CN219961158U

CN219961158U - Heat abstractor and electronic equipment

Info

Publication number: CN219961158U
Application number: CN202320149197.XU
Authority: CN
Inventors: 周鑫; 李佩; 王振; 曹秀燕; 孟裕顺
Original assignee: Huawei Technologies Co Ltd
Current assignee: Huawei Technologies Co Ltd
Priority date: 2023-01-13
Filing date: 2023-01-13
Publication date: 2023-11-03
Anticipated expiration: 2033-01-13

Abstract

The embodiment of the application provides a heat dissipation device and electronic equipment. In the embodiment of the application, the first heat exchanger, the first heat generation chamber, the second heat generation chamber and the second heat exchanger are sequentially arranged along the first direction, the first hot air duct is connected with the first heat exchanger and the first heat generation chamber, and the second hot air duct is connected with the second heat exchanger and the second heat generation chamber. The first cold air duct is connected with the first heat exchanger and the first heat generation chamber, and the second cold air duct is connected with the second heat exchanger and the second heat generation chamber. The first hot air duct and the second hot air duct are not provided with shielding and laminating parts, the first cold air duct and the second cold air duct are not provided with shielding and laminating parts, the occupied space of the heat radiating device can be reduced, and the air duct is easy to overhaul.

Description

Heat abstractor and electronic equipment

Technical Field

The present application relates to the field of heat dissipation technologies, and in particular, to a heat dissipation device and an electronic device.

Background

The process of selectively or non-selectively producing a high quality single crystal thin film as the crystal structure of the substrate at the substrate surface may be performed in an epitaxial apparatus. In the film growth process, the substrate needs to be heated, and heating chambers are arranged on two opposite sides of a reaction chamber of the epitaxial equipment and are used for heating the substrate. The temperature in the heating chamber is too high in the heating process, and heat dissipation needs to be carried out on the heating chamber.

The existing heat dissipation device often occupies a large space in the extension equipment, so that the whole volume of the extension equipment is large, the air duct cannot be independently disassembled and assembled, and maintenance is difficult.

Therefore, it is necessary to provide a heat dissipating device with small space occupation, and to enable different air channels to be independently assembled and disassembled, so as to increase maintainability of the heat dissipating device.

Disclosure of Invention

The embodiment of the utility model provides a heat dissipation device and electronic equipment. The heat dissipation device has the characteristics of small occupied space, independent disassembly and assembly of different air channels, high maintainability and the like.

In a first aspect, an embodiment of the present utility model provides a heat dissipating device. The heat dissipation device can be applied to electronic equipment, and the electronic equipment comprises a first heat generation chamber and a second heat generation chamber. It is understood that the first heat generating chamber and the second heat generating chamber may be disposed at intervals or may be disposed in contact. The heat dissipation device comprises a first hot air channel, a first heat exchanger, a first cold air channel, a second hot air channel, a second heat exchanger and a second cold air channel, wherein the first heat exchanger, the first heat generation chamber, the second heat generation chamber and the second heat exchanger are sequentially arranged along a first direction; the first hot air duct is connected with the first heat exchanger and the first heat generation chamber, the second hot air duct is connected with the second heat exchanger and the second heat generation chamber, and the first hot air duct and the second hot air duct are respectively positioned at two opposite ends in the first direction; the first cold air duct is connected with the first heat exchanger and the first heat generation chamber, and the first cold air duct and the first hot air duct are respectively positioned at two sides of the first heat exchanger; the second cold air duct is connected with the second heat exchanger and the second heat generation chamber, and the second cold air duct and the second hot air duct are respectively positioned at two sides of the first heat exchanger; the first cold air duct and the second cold air duct are respectively positioned at two opposite ends of the first direction.

According to the embodiment of the application, the first heat exchanger, the first heat generation chamber, the second heat generator and the second heat exchanger are sequentially arranged, the first hot air channel is fixedly connected with the first side part and the first heat exchanger, the second hot air channel is fixedly connected with the second side part and the second heat exchanger, so that the first heat generation chamber radiates heat through the first heat exchanger, the second heat generation chamber radiates heat through the second heat exchanger, the radiating efficiency is high, the extending directions of the first hot air channel and the second hot air channel are different, and in the direction vertical to the first direction, a shielding and laminating part does not exist between the first hot air channel and the second hot air channel, and the first hot air channel and the second hot air channel are arranged in parallel relative to the first hot air channel and the second hot air channel and are commonly connected with one heat exchanger. It can be understood that, because the first cold air duct is fixedly connected to the first heat exchanger and the first heat generation chamber, the second cold air duct is connected to the second heat exchanger and the second heat generation chamber, the extending directions of the first cold air duct and the second cold air duct are different, no shielding and laminating part exists between the first cold air duct and the second cold air duct, and the first cold air duct and the second cold air duct are parallel to each other and are connected with the heat exchanger together.

In a possible implementation manner, the first hot air duct and the second hot air duct are located on the same side of the electronic device, and/or the first cold air duct and the second cold air duct are located on the same side of the electronic device, so that the occupied area of the heat dissipation device can be reduced.

In a possible implementation manner, one end of the first hot air duct is connected with one side of the first heating chamber in the second direction, one end of the second hot air duct is connected with one side of the second heating chamber in the second direction, and the second direction is perpendicular to the first direction, so that sufficient heat dissipation for the first heating chamber and the second heating chamber is facilitated.

In a possible embodiment, the first cold air duct is located between the first heat exchanger and the first heating chamber, and the second cold air duct is located between the second heat exchanger and the second heating chamber. The first cold air channel is located between the first heat exchanger and the first heating chamber, and means that the first cold air channel can extend along the first direction, the first cold air channel can not exceed the boundary between the connected first heat exchanger and the first heating chamber, the second cold air channel is located between the second heat exchanger and the second heating chamber, and means that the second cold air channel can extend along the first direction, and the second cold air channel can not exceed the boundary between the connected second heat exchanger and the second heating chamber, so that the occupied space of the heat radiating device in the direction perpendicular to the first direction can be reduced.

In one possible implementation manner, the first hot air duct includes a first opening and a second opening, the first opening is connected with the first heat exchanger, the second opening is connected with the first heat generating chamber, the first opening includes a first edge, the first edge extends along a second direction, and an included angle between the first edge and a normal line of a plane where the second opening is located is an acute angle, where the second direction is perpendicular to the first direction. According to the limited space in the electronic equipment, the space occupied by the heat dissipation device can be reduced and the space utilization rate in the electronic equipment can be improved by adjusting the relative positions of the first opening and the second opening.

In one possible implementation manner, the heat dissipating device includes a locking element, the locking element includes a first locking portion and a second locking portion, the first locking portion is fixedly connected to the outer wall of the first hot air duct, the first locking portion is provided with a lock tongue, the second locking portion is fixedly connected to the outer wall of the first heat generating chamber, the second locking portion is provided with a through hole, and the lock tongue is embedded into the through hole and forms detachable connection. According to the embodiment of the application, the first hot air duct and the first heat generation chamber can be detachably connected through the locking piece, and the locking of the first locking part is matched with the through hole of the second locking part, so that the miniaturization of the locking piece is facilitated, and the space occupied by the heat dissipation device is reduced. The through holes of the first locking part and the second locking part are matched, so that the disassembly is easy to realize, the disassembly time and difficulty can be reduced, the disassembly efficiency is improved, and the maintainability of the heat dissipating device is improved.

In a possible embodiment, one end of the first hot air duct is embedded in the air inlet duct of the first heat exchanger. It will be appreciated that the aperture size of the first hot air duct is smaller than the aperture size of the inlet duct of the first heat exchanger so that the first hot air duct can be embedded into the inlet duct of the first heat exchanger. Hot air enters the air inlet channel of the first heat exchanger with a large caliber from the first hot air channel with a small caliber, so that the wind resistance of the hot air is reduced, and the transmission efficiency of the hot air is improved. If the hot air enters the small-caliber pipeline from the large-caliber pipeline, the wind resistance is large, and the quick transmission of the hot air is not facilitated.

