CN115164490A - High-power high-efficiency semiconductor direct cooling machine - Google Patents
High-power high-efficiency semiconductor direct cooling machine Download PDFInfo
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- CN115164490A CN115164490A CN202210872424.1A CN202210872424A CN115164490A CN 115164490 A CN115164490 A CN 115164490A CN 202210872424 A CN202210872424 A CN 202210872424A CN 115164490 A CN115164490 A CN 115164490A
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D15/00—Devices not covered by group F25D11/00 or F25D13/00, e.g. non-self-contained movable devices
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B21/00—Machines, plants or systems, using electric or magnetic effects
- F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D29/00—Arrangement or mounting of control or safety devices
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
- Y02B30/00—Energy efficient heating, ventilation or air conditioning [HVAC]
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention relates to the technical field of semiconductor thermoelectric refrigeration, in particular to a high-power high-efficiency semiconductor direct cooling machine, which comprises: the combined heat exchanger comprises a shell and a combined heat exchanger arranged in the shell, wherein a cold liquid flow channel and a hot liquid flow channel are arranged in the combined heat exchanger; a TANK TANK mounted on one side of the combined heat exchanger; at least three block-shaped water TANKs respectively installed at the upper and lower sides of the combined heat exchanger and at the top of the TANK; the magnetic pump is arranged on the bottom plate of the shell; and the water tank bracket is arranged on the bottom plate of the shell. The invention has the beneficial effects that: the invention has optimized integral structure, smaller appearance size, can be installed in smaller space, and meets the narrow space condition of a dust-free clean room of a chip manufacturing factory; the internal integration level is high, moving parts are reduced, the reliability is higher, and the cost is reduced; meanwhile, the installation is convenient, and the maintenance is convenient.
Description
Technical Field
The invention relates to the technical field of semiconductor thermoelectric refrigeration, in particular to a high-power high-efficiency semiconductor direct cooling machine.
Background
Referring to fig. 1 and 2, the main components of the conventional direct cooling machine applied to a semiconductor chip manufacturing temperature control process are a heat exchanger A2-5, a TANK A2-2, a magnetic pump A2-1, a connecting stainless steel pipe A2-3 and a pipe fitting A2-4, and the direct cooling machine is a high-power direct cooling machine under the influence of cooling power, and two or more independent systems are designed in the system to operate in a combined manner.
In the original scheme, two sets of systems are used for independently designing double pumps, the double pumps are influenced by the positions of equipment connected with an inlet and an outlet, the structural space layout is limited, the connected pipelines cannot be in flexible connection, and then are connected by stainless steel hard pipes to form rigid connection of the magnetic pump A2-5, due to the fact that the sizes of the inlet and outlet pipeline connecting pipes have tolerances, the body of the magnetic pump A2-5 is stressed in different directions to cause vibration of the magnetic pump A2-5, the failure rate of the magnetic pump A2-5 is high, and the pipeline interface of the magnetic pump A2-5 is easily leaked due to the influence of vibration for a long time;
cold and hot pipes coexist in the whole interior, and the production process of the heat-insulating layer is limited due to the limitation of the interior space and structure, so that the heat exchange consumption is caused, and the refrigeration and heating efficiency is influenced;
the internal equipment is independently combined and operated, the hard stainless steel pipes and pipe fittings have more parts and limited layout, so that the size of the whole structure is limited and part of field installation requirements cannot be met;
the pump, the stainless steel pipe and the pipe fitting system have complex assembly and manufacturing procedures, low production efficiency, poor maintainability and operability and inconvenient maintenance;
the internal double-set system operates independently, and the material cost is high.
Disclosure of Invention
Aiming at the problem, the invention provides a high-power high-efficiency semiconductor direct cooling machine, which comprises:
the combined heat exchanger comprises a shell and a combined heat exchanger arranged in the shell, wherein a cold liquid flow channel and a hot liquid flow channel are arranged in the combined heat exchanger;
a TANK TANK mounted on one side of the combined heat exchanger;
at least three block-shaped water TANKs respectively installed at the upper and lower sides of the combined heat exchanger and at the top of the TANK;
the magnetic pump is arranged on the bottom plate of the shell;
the water tank bracket is arranged on the bottom plate of the shell, and the blocky water tank is arranged on the water tank bracket.
