CN115267268A - Chip testing device - Google Patents
Chip testing device Download PDFInfo
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- CN115267268A CN115267268A CN202210852094.XA CN202210852094A CN115267268A CN 115267268 A CN115267268 A CN 115267268A CN 202210852094 A CN202210852094 A CN 202210852094A CN 115267268 A CN115267268 A CN 115267268A
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- 238000012360 testing method Methods 0.000 title claims abstract description 96
- 230000017525 heat dissipation Effects 0.000 claims abstract description 30
- 230000005484 gravity Effects 0.000 claims description 32
- 230000000712 assembly Effects 0.000 claims description 3
- 238000000429 assembly Methods 0.000 claims description 3
- 238000009423 ventilation Methods 0.000 abstract description 9
- 239000004065 semiconductor Substances 0.000 abstract description 6
- 238000001514 detection method Methods 0.000 abstract description 2
- 238000010586 diagram Methods 0.000 description 7
- 238000010438 heat treatment Methods 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 239000002356 single layer Substances 0.000 description 4
- 238000001816 cooling Methods 0.000 description 2
- 239000010410 layer Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000007664 blowing Methods 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 238000005057 refrigeration Methods 0.000 description 1
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
- G01R31/2874—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature
- G01R31/2877—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature related to cooling
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
- H05K7/20145—Means for directing air flow, e.g. ducts, deflectors, plenum or guides
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
- H05K7/20172—Fan mounting or fan specifications
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- General Physics & Mathematics (AREA)
- Environmental & Geological Engineering (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Computer Hardware Design (AREA)
- General Engineering & Computer Science (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
The invention provides a chip testing device, and relates to the technical field of semiconductor chip detection. The chip testing device comprises at least one testing drawer, wherein each testing drawer comprises a ventilation opening positioned at one end of the testing drawer and a heat dissipation assembly positioned at the ventilation opening. The heat dissipation assembly comprises a fan and a wind control assembly. The wind control assembly comprises a support and an impeller which is rotatably connected with the support, a plurality of first through holes are formed in the support, a plurality of second through holes are formed in the impeller, the wind control assembly is structured in a manner that when the fan rotates, the impeller rotates to the second through holes to be communicated with the first through holes, and when the fan stops rotating, the impeller rotates to the second through holes and is staggered with the first through holes. The device ensures that the temperatures of different chip positions in the shell are consistent, avoids the temperature inconsistency when the reliability test of the chip is influenced by the distance between the radiating fins at the bottom of the chip and the heat sink and the ventilation opening and the convection of larger air flow between the radiating fins and the outside, and improves the test accuracy.
Description
The present application is a divisional application entitled "a chip reliability testing apparatus" in CN 202210588922.3, application date of 2022, 5 months 27.
Technical Field
The invention relates to the technical field of semiconductor detection, in particular to a chip testing device.
Background
The current COC chip reliability test equipment generally consists of three parts, namely a test single layer, a test drawer and a test clamp. A plurality of COC chips are loaded on different positions of a test fixture, the test fixture is fastened on a heat sink of a test drawer, and the test drawer is communicated with a test single-layer electrical connection through a backplane connector.
During reliability test, the COC chip has a part of power to be heated, but the main heat source is from a heat sink of a test drawer at the bottom of the clamp. In order to make the test conditions of each chip consistent, the temperatures of the surfaces of the heat sinks need to be consistent firstly, and the uniformity index is met. There are about three heating methods currently used on the heat sink of the test drawer. The method comprises the following steps of firstly, adopting a semiconductor refrigerating sheet; the second way is to adopt a heating plate; and the third mode adopts a heating rod. All three heating methods require forced air cooling by using a fan. The air inlet/outlet of the fan can not be closed during testing, and the natural convection with the outside cold air can not be isolated or reduced as much as possible. Forced air cooling of the fan inevitably requires more air inlets/outlets at the edge of the system under test to exchange heat with the outside. In the first mode, the semiconductor refrigeration piece is positioned between the heat sink and the radiating piece, and the temperature of the COC chip during testing cannot be influenced by natural convection of outside cold air. However, the heating method depends on the service life of the semiconductor refrigerating sheet, the service life of the test drawer is shorter than that of the second method and that of the third method, and heat-conducting silicone grease needs to be coated on two sides of the semiconductor during production and assembly. In the heating mode of the second mode and the third mode, during testing, the air inlet/outlet and the outside of the system can still exchange heat through natural convection, so that the temperature of the heat sink end of the air inlet/outlet close to the edge of the system is lower than that of the heat sink far away from the edge of the system, the uniformity of the temperature of the heat sink is poor, and the temperature conditions of the COC chip are inconsistent during testing. Meaning that some chips may be tested at temperatures below or above the desired temperature: the temperature is too low, so that the COC chip cannot be sufficiently screened; the excessive temperature condition means that the temperature condition is deviated from the normal use environment, which may cause damage of the COC chip and reduce the yield.