In a possible implementation manner, the air inlet duct of the first heat exchanger comprises a first sub-duct and a second sub-duct which are fixedly connected, the inner wall of the second sub-duct is expanded outwards relative to the inner wall of the first sub-duct, the first hot air duct is connected with the inner wall of the first sub-duct, and a specific gap is formed between the inner walls of the first hot air duct and the second sub-duct. The inner wall of the second sub-air duct is expanded relative to the inner wall of the first sub-air duct, so that the air inlet duct of the first heat exchanger can form a horn-shaped structure. It can be understood that the inner wall of the second sub-air duct is obliquely arranged relative to the inner wall of the first sub-air duct, and the caliber size of the second sub-air duct is larger than that of the first sub-air duct, so that the assembly difficulty of embedding the first hot air duct into the first sub-air duct can be reduced. The first hot air duct and the inner wall of the first sub air duct can be in direct contact or indirect contact.

In one possible embodiment, the heat dissipating device includes a rubber ring, and the rubber ring is located between the first sub-air duct and the first hot air duct. Through setting up the rubber ring joint between first sub-wind channel and first hot air duct, can make the air inlet duct and the first hot air duct zonulae occludens of first heat exchanger, improve heat abstractor's leakproofness. In addition, when the first hot air duct is arranged in the air inlet duct of the first heat exchanger, the rubber ring can be sleeved on the outer wall of the first hot air duct, the rubber ring has elastic deformation capability and is easy to compress under external force, so that the first hot air duct provided with the rubber ring easily slides into the inner wall of the first sub-air duct along the inclined inner wall of the second sub-air duct, and the sealing contact connection between the first hot air duct and the first sub-air duct is realized. The rubber ring can be made of silicon rubber, and the rubber ring needs to have high temperature resistance, so that the rubber ring is prevented from being damaged by hot air.

In one possible embodiment, the heat dissipating device includes a fan located within the first cold air duct and a buffer located between an outer surface of the fan and an inner wall of the first cold air duct. The fan can be used for sending cold wind into first heat generation room, improves the transmission efficiency of cold wind. The buffer member may be a sponge, a silica gel pad, a shock-insulating pad, or the like, which is not limited in the present application. Through setting up the bolster, can reduce the vibration of fan during operation to electronic equipment's influence to and reduce heat abstractor's noise. It is understood that the same fan and buffer member may be disposed in the second cooling air duct to achieve the same technical effect.

In one possible implementation manner, the heat dissipating device includes a fan and a choke member, the choke member surrounds the periphery of the fan and contacts the inner wall of the first cold air duct, and the extending track of the first cold air duct passes through a ring surrounded by the choke member. The choke piece can be foam or foam strips and the like. Through setting up choke spare, can prevent that the cold air in the first cold wind channel from circulating in the clearance between fan and the first cold wind channel inner wall (the clearance between cold air entering fan and the first cold wind channel inner wall can lead to cold air at the clearance internal recycle, is difficult to get into first heat generation room, and the utilization efficiency of cold air is low) for the cold air in the first cold wind channel can only get into first heat generation room through the fan, improves the utilization efficiency of cold air. In addition, the arrangement of the choke piece can also reduce noise in the fan movement process and weaken the influence of vibration of the fan during operation on the epitaxial equipment or the electronic equipment.

In a possible embodiment, the flow direction of the hot air entering the first heat exchanger is opposite to the flow direction of the cooling medium in the first heat exchanger. Through setting up the flow direction relation of hot air and coolant, can increase the heat exchange quantity, and also be favorable to in the first heat exchanger after the coolant after the intensification can discharge fast, improve heat exchange efficiency. It can be appreciated that in the second direction, the side of the hot air entering the first heat exchanger and the side of the cooling medium leaving the first heat exchanger can be understood as the same side of the first heat exchanger, and the cooling medium can be contacted with the hot air on the side of the hot air entering the first heat exchanger, and then discharged out of the first heat exchanger after temperature rise, thereby being beneficial to improving heat exchange efficiency. It will be appreciated that the flow direction of the cooling medium in the second heat exchanger may also be opposite to the flow direction of the hot air entering the second heat exchanger.

In a second aspect, the present application provides an electronic device, including a first heat generating element, a second heat generating element, and a heat dissipating device in any one of the foregoing embodiments, where the first heat generating element is located in a housing of the first heat generating chamber, the second heat generating element is located in a housing of the second heat generating chamber, thermal energy of the first heat generating element is conducted to the first heat exchanger, and thermal energy of the second heat generating element is conducted to the second heat exchanger. The electronic device may be an inverter, an epitaxial device, or the like.

In a possible embodiment, the electronic device comprises a reaction chamber, which is located between the first heat generating chamber and the second heat generating chamber. The first heat generation chamber and the second heat generation chamber may be used to heat the reaction chamber.

In a possible implementation manner, the electronic device includes a cabinet body, the cabinet body is in a trapezoid column shape, and the first heat generation chamber, the reaction chamber, the second heat generation chamber and the heat dissipation device are all located in the cabinet body; the cabinet body comprises a first side face, a second side face, a third side face and a fourth side face, wherein the first side face is parallel to the third side face, the second side face is connected with the first side face and the third side face, the fourth side face is connected with the first side face and the third side face, an included angle between the second side face and the third side face is smaller than an included angle between the second side face and the first side face, and the first hot air duct and the second hot air duct are both located at an included angle formed by the second side face and the third side face. The space at the corner position formed by the second side surface and the third side surface is larger, and the space in the cabinet body can be fully utilized by arranging the first hot air channel and the second hot air channel at the included angle formed by the second side surface and the third side surface, so that the space utilization rate in the cabinet body can be improved.

In a possible implementation manner, the first heat generating chamber comprises a supporting piece, a first cavity and a second cavity, the supporting piece is fixedly connected to the inner side wall of the first heat generating chamber, the first heat generating piece is fixed on one side of the supporting piece, which faces the second heat generating chamber, the supporting piece separates the first cavity from the second cavity, the supporting piece is provided with a ventilation hole, and the ventilation hole is communicated with the first cavity and the second cavity. The cold air of the cold air duct is diffused in the first heating chamber through the vent hole. The cooling air is diffused in the second cavity of the first heat generation chamber through the ventilation holes on the supporting piece, so that the diffusion efficiency of the cooling air can be improved, and the uniformity of heat dissipation in the first heat generation chamber is improved.

Drawings

In order to more clearly describe the embodiments of the present application or the technical solutions in the background art, the following description will describe the drawings that are required to be used in the embodiments of the present application or the background art.

Fig. 1 is a schematic structural diagram of an electronic device according to an embodiment of the present application;

fig. 2 is a schematic view of an application environment of an epitaxial apparatus according to an embodiment of the present application;

fig. 3 is a schematic view of a part of the internal structure of an epitaxy apparatus according to an embodiment of the present application;

Fig. 4 is a schematic structural diagram of a first heat generating chamber according to an embodiment of the present application;

fig. 5 is a schematic view of a part of an epitaxy apparatus according to an embodiment of the present application;

fig. 6 is a schematic perspective view of a first hot air duct, a first heat exchanger, and a first cold air duct according to an embodiment of the present application;

fig. 7 is a schematic view of a part of an epitaxy apparatus according to an embodiment of the present application;

fig. 8 is a schematic perspective view of a second hot air duct, a second heat exchanger, and a second cold air duct according to an embodiment of the present application;

fig. 9 is a schematic view of a part of a heat dissipating device according to an embodiment of the present application;

FIG. 10a is a schematic view of a locking element according to an embodiment of the present application in a first state;

FIG. 10b is a schematic view of a locking element according to an embodiment of the present application in a second state;

FIG. 10c is a schematic view of a locking element according to an embodiment of the present application in a third state;

FIG. 10d is a schematic view of a locking element according to an embodiment of the present application in a fourth state;

fig. 11 is a schematic view of a part of a heat dissipating device according to an embodiment of the present application;

Fig. 12 is a schematic view of a part of a heat dissipating device according to an embodiment of the present application.