The invention adopts the following further technical scheme: the block-shaped water TANK comprises a cold end water TANK and a hot end water TANK, and the cold end is respectively connected with a cold end outlet of the combined heat exchanger and an outlet of the TANK; the heat end of the heat exchanger is respectively connected with a heat end inlet and a heat end outlet of the combined heat exchanger and an outlet and an inlet of the external cooling water joint.
The invention adopts the following further technical scheme: the magnetic pump is characterized by further comprising a soft and hard pipe adapter, wherein the soft and hard pipe adapter is connected with the inlet end of the magnetic pump through a high and low temperature resistant butadiene acrylonitrile rubber hose, and the outlet end of the magnetic pump is connected with a customer using end through a high and low temperature resistant butadiene acrylonitrile rubber hose.
The invention adopts the following further technical scheme: the flexible and hard pipe adapter is arranged above the TANK, the flexible and hard pipe adapter is communicated with the TANK through a hole, and the joint of the flexible and hard pipe adapter and the TANK is sealed by an O-shaped ring.
The invention adopts the following further technical scheme: the combined heat exchanger includes:
an upper housing and a lower housing;
the middle heat exchange module is positioned between the upper shell and the lower shell;
the pair of integral radiating blocks are symmetrically arranged at the positions of two sides of the middle heat exchange module, and the pair of integral radiating blocks and the middle heat exchange module are welded into a whole to form three independent integral structures with heat exchange cavities, and cooling liquid is injected into the heat exchange cavities;
the semiconductor chips are symmetrically arranged at positions between the integral radiating block and the middle heat exchange module.
The invention adopts the following further technical scheme: the pair of integral radiating blocks are respectively connected with the upper shell and the lower shell through bolts; and first O-shaped sealing rings for sealing are uniformly distributed on the integral radiating block.
The invention adopts the following further technical scheme: the middle heat exchange module further comprises a heat dissipation module outer cavity, an integral heat dissipation block and an integral heat dissipation block, wherein the integral heat dissipation block and the integral heat dissipation block are symmetrically arranged on two sides of the heat dissipation module outer cavity, and the integral heat dissipation block are identical in structure.
The invention adopts the following further technical scheme: the integral radiating block comprises an aluminum radiating block outer plate, an aluminum radiating block fin and two aluminum radiating block base plates, wherein the aluminum radiating block fin is arranged on the aluminum radiating block outer plate, and the aluminum radiating block base plates are symmetrically arranged on the aluminum radiating block outer plate.
The invention adopts the following further technical scheme: the integral radiating block comprises a radiating module outer cavity, fin radiating blocks, a water inlet and a water outlet, fixing bolts and second O-shaped sealing rings, wherein the fin radiating blocks are at least provided with two groups and are all arranged inside the radiating module outer cavity, and the second O-shaped sealing rings seal the fin radiating blocks inside the radiating module outer cavity through the fixing bolts.
The invention adopts the following further technical scheme: the fin radiating block comprises a copper radiating block outer plate, a copper radiating block base plate and at least two groups of copper radiating block fins, wherein the copper radiating block base plate is arranged on the copper radiating block outer plate, and the copper radiating block fins are fixed on the copper radiating block base plate.