Disclosure of Invention
An object of the first aspect of the present invention is to provide a chip testing apparatus, which solves the problem of non-uniform internal temperature of the chip testing apparatus in the prior art.
Another object of the first aspect of the present invention is to solve the problems that the heat dissipation structure of the prior art chip testing device needs to be additionally controlled, the structure becomes complicated, a large amount of cost is increased, and the heat dissipation structure may fail after being used for a long time.
In particular, the present invention provides a chip testing device comprising at least one test drawer, each of said test drawers comprising:
a vent located at one end of the test drawer; and
the fan comprises a fan and a wind control assembly, the wind control assembly comprises a support and an impeller, the impeller is rotatably connected with the support, a plurality of first through holes are formed in the support, a plurality of second through holes are formed in the impeller, the wind control assembly is constructed to be in the state that the fan rotates, the impeller rotates to the second through holes and the first through holes in the support are communicated with the two sides of the wind control assembly, and when the fan stops rotating, the impeller rotates to the second through holes and the first through holes are staggered to reduce air circulation on the two sides of the wind control assembly.
Optionally, the impeller is disc-shaped, the second through holes are multiple and uniformly arranged around the center of the impeller, and part of the target sidewall of each second through hole is an inclined surface, so that when the fan rotates and air blows through the second through holes of the impeller vertically, the air pushes the target sidewall to drive the impeller to rotate.
Optionally, one of the target side walls of each of the second through holes is configured to extend in a radial direction of the impeller, and the target side wall is a slope, so that a dimension of the second through hole at a position close to the bracket is larger than a dimension of the second through hole at a position away from the bracket, and a cross section of the target side wall taken when the target side wall is cut on a plane perpendicular to the radial direction of the impeller forms a preset angle, and the preset angle is 45 ° to 75 °.
Optionally, the bracket is located at a position between the fan and the impeller, so that air blown by the fan passes through the first through hole of the bracket and then blows towards the impeller, and the impeller is rotated to a position where the first through hole corresponds to the second through hole under the action of the inclined surface of the impeller.
Optionally, each of the first through holes has the same shape as the corresponding second through hole, and when the first through hole and the second through hole are completely staggered, the target sidewall is located at the first through hole.
Optionally, the first through holes are all identical in structure, the second through holes are all identical in structure, each first through hole is identical in structure to each second through hole in shape, and when the first through holes and the second through holes are completely staggered, the target side wall is located at the position of the first through hole.
Optionally, the impeller is provided with a gravity structure near the outer edge, so that when the impeller is rotated to a position where the gravity structure is separated from the lowest point, the impeller is naturally rotated to a position where the gravity structure is located at the lowest point under the action of the gravity structure, and when the impeller is rotated to a position where the gravity structure is located at the lowest point of the impeller, the first through holes and the second through holes are arranged in a staggered manner, so as to reduce the flow of the air at the first through holes and the second through holes.
Optionally, the gravity structure is a gravity pin disposed at a position between two of the second through holes of the impeller and located near an outer edge of the impeller.
Optionally, a plurality of grooves symmetrically distributed around the center of the impeller are arranged at the impeller.
Optionally, a plurality of heat dissipation assemblies are arranged at each air vent.
Optionally, the test drawer further comprises:
the heat sink comprises at least one heat sink, a plurality of chips and a plurality of control modules, wherein each heat sink is provided with a plurality of chips so as to perform reliability test on the chips;
the heat sink is arranged on the side face of the heat sink opposite to the chip and used for dissipating heat of the heat sink, and the heat dissipation fins are arranged on the side edge of the heat dissipation assembly so that the fan of the heat dissipation assembly dissipates heat of the heat dissipation fins.
