CN115250566A - Integrated circuit board and manufacturing method thereof - Google Patents

Integrated circuit board and manufacturing method thereof Download PDF

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Publication number
CN115250566A
CN115250566A CN202110460388.3A CN202110460388A CN115250566A CN 115250566 A CN115250566 A CN 115250566A CN 202110460388 A CN202110460388 A CN 202110460388A CN 115250566 A CN115250566 A CN 115250566A
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CN
China
Prior art keywords
circuit board
component
hole
circuit
pattern
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202110460388.3A
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Chinese (zh)
Inventor
韩国荣
薛阳
杨阳
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Shennan Circuit Co Ltd
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Shennan Circuit Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shennan Circuit Co Ltd filed Critical Shennan Circuit Co Ltd
Priority to CN202110460388.3A priority Critical patent/CN115250566A/en
Publication of CN115250566A publication Critical patent/CN115250566A/en
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4638—Aligning and fixing the circuit boards before lamination; Detecting or measuring the misalignment after lamination; Aligning external circuit patterns or via connections relative to internal circuits

Abstract

The application discloses integrated circuit board and manufacturing method thereof, integrated circuit board includes: the first circuit board is provided with a first component; the second circuit board is provided with a second component; the first circuit board and the second circuit board are respectively attached to two sides of the third circuit board, and a groove is formed in the third circuit board to accommodate the first component and the second component. By the method, three-dimensional stacking of the components is realized, and the occupied area of the components is saved.