Detailed Description

The following description of the embodiments of the present application will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present application, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the application without making any inventive effort, are intended to be within the scope of the application.

All technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The term "and/or" as used herein includes any and all combinations of one or more of the associated listed items. The description as it relates to "first", "second", etc. in the present application is for descriptive purposes only and is not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated.

As shown in fig. 1, fig. 1 is a schematic structural diagram of an electronic device 3000. The electronic device 3000 may be an inverter, an epitaxial device, or the like. The electronic device 3000 may include a first heat generation chamber 11 and a second heat generation chamber 12, and the first heat generation chamber 11 and the second heat generation chamber 12 are arranged in sequence. The first heat generation chamber 11 may be spaced apart from the second heat generation chamber 12, or the first heat generation chamber 11 may be disposed in contact with the second heat generation chamber 12, which is not limited in the present application. The first heating element 115 is arranged in the shell of the first heating chamber 11, the second heating element 125 is arranged in the shell of the second heating chamber 12, and the first heating element 115 and the second heating element 125 generate heat energy. In order to reduce the influence of heat energy on the electronic device 3000, the electronic device 3000 is generally required to provide a heat dissipating device (not shown in fig. 1), so that the heat energy of the first heat generating component 115 can be conducted to the heat dissipating device, and the heat energy of the second heat generating component 125 can be conducted to the heat dissipating device, so as to dissipate the heat of the first heat generating chamber 11 and the second heat generating chamber 12.

In some embodiments, the electronic device 3000 may further include a housing 300, where the housing 300 has a receiving space, and can be used to mount the first heat generating chamber 11, the second heat generating chamber 12, a heat dissipating device, or other structural components.

The positions, shapes and sizes of the first heat generating chamber 11, the second heat generating chamber 12, the first heat generating member 115 and the second heat generating member 125 in fig. 1 are only schematically represented, and may be adjusted as needed. In addition, fig. 1 is a schematic diagram schematically showing a structure of an electronic apparatus 3000, and the structure of the electronic apparatus 3000 is not limited in the embodiment of the present application.

As shown in fig. 2, fig. 2 is a schematic view of an application environment of an epitaxial apparatus 1000 according to an embodiment of the present application. The embodiment of the application takes the electronic device 3000 as the epitaxial device 1000 as an example. The epitaxial apparatus 1000 may be used to produce devices. The epitaxial apparatus 1000 is typically used in conjunction with a transfer apparatus 2000 for transferring a substrate (not shown in fig. 2) into the epitaxial apparatus 1000. The epitaxial apparatus 1000 may heat the substrate to selectively or non-selectively produce a high quality monocrystalline film on the substrate surface as the substrate crystal structure.

A plurality of epitaxial devices 1000 may be disposed on the outer side of the transfer device 2000, and illustratively, a portion of the transfer device 2000 mated with the epitaxial devices 1000 may be a hexagonal columnar structure, the epitaxial devices 1000 may be a trapezoidal columnar structure, and the epitaxial devices 1000 may be disposed around the periphery of the hexagonal columnar structure of the transfer device 2000, so that the occupation space of the epitaxial devices 1000 and the transfer device 2000 can be reduced. Four epitaxial devices 1000 are shown in fig. 2, and in other embodiments, the number of epitaxial devices 1000 may be one, two, three, etc., as the application is not limited in this regard. In other embodiments, the portion of the transfer apparatus 2000 mated with the epitaxial apparatus 1000 may be a pentagonal columnar structure, a heptagonal columnar structure, and the epitaxial apparatus 1000 may be a square columnar structure, a parallelogram columnar structure, a pentagonal structure, or the like, which is not limited in the present application. The plurality of epitaxial devices 1000 are arranged around one transfer apparatus 2000, which is advantageous for mass production of semiconductor devices, can reduce production cost, can improve production efficiency, and can reduce the overall required floor space of the transfer apparatus 2000 and the epitaxial devices 1000.

The epitaxial apparatus 1000 may include a cabinet 100, taking the epitaxial apparatus 1000 as an example of a trapezoidal columnar structure, that is, the cabinet 100 may be a trapezoidal columnar structure. The cabinet body 100 may include a first side 101, a second side 102, a third side 103, and a fourth side 104, the first side 101 may be parallel to the third side 103, the second side 102 may connect the first side 101 and the third side 103, the fourth side 104 may connect the first side 101 and the third side 103, the second side 102 and the fourth side 104 are spaced apart, and an included angle between the second side 102 and the third side 103 is smaller than an included angle between the second side 102 and the first side 101. The first side 101 may be facing the transfer device 2000 and the third side 103 may be located on a side of the epitaxial device 1000 facing away from the transfer device 2000. Since the angle between the second side 102 and the third side 103 is smaller than the angle between the second side 102 and the first side 101, the first side 101 may be understood as a short side of the trapezoid, the third side 103 may be understood as a long side of the trapezoid, and the second side 102 and the fourth side 104 may be understood as two waists of the trapezoid. By providing the first side 101 of the epitaxial apparatus 1000 facing the transfer apparatus 2000, the utilization of the space around the transfer apparatus 2000 is advantageously improved, and the overall footprint of the transfer apparatus 2000 and the plurality of epitaxial apparatuses 1000 can be reduced. The third side 103 can be provided with a door plate, and maintenance personnel can open the epitaxial equipment 1000 for maintenance through the door plate, and the third side 103 is located on one side of the epitaxial equipment 1000, which is away from the conveying equipment 2000, so that a larger operable space is provided for maintenance of structural components in the epitaxial equipment 1000.

In order to reduce the influence of thermal energy on the epitaxial apparatus 1000, a heat dissipation device (not shown in fig. 2) is generally required to be disposed on the epitaxial apparatus 1000 to dissipate heat from the heat generating element in the epitaxial apparatus 1000.

As shown in fig. 3, fig. 3 is a schematic view of a part of the structure of the interior of an epitaxy apparatus 1000. In the embodiment of the present application, the structure of the heat dissipating device 200 is described by taking the application of the heat dissipating device 200 to the epitaxial apparatus 1000 as an example. The structure of the heat sink of the other electronic device 3000 may refer to the structure of the heat sink 200 of the epitaxial device 1000. The epitaxial apparatus 1000 may include a heat dissipating device 200 and first and second heat generating chambers 11 and 12 arranged in sequence, and the first and second heat generating chambers 11 and 12 may be disposed at intervals. In other embodiments, the first heat generation chamber 11 and the second heat generation chamber 12 may be disposed in contact.

In some embodiments, the epitaxial apparatus 1000 may include a reaction chamber 13, and the first heat generation chamber 11, the reaction chamber 13, and the second heat generation chamber 12 are disposed in this order.

The first heat generating chamber 11 may include a first heat generating member 115, and the first heat generating member 115 may be a structural member capable of generating heat energy such as a high-power bulb, for example, the first heat generating member 115 may be a lamp group formed by a high-power tungsten halogen bulb. The first heat generating chamber 11 may include a support 114, and the support 114 of the first heat generating chamber is referred to as a first support 114 for distinguishing from the support of the second heat generating chamber 12. The edge of the first support 114 may be fixedly connected to the inner sidewall of the first heat generation chamber 11. The first supporting member 114 may have an arc surface, the first supporting member 114 may be protruded towards a side facing away from the reaction chamber 13, and the first heating member 115 may be fixedly connected to a side of the first supporting member 114 facing toward the reaction chamber 13, that is, the first heating member 115 may be fixedly connected to a side of the first supporting member 114 facing toward the second heating chamber 12, and the first supporting member 114 may have an arc surface to perform a light condensation function, so as to collect heat energy to heat the reaction chamber 13.