The test drawer of the chip testing device department of this scheme sets up radiator unit in vent position department, and this radiator unit includes fan and wind-control subassembly, and when the fan rotated, the impeller of wind-control subassembly can rotate to the first through-hole and the second through-hole of support and impeller and link up to guarantee to dispel the heat for the chip that sets up in test drawer department. And when fan stop rotating, then the impeller rotates to first through-hole and the second through-hole crisscross of support and impeller to hinder the air and circulate in wind accuse subassembly both sides, reduced the inside and outside circulation of air of casing, and then guarantee to be located the temperature unanimity of the chip of the different positions or the different positions of the inside same chip of casing, the temperature when avoiding influencing the reliability test of chip because of the distance of chip and vent is inconsistent, and then improves the test accuracy.
The chip testing device of this scheme passes through the first through-hole of support, the second through-hole of impeller and the design of the gravity structure on the impeller for this impeller is when the fan starts the heat dissipation, and the impeller rotates to the state of the mutual corresponding circulation of first through-hole and second through-hole, thereby dispels the heat for the test drawer. When the fan is closed, the impeller rotates under the action of the gravity structure until the first through holes and the second through holes are in a staggered design, so that the circulation of air at the ventilation opening is blocked, and the heat on the chip close to the ventilation opening and the chip far away from the ventilation opening are basically consistent. The rotation of impeller in this embodiment need not any external control device, utilizes inherent structure of itself can reach the purpose, compares the design that needs control structure, and the radiating component's of this scheme structure is ingenious, and can not appear because of the circumstances wrong circumstances such as control short circuit appear.
The above and other objects, advantages and features of the present invention will become more apparent to those skilled in the art from the following detailed description of specific embodiments thereof taken in conjunction with the accompanying drawings.
Drawings
Some specific embodiments of the invention will be described in detail hereinafter, by way of illustration and not limitation, with reference to the accompanying drawings. The same reference numbers in the drawings identify the same or similar elements or components. Those skilled in the art will appreciate that the drawings are not necessarily drawn to scale. In the drawings:
FIG. 1 is a schematic block diagram of a chip testing apparatus according to a specific embodiment of the present invention;
FIG. 2 is a schematic block diagram of a test drawer according to one particular embodiment of the present invention;
FIG. 3 is a partial schematic block diagram of a test drawer according to a specific embodiment of the present invention;
FIG. 4 is a schematic block diagram of a heat sink assembly according to a specific embodiment of the present invention;
FIG. 5 is a partial schematic block diagram of a heat dissipation assembly in accordance with a specific embodiment of the present invention;
FIG. 6 is a schematic block diagram of an impeller according to a specific embodiment of the present invention;
fig. 7 is a schematic block diagram of another angle of an impeller according to a specific embodiment of the present invention.
Detailed Description
Referring to fig. 1 to 3, a chip testing apparatus 100 of the present embodiment generally includes a single testing layer 10, a testing drawer 20, and a chip 40 disposed at the testing drawer 20 using a testing jig 30. A test drawer 20 is provided inside the test monolayer 10. Generally speaking, a plurality of test drawers 20 may be disposed within the test monolayer 10, with a plurality of chips 40 disposed at each test drawer 20. Specifically, the single testing layer 10 may include a housing 11, the housing 11 is provided with a plurality of openings 12, each opening 12 is provided with a corresponding testing drawer 20, and the testing drawers 20 may be pulled out from the housing 11.
Referring to fig. 2 to 4, as a specific embodiment of the present invention, the structure of the test drawer 20 at the chip test apparatus 100 of the present embodiment is the same. Each test drawer 20 may include a vent 21 and a heat sink assembly 22. The vent 21 is located at one end of the test drawer 20, specifically, the vent 21 is located at the opening 12 of the housing 11 when the test drawer 20 is located inside the housing 11. The heat dissipation assembly 22 is disposed at the vent 21. Specifically, the heat dissipation assembly 22 may include a fan 221 and a wind control assembly 222 disposed at a side of the fan 221, and the wind control assembly 222 may include a bracket 223 and an impeller 224 rotatably coupled to the bracket 223. A plurality of first through holes 225 are provided at the supporter 223, and a plurality of second through holes 226 are provided at the impeller 224. The wind control assembly 222 is configured such that when the fan 221 rotates, the impeller 224 rotates to the second through hole 226 to be communicated with the first through hole 225 at the bracket 223 to allow air to circulate at both sides of the wind control assembly 222. When the fan 221 stops rotating, the impeller 224 rotates to the second through hole 226 to be staggered with the first through hole 225, so as to reduce air circulation on two sides of the wind control assembly 222.
