CN206878037U - A kind of piezoelectric device for preventing overheat - Google Patents
A kind of piezoelectric device for preventing overheat Download PDFInfo
- Publication number
- CN206878037U CN206878037U CN201720606432.6U CN201720606432U CN206878037U CN 206878037 U CN206878037 U CN 206878037U CN 201720606432 U CN201720606432 U CN 201720606432U CN 206878037 U CN206878037 U CN 206878037U
- Authority
- CN
- China
- Prior art keywords
- piezoelectric device
- heat
- piezoelectric
- coating
- piezoelectric substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000000758 substrate Substances 0.000 claims abstract description 23
- 239000011248 coating agent Substances 0.000 claims abstract description 19
- 238000000576 coating method Methods 0.000 claims abstract description 19
- 239000004020 conductor Substances 0.000 claims abstract description 12
- 229910000679 solder Inorganic materials 0.000 claims abstract description 12
- 229910052751 metal Inorganic materials 0.000 claims abstract description 11
- 239000002184 metal Substances 0.000 claims abstract description 11
- 230000005611 electricity Effects 0.000 claims 1
- 238000010276 construction Methods 0.000 abstract description 3
- 239000000463 material Substances 0.000 description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 9
- 239000010949 copper Substances 0.000 description 9
- 229910052802 copper Inorganic materials 0.000 description 8
- 230000000694 effects Effects 0.000 description 8
- 229910000838 Al alloy Inorganic materials 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 230000005855 radiation Effects 0.000 description 4
- 239000004411 aluminium Substances 0.000 description 3
- 238000001816 cooling Methods 0.000 description 3
- 239000007789 gas Substances 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 238000006467 substitution reaction Methods 0.000 description 2
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 239000011435 rock Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
- H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a kind of piezoelectric device for preventing overheat, the coating is arranged on the top of piezoelectric device, 2 solder protuberances are separately positioned on the left end and right-hand member of coating, the lower convexity metal is arranged on the lower section of solder protuberance, the supporting layer is fixed on the bottom of coating, the piezoelectric substrate is arranged on the lower section of supporting layer, the electrode is arranged on the surface in the middle part of supporting layer, the connection conductor is arranged on the inside of piezoelectric substrate, the heat-conduction component is connected to the bottom of piezoelectric substrate, the passage is arranged on the bottom of piezoelectric device, 2 bellows are separately positioned on the left side and right side of passage, the heat sink is arranged on the bottom of piezoelectric device, the heat abstractor is arranged on the lower section of piezoelectric substrate.This prevents that the piezoelectric device of overheat is simple in construction, and easy to use, low cost is safe and efficient.
Description
Technical field
The utility model belongs to piezoelectric device technical field, and in particular to a kind of piezoelectric device for preventing overheat.
Background technology
Utilize device made of the piezo-electric effect (see quartz crystal) of material.The structure of most of piezoelectric devices by electrode,
Piezoelectric patches, support and shell composition.Wherein piezoelectric patches can be the shapes such as disk, strip sheet, rod, cylinder.Piezoelectric device is answered
It is very wide with scope.When intrinsic frequency of the signal frequency close to piezoelectric patches, piezoelectric device produces mechanical humorous by inverse piezoelectric effect
Shake, resonant frequency depends mainly on the size and dimension of piezoelectric patches.If frequency-temperature characteristic also meets to require, you can be used for into
Row frequency stabilization, frequency-selecting and timing.Sound wave is produced using this resonance, just forms ultrasonic transducer.Using resonant frequency with temperature
Or pressure and the characteristics of change, may also be fabricated which precision very high thermo detector and dynamometer.Under non-resonant condition, the inverse of it is utilized
Piezo-electric effect can be made into micro positioner, and can be made into piezoelectricity again using its direct piezoelectric effect ignites and ignite device.By machinery or
Caused heat shifts to avoid influenceing the device of its normal work or instrument other utensils in time in the course of the work.Common
Radiator can be divided into air-cooled according to radiating mode, and heat-pipe radiator, liquid is cold, semiconductor refrigerating, the multiple types such as compressor cooling
Type.Fin material refers to specific material used in fin.Its heat conductivility of every kind of material is different, by heat conductivility
Arrange from high to low, be respectively silver, copper, aluminium, steel.But if with silver come make fin can be too expensive, therefore best scheme is
Using copper.Although aluminium considerably cheaper, it is apparent that thermal conductivity is just be not as good (only about 50 percent multiple spot of copper) as copper.Often