The invention has the beneficial effects that:
the invention has optimized integral structure, smaller appearance size and can be installed in smaller space, thereby meeting the narrow space condition of a dust-free clean room of a chip manufacturing plant; the internal integration level is high, moving parts are reduced, the reliability is higher, and the cost is reduced; meanwhile, the installation is convenient, and the maintenance is convenient;
the invention can realize the refrigeration and heating functions with larger power through modular combination while reducing the size of the whole structure;
the invention is mainly applied to the temperature control in the reaction cavity of the semiconductor chip production etching process, can realize the quick switching of refrigeration and heating, has thermal inertia less than 3s and meets the accurate temperature control of 0.1 ℃; when the reaction cavity is fed, the heat is taken away by rapid refrigeration; during the intermittent process between the incoming materials, the reaction cavity needs to be heated so as to maintain the temperature in the reaction cavity constant;
the combined heat exchanger and the intermediate heat exchange module are manufactured by a welding forming process, so that the installation procedures are reduced, and the assembly is simpler and more convenient; the sealing surface is not contacted, so that the leakage risk is eliminated, the reliability of the equipment is improved, and the after-sale maintenance work is reduced;
because the contact sealing surface is reduced and the installation matching procedures are reduced, the semiconductor chip arrangement mode can be designed into double rows, the structure is more compact, and the layout is more reasonable; under the condition that the number of the semiconductor chips is the same, the contact area between the whole radiating block and the cooling liquid is increased, the surface temperature of the whole radiating block is more uniform than that of an independent radiating block, and meanwhile, the boundary loss effect of the cooling liquid and the whole radiating block is reduced, so that the overall radiating performance is improved by three factors.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.
FIG. 1 is a schematic diagram of a prior art configuration of the present invention;
FIG. 2 is a side view of the present invention as shown in FIG. 1;
FIG. 3 is a schematic structural view of the present invention;
FIG. 4 is a left side view of FIG. 3 of the present invention;
FIG. 5 is a schematic perspective view of a modular heat exchanger according to the present invention;
fig. 6 is a cross-sectional view of fig. 5 of the present invention.
FIG. 7 is a schematic structural view of an intermediate heat exchange module according to the present invention;
FIG. 8 is an external view of the intermediate heat exchange module of the present invention;
FIG. 9 is a cross-sectional view of the integral heat slug of the present invention;
FIG. 10 is an external view of the integral heat sink of the present invention;
FIG. 11 is a cross-sectional view of the integral heat slug of the present invention;
FIG. 12 is a schematic view of a finned heat sink according to the present invention.
The implementation, functional features and advantages of the present invention will be further described with reference to the accompanying drawings.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that all directional indicators (such as upper, lower, left, right, front, and rear … …) in the embodiments of the present invention are only used to explain the relative position relationship between the components, the movement situation, etc. in a specific posture (as shown in the drawings), and if the specific posture is changed, the directional indicator is changed accordingly.
In addition, the descriptions related to "first", "second", etc. in the present invention are only for descriptive purposes and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, technical solutions between various embodiments may be combined with each other, but must be realized by a person skilled in the art, and when the technical solutions are contradictory or cannot be realized, such a combination should not be considered to exist, and is not within the protection scope of the present invention.
Referring to fig. 3 and 4, a high power and high efficiency semiconductor direct cooling machine includes:
the combined heat exchanger B2 comprises a shell B1 and a combined heat exchanger B2 arranged in the shell B1, wherein a cold liquid flow channel and a hot liquid flow channel are arranged in the combined heat exchanger B2;
a TANK B3, said TANK B3 being mounted on one side of said combined heat exchanger B2;
at least three bulk water TANKs B5, the three bulk water TANKs B5 being installed at an upper side and a lower side of the combined heat exchanger B2 and at a top of the TANK B3, respectively;
the magnetic pump B4, the said magnetic pump B4 is installed on bottom plate of the body B1;
and the water tank-carrying bracket B7 is arranged on the bottom plate of the shell B1, and the block-shaped water tank B5 is arranged on the water tank-carrying bracket B7.
The block-shaped water TANK B5 comprises a cold end and a hot end, and the cold end is respectively connected with a cold end outlet of the combined heat exchanger B2 and an outlet of the TANK TANK B3; the heat end of the heat exchanger is respectively connected with a heat end inlet and a heat end outlet of the combined heat exchanger B2 and an outlet and an inlet of the external cooling water joint B9.
The device is characterized by further comprising a soft and hard pipe adapter B6, wherein the soft and hard pipe adapter B6 is connected with the inlet end of the magnetic pump B4 through a high and low temperature resistant butadiene acrylonitrile rubber hose B8, and the outlet end of the magnetic pump B4 is connected with the customer using end through a high and low temperature resistant butadiene acrylonitrile rubber hose B8.
The soft and hard pipe adapter B6 is arranged above the TANK TANK B3, the soft and hard pipe adapter B6 is communicated with the TANK TANK B3 through a hole, and the joint of the soft and hard pipe adapter B6 and the TANK TANK B3 is sealed by an O-shaped ring.