The test drawer 20 of the chip testing apparatus 100 of the present embodiment is provided with the heat dissipation assembly 22 at the position of the vent 21, and the heat dissipation assembly 22 includes the fan 221 and the wind control assembly 222, when the fan 221 rotates, the impeller 224 of the wind control assembly 222 can rotate to the penetration of the bracket 223 and the first through hole 225 and the second through hole 226 of the impeller 224, so as to ensure that the heat dissipation can be performed for the chip 40 provided at the test drawer 20. When the fan 221 stops rotating, the impeller 224 rotates to the bracket 223 and the first through hole 225 and the second through hole 226 of the impeller 224 are staggered, so that air is prevented from flowing through the two sides of the wind control assembly 222, that is, air flowing inside and outside the housing 11 is reduced, temperature consistency of chips 40 at different positions or different positions of the same chip 40 inside the housing 11 is ensured, temperature inconsistency when reliability test of the chip 40 is affected due to the distance between the chip 40 and the vent 21 is avoided, and test accuracy is improved.
As a specific embodiment of the present invention, the impeller 224 of the present embodiment is disc-shaped, the second through holes 226 are plural and are uniformly disposed around the center of the impeller 224, and a portion of the target sidewall 227 of each second through hole 226 is a slope, so that when the fan 221 rotates and air vertically blows through the second through holes 226 of the impeller 224, the air pushes the target sidewall 227 to drive the impeller 224 to rotate.
Specifically, referring to fig. 5 to 7, the impeller 224 of the present embodiment has a disk shape, and the second through hole 226 provided at the impeller 224 is also designed around the center point of the disk-shaped impeller 224. And a target sidewall 227 is provided at each second through hole 226, the target sidewall 227 is a slope, and when the fan 221 rotates and air vertically blows through the second through hole 226, the thrust of the air on the slope pushes the impeller 224 to rotate. Specifically, the slope of the target sidewall 227 of each second through hole 226 is pushed along the circumferential direction and along the same side. As such, the plurality of target sidewalls 227 may provide a greater force to rotate the impeller 224.
One of the target side walls 227 of each of the second through holes 226 is configured to extend in a radial direction of the impeller 224, and the target side wall 227 is a slope such that a dimension of the second through hole 226 at a position close to the support 223 is larger than a dimension of the second through hole 227 at a position away from the support 223, and a cross section of the target side wall 227 taken when cut in a plane perpendicular to the radial direction of the impeller forms a predetermined angle of 45 ° to 75 °.
Specifically, the target sidewall 227 of the second through hole 226 of the present embodiment is configured to be designed in the radial direction of the impeller 224. In this way, when the target side wall 227 is designed to be a slope, all the wind blowing to the slope gives the same thrust to the impeller 224, and part of the thrust is directed to the circumferential direction of the impeller 224. Specifically, the angle formed by the cross section of the target side wall 227 of the present embodiment is 45 ° to 75 °, and may be, for example, 45 °, 55 °, 60 °, or 75 °. The bevel angle can be designed according to actual conditions.
As a specific embodiment of the present invention, the bracket 223 of the present embodiment is located at a position between the fan 221 and the impeller 224, so that air blown by the fan 221 passes through the first through hole 225 of the bracket 223 and then is blown toward the impeller 224, and the impeller 224 is rotated to a position where the first through hole 225 corresponds to the second through hole 226 under the action of the inclined surface of the impeller 224.
Specifically, the fan 221 of the present embodiment needs to blow to the bracket 223 first, and then blow to the impeller 224 after the air passes through the first through hole 225 on the bracket 223, and if the inclined surface of the second through hole 226 on the impeller 224 is located behind the first through hole 225, the impeller 224 will be rotated by the force of the inclined surface until the second through hole 226 of the impeller 224 corresponds to the first through hole 225, and the wind cannot blow to the inclined surface and stop rotating.
