CN205643222U - Hot capability test tool of fin - Google Patents
Hot capability test tool of fin Download PDFInfo
- Publication number
- CN205643222U CN205643222U CN201620448066.1U CN201620448066U CN205643222U CN 205643222 U CN205643222 U CN 205643222U CN 201620448066 U CN201620448066 U CN 201620448066U CN 205643222 U CN205643222 U CN 205643222U
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- copper billet
- heating film
- holes
- heatproof
- pcb
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Abstract
The utility model discloses a hot capability test tool of fin, the device include copper billet, heating film, temperature resistant PCB and fixed establishment, the beneficial effects of the utility model are that: 1 the utility model discloses a but heating film evenly distributed can make hot equipartition on the copper billet, reduces the test error, 2. This device adoption heating film pastes inside the copper billet, need not weld or paint the heat conduction silicone grease, reduces and processes the degree of difficulty, reduces the quality of manufacturing cost improvement product, the stability ability of increase product, can reduce fin research and development and production testing cost, 3 the utility model relates to a technical staff's activity duration is hanged down, can install fast, maintain, reduce to simple and practical, installation and the maintenance degree of difficulty, saves a large amount of operating time.
Description
Technical field
This utility model belongs to field of radiating, is specifically related to a kind of fin thermal performance test tool, is used for detecting heat radiation
Sheet is thermal source and the temperature of fin base plate under specifying power.
Background technology
At present, in fin thermal performance test project, generally bury the mode of thermocouple wire with grooving and go to detect heat source region
Temperature, but grooving would generally destroy product, increases R & D Cost.Fin can be detected individually in the case of not destroying product
The apparatus structure of the temperature of heat source region is complicated, and processing and maintenance cost are higher, and cannot realize heat and be distributed in whole heating block
On, increase test error.
Summary of the invention
For problems of the prior art, this utility model provides a kind of fin thermal performance test tool.This reality
Simple and practical by new design, install and maintenance difficulty is low, can Fast Installation, keep in repair, reduce activity duration of technical staff, joint
Save the substantial amounts of working time.
For achieving the above object, this utility model is by the following technical solutions:
A kind of fin thermal performance test tool, this device includes copper billet, heating film, heatproof PCB and fixed mechanism,
On described copper billet, center is provided with two heavy stand holes, and the marginal area of copper billet is respectively equipped with two screwed holes, described
Copper billet is provided with detection groove, and the bottom surface of copper billet is provided with the placing trough placing heating film；
Described heating film is made up of resistance wire, back-adhesive surface, dielectric film, welding wire and power line, and the centre of described heating film sets
There is preformed hole；
Described heatproof PCB is provided with two through holes, and the edge of described heatproof PCB is provided with two installing holes, said two
The position of through hole position one_to_one corresponding with two heavy stand holes respectively is arranged, the position of two installing holes respectively with two screwed holes
Position one_to_one corresponding arrange, be provided with grooving bottom described heatproof PCB,
Described fixed mechanism includes plastics PIN, screw, thermocouple wire and spring；
One end of described thermocouple wire is welded into round end, and the other end of described thermocouple wire penetrates plastics PIN, bullet the most successively
Spring, two through holes and two heavy stand holes, described heating film is bonded in placing trough by back-adhesive surface, and described screw is by heatproof PCB
Sealed with copper billet.
The degree of depth of described detection groove is 1mm, and the width of detection groove is 1mm.
Described heatproof PCB is that glass fiber material makes.
The degree of depth of described placing trough is 0.15mm.
