CN110208579A - A kind of chip test base - Google Patents
A kind of chip test base Download PDFInfo
- Publication number
- CN110208579A CN110208579A CN201910358466.1A CN201910358466A CN110208579A CN 110208579 A CN110208579 A CN 110208579A CN 201910358466 A CN201910358466 A CN 201910358466A CN 110208579 A CN110208579 A CN 110208579A
- Authority
- CN
- China
- Prior art keywords
- heat
- conducting part
- test base
- chip test
- pedestal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000012360 testing method Methods 0.000 title claims abstract description 32
- 230000004308 accommodation Effects 0.000 claims abstract description 10
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 28
- 230000000694 effects Effects 0.000 claims description 10
- 230000006835 compression Effects 0.000 claims description 7
- 238000007906 compression Methods 0.000 claims description 7
- 238000001514 detection method Methods 0.000 claims description 5
- 239000011159 matrix material Substances 0.000 claims description 3
- 239000007769 metal material Substances 0.000 claims description 3
- 239000000463 material Substances 0.000 claims description 2
- 238000002788 crimping Methods 0.000 claims 1
- 238000005516 engineering process Methods 0.000 abstract description 3
- 230000005855 radiation Effects 0.000 abstract 1
- 238000000034 method Methods 0.000 description 8
- 238000013461 design Methods 0.000 description 3
- 230000017525 heat dissipation Effects 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 206010053615 Thermal burn Diseases 0.000 description 1
- 230000001276 controlling effect Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 235000013399 edible fruits Nutrition 0.000 description 1
- 238000004880 explosion Methods 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
Classifications
-
- A—HUMAN NECESSITIES
- A47—FURNITURE; DOMESTIC ARTICLES OR APPLIANCES; COFFEE MILLS; SPICE MILLS; SUCTION CLEANERS IN GENERAL
- A47B—TABLES; DESKS; OFFICE FURNITURE; CABINETS; DRAWERS; GENERAL DETAILS OF FURNITURE
- A47B3/00—Folding or stowable tables
- A47B3/14—Foldable table and seat units
-
- E—FIXED CONSTRUCTIONS
- E04—BUILDING
- E04H—BUILDINGS OR LIKE STRUCTURES FOR PARTICULAR PURPOSES; SWIMMING OR SPLASH BATHS OR POOLS; MASTS; FENCING; TENTS OR CANOPIES, IN GENERAL
- E04H1/00—Buildings or groups of buildings for dwelling or office purposes; General layout, e.g. modular co-ordination or staggered storeys
- E04H1/12—Small buildings or other erections for limited occupation, erected in the open air or arranged in buildings, e.g. kiosks, waiting shelters for bus stops or for filling stations, roofs for railway platforms, watchmen's huts or dressing cubicles
- E04H1/1205—Small buildings erected in the open air
-
- A—HUMAN NECESSITIES
- A47—FURNITURE; DOMESTIC ARTICLES OR APPLIANCES; COFFEE MILLS; SPICE MILLS; SUCTION CLEANERS IN GENERAL
- A47B—TABLES; DESKS; OFFICE FURNITURE; CABINETS; DRAWERS; GENERAL DETAILS OF FURNITURE
- A47B37/00—Tables adapted for other particular purposes
- A47B37/04—Tables specially adapted for use in the garden or otherwise in the open air, e.g. with means for holding umbrellas or umbrella-like sunshades
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0433—Sockets for IC's or transistors
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0433—Sockets for IC's or transistors
- G01R1/0441—Details
- G01R1/0458—Details related to environmental aspects, e.g. temperature
Landscapes
- Engineering & Computer Science (AREA)
- Architecture (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Civil Engineering (AREA)
- Structural Engineering (AREA)
- Toys (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
The present invention relates to chip testing technology fields, provide a kind of chip test base, including fixing seat, and fixing seat offers accommodation groove and screw hole from bottom to the last time；Radiator, radiator include heat-conducting part and radiating part, and the lower end of heat-conducting part is set in accommodation groove through screw hole, and the lower end of heat-conducting part is fixedly connected with anti-falling piece；Crimp, crimp are set in the outside of heat-conducting part, and outer wall is threadedly coupled with screw hole, and the bottom of crimp is crimped on the top of anti-falling piece；Thermocouple, the test side of thermocouple and the bottom end of heat-conducting part are concordant；The present invention is intended to provide a kind of chip test base of excellent radiation performance.
Description
Technical field
The present invention relates to chip testing technology fields, and in particular to a kind of chip test base.