Specifically, the first through hole 225 and the second through hole 226 of the present embodiment have the same shape, and the specific shape may be determined as the case may be. In this embodiment, each of the first through hole 225 and the second through hole 226 is configured in an isosceles trapezoid shape, wherein a side wall formed by one waist of the isosceles trapezoid is the target side wall 227.
Specifically, in order to make the inclined surface smoothly push the impeller 224 to rotate, the size of the opening 12 formed at the position of the side wall of the second through hole 226 close to the bracket 223 is larger than the size of the opening 12 at the position far from the bracket 223.
Further, in order to allow air to flow from the first through hole 225 to the sidewall of the second through hole 226 when the first through hole 225 is completely staggered with the second through hole 226, the impeller 224 stays at the position where the target sidewall 227 is located at the first through hole 225. And is preferably located at a sidewall position of the first through-hole 225 adjacent to the second through-hole 226. Specifically, a certain gap is left for air to flow from the first through hole 225 to the inclined plane of the second through hole 226.
As a specific embodiment of the present invention, the plurality of first through holes 225 of the present embodiment are all identical in structure, the plurality of second through holes 226 are all identical in structure, and each first through hole 225 is identical in structure to each second through hole 226 in shape, and when the first through hole 225 and the second through hole 226 are completely staggered, the target sidewall 227 is disposed at the position of the first through hole 225.
In the present embodiment, all of the first through holes 225 and all of the second through holes 226 may have the shape of an isosceles trapezoid, but the shape and size thereof are slightly different.
Specifically, the shape and size of the first through-hole 225 and the second through-hole 226 of the present embodiment may be freely designed according to the size of the bracket 223 and the impeller 224. In order to allow the second through holes 226 and the first through holes 225 to be switched between corresponding and staggered states when the impeller 224 rotates, the first through holes 225 and the second through holes 226 may be designed to have symmetrical shapes, and the angle formed by the two most lateral sides of the size of the opening 12 of the first through hole 225 and the center of the circle and the angle formed by the position where the hole is not opened and the center of the circle may be designed to be the same, so that the number of the first through holes 225 or the second through holes 226 may be designed according to the angle. If the angle formed by the outermost side edge of the first through hole 225 or the second through hole 226 and the center of the circle is 30 degrees, the number of the first through hole 225 or the second through hole 226 may be designed to be 6. If the angle formed by the outermost side of the first through-hole 225 or the second through-hole 226 and the center of the circle is 15 degrees, the number of the first through-holes 225 or the second through-holes 226 may be designed to be 12.
As a specific embodiment of the present invention, the impeller 224 of the present embodiment is provided with the gravity structure 228 near the outer edge, so that when the impeller 224 is rotated until the gravity structure 228 is separated from the lowest point position, the impeller 224 is naturally rotated until the gravity structure 228 is located at the lowest point position under the action of the gravity structure 228, and when the impeller 224 is rotated until the gravity structure 228 is located at the lowest point position of the impeller 224, the first through holes 225 and the second through holes 226 are alternately arranged, so as to reduce the flow of air at the positions of the first through holes 225 and the second through holes 226.
In particular, the gravity structure 228 may be a gravity pin disposed at the impeller 224. The gravity pin may be located near the outer periphery of the impeller 224 and between the two second through holes 226. This may allow the center of gravity of the impeller 224 to move from a central position to a position near the gravity pin. In a natural state, i.e., when the fan 221 is turned off, the impeller 224 will naturally rotate until the gravity structure 228 is at the lowest point. At this time, the positions of the first through hole 225 and the second through hole 226 at the impeller 224 and the bracket 223 need to be just staggered.
Specifically, in the present embodiment, the bracket 223 is fixed at the position of the ventilation opening 21 of the test drawer 20, and the impeller 224 is designed with a rotating shaft and a shaft hole, so that the impeller 224 can rotate relative to the bracket 223. The bracket 223 can be provided for rotation, and a shaft hole is designed in the middle of the impeller 224, and the shaft hole of the impeller 224 is directly sleeved on the rotating shaft of the bracket 223. Of course, as another embodiment, the impeller 224 and the bracket 223 may also be fixed by using a bearing, so that the impeller 224 rotates relative to the bracket 223, that is, the periphery of the bearing is disposed on the bracket 223, and the impeller 224 is provided with a rotating shaft, which is sleeved in the middle of the bearing.