Description

Integrated circuit board and manufacturing method thereof
Technical Field
The invention relates to the field of PCB processing and the technical field of packaging, in particular to an integrated circuit board and a manufacturing method thereof.
Background
With the development of signal processing systems, the traditional signal processing system has a large occupied area in hardware products, which is not only unfavorable for the miniaturization of the system, but also has high limitation in special scenes.
The signal processing module with high integration level can not only reduce the design area, but also simplify the design circuit and shorten the design period, so that the further integration of the electronic elements is the trend of electronic system development.
Disclosure of Invention
The application provides an integrated circuit board and a manufacturing method thereof, and aims to solve the technical problems that in the prior art, a signal processing module is large in occupied area and cannot be miniaturized.
In order to solve the above technical problem, the present application provides an integrated circuit board, which includes: the first circuit board is provided with a first component; the second circuit board is provided with a second component; the first circuit board and the second circuit board are respectively attached to two opposite sides of the third circuit board, and a groove is formed in the third circuit board to accommodate the first component and the second component; an FPGA device is arranged on the opposite side of the first circuit board away from the first component, and a molding compound is arranged on the side close to the FPGA device so as to package the FPGA; and the opposite side of the second circuit board far away from the second component is provided with a ball-planting bonding pad so as to electrically connect the first component and the second component with an external device.
The first circuit board is also provided with a first hole and a first circuit pattern, the first hole penetrates through the first circuit board, and the first circuit pattern covers the surfaces of two opposite sides of the first circuit board.
The first component is welded on one side face of the first circuit board covered with the first circuit pattern, the component comprises a plurality of components, the first component is electrically connected with the first component through the first hole and the first circuit pattern, and the first component is electrically connected with the FPGA component.
The second circuit board is also provided with a second hole and a second circuit pattern, the second hole penetrates through the second circuit board, and the second circuit pattern covers the surfaces of two opposite sides of the second circuit board.
The second component is welded on one side face of the second circuit board covered with the second circuit pattern, the component comprises a plurality of components, the second component is electrically connected with the second component through the second hole and the second circuit pattern, and the second component is electrically connected with the FPGA component.
The integrated circuit board further comprises a third hole, and the third hole penetrates through the first circuit board, the second circuit board and the third circuit board so that the first component and the second component are electrically connected.
The first component comprises an FPGA, a DDR, a PHY, a sensor, a FLASH, a capacitance resistance inductor or a crystal oscillator; the second component comprises an FPGA, a DDR, a PHY, a sensor, a FLASH, a capacitance resistance sensor or a crystal oscillator.
In order to solve the above technical problem, the present application further provides a method for manufacturing an integrated circuit board, where the method includes: acquiring a first circuit board and a second circuit board; manufacturing a first component on a first circuit board, and manufacturing a second component on a second circuit board; acquiring a third circuit board; grooves are formed in two opposite sides of the third circuit board; the first circuit board and the second circuit board are respectively attached to two sides of the third circuit board; welding an FPGA device on one side of the first circuit board, which is far away from the first component; arranging a ball planting bonding pad on one side of the second circuit board far away from the second component; and (5) packaging the FPGA device by using a plastic sealant.
The steps of manufacturing a first component on a first circuit board and a second component on a second circuit board include: manufacturing a first hole and a first circuit pattern on the first circuit board, wherein the first hole penetrates through the first circuit board, and the first circuit pattern covers the surfaces of two opposite sides of the first circuit board; manufacturing a second hole and a second circuit pattern on the second circuit board, wherein the second hole penetrates through the second circuit board, and the second circuit pattern covers the surfaces of two opposite sides of the second circuit board; the first component and the second component are soldered to the first wiring pattern surface and the second wiring pattern surface, respectively.
Before the step of welding the FPGA device on the side of the first circuit board away from the first component after the pressing, the method further comprises the following steps: and drilling third holes on the first circuit board, the second circuit board and the third circuit board which are far away from the first component and the second component, wherein the third holes sequentially penetrate through the first circuit board, the third circuit board and the second circuit board.
The beneficial effect of this application is: this application is through setting up first component on first circuit board, sets up the second component on the second circuit board, pastes first circuit board and second circuit board respectively and leans on in third circuit board both sides, links together first circuit board and second circuit board through the third circuit board to make first component on the first circuit board and the second component on the second circuit board form three-dimensional and pile up, saved signal processing module's area occupation, realize signal processing module's miniaturization.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
FIG. 1 is a schematic structural diagram of an embodiment of an integrated circuit board of the present application;
fig. 2 is a schematic flowchart illustrating a method for manufacturing an integrated circuit according to an embodiment of the present disclosure.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The terminology used in the embodiments of the present application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. As used in the examples of this application and the appended claims, the singular forms "a", "an", and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise, the "plurality" typically includes at least two, but does not exclude the presence of at least one.