In the invention, when the combined heat exchanger B2 works, the heat of the cold end is transferred to the hot end, the temperature of the cold end is reduced, the cooling carrier is cooled and cooled, and the cooling carrier is conveyed to the heat load of a user by the magnetic pump B4, so that the heat load of the user is cooled.
When the combined heat exchanger B2 works, the heat at the cold end is transferred to the hot end, the temperature of the hot end rises, and the transferred heat is taken away by external cooling water, so that the temperature of the hot end is stabilized in a required temperature range, and the stable operation of the high-power semiconductor direct cooling machine is met.
The invention has optimized integral structure, smaller appearance size and can be installed in smaller space, thereby meeting the narrow space condition of a dust-free clean room of a chip manufacturing plant; the integration level is high, moving parts are reduced, the reliability is higher, and the cost is reduced; meanwhile, the installation is convenient, and the maintenance is convenient;
the invention can realize the refrigeration and heating functions with larger power through modular combination while reducing the size of the whole structure.
The blocky water tank B5 uses the integrated block water tank instead of a stainless steel pipe and a cutting sleeve pipe, so that the leakage risk at the pipeline joint is reduced, the assembly process is reduced, the production efficiency is improved, and the production cost is reduced.
The inlet and outlet of the magnetic pump B4 of the invention use the high and low temperature resistant nitrile rubber hose B8 to replace a stainless steel pipe, thus eliminating the influence of rigid stress on the pump bearing.
The invention uses the fluorinated liquid and water as heat carriers to respectively realize the heat exchange of the cold end and the hot end, and the carriers can also use media including but not limited to oil, air, nitrogen and the like.
The invention is based on the application of the semiconductor refrigeration technology of Bolty effect, the combined heat exchanger B2, TANK TANK B3 and magnetic pump B4 in the high-power direct cooling machine are core parts, and the shape of the heat exchange, the shape and the material of TANK and the type of the magnetic pump are not limited.
The combined heat exchanger B2, the TANK TANK B3 and the magnetic pump B4 in the invention are core parts, the main blocky water TANK B5 and the hose are connected, the position relation among the three is not limited by the process, and the three can be changed freely.
The block-shaped water tank and the hose can be replaced by water tanks with any shapes such as circular shape, hoses made of other materials, hard pipes and the like.
The invention relates to a high-power high-efficiency direct cooling machine which is based on the application of a platinum effect semiconductor refrigeration and heating technology and is integrated together into a high-power high-efficiency direct cooling machine through a high-efficiency heat exchanger, a stable integrated block-shaped water tank and a self-adaptive pressure balance adjustment liquid supply system.
The invention is mainly applied to the temperature control in the reaction cavity of the semiconductor chip production etching process, can realize the quick switching of refrigeration and heating, has thermal inertia less than 3s and meets the accurate temperature control of 0.1 ℃; when the reaction cavity is fed, the heat is taken away by rapid refrigeration; during the batch process between the incoming materials, the reaction chamber must be heated to maintain the temperature in the reaction chamber constant.
Referring to fig. 5 and 6, the combined heat exchanger B2 includes:
an upper case 1 and a lower case 3;
the middle heat exchange module 2 is positioned between the upper shell 1 and the lower shell 3;
the pair of integral radiating blocks 5 are symmetrically arranged at the positions of two sides of the middle heat exchange module 2, and the integral radiating blocks 5 and the middle heat exchange module 2 are welded into a whole, so that the installation procedures are reduced, the assembly is simpler and more convenient, three independent integral structures with heat exchange cavities are formed, and cooling liquid is injected into the heat exchange cavities; the pair of integral radiating blocks 5 are respectively connected with the upper shell 1 and the lower shell 3 through bolts;
the heat exchanger comprises at least two semiconductor chips 4, wherein the semiconductor chips 4 are symmetrically arranged at positions between an integral heat dissipation block 5 and an intermediate heat exchange module 2; the semiconductor chip 4 can be mounted with 32 blocks at most, but the number is not limited, and the whole structure can be changed according to actual conditions.