Fin material is copper and aluminium alloy, and the two respectively has its advantage and disadvantage.The thermal conductivity of copper is good, but expensive, difficulty of processing
Higher, weight is excessive (many fine copper radiators have been above limitation of the machine to weight), and thermal capacity is smaller, and easy oxygen
Change.And fine aluminium is too soft, it is impossible to directly use, be all that the aluminium alloy used could provide enough hardness, be the advantages of aluminium alloy
It is cheap, it is in light weight, but thermal conductivity will be far short of what is expected than copper.Some radiators just respectively take the chief, at aluminium alloy heat radiator bottom
Embedded a piece of copper coin on seat.For domestic consumer, radiating requirements are had been sufficient for aluminum radiating fin.Radiating mode
Refer to that the radiator distributes the major way of heat.In thermodynamics, radiating is exactly heat transfer, and the transfer mode master of heat
There are three kinds：Heat transfer, thermal convection current and heat radiation.In itself or when material contacts with material, the transmission of energy is just claimed material
For heat transfer, this is a kind of most common thermaltransmission mode.For example cooling fin fin base directly contacts with piezoelectric device and takes away heat
Mode just belong to heat transfer.Thermal convection current refers to the thermaltransmission mode that the fluid (gas or liquid) of flowing walks the torrid zone,
Relatively common in the cooling system of computer housing is that radiator fan drives gas to flow " pressure thermal convection current " radiating mode.Heat
Radiation refer to by ray radiation transmit heat, it is daily it is most common be exactly solar radiation.These three radiating modes are not
Isolated, in daily heat transfer, these three radiating modes are all to occur simultaneously, are concured.Radiator dissipates
Effective radiating surface of the pyroconductivity of the thermal efficiency and radiator material, the thermal capacitance of radiator material and heat eliminating medium and radiator
The relating to parameters such as product.But existing piezoelectric device radiating effect is poor, piezoelectric device is easily because of the too high influence efficiency of temperature, sternly
Piezoelectric device can be damaged during weight, therefore we need a new piezoelectric device for preventing overheat, to meet the needs of people.
Utility model content
The purpose of this utility model is to provide a kind of piezoelectric device for preventing overheat, to solve to carry in above-mentioned background technology
The problem of going out.
To achieve the above object, the utility model provides following technical scheme：A kind of piezoelectric device for preventing overheat, including
Solder protuberance, coating, lower convexity metal, piezoelectric substrate, bellows, passage, electrode, supporting layer, connection conductor, heat-conduction part
Part, piezoelectric device, heat sink, the coating are arranged on the top of piezoelectric device, and 2 solder protuberances are separately positioned on and covered
The left end and right-hand member of cap rock, the lower convexity metal are arranged on the lower section of solder protuberance, and the supporting layer is fixed on coating
Bottom, the piezoelectric substrate are arranged on the lower section of supporting layer, and the electrode is arranged on the surface in the middle part of supporting layer, and the connection is led
Body is arranged on the inside of piezoelectric substrate, and the heat-conduction component is connected to the bottom of piezoelectric substrate, and the passage is arranged on pressure
The bottom of electrical part, 2 bellows are separately positioned on the left side and right side of passage, and the heat sink is arranged on piezoelectric device
Bottom, the heat abstractor is arranged on the lower section of piezoelectric substrate.
Preferably, the cover surface is provided with through hole, and lower convexity metal is slidably connected with through hole.
Preferably, the cover surface is provided with epoxylite diaphragm.
Preferably, the heat-conduction component top is provided with screw thread, and piezoelectric substrate is rotated by screw thread and heat-conduction component
Connection.
Preferably, the electrode is electrically connected with by electric wire and external power.
Preferably, the connection conductor is provided with 6.
Technique effect of the present utility model and advantage：This prevents that the piezoelectric device of overheat is simple in construction, easy to use, cost
It is low, it is safe and efficient；The setting of bellows make it that the piezoelectric device radiating effect is more preferable, is taken away heat by the flowing of gas, both
Environmental protection also saves space, practicality and high efficiency；The setting of passage causes piezoelectric device to have more efficient thermal diffusivity, due to logical
Stomata sets more, can avoid that the piezoelectric device temperature is too high, and use is safer；Connecting conductor can be by piezoelectric device
Heat transfer has effectively carried out the transmission of heat, sufficiently lower the temperature of piezoelectric device to heat-conduction component；Heat sink
Setting can further disperse the heat of collection, and radiating effect is obvious, has saved cost, and simple and practical.