It should be understood that the term "and/or" as used herein is merely one type of association that describes an associated object, meaning that three relationships may exist, e.g., a and/or B may mean: a exists alone, A and B exist simultaneously, and B exists alone. In addition, the character "/" herein generally indicates that the former and latter related objects are in an "or" relationship.
It should be understood that the terms "comprises," "comprising," or any other variation thereof, as used herein, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrases "comprising 8230; \8230;" comprises 8230; "does not exclude the presence of additional like elements in a process, method, article, or apparatus that comprises the element.
It should be noted that, if directional indications (such as upper, lower, left, right, front, rear, 8230; \8230;) are involved in the embodiment of the present invention, the directional indications are only used to explain the relative positional relationship between the components in a specific posture (as shown in the figure), the motion situation, etc., and if the specific posture is changed, the directional indications are correspondingly changed.
Reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the application. The appearances of the phrase in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. It is explicitly and implicitly understood by one skilled in the art that the embodiments described herein can be combined with other embodiments.
Please refer to fig. 1, wherein fig. 1 is a schematic structural diagram of an embodiment of an integrated circuit board according to the present disclosure.
As shown in fig. 1, the integrated circuit board includes: the packaging structure comprises a first circuit board 1, wherein a first component 11 is arranged on the first circuit board 1, a second circuit board 2 is arranged on the second circuit board 2, a second component 21 and a third circuit board 3 are arranged on the second circuit board 2, grooves are formed in two opposite sides of the third circuit board 3, the third circuit board 3 is arranged between the first circuit board 1 and the second circuit board 2, so that the first circuit board 1 and the second circuit board 2 are respectively attached to two sides of the third circuit board 3, the grooves in the third circuit board 3 are used for respectively accommodating the first component 11 and the second component 21, an FPGA component 4 is arranged on one opposite side, away from the first component 11, of the first circuit board 1, a plastic sealing glue 5 is arranged on one side, close to the FPGA component 4, of the first circuit board 1, the FPGA component 4 covers one side, and a ball-planting bonding pad 6 is arranged on one opposite side, away from the second component 21, of the second circuit board 2, so that the first component 11 and the second component 21 are electrically connected with an external component.
Specifically, the first component 11 is disposed on a surface of the first circuit board 1 on a side facing the second circuit board 2; the second component 21 is arranged on the surface of the second circuit board 2 on the side facing the first circuit board 1. Thereby enabling the first component 11 and the second component 21 to be received by the recesses on opposite sides of the third circuit board 3.
The FPGA device 4 is a programmable gate array device, and can control operation timing of components inside the integrated circuit board, and the FPGA device 4 can be used to control the first component 11 on the first circuit board 1 and the second component 21 on the second circuit board. The FPGA device 4 is soldered to one side of the first circuit board 1.
The surface of the FPGA device 4 is provided with a molding compound 5, and the molding compound 5 is used for protecting the first component 11, the second component 21 and the FPGA device 4 inside the integrated circuit board. In this embodiment, the height of the molding compound 5 is greater than the height of the surface component of the integrated circuit board, and in this embodiment, the height of the molding compound 5 is greater than the height of the FPGA device 4 to seal the surface and the internal components of the integrated circuit board, thereby protecting the surface and the internal components of the integrated circuit board. In other embodiments, the side of the first circuit board 1 away from the first component 11 is provided with other components besides the FPGA device, and is not limited herein.
The ball-planting pad 6 is arranged on the outer side far away from the first component 11, the second component 21 and the FPGA component 4 and is used for being connected with an external component, so that the first component 11, the second component 21 and the FPGA component 4 inside the integrated circuit board are connected with the external component. In one embodiment, the ball-planting pad 6 may include a plurality of pads, so that different components and devices are respectively connected with external devices.
In this embodiment, the first component 11 is fabricated on the first circuit board 1, the second component 21 is fabricated on the second circuit board 2, and the first circuit board 1 and the second circuit board 2 are connected through the third circuit board 3, so that the first component 11 and the second component 21 are stacked inside the integrated circuit board, thereby saving the occupied space of components in the integrated circuit board and making the integrated circuit board more miniaturized.
In one embodiment, the first component 11 includes a plurality of components and is two-dimensionally arranged on the first circuit board 1, the second component 21 includes a plurality of components and is two-dimensionally arranged on the second component 21, and the number of the first component 11 and the second component 21 is not limited. In this embodiment, the first component 11 arranged in two dimensions is fabricated on the first circuit board 1, the second component 21 arranged in two dimensions is fabricated on the second circuit board 2, and then the first circuit board 1 and the second circuit board 2 are connected through the third circuit board 3 by pressing with the third circuit board 3, so that the first component 11 and the second component 21 form a three-dimensional stack in the integrated circuit board, and the occupied space of components in the integrated circuit board is further saved.