The second heat generating chamber 12 may include a second heat generating member 125, and the second heat generating member 125 may be a structural member capable of generating heat energy, such as a high-power bulb, for example, the second heat generating member 125 may be a lamp group formed by a high-power tungsten halogen bulb. The second heat generating chamber 12 may include a second supporting member 124, where the structure of the second supporting member 124, the relationship between the second supporting member 124 and the second heat generating chamber 12, and the relationship between the second supporting member 124 and the second heat generating member 125 refer to the structure of the first supporting member 114 and the relationship between the first supporting member 114 and the first heat generating chamber 11, and the first heat generating member 115, which are not described herein.

The reaction chamber 13 may include a base 131, the base 131 being for carrying a substrate 132 transferred from the transfer apparatus 2000, the substrate 132 being adsorbed on the base 131. Heating of the substrate 132 is required to grow a film on the substrate 132. The reaction chamber 13 is located between the first heat generating member 115 and the second heat generating member 125, and the first heat generating member 115 and the second heat generating member 125 may generate heat energy for heating the substrate 132.

The heat energy generated by the first heat generating element 115 and the second heat generating element 125 may raise the temperature in the first heat generating chamber 11 and the second heat generating chamber 12, and the wires or lines in the first heat generating chamber 11 and the second heat generating chamber 12 may be damaged due to the excessive temperature. Therefore, it is necessary to provide the heat sink 200 capable of cooling the first heat generation chamber 11 and the second heat generation chamber 12 in the epitaxial apparatus 1000.

The heat dissipation device 200 can also be applied to other devices with limited space, and the heat dissipation device is applied to the electronic device 3000, and can dissipate heat for a heating element in a heating chamber of the electronic device 3000, so as to avoid damage caused by overhigh temperature of the heating element, thereby affecting normal operation of the electronic device 3000.

Referring to fig. 3, the heat sink 200 may include a first hot air duct 21, a first heat exchanger 31, a first cold air duct 41, a second hot air duct 22, a second heat exchanger 32, and a second cold air duct 42. The first heat exchanger 31, the first heat generation chamber 11, the second heat generation chamber 12, and the second heat exchanger 32 may be sequentially arranged along the first direction A1, and the reaction chamber 13 is located between the first heat generation chamber 11 and the second heat generation chamber 12. The first heat exchanger 31 may be located in the first heat exchange chamber 310, and the first heat exchange chamber 310 may be a chamber for accommodating the first heat exchanger 31, or may be a housing of the first heat exchanger 31, which may be a part of the first heat exchanger 31. The second heat exchanger 32 may be located in the second heat exchange chamber 320, and the second heat exchange chamber 320 may be a chamber that accommodates the second heat exchanger 32, or may be a housing of the second heat exchanger 32, and may be a part of the second heat exchanger 32. The second direction A2 is perpendicular to the first direction A1, and the third direction A3 is opposite to the second direction A2.

The first heat generation chamber 11 may include a first top 111, a first bottom 112, and a first side 113, the first top 111 facing the first heat exchanger 31, the first bottom 112 facing the second heat generation chamber 12, and the first side 113 may be connected between the first top 111 and the first bottom 112. The first hot air duct 21 may be fixedly connected to the first heat generation chamber 11 and the first heat exchanger 31. It is to be understood that one end of the first hot air duct 21 may be fixedly connected to the first side portion 113 (the first side portion 113 is a side of the first heat generating chamber 11 in the second direction A2) or other positions of the first heat generating chamber 11, and the other end of the first hot air duct 21 may be fixedly connected to a side of the first heat exchanger 31 facing the first heat generating chamber 11 or other positions of the first heat exchanger 31, which is not limited in the present application. The first cold air duct 41 may be fixedly connected to the first heat exchanger 31 and the first heat generating chamber 11, and the first cold air duct 41 and the first hot air duct 21 are arranged along the second direction A2, and the first cold air duct 41 and the first hot air duct 21 are respectively located at two sides of the first heat exchanger 31. It can be appreciated that one end of the first cold air duct 41 is fixedly connected to the first heat exchanger 31, and the other end of the first cold air duct 41 is fixedly connected to the first heat generation chamber 11. Illustratively, one end of the first cold air duct 41 may be fixedly connected to the first top 111, and one end of the first cold air duct 41 may also be fixedly connected to other positions of the first heat generating chamber 11; the other end of the first cold air duct 41 may be fixedly connected to the side of the first heat exchanger 31 facing the first heat generating chamber 11, which is favorable for reducing the space occupied by the heat dissipating device 200, and the other end of the first cold air duct 41 may also be fixedly connected to other positions of the first heat exchanger 31, which is not limited in the present application. The first cold air duct 41 may be located between the first heat exchanger 31 and the first heat-generating chamber 11 (i.e., the first cold air duct 41 may extend along the first direction A1, and the first cold air duct 41 may not exceed the boundary between the connected first heat exchanger 31 and the first heat-generating chamber 11), and by way of example, one end of the first cold air duct 41 is fixedly connected to the first top 111, and the other end of the first cold air duct 41 is fixedly connected to one side of the first heat exchanger 31 facing the first heat-generating chamber 11, compared with the case where the first cold air duct 41 is connected to the side of the first heat-generating chamber 11, so that the space occupied by the heat dissipating device 200 in the direction perpendicular to the first direction A1 can be reduced.

The second heat generation chamber 12 may include a second top 122, a second bottom 121, and a second side 123, the second top 122 facing the first heat generation chamber 11, the second bottom 121 facing the second heat exchanger 32, and the second side 123 may be connected between the second top 122 and the second bottom 121. The second hot air duct 22 is fixedly connected to the second heat generation chamber 12 and the second heat exchanger 32. It is understood that one end of the second hot air duct 22 may be fixedly connected to the second side 123 (the second side 123 is a side of the second heat generating chamber 12 in the second direction A2) or other positions of the second heat generating chamber 12, and the other end of the second hot air duct 22 may be fixedly connected between a side of the second heat exchanger 32 facing the second heat generating chamber 12 or other positions of the second heat exchanger 32, which is not limited in the present application. The first hot air duct 21 and the second hot air duct 22 are arranged along the first direction A1, and the first hot air duct 21 and the second hot air duct 22 are respectively located at opposite ends of the first direction A1. The second cold air duct 42 is connected to the second heat exchanger 32 and the second heat generating chamber 12, and the second cold air duct 42 and the second hot air duct 22 are arranged along the second direction A2, and the second cold air duct 42 and the second hot air duct 22 are respectively located at two sides of the second heat exchanger 32. It will be appreciated that one end of the second cold air duct 42 is fixedly connected to the second heat exchanger 32, and the other end of the second cold air duct 42 is fixedly connected to the second heat generation chamber 12. One end of the second cold air duct 42 may be fixedly connected to the second bottom 121, and one end of the second cold air duct 42 may also be fixedly connected to other positions of the second heat generation chamber 12; the other end of the second cold air duct 42 may be fixedly connected to a side of the second heat exchanger 32 facing the second heat generation chamber 12, and the other end of the second cold air duct 42 may be fixedly connected to another position of the second heat exchanger 32, which is not limited in the present application. The first cold air duct 41 and the second cold air duct 42 are arranged along the first direction A1, and the first cold air duct 41 and the second cold air duct 42 are respectively located at opposite ends of the first direction A1. The second cold air duct 42 may be located between the second heat exchanger 32 and the second heat generation chamber 12 (i.e., the second cold air duct 42 may extend along the first direction A2, and the second cold air duct 42 may not exceed the boundary between the connected second heat exchanger 32 and the second heat generation chamber 12), for example, when one end of the second cold air duct 42 is fixedly connected to the second bottom 121 and the other end of the second cold air duct 42 may be fixedly connected to a side of the second heat exchanger 32 facing the second heat generation chamber 12, compared to a side of the second cold air duct 42 connected to the second heat generation chamber 12, the space occupied by the heat dissipating device 200 in a direction perpendicular to the first direction A1 can be reduced.

