KR100895815B1 - Semiconductor package and method of manufacturing theereof - Google Patents

Abstract

A semiconductor package and a method of manufacturing the same are disclosed. The semiconductor package electrically connects a substrate having first and second connection pads, a first semiconductor chip disposed on the substrate, the first semiconductor chip having a first bonding pad, the first bonding pad and the first connection pad, and partially bent. A first conductive member having a bent portion, a second semiconductor chip disposed on the first semiconductor chip and having a second bonding pad, and a second conductive member electrically connecting the second bonding pad and the second connection pad. do. Bonding pads of the semiconductor chip disposed relatively on the upper side by bending a portion of the conductive pads connecting the bonding pads of the semiconductor chip disposed on the lower portion of the plurality of stacked semiconductor chips and the connection pads of the substrate on which the semiconductor chip is mounted; The electrically conductive members connecting the connection pads of the substrate on which the semiconductor chip is mounted are prevented from being electrically shorted to each other.

Semiconductor, Lamination, Conductive Member, Semiconductor Chip, Bonding Pad, Connection Pad

Description

Semiconductor package and manufacturing method therefor {SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THEEREOF}

1 is a cross-sectional view of a laminated package according to the prior art.

2 is a cross-sectional view of a semiconductor package according to an embodiment of the present invention.

3 to 7 are plan views and cross-sectional views illustrating a method of manufacturing a semiconductor package according to an embodiment of the present invention.

The present invention relates to a semiconductor package and a method of manufacturing the same.

Recently, semiconductor packages including semiconductor devices for storing massive data and processing data stored in a short time have been developed, and semiconductor packages including semiconductor devices have been applied to personal computers, television receivers, home appliances, information and communication devices, and the like. have.

The semiconductor package is a semiconductor chip manufacturing process for forming a semiconductor chip by integrating devices such as transistors, resistors, capacitors, etc. on a semiconductor chip such as a wafer, and a semiconductor that is weakly electrically connected and brittle with an external circuit board by individualizing the semiconductor chip from the wafer. It is manufactured by a package process that protects the chip from external shocks and / or vibrations.

Recently, with the miniaturization of electronic products, semiconductor packages require high integration and various functions, and according to such demands, a package in which a plurality of semiconductor chips performing various functions have been recently developed.

1 is a cross-sectional view of a laminated package according to the prior art.

Referring to FIG. 1, a conventional stacked package 12 includes a substrate 1. A plurality of connection pads 2 are disposed on the upper edge of the substrate 1, a ball land 3 is disposed on the lower surface of the substrate 1 facing the upper surface of the substrate 1, and the solder balls 4 are disposed on the ball land 3. Electrically connected.

The first semiconductor chip 5 is disposed on the upper surface of the substrate 1. The first semiconductor chip 5 is disposed on the upper surface of the substrate 1 by an adhesive member (not shown). Bonding pads (not shown) are disposed on the upper edge of the first semiconductor chip 5, and the bonding pads are electrically bonded to the connection pads 2 disposed on the upper surface of the substrate 1 by the first conductive wires 2. do.

The bonding member 7 is disposed on the upper surface of the first semiconductor chip 5, and the second semiconductor chip 8 is disposed on the bonding member 7. Bonding pads are disposed on the upper edge of the second semiconductor chip 8, and the bonding pads are electrically bonded to other connection pads 2 disposed on the upper surface of the substrate 1 by the second conductive wire 9.

The first and second semiconductor chips 5, 8 and the first and second conductive wires 6, 9 are molded by a molding member 11 comprising an epoxy resin.

In the conventional laminated package having such a structure, the first conductive wires 6 and the second conductive wires 9 are bonded to the first and second conductive wires 6 and 9 to the connection pads. 2 is frequently shorted by the height and position error of the conductive wires 6, 9 or the flow of the molding member 11.

One object of the present invention is to provide a semiconductor package in which at least two semiconductor chips are stacked and the shorting of each conductive wire is prevented when the bonding pad and the connection pad of each semiconductor chip are bonded with the conductive wire.

Another object of the present invention is to provide a method of manufacturing a semiconductor package in which at least two semiconductor chips are stacked and the shorting of each conductive wire is prevented when the bonding pad and the connection pad of each semiconductor chip are bonded with the conductive wire.