In this embodiment, the first circuit board 1 is further provided with a first hole 12 and a first circuit pattern (not shown in the figure), in an embodiment, the first hole 12 penetrates through the first circuit board 1, the first circuit pattern covers two opposite side surfaces of the first circuit board 1, the first component 11 is soldered on one side surface of the first circuit board 1 in a soldering manner, specifically, the first component 11 is soldered on one side surface of the first circuit board 1 covered with the first circuit pattern, wherein the first component 11 includes a plurality of first components 11, the plurality of first components 11 form an electrical connection through the first hole 12 and the first circuit pattern, and meanwhile, the first hole 12 and the first circuit pattern also form an electrical connection between the first component 12 and the FPGA device 4.
The second circuit board 2 is provided with a second hole 22 and a second wiring pattern (not shown), and the second hole 22 and the second wiring pattern are connected to the second component 21 to electrically connect the plurality of second components 21. In one embodiment, the second hole 22 penetrates through the second circuit board 2, the second circuit pattern covers two opposite side surfaces of the second circuit board 2, the second component 21 is soldered to one side surface of the second circuit board 1, and specifically, the second component 21 is soldered to the two side surfaces of the second circuit board 2 covered with the second circuit pattern, wherein the second component 21 includes a plurality of second components 21, the plurality of second components 21 form an electrical connection through the second hole 22 and the second circuit pattern, and meanwhile, the second hole 12 and the second circuit pattern also form an electrical connection between the second component 12 and the ball-mounting pad.
It should be noted that the electrical connection refers to a collection of all electrical circuits in an electrical product in a broad sense, and includes power connection parts such as a power plug, a power connection terminal, and the like, a power cord, an internal wire, an internal connection part, and the like; electrical connection in the narrow sense is intended to refer to all ways of connecting different conductors within a product. In this embodiment, the connection mode between the components is referred to.
In this embodiment, a third hole 31 is further disposed on the integrated circuit board, and the third hole 31 sequentially penetrates through the first circuit board 1, the third circuit board 3 and the second circuit board 2, so as to electrically connect the first component 11 on the first circuit board 1 and the second component 21 on the second circuit board 2. Meanwhile, the first component 11 on the first circuit board 1 is electrically connected with the ball-planting pad 6 on the back side of the second circuit board 2, and the FPGA component 4 on the first circuit board 1 is electrically connected with the second component 21 on the second circuit board 2.
In this embodiment, the third circuit board 3 is made of PP material, the third circuit board 3 is disposed between the first circuit board 1 and the second circuit board 2, and after the pressing process, the third circuit board 3 is connected to the first circuit board 1 and the second circuit board 2, respectively, so that the first circuit board 1 and the second circuit board 2 are respectively attached to two sides of the third circuit board 3.
The beneficial effect of this embodiment is: the first component arranged in two dimensions is manufactured on the first circuit board, the second component arranged in two dimensions is manufactured on the second circuit board, then the first circuit board and the second circuit board are pressed together, and the third circuit board is connected with the first circuit board and the second circuit board, so that the first component and the second component form three-dimensional stacking in the integrated circuit board, and therefore the occupied space of the components in the integrated circuit board is saved. Meanwhile, the electrical connection among the components is formed through the first hole, the second hole and the third hole in the circuit board.
Please refer to fig. 2, and fig. 2 is a schematic flow chart illustrating an embodiment of a method for manufacturing an integrated circuit board according to the present application. As shown in fig. 2, the manufacturing method includes:
step S21: and obtaining a first circuit board and a second circuit board.
The first circuit board and the second circuit board are both PCB boards so as to support the manufacture of components. The first circuit board and the second circuit board may be arranged identically or differently, and are not limited herein.
Step S22: a first component is fabricated on a first circuit board and a second component is fabricated on a second circuit board.
The method comprises the following steps: the method comprises the steps of manufacturing a first hole and a first circuit pattern on a first circuit board, enabling the first hole to penetrate through the first circuit board, enabling the first circuit pattern to cover the surfaces of two opposite sides of the first circuit board, manufacturing a second hole and a second circuit pattern on a second circuit board, enabling the second hole to penetrate through the second circuit board, enabling the second circuit pattern to cover the surfaces of two opposite sides of the second circuit board, and then respectively welding a first component and a second component to the surfaces of the first circuit pattern and the second circuit pattern. Specifically, a reflow process is used to solder the first component to the first circuit board and the second component to the second circuit board.
The first components comprise a plurality of first components, and the plurality of first components are electrically connected with each other through the first holes and the first circuit patterns. The second component comprises a plurality of second components, and the plurality of second components form electrical connection through the second holes and the second circuit pattern.
In an embodiment, the first hole and the second hole are via holes, and the first circuit pattern and the second circuit pattern are copper metal layers, which is not limited herein.
The first component may be a DDR, PHY, sensor, FLASH, capacitance resistance, crystal oscillator, or other component, and the second component may also be a DDR, PHY, sensor, FLASH, capacitance resistance, crystal oscillator, or other component, which is not limited herein. The first component and the second component refer to components on the first circuit board and the second circuit board, and are not limited to functions and kinds of the components. In this embodiment, the first component and the second component may be the same or different, and are specifically set according to actual needs.