Brief description of the drawings
Fig. 1 is structural representation of the present utility model；
Fig. 2 is profile of the present utility model.
Fig. 3 is construction for heat radiating device schematic diagram.
In figure：1st, solder protuberance；2nd, coating；3rd, lower convexity metal；4th, piezoelectric substrate；5th, bellows；6th, passage；7th, it is electric
Pole；8th, supporting layer；9th, conductor is connected；10th, heat-conduction component；11st, piezoelectric device；12nd, heat sink；13rd, heat abstractor.
Embodiment
Below in conjunction with the accompanying drawing in the utility model embodiment, the technical scheme in the embodiment of the utility model is carried out
Clearly and completely describing, it is clear that described embodiment is only the utility model part of the embodiment, rather than whole
Embodiment.Based on the embodiment in the utility model, those of ordinary skill in the art are not under the premise of creative work is made
The every other embodiment obtained, belong to the scope of the utility model protection.
A kind of piezoelectric device for preventing overheat that the utility model provides as depicted in figs. 1 and 2, including solder protuberance 1,
Coating 2, lower convexity metal 3, piezoelectric substrate 4, bellows 5, passage 6, electrode 7, supporting layer 8, connection conductor 9, heat-conduction part
Part 10, piezoelectric device 11, heat sink 12, the coating 2 are arranged on the top of piezoelectric device 11, and the surface of coating 2 is set
There is through hole, and lower convexity metal 3 is slidably connected with through hole, the surface of coating 2 is provided with epoxylite diaphragm, 2 institutes
Left end and right-hand member that solder protuberance 1 is separately positioned on coating 2 are stated, the lower convexity metal 3 is arranged under solder protuberance 1
Side, the supporting layer 8 are fixed on the bottom of coating 2, and the piezoelectric substrate 4 is arranged on the lower section of supporting layer 8, the electrode 7
The surface at the middle part of supporting layer 8 is arranged on, the electrode 7 is electrically connected with by electric wire and external power, and the connection conductor 9 is set
In the inside of piezoelectric substrate 4, the connection conductor 9 is provided with 6, and the heat-conduction component 10 is connected to the bottom of piezoelectric substrate 4,
The top of heat-conduction component 10 is provided with screw thread, and piezoelectric substrate 4 is rotatablely connected by screw thread and heat-conduction component 10, described logical
Stomata 6 is arranged on the bottom of piezoelectric device 11, and 2 bellows 5 are separately positioned on the left side and right side of passage 6, described to dissipate
Hot plate 12 is arranged on the bottom of piezoelectric device 11, and the heat abstractor 13 is arranged on the lower section of piezoelectric substrate 4.
Operation principle：This prevents the piezoelectric device of overheat when in use, and the meeting of connection conductor 9 will be hot caused by piezoelectric device 11
Amount is transferred to heat-conduction component 10, then passes in heat abstractor 13, and heat can outwardly be disperseed by bellows 5, be arranged on simultaneously
The passage 6 on the surface of heat abstractor 13 can also spread out of partial heat, and heat sink 12 constantly works, and piezoelectric device 11 is kept just
Normal temperature levels.
Finally it should be noted that：Preferred embodiment of the present utility model is the foregoing is only, is not limited to this
Utility model, although the utility model is described in detail with reference to the foregoing embodiments, for those skilled in the art
For, it can still modify to the technical scheme described in foregoing embodiments, or to which part technical characteristic
Progress equivalent substitution, all within the spirit and principles of the utility model, any modification, equivalent substitution and improvements made etc.,
It should be included within the scope of protection of the utility model.