In some embodiments, to reduce the space occupied by the heat sink 200 in the direction perpendicular to the first direction A1, the first hot air duct 21 and the second hot air duct 22 may be disposed on the same side of the epitaxial apparatus 1000, and illustratively, the first side 113 and the second side 123 may be disposed toward the same side of the epitaxial apparatus 1000, one end of the first hot air duct 21 is connected to the first side 113, and one end of the second hot air duct 22 is connected to the second side 123, so that the space occupied by the heat sink 200 in the direction perpendicular to the first direction A1 is reduced, and the floor space of the heat sink 200 is reduced. If the first hot air duct 21 and the second hot air duct 22 are located at different sides of the extension apparatus 1000, an increase in the space occupied by the heat sink 200 in the direction perpendicular to the first direction A1 may be caused. It will be appreciated that the first cooling air duct 41 and the second cooling air duct 42 may also be disposed on the same side of the electronic device to reduce the floor space of the heat dissipating device 200.

In some embodiments, the first hot air duct 21 and the first cold air duct 41 may be fixedly connected to a side of the first heat exchanger 31 facing the first heat generating chamber 11. It can be appreciated that when the first hot air duct 21 is fixedly connected with the first cold air duct 41 and is fixedly connected with the other side of the first heat exchanger 31, the first hot air duct 21 and the first cold air duct 41 need longer pipelines, and the pipelines need to be bent for a plurality of times to realize connection, so that the pipeline resistance at the bending part is increased, the air flow rate in the pipelines is slowed down, the pipeline wear rate is increased, the problems of air leakage and the like are more likely to occur, and the heat exchange efficiency and reliability of the heat dissipating device 200 are affected.

If one heat exchanger is provided, such as the first heat exchanger 31 is provided, the second heat exchanger 32 is not provided, or the second heat exchanger 32 is provided, the first heat exchanger 31 is not provided, the first hot air duct 21 and the second hot air duct 22 are connected to the same heat exchanger, the first cold air duct 41 and the second cold air duct 42 are connected to the same heat exchanger, which may cause a portion of shielding and lamination between the first hot air duct 21 and the second hot air duct 22 and a portion of shielding and lamination between the first cold air duct 41 and the second cold air duct 42 in the second direction A2, increasing the occupation space of the heat sink 200 in the second direction A2. According to the embodiment of the application, the two heat exchangers are arranged, so that the first heat-generating chamber 11 exchanges heat through the first heat exchanger 31, the second heat-generating chamber 12 exchanges heat through the second heat exchanger 32, the heat dissipation efficiency is high, and shielding between pipelines can be avoided.

In the embodiment of the application, the first heat generating chamber 11 and the first heat exchanger 31 are fixedly connected by the first heat air flue 21, the second heat generating chamber 12 and the second heat exchanger 32 are fixedly connected by the second heat air flue 22, so that the first heat air flue 21 and the second heat air flue 22 can extend towards different directions (the first heat air flue 21 extends from the first heat generating chamber 11 to the first heat exchanger 31, and the second heat air flue 22 extends from the second heat generating chamber 12 to the second heat exchanger 32), and no shielding and lamination part exists between the first heat air flue 21 and the second heat air flue 22 in the second direction A2, which is beneficial to reducing the occupied space of the heat dissipating device 200 in the second direction A2. And because the first hot air duct 21 and the second hot air duct 22 do not shield each other, the first hot air duct 21 can be independently disassembled and assembled, or the second hot air duct 22 can be independently disassembled and assembled, so that the maintenance of the heat dissipating device 200 is facilitated, and the maintenance workload and the maintenance cost can be reduced.

In the embodiment of the application, the first cold air duct 41 is fixedly connected to the first heat exchanger 31 and the first heat generation chamber 11, the second cold air duct 42 is fixedly connected to the second heat exchanger 32 and the second heat generation chamber 12, so that the first cold air duct 41 and the second cold air duct 42 can extend towards different directions (the first cold air duct 41 extends from the first heat exchanger 31 to the first heat generation chamber 11, and the second cold air duct 42 extends from the second heat exchanger 32 to the second heat generation chamber 12), and in the second direction A2, no shielding and lamination part exists between the first cold air duct 41 and the second cold air duct 42, which is beneficial to reducing the occupied space of the heat sink 200 in the second direction A2, and in the overhaul process of the heat sink 200, the first cold air duct 41 can be independently overhauled, or the second cold air duct 42 can be independently overhauled, so that the overhaul cost can be reduced, the maintenance workload and the maintenance cost of the heat sink 200 can be independently disassembled and facilitated.

In the embodiment of the application, by arranging two heat exchangers, and the extending directions of the first hot air duct 21 and the second hot air duct 22 are different, and the first hot air duct 21 and the second hot air duct 22 do not have shielding and laminating parts, the first cold air duct 41 and the second cold air duct 42 extend towards different directions, and the shielding and laminating parts do not exist between the first cold air duct 41 and the second cold air duct 42, so that the space of the epitaxial device 1000 in the first direction A1 can be fully utilized, the space occupied by the epitaxial device 1000 in the direction perpendicular to the first direction A1 is reduced, the space utilization is fully realized under the condition that the space of the epitaxial device 1000 is limited, and the occupied area of the epitaxial device 1000 is reduced.

The hot air in the first heat generation chamber 11 can enter the first heat exchanger 31 through the first hot air duct 21, and when the hot air passes through the first heat exchanger 31, the hot air can exchange heat with a cooling medium (the cooling medium may be water, cooling gas or the like) of the first heat exchanger 31, and the hot air is cooled into cold air. The cold air can be transmitted into the first heat-generating chamber 11 through the first cold air duct 41 to radiate the heat of the first heat-generating chamber 11, so that the temperature in the first heat-generating chamber 11 is reduced, and the high temperature is prevented from damaging structural members and devices in the first heat-generating chamber 11.

In some embodiments, the flow of hot air entering the first heat exchanger 31 is counter to the flow of cooling medium within the first heat exchanger 31. Illustratively, the hot air entering the first heat exchanger 31 may flow in the second direction A2, and the cooling medium may flow in the third direction A3 within the first heat exchanger 31. The heat exchange amount of the hot air and the cooling medium can be increased by arranging the flow direction of the hot air opposite to the flow direction of the cooling medium, so that the heat exchange efficiency is improved, the hot air is sufficiently cooled, in addition, the cooling medium in the first heat exchanger 31 after being heated can be discharged rapidly, it is understood that in the second direction A2, one side of the hot air entering the first heat exchanger 31 and one side of the cooling medium leaving the first heat exchanger 31 can be understood as the same side of the first heat exchanger 31, the cooling medium can be contacted with the hot air on one side of the hot air entering the first heat exchanger 31, and the heated cooling medium is discharged out of the first heat exchanger 31 immediately, so that the heat exchange efficiency can be improved.

The hot air in the second heat generation chamber 12 can enter the second heat exchanger 32 through the second hot air duct 22, and when the hot air passes through the second heat exchanger 32, the hot air can exchange heat with a cooling medium (the cooling medium may be water, cooling gas or the like) of the second heat exchanger 32, and the hot air is cooled into cold air. The cold air can be transmitted into the second heat generation chamber 12 through the second cold air duct 42 to dissipate heat of the second heat generation chamber 12, so that the temperature in the second heat generation chamber 12 is reduced, and the structural members and devices in the second heat generation chamber 12 are prevented from being damaged by high temperature.

In some embodiments, the flow of hot air into the second heat exchanger 32 is counter to the flow of cooling medium within the second heat exchanger 32. Illustratively, the hot air entering the second heat exchanger 32 may flow in the second direction A2, and the cooling medium may flow in the third direction A3 within the second heat exchanger 32. The heat exchange amount of the hot air and the cooling medium can be increased by arranging that the flow direction of the hot air is opposite to the flow direction of the cooling medium, so that the heat exchange efficiency is improved, the hot air is fully cooled, in addition, the cooling medium in the second heat exchanger 32 after being heated can be discharged quickly, it is understood that in the second direction A2, one side of the hot air entering the second heat exchanger 32 and one side of the cooling medium leaving the second heat exchanger 32 can be understood as the same side of the second heat exchanger 32, the cooling medium can be contacted with the hot air on one side of the hot air entering the second heat exchanger 32, and then discharged out of the second heat exchanger 32 after being heated, so that the heat exchange efficiency can be improved.