A semiconductor package for realizing an object of the present invention includes a substrate having first and second connection pads, a first semiconductor chip disposed on the substrate and having a first bonding pad, the first bonding pad, and the first bonding pad. A first conductive member electrically connected to the connection pad and having a bent portion partially bent, a second semiconductor chip disposed on the first semiconductor chip and having a second bonding pad, the second bonding pad, and the second connection pad. And a second conductive member electrically connected thereto.

The first conductive member of the semiconductor package includes a first conductive portion having a curved shape and connected to the first bonding pad, and a second conductive portion electrically connected to the first conductive portion and having a straight shape.

The second conductive portion of the semiconductor package is disposed in parallel with the upper surface of the substrate.

The second conductive portion of the semiconductor package is disposed to be inclined with respect to the upper surface of the substrate.

The first conductive portion of the semiconductor package is covered by an adhesive member and the second conductive portion is exposed with respect to the adhesive member.

According to another aspect of the present invention, there is provided a method of manufacturing a semiconductor package, including disposing a first semiconductor chip having a first bonding pad on a substrate having first and second connection pads. Electrically bonding a first bonding pad and the first connection pad, pressing a portion of the first conductive member to form a bent portion, and forming a second semiconductor chip having a second bonding pad on the first semiconductor chip. Arranging and electrically bonding the second bonding pad and the second connection pad using a second conductive member.

In the forming of the bent portion, a portion of the first conductive member is pressed in the direction toward the substrate from the upper portion of the substrate to form the bent portion.

The forming of the bent portion may include aligning a shape processing member having an opening overlapping a portion of the first conductive member to the first conductive member, and moving the part of the first conductive member to the substrate toward the substrate. And pressing to form a first conductive portion having a curved shape and a second conductive portion having a straight shape.

In the pressing of a part of the first conductive member, the shape processing member is in contact with the substrate.

In the pressing of a portion of the first conductive member, the shape processing member is spaced apart from the substrate by a predetermined distance.

After pressing a portion of the first conductive member, providing an adhesive member in the opening.

Hereinafter, a semiconductor package and a method of manufacturing the same according to embodiments of the present invention will be described in detail with reference to the accompanying drawings, but the present invention is not limited to the following embodiments, and the general knowledge in the art. Those skilled in the art can implement the present invention in various other forms without departing from the technical spirit of the present invention.

Semiconductor package

2 is a cross-sectional view of a semiconductor package according to an embodiment of the present invention.

2, the semiconductor package 100 includes a substrate 10, a first semiconductor chip 20, a first conductive member 30, a second semiconductor chip 40, and a second conductive member 50. do. In addition, the semiconductor package 100 may further include a molding member 60.

The substrate 10 includes a body 12, a first connection pad 12 and a second connection pad 14, and a ball land 16. In addition, the substrate 10 may further include a solder ball 18.

The body 12 is an insulated substrate having a plate shape. The first connection pad 12 and the second connection pad 14 are disposed on the upper surface of the body 12. In this embodiment, the first connection pad 12 and the second connection pad 14 may be disposed at both edges of the body 12, respectively. The first connection pad 12 is disposed inside the second connection pad 14, and the second connection pad 14 is disposed outside the first connection pad 12.

The ball land 16 is disposed on the bottom surface of the body 12 opposite to the top surface. The ball lands 16 are electrically connected to the first connection pads 12 and / or the second connection pads 14 through conductive vias (not shown) or the like.

The solder ball 18 is electrically connected to the ball land 16. The solder ball 18 is electrically connected to the terminal of an external device.

The first semiconductor chip 20 is disposed at the center of the upper surface of the substrate 10. In the present embodiment, the first semiconductor chip 20 includes a data storage unit (not shown) for storing data and / or a data processing unit (not shown) for processing data. The first semiconductor chip 20 is attached to the central portion of the upper surface of the substrate 10 by the first bonding member 15. The first bonding member 15 may be an adhesive or a double-sided adhesive tape or the like.

The first semiconductor chip 20 includes a first bonding pad 26. The first bonding pads 26 are disposed at both edges of the first semiconductor chip 20, and the first bonding pads 26 correspond to the first connection pads 12 formed on the substrate 10.

The first conductive member 30 is electrically connected to the first bonding pads 26 of the first semiconductor chip 20 and the first connection pads 12 of the substrate 10. In the present embodiment, the first conductive member 30 may be, for example, a conductive wire. The data processed by the input / output or the data processor is output to the data storage of the first semiconductor chip 20 through the first conductive member 30.