As a specific embodiment of the present invention, in this embodiment, a plurality of heat dissipation assemblies 22 may be designed at the position of the vent 21 of each test drawer 20, that is, a plurality of fans 221, a plurality of brackets 223 and a plurality of impellers 224 may be designed at the position of the vent 21, so as to better dissipate heat for the chips 40 in the test drawer 20.
As a specific embodiment of the present invention, in the present embodiment, a plurality of grooves 229 symmetrically distributed with respect to the center of the impeller 224 are provided at the impeller 224. The design of the groove 229 may reduce the weight of the impeller 224, but of course the groove 229 is also symmetrically designed and located substantially between the two second through holes 226. In one embodiment, the groove 229 structure may be a triangular groove or an isosceles trapezoid groove. The structure of the specific groove 229 is designed according to actual needs. It is only necessary to ensure that the center of gravity of the impeller 224 is located on the line or extension of the center of gravity of the impeller 224 and the center of gravity of the gravity structure 228 without changing the position of the center of gravity of the entire impeller 224 after the groove is designed.
Specifically, in this embodiment, through the design of the first through hole 225 of the bracket 223, the second through hole 226 of the impeller 224, and the gravity structure 228 on the impeller 224, when the fan 221 starts to dissipate heat, the impeller 224 rotates to a state where the first through hole 225 and the second through hole 226 correspondingly circulate, so as to dissipate heat for the test drawer. When the fan 221 is turned off, the impeller 224 is rotated by the gravity structure 228 until the first through holes 225 and the second through holes 226 are staggered, so as to prevent the air from flowing through the vent 21, and thus the heat on the chip 40 near the vent 21 and far from the vent 21 is substantially uniform. The rotation of the impeller 224 in this embodiment does not need any external control device, and the purpose can be achieved by using the inherent structure of the impeller, and compared with the design that needs a control structure, the structure of this embodiment is ingenious, and the situation that errors occur due to the situations such as control short circuit does not occur.
As a specific embodiment of the present invention, in this embodiment, the test drawer 20 may further include at least one heat sink 50 and heat dissipation fins 60. Wherein a plurality of chips 40 are disposed on each heat sink 50 for performing a reliability test on the chips 40. If there are a plurality of heat sinks 50, the heat sinks 50 are sequentially arranged side by side, and the heat dissipation fins 60 are arranged from a position away from the ventilation opening 21 to a position close to the ventilation opening 21 and are disposed at a side position of the heat sink 50 opposite to the chip 40 to dissipate heat from the heat sink 50, and the heat dissipation fins 60 are disposed at a side of the heat dissipation assembly 22 so that the fan 221 of the heat dissipation assembly 22 dissipates heat for the heat dissipation fins 60.
Because there is only one vent 21, the distance between the heat sink 50 and the heat sink 60 is far from the vent, so that in practical use, the same chip 40 or different chips 40 disposed on different heat sinks 50 may have different heat quantities due to the distance from the vent 21, and especially for the chip 40 located closer to the vent 21, the test may be inaccurate. In the present embodiment, the heat dissipation assembly 22 of the present embodiment is utilized to solve the technical problem, so as to reduce the problem of non-uniform heat during the reliability test of the chip 40 while ensuring the heat dissipation, and improve the accuracy of the test.
Thus, it should be appreciated by those skilled in the art that while a number of exemplary embodiments of the invention have been illustrated and described in detail herein, many other variations or modifications consistent with the principles of the invention may be directly determined or derived from the disclosure of the present invention without departing from the spirit and scope of the invention. Accordingly, the scope of the invention should be understood and interpreted to cover all such other variations or modifications.