As shown in fig. 4, fig. 4 is a schematic structural view of the first heat generation chamber 11. The first supporting member 114 separates the first heat generating chamber 11 into a first cavity 116 and a second cavity 117, and a vent 1141 may be provided on the first supporting member 114, where the vent 1141 communicates with the first cavity 116 and the second cavity 117. The cooling air in the first cooling air duct 41 can be diffused in the first heat generation chamber 11 through the ventilation holes 1141, so that the diffusion efficiency of the cooling air in the first heat generation chamber 11 can be improved, and the heat dissipation uniformity in the first heat generation chamber 11 can be improved.

It can be appreciated that the ventilation holes 1141 on the first supporting member 114 may be located in a region where the first heat generating member 115 is not provided, the number of the ventilation holes 1141 may be plural, the ventilation holes 1141 may be uniformly distributed on the first supporting member 114, which is favorable for the heat dissipation uniformity in the first heat generating chamber 11, and the caliber of the ventilation holes 1141 should be prevented from being too large, which results in too large cold air flow at the ventilation holes 1141, which affects the overall heat dissipation uniformity in the first heat generating chamber 11. In fig. 4, two vent holes 1141 are taken as an example in the region where the first heat generating element 115 is not provided, and the number of vent holes 1141 may be four, six, etc., which is not limited in the present application.

In other embodiments, the first heat generating element 115 may be installed in the vent 1141, and due to the size design, a gap exists between the first heat generating element 115 and the inner wall of the vent 1141, and the cooling air may flow from the gap between the first heat generating element 115 and the inner wall of the vent 1141, i.e., from a portion of the space of the vent 1141.

Referring to fig. 3 and 5, fig. 5 is a schematic view of a portion of an epitaxy apparatus 1000. The first heat generating chamber 11, the reaction chamber 13, the second heat generating chamber 12 and the heat dissipating device 200 are all located in the cabinet 100. The cabinet 100 is in a trapezoidal column shape, the first side 101 can be understood as a short side of the trapezoidal structure, the third side 103 can be understood as a long side of the trapezoidal structure, and a space at an included angle formed by the second side 102 and the third side 103 is larger. The first hot air duct 21 and the second hot air duct 22 may be located at an included angle formed by the second side 102 and the third side 103 of the cabinet 100. By arranging the first hot air duct 21 and the second hot air duct 22 at the included angle formed by the second side surface 102 and the third side surface 103, the space in the cabinet body 100 can be fully utilized, and the space utilization rate in the cabinet body 100 can be improved.

Referring to fig. 3, 5 and 6, fig. 6 is a schematic perspective view illustrating a first hot air duct 21, a first heat exchanger 31 and a first cold air duct 41 according to an embodiment of the present application. The first hot air duct 21 may include a first portion 211, a second portion 212, and a third portion 213, the first portion 211 being fixedly connected to the first side 113, one end of the second portion 212 being fixedly connected to the first portion 211, the other end of the second portion 212 being fixedly connected to the third portion 213, one end of the third portion 213 being fixedly connected to the first heat exchanger 31. The first portion 211, the second portion 212, and the third portion 213 may be integrally formed, or may be integrally formed by assembling, which is not limited in this regard. In other embodiments, the first hot air duct 21 may also comprise two parts, i.e. two sections of pipes are provided.

The first hot air duct 21 includes a first opening 201 and a second opening 202, the first opening 201 being connected to the first heat exchanger 31, and the second opening 202 being connected to the first heat generation chamber 11. The first opening 201 is an end opening of the third portion 213, and the second opening 202 is an end opening of the first portion 211. The first opening 201 includes a first side 2011, the first side 2011 extends along a second direction A2 (a Y direction at the first opening 201 is an extending direction of the first side 2011), and an included angle B1 between the first side 2011 and a normal line of a plane in which the second opening 202 is located is an acute angle. It will be appreciated that the first hot air duct 21 is twisted. According to the limited space in the epitaxy apparatus, the relative positions and the corresponding relations of the first opening 201 and the second opening 202 are adjusted, so that the first portion 211 and the second portion 212 of the first hot air duct 21 are twisted relative to the third portion 213, the space occupied by the heat dissipation device 200 can be reduced, and the space utilization rate in the epitaxy apparatus can be improved.

Second portion 212 towards the first portion 211, the third opening 203 comprises a second edge 2031, the normal line of the plane of the second opening 202 is consistent with the extending direction of the second edge 2031 (the Y direction at the third opening 203 is the extending direction of the second edge 2031), so the included angle B1 between the first edge 2011 and the normal line of the plane of the second opening 202 is equal to the included angle B1 between the Y direction at the third opening 203 (the second edge 2031) and the first edge 2011 ^， . The second portion 212 is twisted relative to the third portion 213.

In some embodiments, the second opening 202 of the first hot air duct 21 may be disposed at a region of the first side 113 near the reaction chamber. Since the heat energy generated by the first heat generating element 115 is mainly concentrated on the side close to the reaction chamber 13, the heat radiation efficiency of the first heat generating chamber 11 can be improved by providing the second opening 202 in the region of the first side 113 close to the reaction chamber.

Referring to fig. 3, 7 and 8, fig. 7 is a schematic view of a part of an epitaxy apparatus 1000, and fig. 8 is a schematic view of a three-dimensional structure of a second hot air duct 22, a second heat exchanger 32 and a second cold air duct 42 according to an embodiment of the application. The second hot air duct 22 may include a fourth portion 221, a fifth portion 222, and a sixth portion 223, wherein the fourth portion 221 is fixedly connected to the second side 123, one end of the fifth portion 222 is fixedly connected to the fourth portion 221, the other end of the fifth portion 222 is fixedly connected to the sixth portion 223, and one end of the sixth portion 223 is fixedly connected to the second heat exchanger 32. The fourth portion 221, the fifth portion 222 and the sixth portion 223 may be integrally formed or may be integrally formed by assembling, which is not limited in this regard. In other embodiments, the second hot air duct 22 may also comprise two parts, i.e. two sections of piping are provided.

The second hot air duct 22 includes a fourth opening 204 and a fifth opening 205, the fourth opening 204 being connected to the second heat exchanger 32, and the fifth opening 205 being connected to the second heat generation chamber 12. The fourth opening 204 is an end opening of the sixth portion 223, and the fifth opening 205 is an end opening of the fourth portion 221. The fourth opening 204 includes a third side 2041, the third side 2041 extends along the second direction A2 (the Y direction at the fourth opening 204 is the extending direction of the third side 2041), and an included angle B2 between the third side 2041 and the normal line of the plane in which the fifth opening 205 is located is an acute angle. It will be appreciated that the second hot air path 22 is twisted. According to the limited space in the epitaxy apparatus, by adjusting the relative positions and the corresponding relation of the fourth opening 204 and the fifth opening 205, the fourth portion 221 and the fifth portion 222 of the second hot air duct 22 are twisted relative to the sixth portion 223, so that the space occupied by the heat dissipating device 200 can be reduced, and the space utilization rate in the epitaxy apparatus can be improved.