Background technique
Traditional test stand is placed among stand bottom by chip, lid is covered can allow chip pin with
Completely, chip can complete specific function by control, and chip can work normally at this time for pogopin contact.Chip is sandwiched in
Between bottom stand and upper lid, keep chip pressing complete by lid pressure.Chip is more closed in one at this time
Space can not radiate substantially or heat dissipation effect is excessively poor.
If the biggish chip of power consumption (chip of such as 8W or so) space closed in test bench works long hours, this
When chip temperature up to 130 degree or more, Hui Zaocheng testing base is burnt and wafer damage.So needing a heat sinking function non-
The chip testing stand of Chang Qiang.
Summary of the invention
The technical issues of solution
In view of the deficiencies of the prior art, the present invention provides a kind of chip test bases, it is desirable to provide a kind of heat dissipation performance is excellent
Good chip test base.
Technical solution
In order to achieve the above object, the present invention is achieved by the following technical programs:
A kind of chip test base, including fixing seat, the fixing seat offer accommodation groove and screw hole from bottom to the last time；
Radiator, the radiator include heat-conducting part and radiating part, and the lower end of the heat-conducting part is set in accommodation groove through the screw hole, and
The lower end of heat-conducting part is fixedly connected with anti-falling piece；Crimp, the crimp are set in the outside of the heat-conducting part, outer wall with
The screw hole is threadedly coupled, and the bottom of the crimp is crimped on the top of the anti-falling piece；Thermocouple, the inspection of the thermocouple
It is concordant with the bottom end of the heat-conducting part to survey end.
Further, the fixing seat includes upper and lower distribution first pedestal and the second pedestal, first pedestal and
Second pedestal one end is hinged, and other end activity is connected together, and the screw hole is provided on the first pedestal, and on the second pedestal
Equipped with the connecting hole being connect with pcb board, will be fixedly connected on pcb board.
Further, first pedestal it is described activity clamping one end be rotatablely connected buckle, the buckle it is upper
End is press section, lower end is latch, and the card slot with latch cooperation is offered on second pedestal.
Further, the radiator uses thermal conductive metallic material, and the radiating part includes fixing with the heat-conducting part
The connecting plate to connect, multiple strip bulges are fixed on the connecting plate, and the strip bulge is distributed in matrix.
Further, the top of the radiating part is connected with radiator fan, and the radiator fan vertex passes through support
Column is fixedly connected with the connecting plate.
Further, the bottom of the anti-falling piece is stretched out in the lower end of the heat-conducting part.
Further, the outside of the crimp is fixed with rotating member, and the rotating member is made of high-temperature resistance plastice.
Further, multiple through-holes are collectively formed between the rotating member and crimp, the through-hole is evenly distributed on
With the crimp on coaxial disc, cooperation is plugged with a rotating bar in the through-hole.
Further, the heat-conducting part offers downwards the stepped hole of perforation from connecting plate, and the thermocouple cooperation is inserted
It connects in the stepped hole, the upper end of the stepped hole is connected with hollow screw, the ring of the hollow screw and the thermocouple
Compression spring is equipped between shape protrusion.
Further, the compression spring under natural conditions, stretch out described thermally conductive by the detection faces of the thermocouple lower end
The bottom in portion.
Beneficial effect
The present invention provides a kind of chip test bases, and compared with existing well-known technique, of the invention having is following beneficial to effect
Fruit:
There is radiator by designing in fixing seat, radiating part is transferred heat to using heat-conducting part fitting chip, to core
The effect of piece progress fast cooling；Simultaneously detected using temperature of the thermocouple to chip, can control radiator fan speed change into
Row heat dissipation, to realize the temperature that dynamic adjustment chip maintains；In being realized with new product for heat-conducting part bottom and thermocouple detection faces
When good fitting, by the way that by the threaded connection design of crimp and the first pedestal, moving down for crimp can push anti-falling piece, band
Dynamic radiator, which synchronizes, to be moved down, and realization is bonded with chip surface stabilization, closely.
Detailed description of the invention
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below
There is attached drawing needed in technical description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this
Some embodiments of invention for those of ordinary skill in the art without creative efforts, can be with
It obtains other drawings based on these drawings.
Fig. 1 is test bench perspective view of the explosion of the present invention；
Fig. 2 is the perspective view of test bench of the present invention；
Fig. 3 is the complete section schematic diagram of test bench of the present invention；
Fig. 4 is the perspective view of radiator of the present invention；
Label in figure respectively represents: 1- fixing seat；2- radiator；3- anti-falling piece；4- crimp；5- thermocouple；6- dissipates
Hot-air fan；7- rotating member；8- connection buckle；9- rotating bar；10- hollow screw；11- compression spring；12- through-hole；13- support
Column；The first pedestal of 101-；The second pedestal of 102-；103- accommodation groove；104- screw hole；201- heat-conducting part；202- radiating part；203- connects
Fishplate bar；204- strip bulge；205- stepped hole；The press section 801-；802- latch.