Claims (10)
1. A chip testing apparatus, comprising at least one reliability test drawer, each of said test drawers comprising:
a vent located at one end of the test drawer; and
the fan comprises a fan and a wind control assembly, the wind control assembly comprises a support and an impeller, the impeller is rotatably connected with the support, a plurality of first through holes are formed in the support, a plurality of second through holes are formed in the impeller, the wind control assembly is constructed to be in the state that the fan rotates, the impeller rotates to the second through holes and the first through holes in the support are communicated with the two sides of the wind control assembly, and when the fan stops rotating, the impeller rotates to the second through holes and the first through holes are staggered to reduce air circulation on the two sides of the wind control assembly.
2. The chip testing apparatus according to claim 1,
the impeller is disc-shaped, the second through holes are multiple and evenly arranged around the center of the impeller, and part of target side walls of each second through hole are inclined planes, so that when the fan rotates and air vertically blows through the second through holes, the air pushes the target side walls to drive the impeller to rotate.
3. The chip testing apparatus according to claim 2,
one of the target side walls of each of the second through holes is configured to extend in a radial direction of the impeller, and the target side wall is a slope such that a dimension of the second through hole at a position close to the holder is larger than a dimension of the second through hole at a position away from the holder, and a cross section of the target side wall taken when the target side wall is cut on a plane perpendicular to the radial direction of the impeller forms a preset angle of 45 ° to 75 °.
4. The chip test apparatus according to claim 3,
the bracket is positioned between the fan and the impeller, so that air blown out by the fan passes through the first through hole of the bracket and then is blown to the impeller, and the impeller rotates to a position where the first through hole corresponds to the second through hole under the action of the inclined surface of the impeller.
5. The chip testing apparatus according to any one of claims 2 to 4,
each first through hole is the same as the corresponding second through hole in shape, and when the first through holes and the second through holes are completely staggered, the target side wall is located at the position of the first through hole.
6. The chip testing device according to any one of claims 2 to 4,
the structures of the first through holes are the same, the structures of the second through holes are the same, the structure of each first through hole is the same as the shape of each second through hole, and when the first through holes and the second through holes are completely staggered, the target side wall is located at the position of the first through hole.
7. The chip testing device according to any one of claims 1 to 4,
the impeller is provided with a gravity structure at a position close to the outer edge, so that when the impeller is rotated to a position where the gravity structure is separated from the lowest point, the impeller is naturally rotated to a position where the gravity structure is located at the lowest point under the action of the gravity structure, and when the impeller is rotated to a position where the gravity structure is located at the lowest point of the impeller, the first through holes and the second through holes are arranged in a staggered mode, so that the air flow at the first through holes and the second through holes is reduced.
8. The chip testing apparatus according to claim 7,
the impeller is provided with a plurality of grooves which are symmetrically distributed with the center of the impeller.
9. The chip testing apparatus according to any one of claims 1 to 4,
and a plurality of heat dissipation assemblies are arranged at each vent.
10. The chip testing device according to any one of claims 1 to 4,
the test drawer further comprises:
the heat sink comprises at least one heat sink, a plurality of chips and a plurality of control modules, wherein each heat sink is provided with a plurality of chips so as to perform reliability test on the chips; and
the heat sink is arranged on the side face of the heat sink opposite to the chip and used for dissipating heat of the heat sink, and the heat dissipation fins are arranged on the side edge of the heat dissipation assembly so that the fan of the heat dissipation assembly dissipates heat of the heat dissipation fins.
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| CN202210852094.XA CN115267268A (en) | 2022-05-27 | 2022-05-27 | Chip testing device |
| CN202210588922.3A CN114689910B (en) | 2022-05-27 | 2022-05-27 | Chip reliability testing device |
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| CN115420989A (en) * | 2022-11-07 | 2022-12-02 | 深圳市西点精工技术有限公司 | High-speed backplane connector preparation testing device and testing method |
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| CN115267268A (en) * | 2022-05-27 | 2022-11-01 | 苏州联讯仪器有限公司 | Chip testing device |
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| CN114689910B (en) | 2022-08-16 |
| CN114689910A (en) | 2022-07-01 |
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Address after: Building 5, No. 1508, Xiangjiang Road, Suzhou High-tech Zone, Suzhou City, Jiangsu Province 215129 Applicant after: Suzhou Lianxun Instrument Co.,Ltd. Address before: 215129 Building 1, No. 1508, Xiangjiang Road, Suzhou high tech Zone, Suzhou, Jiangsu Province Applicant before: STELIGHT INSTRUMENT Inc. |