The side of the fifth portion 222 facing the fourth portion 221 is provided with a sixth opening 206, the sixth opening 206 includes a fourth side 2061, the normal line of the plane in which the fifth opening 205 is located is consistent with the extending direction of the fourth side 2061 (the Y direction at the sixth opening 206 is the extending direction of the fourth side 2061), and therefore the included angle B2 between the third side 2041 and the normal line of the plane in which the fifth opening 205 is located is equal to the included angle B2 between the Y direction at the sixth opening 206 (i.e. the fourth side 2061) and the third side 2041 ^， . The fifth portion 222 is twisted relative to the sixth portion 223. Referring to fig. 3 and fig. 9, fig. 9 is a schematic diagram illustrating a portion of a heat dissipating device 200 according to an embodiment of the application. The first hot air duct 21 is detachably connected with the first heat exchanger 31, and is convenient to maintain and overhaul. The first heat exchanger 31 may be provided with an air inlet duct 311, and the air inlet duct 311 may be located in the first heat exchange chamber 310 of the first heat exchanger 31. One end of the first hot air duct 21 may be embedded in the air inlet duct 311 of the first heat exchanger 31. For example, the first hot air duct 21 and the air inlet duct 311 of the first heat exchanger 31 may be circular pipes, and the caliber of the first hot air duct 21 is smaller than that of the air inlet duct 311 of the first heat exchanger 31, so that one end of the first hot air duct 21 can be embedded into the air inlet duct 311 of the first heat exchanger 31. The hot air enters the air inlet channel 311 of the first heat exchanger 31 with a large caliber from the first hot air channel 21 with a small caliber, which is beneficial to reducing the wind resistance of the hot air and improving the transmission efficiency of the hot air. The increase of wind resistance in the process of hot air flowing from the large-caliber pipeline to the small-caliber pipeline is avoided. In other embodiments, the first hot air duct 21 and the air inlet duct 311 of the first heat exchanger 31 may be square pipes or other polygonal pipes, which is not limited by the present application.

As shown in fig. 9, the air inlet duct 311 of the first heat exchanger 31 includes a first sub-duct 312 and a second sub-duct 313 that are fixedly connected, and the first hot air duct 21 is connected with an inner wall of the first sub-duct 312, and it can be understood that the first hot air duct 21 may be directly connected with the first sub-duct 312 or indirectly connected through a rubber ring or the like, so that the outer wall of the first hot air duct 21 and the inner wall of the first sub-duct 312 are detachably and fixedly connected in a sleeve manner, and the assembly efficiency is high. A gap may be provided between the inner walls of the first hot air duct 21 and the second sub air duct 313, that is, the caliber size of the second sub air duct 313 is larger than the caliber size of the first sub air duct 312.

In some embodiments, the inner wall of the second sub-duct 313 is flared with respect to the inner wall of the first sub-duct 312, and the first sub-duct 312 and the second sub-duct 313 form a horn-like structure. Illustratively, the inner wall of the first sub-duct 312 and the inner wall of the second sub-duct 313 form a first angle 314, and the first angle 314 is greater than 180 ° and less than 270 °. Because the inner wall of the second sub-air duct 313 expands outwards relative to the inner wall of the first sub-air duct 312, the inner wall of the second sub-air duct 313 is inclined relative to the inner wall of the first sub-air duct 312, and the assembly difficulty of embedding the first hot air duct 21 into the first sub-air duct 312 can be reduced. For example, when the first sub-air duct 312, the second sub-air duct 313 and the first hot air duct 21 are all circular pipes, the caliber of the second sub-air duct 313 is larger than that of the first sub-air duct 312, a gap exists between the first hot air duct 21 and the second sub-air duct 313, and the difficulty of embedding the first hot air duct 21 into the first sub-air duct 312 through the second sub-air duct 313 with the larger caliber is smaller than that of directly embedding the first hot air duct 21 into the first sub-air duct 312.

In some embodiments, the heat dissipating device 200 may include a rubber ring 315, and the rubber ring 315 may be located between the first sub-air duct 312 and the first hot air duct 21. The rubber ring 315 may be made of silicone rubber, and the rubber ring 315 needs to have high temperature resistance (illustratively, the rubber ring 315 needs to be able to withstand an operating temperature of 110 ℃) so as to avoid the damage of the rubber ring 315 caused by hot air. The rubber ring 315 is clamped between the first sub-air duct 312 and the first hot air duct 21, so that the air inlet duct 311 of the first heat exchanger 31 is tightly connected with the first hot air duct 21, and the tightness of the heat dissipating device 200 is improved. In addition, when the first hot air duct 21 is installed in the air inlet duct 311 of the first heat exchanger 31, the rubber ring 315 may be sleeved on the outer wall of the first hot air duct 21, and the rubber ring 315 has elastic deformation capability and is easy to compress under external force, so that the first hot air duct 21 provided with the rubber ring 315 is easy to slide into the inner wall of the first sub-air duct 312 along the inclined inner wall of the second sub-air duct 313, and sealing contact connection between the first hot air duct 21 and the first sub-air duct 312 is realized.

It can be appreciated that the installation manner of the first hot air duct 21 shown in fig. 9 installed in the air inlet duct 311 of the first heat exchanger 31 may be adopted between the second hot air duct 22 and the air inlet duct of the second heat exchanger 32, between the first cold air duct 41 and the first heat generating chamber 11, and between the second cold air duct 42 and the second heat generating chamber 12, which will not be described herein.

Referring to fig. 10a to 10d, fig. 10a is a schematic structural view of a locking element 51 in a first state according to an embodiment of the present application, fig. 10b is a schematic structural view of a locking element 51 in a second state according to an embodiment of the present application, fig. 10c is a schematic structural view of a locking element 51 in a third state according to an embodiment of the present application, and fig. 10d is a schematic structural view of a locking element 51 in a fourth state according to an embodiment of the present application. The first state refers to a state in which the first locking portion 511 and the second locking portion 521 of the locking element 51 are separated, the second state refers to a state in which the first locking portion 511 and the second locking portion 521 of the locking element 51 are close to each other, the third state refers to a state in which the first locking portion 511 and the second locking portion 521 of the locking element 51 are closer to each other, and the fourth state refers to a state in which a part of the structure of the first locking portion 511 of the locking element 51 is embedded in the second locking portion 521.

The first hot air duct 21 and the first heat generating chamber 11 may be detachably connected, and for example, the connection between the first hot air duct 21 and the first heat generating chamber 11 may be a threaded connection, a snap connection, a hinge connection, a locking connection, or the like, which is not limited in the present application.

Taking the locking element connection as an example, the heat dissipating device 200 may include a locking element 51, where the locking element 51 may include a first locking portion 511 and a second locking portion 521, where the first locking portion 511 is fixedly connected to an outer wall of the first hot air duct 21, the first locking portion 511 may include a lock base 513, the first locking portion 511 may further include a lock tongue 512, the lock tongue 512 may retract into the lock base 513 when subjected to an external force, and after the external force is removed, the lock tongue 512 may extend out of the lock base 513. The locking tongue 512 may be provided with a bevel 514. The second locking portion 521 may be fixedly connected to the outer wall of the first heat generating chamber 11, and illustratively, the second locking portion 521 is connected to the first side portion 113, the second locking portion 521 is provided with a through hole 522, the locking tongue 512 may be inserted into the through hole 522 to form a detachable connection, and the second locking portion 521 may have a plate structure.

In the locking process, one end of the first hot air duct 21 is close to the first heat generating chamber 11, after the second locking portion 521 contacts with the inclined surface 514 of the lock tongue 512, the lock tongue 512 gradually sinks into the lock seat 513, and after the first hot air duct 21 moves to a preset position, the lock tongue 512 pops out from the lock seat 513 and is embedded in the through hole 522 of the second locking portion 521. The locking bolt 512 may also be removed from the through hole 522 during disassembly.

The first hot air duct 21 and the first heat generation chamber 11 can be detachably connected by the locking piece 51, and the locking tongue 512 of the first locking part 511 is matched with the through hole 522 of the second locking part 521, so that miniaturization of the locking piece 51 is facilitated, and space occupied by the heat dissipation device 200 is reduced. The locking tongue 512 of the first locking part 511 and the through hole 522 of the second locking part 521 are matched to facilitate disassembly, so that the disassembly time and difficulty can be reduced, the disassembly efficiency is improved, and the maintainability of the heat dissipating device 200 is further improved.

The second hot air duct 22 and the second heat generating chamber 12 may also be connected by a locking member, and the specific connection manner refers to the first hot air duct 21 and the first heat generating chamber 11, which are not described herein again.