Claims (6)
1. a kind of piezoelectric device for preventing overheat, including solder protuberance (1), coating (2), lower convexity metal (3), piezoelectric substrate
(4), bellows (5), passage (6), electrode (7), supporting layer (8), connection conductor (9), heat-conduction component (10), piezoelectric device
(11), heat sink (12), heat abstractor (13), it is characterised in that：The coating (2) is arranged on the top of piezoelectric device (11)
Portion, 2 solder protuberances (1) are separately positioned on the left end and right-hand member of coating (2), and the lower convexity metal (3) is arranged on
The lower section of solder protuberance (1), the supporting layer (8) are fixed on the bottom of coating (2), and the piezoelectric substrate (4) is arranged on branch
The lower section of layer (8) is supportted, the electrode (7) is arranged on the surface in the middle part of supporting layer (8), and the connection conductor (9) is arranged on piezoelectricity
The inside of substrate (4), the heat-conduction component (10) are connected to the bottom of piezoelectric substrate (4), and the passage (6) is arranged on pressure
The bottom of electrical part (11), 2 bellows (5) are separately positioned on the left side and right side of passage (6), the heat sink (12)
The bottom of piezoelectric device (11) is arranged on, the heat abstractor (13) is arranged on the lower section of piezoelectric substrate (4).
A kind of 2. piezoelectric device for preventing overheat according to claim 1, it is characterised in that：Coating (2) surface
Provided with through hole, and lower convexity metal (3) is slidably connected with through hole.
A kind of 3. piezoelectric device for preventing overheat according to claim 1, it is characterised in that：Coating (2) surface
Provided with epoxylite diaphragm.
A kind of 4. piezoelectric device for preventing overheat according to claim 1, it is characterised in that：The heat-conduction component (10)
Top is provided with screw thread, and piezoelectric substrate (4) is rotatablely connected by screw thread and heat-conduction component (10).
A kind of 5. piezoelectric device for preventing overheat according to claim 1, it is characterised in that：The electrode (7) passes through electricity
Line is electrically connected with external power.
A kind of 6. piezoelectric device for preventing overheat according to claim 1, it is characterised in that：The connection conductor (9) sets
There are 6.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720606432.6U CN206878037U (en) | 2017-05-27 | 2017-05-27 | A kind of piezoelectric device for preventing overheat |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720606432.6U CN206878037U (en) | 2017-05-27 | 2017-05-27 | A kind of piezoelectric device for preventing overheat |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206878037U true CN206878037U (en) | 2018-01-12 |
Family
ID=61337596
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720606432.6U Active CN206878037U (en) | 2017-05-27 | 2017-05-27 | A kind of piezoelectric device for preventing overheat |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206878037U (en) |
-
2017
- 2017-05-27 CN CN201720606432.6U patent/CN206878037U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN201251749Y (en) | Novel refrigerating and heat-dissipating device of CPU semiconductor | |
| CN105186927B (en) | A kind of gas stove wok stand using cogeneration | |
| CN204204992U (en) | Battery modules | |
| CN207020614U (en) | A kind of graphite ene coatings cpu heat | |
| CN206878037U (en) | A kind of piezoelectric device for preventing overheat | |
| CN211605372U (en) | Filter cavity with strong local heat dissipation capacity | |
| CN209729888U (en) | High reliablity heat radiation module | |
| CN201215770Y (en) | Heat radiating installation construction for capacitor | |
| CN201491457U (en) | tree-shaped electronic radiator | |
| CN201064074Y (en) | Heat pipe radiator | |
| CN216057983U (en) | Heat dissipation device with heat dissipation fan for electrical equipment | |
| CN208874535U (en) | Thermal energy convection heat emission type photovoltaic module | |
| CN106357161A (en) | Installing structure of temperature-difference power generation module | |
| CN208336005U (en) | A kind of air switch contact radiator | |
| CN207639070U (en) | A kind of cooling fast aluminum alloy radiator casing | |
| CN207318800U (en) | A kind of high heat load All-in-One optical module semiconductor temperature module | |
| CN201556155U (en) | Heat sink | |
| CN204425269U (en) | A kind of heat radiation glass film plates of high power condense photovoltaic electrification module receiver | |
| CN206341548U (en) | A kind of package assembly of aluminium base and heat-dissipating casing | |
| CN207612241U (en) | A kind of intelligent photovoltaic component | |
| CN210900117U (en) | High-voltage insulation heat-conducting silica gel sheet | |
| CN108766795A (en) | A kind of air switch contact radiator | |
| CN210040459U (en) | Heat radiation module of cylindrical battery module | |
| CN218104027U (en) | Heat dissipation device for electric equipment | |
| CN209246454U (en) | A kind of semiconductor chilling plate of metal |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |