CN115181509A - 一种超柔软新型pi复合胶带的制作方法 - Google Patents
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- 239000002131 composite material Substances 0.000 title claims abstract description 24
- 239000002390 adhesive tape Substances 0.000 title claims abstract description 17
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 12
- 239000004642 Polyimide Substances 0.000 title description 2
- 229920001721 polyimide Polymers 0.000 title description 2
- 239000010410 layer Substances 0.000 claims abstract description 63
- 239000011248 coating agent Substances 0.000 claims abstract description 37
- 238000000576 coating method Methods 0.000 claims abstract description 37
- 239000012790 adhesive layer Substances 0.000 claims abstract description 23
- 239000000853 adhesive Substances 0.000 claims abstract description 12
- 230000001070 adhesive effect Effects 0.000 claims abstract description 12
- 239000000463 material Substances 0.000 claims abstract description 11
- 230000003666 anti-fingerprint Effects 0.000 claims abstract description 10
- 238000000034 method Methods 0.000 claims abstract description 6
- 238000004140 cleaning Methods 0.000 claims abstract description 4
- 230000003678 scratch resistant effect Effects 0.000 claims abstract 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 claims description 36
- 239000003795 chemical substances by application Substances 0.000 claims description 18
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 claims description 9
- 238000002156 mixing Methods 0.000 claims description 7
- 239000004593 Epoxy Substances 0.000 claims description 6
- 239000000203 mixture Substances 0.000 claims description 4
- 238000007639 printing Methods 0.000 claims description 4
- 229920002396 Polyurea Polymers 0.000 claims description 3
- 239000002216 antistatic agent Substances 0.000 claims description 3
- 239000003431 cross linking reagent Substances 0.000 claims description 3
- 239000002270 dispersing agent Substances 0.000 claims description 3
- 239000005056 polyisocyanate Substances 0.000 claims description 3
- 229920001228 polyisocyanate Polymers 0.000 claims description 3
- 229920000642 polymer Polymers 0.000 claims description 3
- 239000002952 polymeric resin Substances 0.000 claims description 3
- 238000006116 polymerization reaction Methods 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 3
- 229920001169 thermoplastic Polymers 0.000 claims description 3