Referring to fig. 11 and 12, fig. 11 is a schematic diagram of a portion of a heat dissipating device 200 according to an embodiment of the application, and fig. 12 is a schematic diagram of a portion of a heat dissipating device 200 according to an embodiment of the application. The heat sink 200 may include a fan 61, and the fan 61 may be located in the first cool air duct 41. The fan 61 can be used for sending the cold air into the first heat generation chamber 11, and the fan 61 can increase the flow velocity of the cold air in the first cold air channel 41, which is beneficial to improving the heat dissipation efficiency of the first heat generation chamber 11.

In some embodiments, the heat sink 200 may include a buffer 71, and the buffer 71 may be located between an outer surface of the fan 61 and an inner wall of the first cool air duct 41, and illustratively, the buffer 71 may be located at a corner of the fan 61 between the inner walls of the first cool air duct 41. The buffer 71 may be a sponge, a silica gel pad, a shock-insulating pad, or the like, which is not limited in the present application. Vibration may occur during rotation of the blower 61, so as to drive vibration of the first cooling air duct 41, the first heat generating chamber 11 and the reaction chamber 13, affect quality of the film layer grown on the substrate 132 in the epitaxial apparatus 1000, and generate noise during vibration. In the embodiment of the application, the buffer member 71 is arranged between the corner of the fan 61 and the first cold air duct 41, so that vibration of the fan 61 during operation can be reduced, and noise of the heat dissipating device 200 can be reduced. For example, the dampers 71 may be provided at eight corners of the blower 61. It will be appreciated that the buffer member 71 is extruded between the first cooling air duct 41 and the fan 61, so that the first cooling air duct 41 and the fan 61 can be fastened and connected without other fastening and connecting manners, and the buffer member is convenient to be detached and replaced separately and quickly. The fan 61 may include one, two, or three, etc. fan blade portions. A fan and a buffer member may also be disposed in the second cooling air duct 42 to reduce vibration and noise of the extension apparatus 1000, and the buffer member is extruded to perform a fastening connection function.

Referring to fig. 11 and 12 in combination, the heat sink 200 may include a choke member 81, the choke member 81 being disposed around the outer circumference of the fan 61 and contacting the inner wall of the first cool air duct 41. The extending track of the first cold air duct 41 passes through the ring surrounded by the choke 81, and the extending track of the first cold air duct 41 may be understood as a center line along the extending direction of the first cold air duct 41 and located inside the first cold air duct 41. The choke 81 may be air return prevention foam or foam strips, and the application is not limited thereto. Through setting up choke 81, can prevent that the cold air in the first cold wind channel 41 from circulating in the clearance between fan 61 and first cold wind channel 41 (the clearance between cold air admission fan 61 and the first cold wind channel 41 can lead to cold air to circulate in the clearance, is difficult to get into first heat generation room 11, and the utilization efficiency of cold air is low) for the cold air in first cold wind channel 41 can only get into first heat generation room 11 through fan 61, improves the utilization efficiency of cold air. In addition, the choke 81 can reduce noise during the movement of the blower 61 and reduce the influence of vibration of the blower 61 on the epitaxial device or the electronic device.

The foregoing is merely illustrative of the present application, and the present application is not limited thereto, and any person skilled in the art will readily recognize that variations or substitutions are within the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.

Claims

1. The heat dissipation device is applied to electronic equipment, and comprises a first heat generation chamber and a second heat generation chamber, and is characterized by comprising a first hot air channel, a first heat exchanger, a first cold air channel, a second hot air channel, a second heat exchanger and a second cold air channel, wherein the first heat exchanger, the first heat generation chamber, the second heat generation chamber and the second heat exchanger are sequentially arranged along a first direction;

the first hot air duct is connected with the first heat exchanger and the first heat generation chamber, the second hot air duct is connected with the second heat exchanger and the second heat generation chamber, and the first hot air duct and the second hot air duct are respectively positioned at two opposite ends in the first direction;

the first cold air duct is connected with the first heat exchanger and the first heat generation chamber, and the first cold air duct and the first hot air duct are respectively positioned at two sides of the first heat exchanger; the second cold air duct is connected with the second heat exchanger and the second heat generation chamber, and the second cold air duct and the second hot air duct are respectively positioned at two sides of the second heat exchanger; the first cold air duct and the second cold air duct are respectively positioned at two opposite ends of the first direction.

2. The heat sink of claim 1, wherein the first hot air duct and the second hot air duct are on the same side of the electronic device and/or the first cold air duct and the second cold air duct are on the same side of the electronic device.

3. The heat dissipating device according to claim 1 or 2, wherein one end of the first hot air channel is connected to one side of the first heat generating chamber in the second direction, and one end of the second hot air channel is connected to one side of the second heat generating chamber in the second direction, and the second direction is perpendicular to the first direction.

4. The heat sink of claim 1, wherein the first cold air duct is located between the first heat exchanger and the first heat generation chamber and the second cold air duct is located between the second heat exchanger and the second heat generation chamber.

5. The heat sink of claim 1, wherein the first hot air duct comprises a first opening and a second opening, the first opening is connected to the first heat exchanger, the second opening is connected to the first heat generation chamber, the first opening comprises a first edge, the first edge extends along a second direction, and an included angle between the first edge and a normal to a plane in which the second opening is located is an acute angle, wherein the second direction is perpendicular to the first direction.

6. The heat dissipating device of claim 1, wherein the heat dissipating device comprises a locking element comprising a first locking portion fixedly connected to the outer wall of the first hot air duct and a second locking portion fixedly connected to the outer wall of the first heat generating chamber, the first locking portion being provided with a locking tongue, the second locking portion being provided with a through hole, the locking tongue being embedded in the through hole and forming a detachable connection.

7. The heat sink of claim 1, wherein one end of the first hot air duct is embedded in an air inlet duct of the first heat exchanger.

8. The heat sink of claim 7, wherein the air inlet duct of the first heat exchanger comprises a first sub-duct and a second sub-duct fixedly connected, wherein the inner wall of the second sub-duct is flared with respect to the inner wall of the first sub-duct, the first hot air duct is connected with the inner wall of the first sub-duct, and a gap is provided between the inner walls of the first hot air duct and the second sub-duct.

9. The heat sink of claim 1, wherein the heat sink comprises a fan located within the first cold air duct and a buffer located between an outer surface of the fan and an inner wall of the first cold air duct.

10. The heat sink of claim 1, wherein the heat sink comprises a fan and a choke member surrounding an outer periphery of the fan and contacting an inner wall of the first cold air duct, an extension track of the first cold air duct passing through a loop defined by the choke member.

11. An electronic device, comprising a first heat generating element, a second heat generating element, and a heat dissipating device according to any one of claims 1-10, wherein the first heat generating element is located in a housing of the first heat generating chamber, the second heat generating element is located in a housing of the second heat generating chamber, heat energy of the first heat generating element is conducted to the first heat exchanger, and heat energy of the second heat generating element is conducted to the second heat exchanger.

12. The electronic device of claim 11, comprising a reaction chamber located between the first heat generating chamber and the second heat generating chamber.

13. The electronic device of claim 12, wherein the electronic device comprises a cabinet, the cabinet is trapezoidal and columnar, and the first heat generation chamber, the reaction chamber, the second heat generation chamber, and the heat dissipation device are all located in the cabinet;

The cabinet body comprises a first side face, a second side face, a third side face and a fourth side face, wherein the first side face is parallel to the third side face, the second side face is connected with the first side face and the third side face, the fourth side face is connected with the first side face and the third side face, an included angle between the second side face and the third side face is smaller than an included angle between the second side face and the first side face, and the first hot air duct and the second hot air duct are both located at an included angle formed by the second side face and the third side face.

14. The electronic device of claim 11, wherein the first heat generation chamber comprises a support, a first cavity, and a second cavity, the support is fixedly connected to an inner sidewall of the first heat generation chamber, the first heat generation member is fixed to a side of the support facing the second heat generation chamber, the support separates the first cavity from the second cavity, the support is provided with a vent, and the vent communicates the first cavity with the second cavity.