A portion of the first conductive member 30 is formed with a bent portion 35 to prevent electrical short with the second conductive member 50 to be described later.

In the present exemplary embodiment, the first conductive member 30 is divided into the first conductive portion 33 and the second conductive portion 36 by the bent portion 35.

An end portion of the first conductive portion 33 is electrically connected to the first bonding pad 26 of the first semiconductor chip 20, and the first conductive portion 33 has a curved shape, for example.

An end portion of the second conductive portion 36 is electrically connected to the first connection pad 12 of the substrate 10, and the second conductive portion 33 has a linear shape, for example.

The bent portion 35 is formed at a portion where the first conductive portion 33 having a curved shape and the second conductive portion 33 having a linear shape meet.

Meanwhile, the second conductive portion 33 having a linear shape may be disposed in contact with the upper surface of the substrate 10 and in parallel with the upper surface of the substrate 10. When the second conductive portion 33 is disposed in contact with the upper surface of the substrate 10 and in parallel with the upper surface of the substrate 10, a short of the second conductive member 50 and the first conductive member 30 to be described later is removed. You can prevent it.

Alternatively, the second conductive portion 33 having a linear shape may be inclined with respect to the upper surface of the substrate 10. When the second conductive portion 33 is disposed to be inclined with respect to the upper surface of the substrate 10, an excessive force is applied to the first conductive member 30 while the first conductive member 30 is bent, thereby preventing excessive force from being applied. Disconnection of the first conductive member 30 can be prevented.

Meanwhile, a second bonding member 45 is disposed between the first semiconductor chip 20 and the second semiconductor chip 40, which will be described later.

The second bonding member 45 covers the upper surface of the first semiconductor chip 20 on which the first bonding pads 26 are formed and the side surface of the first semiconductor chip 20 together. In addition, the second bonding member 45 also covers the first conductive portion 33 of the first conductive member 30 connected to the first bonding pad 26 together with the second conductive member 50 and the first conductive member to be described later. The electrical short of the conductive part 33 is prevented once again.

The second semiconductor chip 40 is disposed on the second bonding member 45 so that the second semiconductor chip 40 and the first semiconductor chip 20 overlap each other. In the present embodiment, the second semiconductor chip 40 includes a data storage unit (not shown) for storing data and / or a data processing unit (not shown) for processing data.

The second bonding pads 46 are disposed on the upper surface of the second semiconductor chip 40. The second bonding pads 46 are disposed at the edges of the second semiconductor chip 40, for example.

The second conductive member 50 electrically connects the second bonding pad 46 formed on the upper surface of the second semiconductor chip 40 and the second connection pad 14 of the substrate 10. In the present embodiment, the second conductive member 50 may be, for example, a conductive wire.

The second conductive member 50 that electrically connects the second bonding pads 46 and the second connection pads 14 has a curved shape, for example. Although the second conductive member 50 has a curved shape in this embodiment, the first conductive member 30, which electrically connects the first bonding pad 26 and the first connection pad 12, is a bent portion 35. Is bent, and further, since a part of the first conductive member 30 is buried by the second bonding member 45, the electrical short of the first conductive member 30 and the second conductive member 50 is prevented. do.

The molding member 60 molds the first semiconductor chip 20, the second semiconductor chip 40, and the exposed second conductive portion 36 and the second conductive member 50 among the first conductive member 30. . The molding member 60 may include, for example, an epoxy resin.

Manufacturing method of semiconductor package

3 to 7 are plan views and cross-sectional views illustrating a method of manufacturing a semiconductor package according to an embodiment of the present invention.

Referring to FIG. 3, in order to manufacture a semiconductor package, a first semiconductor chip 20 is disposed on a substrate 10.

The substrate 10 has a body 12, a first connection pad 12, a second connection pad 14, and a ball land 16. The body 12 is an insulating substrate having a plate shape, and a first connection pad 12 and a second connection pad 14 are formed on an upper surface of the body 12. Specifically, the first connection pad 12 and the second connection pad 14 are formed at both edges of the body 12 of the substrate 10, respectively.

In this embodiment, the interval between the first connection pads 12 formed on both edges of the body 12 will be defined as the first interval D1.

The ball land 16 is formed on the bottom surface opposite to the top surface of the body 12. The ball lands 16 are electrically connected to the first connection pads 12 and / or the second connection pads 14 through conductive vias (not shown) or the like.

