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202111356798.XA CN115279011A (en) 2021-11-16 2021-11-16 Circuit board and circuit board processing method

Publications (1)

Publication Number Publication Date
CN115279011A true CN115279011A (en) 2022-11-01

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN202111356798.XA Pending CN115279011A (en) 2021-11-16 2021-11-16 Circuit board and circuit board processing method

Country Status (1)

Country Link
CN (1) CN115279011A (en)

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