Specific embodiment
In order to make the object, technical scheme and advantages of the embodiment of the invention clearer, below in conjunction with the embodiment of the present invention
In attached drawing, technical scheme in the embodiment of the invention is clearly and completely described, it is clear that described embodiment is
A part of the embodiment of the present invention, instead of all the embodiments.Based on the embodiments of the present invention, those of ordinary skill in the art
Every other embodiment obtained without creative efforts, shall fall within the protection scope of the present invention.
Embodiment:
A kind of chip test base of the present embodiment, including fixing seat 1, referring to Fig.1-4: fixing seat 1 is from bottom to the last time
Offer accommodation groove 103 and screw hole 104；Wherein, fixing seat 1 includes upper and lower distribution first pedestal 101 and the second pedestal 102,
First pedestal 101 and 102 one end of the second pedestal are hinged, and other end activity is connected together, and screw hole 104 is provided with the first pedestal
On 101, wherein for preferably the first pedestal 101 in one end rotation connection buckle 8 of activity clamping, the upper end of buckle is press section
801, lower end is latch 802, and the card slot cooperated with latch 802, press section 801 and the first pedestal are offered on the second pedestal 102
Cylindrical spring is equipped between 101, realization is steadily clamped.The connection connecting with pcb board is equipped on the second pedestal 102 simultaneously
Hole will be fixedly connected on pcb board, in actual use by the way that the chip on pcb board to be placed in accommodation groove 103.
Referring to Fig. 4: radiator 2, radiator 2 use thermal conductive metallic material, and the preferred material of the present embodiment is copper；Radiator 2
Including heat-conducting part 201 and radiating part 202, the screw hole 104 that the lower end of heat-conducting part 201 passes through the first pedestal 101 is set to accommodation groove 103
It is interior, and the lower end of heat-conducting part 201 is fixedly connected with anti-falling piece 3 by screw, the bottom of anti-falling piece 3 is stretched out in the lower end of heat-conducting part 201
Portion, to facilitate the lower end of heat-conducting part 201 to contact with chip surface.Wherein, radiating part 202 includes being fixedly connected with heat-conducting part 201
Connecting plate 203, multiple strip bulges 204 are fixed on connecting plate 203, the strip bulge 204 is distributed in matrix, multiple bar shapeds
Protrusion 204 considerably increases the contact area with air, realizes conduction heat fast exchange, export.
Radiator fan 6 is connected with by the top of radiating part 202 again, wherein the wind speed of radiator fan 6 is adjustable；Radiator fan
6 vertex are fixedly connected by support column 13 with connecting plate 203.
Crimp 4, crimp 4 are set in the outside of heat-conducting part 201, and outer wall is threadedly coupled with screw hole 104, crimp 4
Bottom be crimped on the top of anti-falling piece 3；The outside of crimp 4 is fixed with rotating member 7, and rotating member 7 uses high-temperature resistance plastice system
Make, good heat-insulated, anti-thermal effect may be implemented in the increase design of rotating member 7, prevents crimp 4 from overheating, is rotated by hand
When can scald hand.
Multiple through-holes 12 are collectively formed between rotating member 7 and crimp 4, through-hole 12 is evenly distributed on coaxial with crimp 4
Disc on, cooperation is plugged with a rotating bar 9 in through-hole 12；The design of multiple through-holes 12 is inserted into convenient for the delocalization of rotating bar 9,
To be rotated, solves circle rotation, the interference of electrical component on pcb board, the phenomenon that can not rotating.
The test side of thermocouple 5, thermocouple 5 is concordant with the bottom end of heat-conducting part 201, and wherein the present embodiment selects MFS7 type temperature
Sensor is spent, and selects MFS7A type, structure is in the form of a column.It (can wherein be used in the external connection digital display screen of temperature sensor
In display chip temperature, convenient for regulating and controlling the wind speed of radiator fan 6, for the prior art, connection type does not just repeat herein).
By offering the stepped hole 205 of perforation downwards from connecting plate 203 in heat-conducting part 201, the cooperation of thermocouple 5 is plugged on
In stepped hole 205, the upper end of stepped hole 205 is connected with hollow screw 10, between hollow screw 10 and the annular protrusion of thermocouple 5
Equipped with compression spring 11；Under natural conditions, the detection faces of 5 lower end of thermocouple stretch out the bottom of heat-conducting part 201 to compression spring 11.