The first semiconductor chip 20 is manufactured using a thin film processing process. A data storage unit (not shown) for storing data and a data processor (not shown) for processing data are formed in the first semiconductor chip 20 by using a thin film processing process. First bonding pads 26 may be formed on the surface of the first semiconductor chip 20 to be electrically connected to the data storage unit and / or the data processing unit. In this embodiment, the first bonding pads 26 are formed at both edges of the first semiconductor chip 20, respectively.

Hereinafter, an interval between the first bonding pads 26 formed at both edges of the first semiconductor chip 20 will be defined as a second interval D2.

The first semiconductor chip 20 is formed at the center of the upper surface of the substrate 10, and the first bonding member 15 is disposed between the first semiconductor chip 20 and the substrate 10, and the first semiconductor chip ( 20 and the substrate 10 are attached to each other by the first bonding member 15. The first bonding member 15 may be an adhesive or a double-sided adhesive tape or the like.

After the first semiconductor chip 20 is attached to the upper surface of the substrate 10, the first bonding pads 26 of the first semiconductor chip 20 and the first connection pads 12 of the substrate 10 may be firstly formed. It is electrically connected by the conductive member 30. In the present embodiment, the first conductive member 30 may be a conductive wire. The data processed by the input / output or the data processor is output to the data storage of the first semiconductor chip 20 through the first conductive member 30.

FIG. 4 is a plan view showing a shape processing member for processing the shape of the first conductive member shown in FIG. 3. FIG. 5 is a cross-sectional view taken along the line II ′ of FIG. 4.

4 and 5, the shape processing member 100 for processing the shape of the first conductive member 30 illustrated in FIG. 3 has a plate shape in which a plurality of openings 110 are arranged in a matrix form. .

In this embodiment, the substrate 10 having the first conductive member 30 shown in FIG. 3 is aligned in each opening 110. In the present embodiment, the width of the openings 110 of the shape processing member 100 will be defined as D3.

The width D3 of the openings 110 of the shape processing member 100 is smaller than the first distance D1 between the first connection pads 12 of the substrate 10 and the first bonding pads 26 of the first semiconductor chip 20. It is formed larger than the second gap D2 between them.

FIG. 6 is a cross-sectional view illustrating processing of the shape of the first conductive member using the shape processing apparatus shown in FIG. 4.

After the shape processing member 100 is aligned on the substrate 10 on which the first semiconductor chip 20 is formed, the shape processing member 100 is moved toward the substrate 10, whereby the first semiconductor chip 20 The shape of the first conductive member 30 that electrically connects the first bonding pads 26 of the substrate 1 and the first connection pads 26 of the substrate 10 is deformed by the shape processing apparatus 100. The bent part 33 is formed in the first conductive member 30.

The first conductive member 30 whose shape is deformed by the shape processing member 100 is divided into a portion which is not pressed by the shape processing member 100 and a part pressed by the shape processing member 100.

The part pressed by the shape processing member 100 has a linear shape, for example, and the part which is not pressed by the shape processing member 100 has a curved shape, for example.

Hereinafter, the curved portion of the first conductive member 30 that is not pressed by the shape processing member 100 is defined as the first conductive portion 33, and the shape processing member 100 of the first conductive member 30 is defined. Defining a straight portion whose shape is changed by the second conductive portion 36, and a portion changed from the first conductive portion 33 to the second conductive portion 26 as the bent portion 35 Shall be.

In the present embodiment, when the shape processing member 100 presses the first conductive member 30 to form the first conductive portion 33 and the second conductive portion 36, the shape processing member 100 is For example, the first conductive member 30 may be pressed until the upper surface of the substrate 10 is in contact with the upper surface of the substrate 10.

As the shape processing member 100 presses the first conductive member 30 until it contacts the upper surface of the substrate 10, the second conductive portion 36 of the first conductive member 30 is formed on the substrate 10. The second conductive portion 36 of the first conductive member 30 may be in contact with the upper surface of the substrate 10.

On the other hand, when the shape processing member 100 presses the first conductive member 30 to form the first conductive portion 33 and the second conductive portion 36, the shape processing member 100 is the substrate 10. The first conductive member 30 may be pressed to a place spaced apart from the upper surface by a predetermined interval.

As the shape processing member 100 presses the first conductive member 30 to a position spaced apart from the upper surface of the substrate 10 by a predetermined distance, the second conductive portion 36 of the first conductive member 30 is formed of the substrate 10. It may be inclined with respect to the upper surface of the).