In this embodiment, the first components are arranged in two dimensions on the first circuit board, and the second components are also arranged in two dimensions on the second circuit board. The first component is arranged on one side of the first circuit board close to the second circuit board, and the second component is arranged on the second circuit board close to the first circuit board.
Step S23: and obtaining a third circuit board.
Wherein, the opposite sides of the third circuit board are provided with grooves. Specifically, one side of the third circuit board, which is close to the first circuit board, is provided with a first groove, the first groove is arranged corresponding to the first component, the number, the shape and the arrangement mode of the first groove are the same as those of the first component on the first circuit board, one side of the third circuit board, which is close to the second circuit board, is provided with a second groove, the second groove is arranged corresponding to the second component, and the number, the shape and the arrangement mode of the second groove are the same as those of the second component on the second circuit board. The first groove and the second groove are used for accommodating the first component and the second component respectively so as to protect the first component and the second component from being damaged in the pressing process.
In this embodiment, the third circuit board may be made of a PP material, and is used to connect the first circuit board and the second circuit board and separate the first component on the first circuit board from the second component on the second circuit board.
Step S24: and respectively attaching the first circuit board and the second circuit board to two sides of the third circuit board for pressing.
Specifically, a first circuit board, a third circuit board and a second circuit board are sequentially stacked, and the stacked first circuit board, third circuit board and second circuit board are subjected to press-fitting treatment, so that the third circuit board is connected with the first circuit board and the second circuit board to form the integrated circuit board. The third circuit board is arranged between the first circuit board and the second circuit board, and the grooves on two sides of the third circuit board are used for accommodating the first component and the second component respectively, so that the first component and the second component are protected from being damaged in the pressing process.
The first component on the first circuit board is arranged close to one side of the second circuit board, the second component on the second circuit board is arranged close to one side of the first circuit board, and the middle of the first circuit board is spaced by the third circuit board, so that the first component and the second component are spaced, the occupied space of the first component and the second component is saved, and the three-dimensional stacking of the first component and the second component in the PCB is realized.
Step S25: and welding the FPGA device on one side of the first circuit board which is subjected to the pressing treatment and is far away from the first component.
The method also comprises the following steps: and arranging a third hole on the circuit board formed after pressing, wherein the third hole sequentially penetrates through the first circuit board, the third circuit board and the second circuit board so as to enable the first component on the first circuit board and the second component on the second circuit board on two opposite sides of the third circuit board to be electrically connected.
The FPGA device is electrically connected with the first component through the first hole and the first circuit pattern on the first circuit board, and is electrically connected with the second component through the third hole and the second circuit pattern. The FPGA is a programmable logic gate array device to control components inside the integrated circuit board to operate.
Step 26: and manufacturing a ball planting bonding pad on one side of the second circuit board far away from the second component.
The ball-planting pad is electrically connected with the first component through the third hole and the first circuit pattern, is electrically connected with the second component through the second hole and the second circuit pattern, and is electrically connected with the FPGA component through the third hole and the first circuit pattern. In one embodiment, the ball-mounting pad may include a plurality of pads for electrically connecting different components, respectively, so as to connect the different components to an external device, respectively. The ball-planting pad is used to form an electrical connection with an external circuit or device, so that the integrated circuit board can be used in the fields requiring miniaturization, such as communication, industry, medical treatment, unmanned aerial vehicles, and the like. The number of the ball-planting pads can be correspondingly set according to an interface of an external device, and is not limited herein.
Step S27: and (5) packaging the FPGA device by using the plastic sealant.
Specifically, a molding compound is used for packaging the integrated circuit board on one side far away from the ball-mounting pad or on one side close to the FPGA so as to protect components and parts inside the integrated circuit board and the FPGA. Specifically, the height of the molding compound is greater than the height of the device on the surface of the integrated circuit board, that is, the height of the molding compound is greater than the height of the FPGA, so that the molding compound completely seals the device on the surface of the integrated circuit board to protect the device on the surface of the integrated circuit board.
The beneficial effect of this embodiment is: the first components which are arranged in two dimensions are manufactured on the first circuit board, the second components which are arranged in two dimensions are manufactured on the second circuit board, then the first circuit board and the second circuit board are pressed together, and the third circuit board is connected with the first circuit board and the second circuit board, so that the first components and the second components form three-dimensional stacking in the integrated circuit board, and the occupied space of the components in the integrated circuit board is saved. Meanwhile, the electrical connection among the components is formed through the first hole, the second hole and the third hole in the circuit board.
The above description is only an embodiment of the present application, and not intended to limit the scope of the present application, and all modifications of equivalent structures and equivalent processes, which are made by using the contents of the specification and the drawings, or directly or indirectly applied to other related technical fields, are also included in the scope of the present application.