In use, driving crimp 4 to rotate by moving rotating bar 9；Moving down for crimp 4 squeezes anti-falling piece 3, drives
Radiator 2, which synchronizes, to be moved down, and realizes that detection faces with the bottom surface of heat-conducting part 201 and thermocouple 5 and chip surface are stable, closely
Fitting.
It should be noted that, in this document, relational terms such as first and second and the like are used merely to a reality
Body or operation are distinguished with another entity or operation, are deposited without necessarily requiring or implying between these entities or operation
In any actual relationship or order or sequence.Moreover, the terms "include", "comprise" or its any other variant are intended to
Non-exclusive inclusion, so that the process, method, article or equipment including a series of elements is not only wanted including those
Element, but also including other elements that are not explicitly listed, or further include for this process, method, article or equipment
Intrinsic element.In the absence of more restrictions, the element limited by sentence "including a ...", it is not excluded that
There is also other identical elements in process, method, article or equipment including the element.
The above embodiments are merely illustrative of the technical solutions of the present invention, rather than its limitations；Although with reference to the foregoing embodiments
Invention is explained in detail, those skilled in the art should understand that: it still can be to aforementioned each implementation
Technical solution documented by example is modified or equivalent replacement of some of the technical features；And these modification or
Replacement, the spirit and scope for technical solution of various embodiments of the present invention that it does not separate the essence of the corresponding technical solution.
Claims (10)
1. a kind of chip test base characterized by comprising
Fixing seat, the fixing seat offer accommodation groove and screw hole from bottom to the last time；
Radiator, the radiator include heat-conducting part and radiating part, and the lower end of the heat-conducting part is set to accommodation groove through the screw hole
It is interior, and the lower end of heat-conducting part is fixedly connected with anti-falling piece, the top of the radiating part is equipped with radiator fan；
Crimp, the crimp are set in the outside of the heat-conducting part, and outer wall is threadedly coupled with the screw hole, the crimping
The bottom of part is crimped on the top of the anti-falling piece；
Thermocouple, the test side of the thermocouple are concordant with the bottom end of the heat-conducting part.
2. a kind of chip test base according to claim 1, which is characterized in that the fixing seat includes upper and lower distribution
First pedestal and the second pedestal, first pedestal and second pedestal one end are hinged, and other end activity is connected together, described
Screw hole is provided on the first pedestal.
3. a kind of chip test base according to claim 2, which is characterized in that first pedestal is in the activity clamping
One end be rotatablely connected buckle, the upper end of the buckle is press section, lower end is latch, is offered on second pedestal and institute
State the card slot of latch cooperation.
4. a kind of chip test base according to claim 1, which is characterized in that the radiator uses heat-conducting metal material
Material, the radiating part includes the connecting plate being fixedly connected with the heat-conducting part, and multiple strip bulges, institute are fixed on the connecting plate
Strip bulge is stated to be distributed in matrix.
5. a kind of chip test base according to claim 4, which is characterized in that the connecting plate vertex passes through support column
It is fixedly connected with radiator fan.
6. a kind of chip test base according to claim 1, which is characterized in that the lower end of the heat-conducting part is stretched out described anti-
The bottom of de- part.
7. a kind of chip test base according to claim 1, which is characterized in that the outside of the crimp is fixed with rotation
Part, the rotating member are made of high-temperature resistance plastice.
8. a kind of chip test base according to claim 7, which is characterized in that common between the rotating member and crimp
Multiple through-holes are formed, the through-hole is evenly distributed on the disc coaxial with the crimp, and cooperation is plugged in the through-hole
One rotating bar.
9. a kind of chip test base according to claim 1, which is characterized in that the heat-conducting part opens up downwards from connecting plate
There is the stepped hole of perforation, the thermocouple cooperation is plugged in the stepped hole, and the upper end of the stepped hole is connected with hollow spiral shell
Nail is equipped with compression spring between the hollow screw and the annular protrusion of the thermocouple.