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 claims description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 2
- 238000010345 tape casting Methods 0.000 claims 1
- 230000007062 hydrolysis Effects 0.000 abstract description 4
- 238000006460 hydrolysis reaction Methods 0.000 abstract description 4
- 230000003647 oxidation Effects 0.000 abstract description 4
- 238000007254 oxidation reaction Methods 0.000 abstract description 4
- 238000001035 drying Methods 0.000 description 5
- 238000001723 curing Methods 0.000 description 4
- 229920006264 polyurethane film Polymers 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 238000013035 low temperature curing Methods 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 239000003522 acrylic cement Substances 0.000 description 1
- 229920006243 acrylic copolymer Polymers 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 238000003851 corona treatment Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000004984 smart glass Substances 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
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Abstract
本发明提供了一种超柔软新型PI复合胶带的制作方法，包括以下步骤：一、对PI层材料和TPU层材料进行清洁处理和电晕处理；二、在PI层的一面涂布胶粘剂，形成一胶粘剂层，然后与TPU层的一面进行贴合，形成一复合基层。在PI层的另一面涂布一防静电防指纹耐刮哑黑涂层。本发明可以大幅提升产品的柔软度，同时极大降低了产品成本，且在电气绝缘性能、拉伸性能、撕裂性能、耐水解性能、耐候抗氧化性能各方面性能均很优异。
Description
技术领域
本发明涉及单面胶带领域，具体为一种超柔软新型PI复合胶带的制作方法。
背景技术
随着电子行业发展以及智能手机、智能手表、智能眼镜等电子设备的兴起，目前市面上的PI胶带应用于较高要求的H级电机和变压器线圈绝缘包扎，耐高温线圈端部包扎固定，测温热电阻保护,电容及电线缠结和其它在高温工作条件下的粘贴绝缘。在线路板制造行业中可用于电子保护粘贴,特别适用于SMT耐温保护、电子开关、PCB板金手指保护、电子变压器、继电器等各种需耐高温及防潮保护的电子元器件。一般市面上PI胶带要么太薄，防爆及绝缘效果不够；如果提升厚度，又存在容易贴不住，以及起翘、成本较高且超低温环境下易脆化等问题。
发明内容
为解决上述技术问题，本发明提供了一种超柔软新型PI复合胶带的制作方法，制作而成的超柔软新型PI复合胶带可以大幅提升产品的柔软度，同时极大降低了产品成本，且在电气绝缘性能、拉伸性能、撕裂性能、耐水解性能、耐候抗氧化性能各方面性能均很优异。
为达到上述目的，本发明的技术方案如下：
一种超柔软新型PI复合胶带的制作方法，包括以下步骤：
一、对PI层材料和TPU层材料进行清洁处理和电晕处理；
二、在PI层的一面涂布胶粘剂，形成一胶粘剂层，然后与TPU层的一面进行贴合，形成一复合基层。
进一步的，胶粘剂层的制备过程为，取热塑性高分子树脂100-150份、环氧型固化剂10-15、醋酸乙酯40-50份，将以上重量份的各组分混合均匀，采用逗号刮刀涂布的方式，将混合后的胶粘剂涂布于PI层的一面。
进一步的，取油墨100-150份、甲苯30-40份、混合型聚异氰酸酯固化剂5-15份及有机硅聚合流平剂5-8份、醋酸乙酯20-30份，将以上重量份的各组分混合均匀，采用微凹涂布的方式涂布于PI层的另一面，形成一油墨处理层，再经过烤箱烘干。
进一步的，取抗刮防指纹溶液100-150份、醋酸乙酯20-30份及改性聚脲聚合物消光剂4-6份、耐磨剂5-10份、分散剂2-5份、份抗静电剂10-20份、流平剂0.1-0.5份，将以上重量份的各组分混合均匀，采用微凹涂布的方式涂布于油墨处理层的表面，形成一功能涂层，再经过烤箱烘干。
进一步的，取丙烯酸胶粘剂100-150份、增粘树脂20-50份、醋酸乙酯20-30份、环氧型交联剂5-15份，将以上重量份的各组分混合均匀，采用逗号刮刀涂布的方式涂布于TPU层的另一面，形成一胶黏剂层。
进一步的，在胶黏剂层5的表面贴合离型层后收纳成卷，并进行低温熟化。
本发明通过以上的技术方案，可以达到如下有益效果：
1、PI层和TPU层的共同粘合形成复合基层，替代了传统以PI层为基层的胶带，大大提高了产品的柔软度，从而提升产品的拉伸、撕裂、耐水解、耐候抗氧化性能，极大的降低了产品成本；
2、PI基材表面使用防静电防指纹耐刮哑黑特殊涂层处理（包含油墨处理层以及涂布于油墨处理层上的功能涂层），消除普通基材PI触摸生涩感，减少静电击穿给电气元件造成的损害，使产品贴合与分拆简单，方便操作；