FIG. 7 is a cross-sectional view illustrating the formation of a second conductive member using the shape processing apparatus shown in FIG. 6.

Referring to FIG. 7, the shape of the first conductive member 30 is processed using the shape processing member 100 to form the first conductive portion 33, the bent portion 35, and the second conductive portion 36. After that, the second joining member 45 is disposed in the opening 110 of the shape processing member 100. In the present embodiment, the second bonding member 45 may be a flowable adhesive, and the second bonding member 45 may be disposed in the opening 110 by a stencil method using the shape processing member 100.

The second bonding member 45 covers the top and side surfaces of the first semiconductor chip 20 and the first conductive portion 33 of the first conductive member 30.

Referring back to FIG. 1, after the second bonding member 45 covers the first semiconductor chip 20 using the shape processing member 100, the shape processing member 100 is removed from the substrate 10.

Subsequently, the second semiconductor chip 40 having the second bonding pads 46 is bonded onto the second bonding members 45. In the present embodiment, the second bonding pads 46 are disposed at both edges of the second semiconductor chip 40, respectively.

After the second semiconductor chip 40 is bonded to the second bonding member 45, the second bonding pad 46 of the second semiconductor chip 40 and the second connection pad 14 of the substrate 10 may be formed. 2 is electrically connected by the electrically conductive member 50. As shown in FIG. In the present embodiment, the second conductive member 50 may be, for example, a conductive wire.

In the present embodiment, the second conductive member 50 electrically connecting the second bonding pad 46 and the second connection pad 14 has a curved shape. In the present embodiment, although the second conductive member 50 has a curved shape, since the first conductive member 30 has a bent shape, the electrical conductivity of the second conductive member 50 and the first conductive member 30 may be reduced. Shorts are prevented from each other.

After the second bonding pads 46 and the second connection pads 14 are electrically connected by using the second conductive members 50, the second semiconductor chip 40, the first and second conductive members 30 and 50. Are each molded by a molding member comprising an epoxy resin.

Subsequently, the ball pad 16 of the substrate 10 is bonded to the solder balls 18 to manufacture a semiconductor package.

As described in detail above, a part of the conductive member connecting the bonding pads of the semiconductor chips disposed below and the connection pads of the substrate on which the semiconductor chips are mounted are bent in a relatively upper portion among the plurality of stacked semiconductor chips. The electrically conductive members connecting the bonding pads of the arranged semiconductor chips and the connection pads of the substrate on which the semiconductor chips are mounted are prevented from being electrically shorted to each other.

Although the detailed description of the present invention has been described with reference to the embodiments of the present invention, those skilled in the art or those skilled in the art will have the spirit and scope of the present invention as set forth in the claims below. It will be appreciated that various modifications and variations can be made in the present invention without departing from the scope of the art.

Claims (11)

delete delete delete delete delete delete Disposing a first semiconductor chip having a first bonding pad on a substrate having first and second connection pads; Electrically bonding the first bonding pad and the first connection pad using a first conductive member; Pressing a portion of the first conductive member to form a bent portion; Disposing a second semiconductor chip having a second bonding pad on the first semiconductor chip; And Electrically bonding the second bonding pad and the second connection pad using a second conductive member; In the step of forming the bent portion A portion of the first conductive member is pressed in the direction toward the substrate from the upper portion of the substrate is a manufacturing method of the semiconductor package, characterized in that the bent portion is formed. Disposing a first semiconductor chip having a first bonding pad on a substrate having first and second connection pads; Electrically bonding the first bonding pad and the first connection pad using a first conductive member; Pressing a portion of the first conductive member to form a bent portion; Disposing a second semiconductor chip having a second bonding pad on the first semiconductor chip; And Electrically bonding the second bonding pad and the second connection pad using a second conductive member; Forming the bent portion Aligning a shape processing member having an opening overlapping a portion of the first conductive member with the first conductive member; And And pressing a portion of the first conductive member toward the substrate with the shape processing member to form a first conductive portion having a curved shape and a second conductive portion having a straight shape. Way. The method of claim 8, wherein pressing a part of the first conductive member The shape processing member is in contact with the substrate. The method of claim 8, wherein pressing a part of the first conductive member The shape processing member is spaced apart from the substrate by a predetermined method of manufacturing a semiconductor package. The method of claim 8, further comprising providing an adhesive member in the opening after pressing a portion of the first conductive member.

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