10. a kind of chip test base according to claim 9, which is characterized in that the compression spring under natural conditions, institute
The detection faces for stating thermocouple lower end stretch out the bottom of the heat-conducting part.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910358466.1A CN110208579A (en) | 2019-04-30 | 2019-04-30 | A kind of chip test base |
| US16/695,083 US20200095788A1 (en) | 2019-04-29 | 2019-11-25 | Home decoration |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910358466.1A CN110208579A (en) | 2019-04-30 | 2019-04-30 | A kind of chip test base |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110208579A true CN110208579A (en) | 2019-09-06 |
Family
ID=67786639
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910358466.1A Pending CN110208579A (en) | 2019-04-29 | 2019-04-30 | A kind of chip test base |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US20200095788A1 (en) |
| CN (1) | CN110208579A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110927561A (en) * | 2019-12-19 | 2020-03-27 | 江西智慧云测安全检测中心有限公司 | Single-point laser test platform |
| CN113466599A (en) * | 2021-07-29 | 2021-10-01 | 深圳市禹龙通电子股份有限公司 | Aging equipment |
| CN114496949A (en) * | 2022-01-25 | 2022-05-13 | 江苏捷策创电子科技有限公司 | Heat dissipation cover of chip test socket |
| CN114689910A (en) * | 2022-05-27 | 2022-07-01 | 苏州联讯仪器有限公司 | Chip reliability testing device |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113882717A (en) * | 2020-07-04 | 2022-01-04 | 广东文泓建设有限公司 | Garden gallery |
| CN112720385B (en) * | 2020-12-25 | 2022-03-25 | 江西博展自动化科技有限公司 | Displacement conversion device used in assembly process of large product |
| CN113012552A (en) * | 2021-03-01 | 2021-06-22 | 河北科技师范学院 | Sand table for building construction planning and construction |
| CN113374078A (en) * | 2021-06-24 | 2021-09-10 | 中诚惠容实业集团有限公司 | Fire prevention heat preservation safety type steel structure support |
| CN114603679A (en) * | 2022-03-09 | 2022-06-10 | 合肥陶陶新材料科技有限公司 | Compacting equipment for ceramic part forming and using method thereof |
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|---|---|---|---|---|
| US20020121358A1 (en) * | 2001-03-03 | 2002-09-05 | Zalman Tech Co., Ltd. | Heatsink and heatsink device using the heatsink |
| CN202471764U (en) * | 2012-01-11 | 2012-10-03 | 金英杰 | Test seat for automatic chip test machine, with temperature heating test function |
| CN206945747U (en) * | 2017-05-17 | 2018-01-30 | 深圳凯智通微电子技术有限公司 | Integrated chip test bench and integrated chip test module |
| WO2018044014A1 (en) * | 2016-09-01 | 2018-03-08 | Leeno Industrial Inc. | A testing device |
| CN207380199U (en) * | 2017-10-20 | 2018-05-18 | 东莞市睿辉机电科技有限公司 | Manual chip testing lid |
| CN210015133U (en) * | 2019-04-30 | 2020-02-04 | 深圳市致宸信息科技有限公司 | Chip testing seat |
-
2019
- 2019-04-30 CN CN201910358466.1A patent/CN110208579A/en active Pending
- 2019-11-25 US US16/695,083 patent/US20200095788A1/en not_active Abandoned
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20020121358A1 (en) * | 2001-03-03 | 2002-09-05 | Zalman Tech Co., Ltd. | Heatsink and heatsink device using the heatsink |
| CN202471764U (en) * | 2012-01-11 | 2012-10-03 | 金英杰 | Test seat for automatic chip test machine, with temperature heating test function |
| WO2018044014A1 (en) * | 2016-09-01 | 2018-03-08 | Leeno Industrial Inc. | A testing device |
| CN206945747U (en) * | 2017-05-17 | 2018-01-30 | 深圳凯智通微电子技术有限公司 | Integrated chip test bench and integrated chip test module |
| CN207380199U (en) * | 2017-10-20 | 2018-05-18 | 东莞市睿辉机电科技有限公司 | Manual chip testing lid |
| CN210015133U (en) * | 2019-04-30 | 2020-02-04 | 深圳市致宸信息科技有限公司 | Chip testing seat |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110927561A (en) * | 2019-12-19 | 2020-03-27 | 江西智慧云测安全检测中心有限公司 | Single-point laser test platform |
| CN110927561B (en) * | 2019-12-19 | 2021-08-24 | 江西智慧云测安全检测中心股份有限公司 | Single-point laser test platform |
| CN113466599A (en) * | 2021-07-29 | 2021-10-01 | 深圳市禹龙通电子股份有限公司 | Aging equipment |
| CN114496949A (en) * | 2022-01-25 | 2022-05-13 | 江苏捷策创电子科技有限公司 | Heat dissipation cover of chip test socket |
| CN114689910A (en) * | 2022-05-27 | 2022-07-01 | 苏州联讯仪器有限公司 | Chip reliability testing device |
| CN114689910B (en) * | 2022-05-27 | 2022-08-16 | 苏州联讯仪器有限公司 | Chip reliability testing device |
Also Published As
| Publication number | Publication date |
|---|---|
| US20200095788A1 (en) | 2020-03-26 |
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