3、通过热固性高性能复合胶粘剂的使用，大幅提升了PI与TPU的复合性能，使得复合基材不易分层。且TPU材料另一面形成有使用高性能丙烯酸共聚物为组分的胶黏剂层，增强了产品的耐候性能，使得应用更为广泛。
附图说明
为了更清楚地说明本发明实施例中的技术方案，下面将对实施例描述中所需要使用的附图作简单地介绍。
图1为本发明所制得的超柔软新型PI复合胶带的结构示意图。
具体元件符号如下：
1PI层；2TPU层；3防静电防指纹耐刮哑黑涂层；31油墨处理层；32功能涂层；4胶粘剂层；5胶黏剂层；6离型层。
具体实施方式
下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地描述。
本发明包括如下步骤：
步骤1、取油墨100-150份、甲苯30-40份、混合型聚异氰酸酯固化剂5-15份及有机硅聚合流平剂5-8份、醋酸乙酯20-30份，将以上重量份的各组分混合均匀待用；
步骤2、取抗刮防指纹溶液100-150份、醋酸乙酯20-30份及改性聚脲聚合物消光剂4-6份、耐磨剂5-10份、分散剂2-5份、份抗静电剂10-20份、流平剂0.1-0.5份，将以上重量份的各组分混合均匀待用；
步骤3、对PI层材料和TPU层材料进行清洁处理和电晕处理；
步骤4、将步骤1制成物采用微凹涂布的方式涂布于步骤3处理后的PI层表面，形成一油墨处理层，经过烤箱烘干后收纳成卷，制成黑色聚氨酯薄膜；
步骤5、将步骤2的制成物采用微凹涂布的方式涂布于步骤4制成的黑色聚氨酯薄膜油墨处理层的表面，形成一功能涂层，经过烤箱烘干后收纳成卷，制成防静电防指纹耐刮哑黑聚氨酯薄膜；
步骤6、胶粘剂的制备：取热塑性高分子树脂100-150份、环氧型固化剂10-15、醋酸乙酯40-50份，将以上重量份的各组分混合均匀待用；
步骤7、采用逗号刮刀涂布的方式，将步骤6的制成物涂布至步骤5所制成的防静电防指纹耐刮哑黑聚氨酯薄膜的PI层的另一面，形成一胶粘剂层；
步骤8、将步骤7的制成品经过烤箱烘干后与步骤3处理后的TPU层的一面贴合后收纳成卷，制成TPI复合基层；
步骤9、胶黏剂的制备：丙烯酸胶粘剂100-150份、增粘树脂20-50份、醋酸乙酯20-30份、环氧型交联剂5-15份，将以上重量份的各组分混合均匀待用；
步骤10、采用逗号刮刀涂布的方式，将步骤9所制备的胶黏剂涂布于TPU层2的另一面，形成一胶黏剂层；
步骤11、将步骤10的制成品烘干，胶黏剂层的表面贴合离型层后收纳成卷；
步骤12、将所制得的产品进行低温熟化；
步骤13、将步骤12的制成品进行相关物性检测（包含，耐磨性能、防指纹性能、防静电性能、耐高低温性能、耐曲性能，拉伸性能等）。
请参考图1所示，本发明所制得的超柔软新型PI复合胶带，包括一PI层1、一TPU层2，该PI层1的表面覆盖一防静电防指纹耐刮哑黑涂层3。该防静电防指纹耐刮哑黑涂层3包括一油墨处理层31和一功能涂层32。该PI层1的下表面与该TPU层2的上表面通过一胶粘剂层4粘合在一起形成一复合基层。该TPU层2的下表面涂布有一胶黏剂层5。该胶黏剂层5的表面贴合有一离型层6。
本发明采用PI层和TPU层的共同粘合的方式使得产品的柔软度大幅提升，同时极大降低了产品成本，且在电气绝缘性能、拉伸性能、撕裂性能、耐水解性能、耐候抗氧化性能各方面均很优异。因其基材设置和性能的多元化，使得应用范围更为广泛。
上述实施案例，仅例示性说明本发明的原理及其功效，而非用于限制本发明。任何熟悉此技术的人士皆可在不违背本发明的精神及范畴下，对上述实施例进行修饰或改变。因此，举凡所属技术领域中具有通常知识者在未脱离本发明所揭示的精神与技术思想下所完的一切等效修饰或改变，仍应由发明的权利要求所涵盖。
Claims (7)
1.一种超柔软新型PI复合胶带的制作方法，包括以下步骤：
一、对PI层材料和TPU层材料进行清洁处理和电晕处理；
二、在PI层的一面涂布胶粘剂，形成一胶粘剂层，然后与TPU层的一面进行贴合，形成一复合基层。
2.如权利要求1所述的一种超柔软新型PI复合胶带的制作方法，其特征在于，胶粘剂层的制备过程为，取热塑性高分子树脂100-150份、环氧型固化剂10-15、醋酸乙酯40-50份，将以上重量份的各组分混合均匀，采用逗号刮刀涂布的方式，将混合后的胶粘剂涂布于PI层的一面。
3.如权利要求2所述的一种超柔软新型PI复合胶带的制作方法，其特征在于，在PI层的另一面涂布一防静电防指纹耐刮哑黑涂层。
4.如权利要求3所述的一种超柔软新型PI复合胶带的制作方法，其特征在于，取油墨100-150份、甲苯30-40份、混合型聚异氰酸酯固化剂5-15份及有机硅聚合流平剂5-8份、醋酸乙酯20-30份，将以上重量份的各组分混合均匀，采用微凹涂布的方式涂布于PI层的另一面，形成一油墨处理层，再经过烤箱烘干。
5.如权利要求4所述的一种超柔软新型PI复合胶带的制作方法，其特征在于，取抗刮防指纹溶液100-150份、醋酸乙酯20-30份及改性聚脲聚合物消光剂4-6份、耐磨剂5-10份、分散剂2-5份、份抗静电剂10-20份、流平剂0.1-0.5份，将以上重量份的各组分混合均匀，采用微凹涂布的方式涂布于油墨处理层的表面，形成一功能涂层，再经过烤箱烘干。
6.如权利要求5所述的一种超柔软新型PI复合胶带的制作方法，其特征在于，取丙烯酸胶粘剂100-150份、增粘树脂20-50份、醋酸乙酯20-30份、环氧型交联剂5-15份，将以上重量份的各组分混合均匀，采用逗号刮刀涂布的方式涂布于TPU层的另一面，形成一胶黏剂层。
7.如权利要求6所述的一种超柔软新型PI复合胶带的制作方法，其特征在于，在胶黏剂层5的表面贴合离型层后收纳成卷，并进行低温熟化。
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