Claims (10)

1. An integrated circuit board, comprising:
the first circuit board is provided with a first component;
the second circuit board is provided with a second component;
the first circuit board and the second circuit board are respectively attached to two opposite sides of the third circuit board, and grooves are formed in the two opposite sides of the third circuit board to accommodate the first component and the second component;
an FPGA device is arranged on the opposite side of the first circuit board away from the first component, and a plastic sealant is arranged on the side close to the FPGA device so as to package the FPGA device;
and a ball planting bonding pad is arranged on the opposite side of the second circuit board far away from the second component, so that the first component and the second component are electrically connected with an external device.
2. The integrated circuit board of claim 1,
the first circuit board is further provided with a first hole and a first circuit pattern, the first hole penetrates through the first circuit board, and the first circuit pattern covers the surfaces of two opposite sides of the first circuit board.
3. The integrated circuit board of claim 2,
the first component is welded on one side face, covered with the first circuit pattern, of the first circuit board, the component comprises a plurality of components, the first component achieves electrical connection between the first components through the first hole and the first circuit pattern, and the first component is electrically connected with the FPGA component.
4. The integrated circuit board of claim 1,
the second circuit board is also provided with a second hole and a second circuit pattern, the second hole penetrates through the second circuit board, and the second circuit pattern covers the surfaces of two opposite sides of the second circuit board.
5. The integrated circuit board of claim 4,
the second component is welded on one side face, covered with the second circuit pattern, of the second circuit board, the component comprises a plurality of components, the second component is electrically connected with the second component through the second hole and the second circuit pattern, and the second component is electrically connected with the FPGA component.
6. The integrated circuit board of claim 1, further comprising a third hole extending through the first circuit board, the second circuit board, and the third circuit board to electrically connect the first component to the second component.
7. The integrated circuit board of claim 1,
the first component comprises an FPGA, a DDR, a PHY, a sensor, a FLASH, a capacitance resistance sensor or a crystal oscillator;
the second component comprises an FPGA, a DDR, a PHY, a sensor, a FLASH, a capacitance resistance sensor or a crystal oscillator.
8. A manufacturing method of an integrated circuit board is characterized by comprising the following steps:
acquiring a first circuit board and a second circuit board;
manufacturing a first component on the first circuit board, and manufacturing a second component on the second circuit board;
acquiring a third circuit board; grooves are formed in two opposite sides of the third circuit board;
respectively attaching the first circuit board and the second circuit board to two sides of the third circuit board for pressing;
welding an FPGA device on one side of the first circuit board which is subjected to the pressing treatment and is far away from the first component;
manufacturing a ball-planting bonding pad on one side of the second circuit board far away from the second component;
and packaging the FPGA device by using a plastic sealant.
9. The method of claim 8, wherein the step of forming a first component on the first circuit board and a second component on the second circuit board comprises:
manufacturing a first hole and a first circuit pattern on the first circuit board, wherein the first hole penetrates through the first circuit board, and the first circuit pattern covers the surfaces of two opposite sides of the first circuit board;
manufacturing a second hole and a second circuit pattern on the second circuit board, wherein the second hole penetrates through the second circuit board, and the second circuit pattern covers the surfaces of two opposite sides of the second circuit board;
soldering the first component and the second component to the first circuit pattern surface and the second circuit pattern surface, respectively.
10. The manufacturing method of claim 6, further comprising, before the step of soldering the FPGA device on the side of the first circuit board away from the first component after the pressing process, the step of:
and drilling third holes on the first circuit board, the second circuit board and the third circuit board which are far away from the first component and the second component, wherein the third holes sequentially penetrate through the first circuit board, the third circuit board and the second circuit board.
CN202110460388.3A 2021-04-27 2021-04-27 Integrated circuit board and manufacturing method thereof Pending CN115250566A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202110460388.3A CN115250566A (en) 2021-04-27 2021-04-27 Integrated circuit board and manufacturing method thereof

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Application Number Priority Date Filing Date Title
CN202110460388.3A CN115250566A (en) 2021-04-27 2021-04-27 Integrated circuit board and manufacturing method thereof

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Publication Number Publication Date
CN115250566A true CN115250566A (en) 2022-10-28

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