In this utility model, the overall dimensions of copper billet is the size for simulating custom chip, can be according to different die size
Amendment size, on copper billet, center is provided with two heavy stand holes and tests the thermocouple wire of fin bottom centre temperature, surface for cloth
It is the shell temperature for cloth detection source center region that the detection groove that 1mm is deep and 1mm is wide is dug in central area, and marginal area is processed respectively
The screwed hole of two M2 is used for fixing copper billet, and bottom is provided with the placing trough of deep 0.15mm for placing heating film；Heating film is by electricity
Resistance silk, 3M467 gum, dielectric film and bonding wire composition, heating film overall dimensions is slightly little than copper billet, 3M back-adhesive surface laminating copper billet, in
Between preformed hole be used for penetrating thermocouple wire and spring, middle preformed hole will avoid two heavy stand holes of the central area of copper billet,
Resistance wire in heating film is can be uniformly distributed in its overall dimensions, in the range of also can concentrating on a certain region or multizone,
Heating film has two power lines drawn for connecting power supply；Heatproof PCB is to be processed by glass fiber material, heatproof 400 degree with
On, indeformable, it is ensured that test plane and the depth of parallelism, bottom preformed groove is used for guiding thermocouple wire to go out to read temperature；Spring and moulding
Material PIN provides thermocouple wire to be close to the elastic force bottom fin, and thermocouple wire makes it exceed copper billet because of spring effect in a free state
Plane, after loading fin, thermocouple wire is pushed back inside copper billet, and expected PIN ensures that thermocouple wire only contacts heat radiation product and do not contacts
Copper billet.
Compared with prior art, the beneficial effects of the utility model are: heating film the most of the present utility model can be uniformly distributed,
Heat can be made to be distributed on copper billet, reduce test error；2. this device use heating film be affixed on inside copper billet, it is not necessary to welding or
Smear heat-conducting silicone grease, reduce difficulty of processing, reduce production cost and improve the quality of product, increase the stability of product, it is possible to
Reduce fin research and development and production test cost；3. this utility model design is simple and practical, install and maintenance difficulty is low, energy quick
Installation, maintenance, the activity duration of minimizing technical staff, save the substantial amounts of working time.
Accompanying drawing explanation
Concrete structure of the present utility model is given by below example and accompanying drawing thereof.
Fig. 1 is integrally-built top view of the present utility model.
Fig. 2 is integrally-built rear view of the present utility model.
Fig. 3 is integrally-built A direction view of the present utility model.
Fig. 4 is the B-B sectional view of this utility model Fig. 3.
Fig. 5 is the integrally-built explosive view of this utility model.
Detailed description of the invention
As shown in Figure 1, Figure 2, shown in Fig. 3, Fig. 4 and Fig. 5, the present embodiment fin thermal performance test tool, this device includes copper
Block 1, heating film 2, heatproof PCB3 and fixed mechanism, on described copper billet 1, center is provided with two heavy stand holes 11, the edge of copper billet 1
Region is respectively equipped with two screwed holes 12, described copper billet 1 be provided with the degree of depth be 1mm, width be the detection groove 13 of 1mm, copper billet 1
Bottom surface is provided with the placing trough that the degree of depth is 0.15mm 14 placing heating film；Described heating film 2 is by resistance wire, back-adhesive surface 21, insulation
Film, welding wire and power line 22 form, and the centre of described heating film 2 is provided with preformed hole 23；Described heatproof PCB3 is provided with two and leads to
Hole 31, the edge of described heatproof PCB3 is provided with two installing holes 32, the position of said two through hole 31 respectively with two heavy stands
The position one_to_one corresponding in hole 11 is arranged, and the position of two installing holes 32 position one_to_one corresponding with two screwed holes 12 respectively sets
Putting, be provided with grooving 33 bottom described heatproof PCB3, described fixed mechanism includes plastics PIN4, screw 5, thermocouple wire 6 and spring 7；
One end of described thermocouple wire 6 is welded into round end, and the other end of described thermocouple wire 6 penetrates plastics PIN4, spring 7, two the most successively
Individual through hole 31 and two heavy stand holes 11, described heating film 2 is bonded in placing trough 14 by back-adhesive surface 21, and described screw 5 is by resistance to
Temperature PCB3 and copper billet 1 are sealed.
As preferably, the present embodiment heatproof PCB3 is that glass fiber material makes.
The installation method of the present embodiment comprises the following steps:
1) two thermocouple wire one end head being first welded into round end, a diameter of 0.7 ~ 1.5mm of round end, by two thermocouple wires
The other end penetrate plastics PIN, spring, two through holes and two heavy stand holes the most successively；
2) weld the two of heating film with power line, heating film is bonded in placing trough by back-adhesive surface, heating film
Middle preformed hole will avoid two heavy stand holes of the central area of copper billet, by heatproof PCB together with copper billet screw closure,
The head of plastics PIN will be in central area, the two of copper billet heavy stand hole；
3) the power line external power supply of heating film, by specifying power heating, thus simulates custom chip duty, passes through
Copper billet conducts heat to fin.
Claims (4)
1. a fin thermal performance test tool, it is characterised in that this device includes copper billet (1), heating film (2), heatproof PCB
(3) and fixed mechanism,
The upper center of described copper billet (1) is provided with two heavy stand holes (11), and the marginal area of copper billet (1) is respectively equipped with two screwed holes
(12), described copper billet (1) is provided with detection groove (13), and the bottom surface of copper billet (1) is provided with the placing trough (14) placing heating film；
Described heating film (2) is made up of resistance wire, back-adhesive surface (21), dielectric film, welding wire and power line (22), described heating film
(2) centre is provided with preformed hole (23)；
Described heatproof PCB(3) be provided with two through holes (31), described heatproof PCB(3) edge be provided with two installing holes
(32), the position of said two through hole (31) position one_to_one corresponding with two heavy stand holes (11) respectively is arranged, two installing holes
(32) position position one_to_one corresponding with two screwed holes (12) respectively is arranged, described heatproof PCB(3) bottom is provided with grooving
(33),
Described fixed mechanism includes plastics PIN(4), screw (5), thermocouple wire (6) and spring (7)；
One end of described thermocouple wire (6) is welded into round end, and the other end of described thermocouple wire (6) penetrates plastics PIN the most successively
(4), spring (7), two through holes (31) and two heavy stand holes (11), described heating film (2) is bonded in by back-adhesive surface (21) and puts
Putting in groove (14), described screw (5) is by heatproof PCB(3) and copper billet (1) sealed.
Fin thermal performance test tool the most according to claim 1, it is characterised in that the degree of depth of described detection groove (13)
For 1mm, the width of detection groove (13) is 1mm.
Fin thermal performance test tool the most according to claim 1, it is characterised in that described heatproof PCB(3) it is glass
Fibrous material makes.
Fin thermal performance test tool the most according to claim 1, it is characterised in that the degree of depth of described placing trough (14)
For 0.15mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620448066.1U CN205643222U (en) | 2016-05-17 | 2016-05-17 | Hot capability test tool of fin |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620448066.1U CN205643222U (en) | 2016-05-17 | 2016-05-17 | Hot capability test tool of fin |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205643222U true CN205643222U (en) | 2016-10-12 |
Family
ID=57057230
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620448066.1U Active CN205643222U (en) | 2016-05-17 | 2016-05-17 | Hot capability test tool of fin |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205643222U (en) |
-
2016
- 2016-05-17 CN CN201620448066.1U patent/CN205643222U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 518109 1-4 / F of building a and 1-4 / F of building B in Ameida hi tech Industrial Park, Dalang community, Dalang office, Longhua New District, Shenzhen City, Guangdong Province Patentee after: Baode South China (Shenzhen) thermal energy system Co.,Ltd. Address before: 518109 1-4 / F of building a and 1-4 / F of building B in Ameida hi tech Industrial Park, Dalang community, Dalang office, Longhua New District, Shenzhen City, Guangdong Province Patentee before: Aavid Shenzen Thermal Energy System Co.,Ltd. |