In the invention, when the power supply works, the semiconductor chip 4 can transfer the heat of one surface to the other surface, namely, the cold and the heat are respectively generated on the two surfaces of the semiconductor chip 4 and are transferred into the heat exchange cavity through the integral radiating block 5, and the heat exchange with the cooling liquid is realized in the heat exchange cavity.
Under the condition that the number of the semiconductor chips is the same, the contact area between the whole radiating block and the cooling liquid is increased, the surface temperature of the whole radiating block is more uniform than that of the independent radiating block, and meanwhile, the boundary loss effect of the cooling liquid and the whole radiating block is reduced, so that the overall radiating performance is improved by three.
The liquid-cooled heat exchanger for the semiconductor direct cooling machine has small structural size and high refrigeration power, and the single unit can reach 4000W; the heating power is high and can reach 7000W; the heat exchange quantity reaches 10000W/W.
In the embodiment, the cooling liquid can be selected from water, can be used in places with low requirements and has low cost; of course, other types of cooling fluid may be chosen, which have a higher specific heat capacity and thus a better heat absorption, but which are more expensive, the choice being chosen according to the circumstances.
A first O-shaped sealing ring 6 for sealing is uniformly arranged on the integral radiating block 5, and the integral radiating block 5 is sealed between the upper shell 1 and the lower shell 3 by the first O-shaped sealing ring 6.
A heat exchange cavity is formed in the upper shell 1, and a first inlet 1-1 and a first outlet 1-2 which are communicated with the outside are formed in the heat exchange cavity; a heat exchange cavity is formed in the lower shell 3, and a first inlet 3-1 and a first outlet 3-2 communicated with the outside are formed in the heat exchange cavity; a heat exchange cavity is formed in the middle heat exchange module 2, and a first inlet 2-4 and a first outlet 2-5 which are communicated with the outside are formed in the heat exchange cavity.
In the invention, inlets and outlets are arranged on the upper shell 1, the lower shell 3 and the middle heat exchange module 2, and cold energy and heat energy are taken away by cooling liquid, thereby realizing the effects of refrigeration and heating; the inlet and outlet of the upper shell 1 and the lower shell 3 are respectively connected with a cooling liquid external pipeline, and the heat exchange between the external cooling water and the heat or cold conducted from the semiconductor chip 4 to the heat dissipation plate is realized during the work so as to maintain the normal working temperature of the semiconductor refrigeration chip 4.
In the invention, the semiconductor refrigeration chip 4 is mainly a plurality of square thin blocks consisting of PN junctions and ceramic heat conduction layers, and one side of the chip is refrigerated and the other side of the chip is heated simultaneously when the chip works; and the contact surface of the heat exchange module 2 and the middle heat exchange module are the same in performance and the same in refrigeration or heating.
Referring to fig. 7 and 8, the intermediate heat exchange module 2 further includes a heat dissipation module outer cavity 2-1, an integral heat dissipation block upper 2-2, and an integral heat dissipation block lower 2-3, wherein the integral heat dissipation block upper 2-2 and the integral heat dissipation block lower 2-3 are symmetrically disposed on two sides of the heat dissipation module outer cavity 2-1, and the integral heat dissipation block upper 2-2 and the integral heat dissipation block lower 2-3 have the same structure.
The material of the outer cavity 2-1 of the heat dissipation module is 6061 aluminum, and the outer cavity is used as a frame of the whole intermediate heat exchange module 2, so that the structure is compact, the strength is high, the aluminum material is convenient to process, and the weight is light; the upper part 2-2 of the integral radiating block, the lower part 2-3 of the integral radiating block and the outer cavity 2-1 of the heat exchange module are integrally welded and formed, special welding aluminum brazing is adopted for forming, no sealing surface is formed after forming, tightness and no leakage exist, and assembly is simpler and more convenient.
Referring to fig. 7, 8 and 9, the integral heat sink 2-2 includes an aluminum heat sink outer plate 2-2-1, an aluminum heat sink fin 2-2-2 and two aluminum heat sink base plates 2-2-3, wherein the aluminum heat sink fin 2-2-2 is disposed on the aluminum heat sink outer plate 2-2-1, and the aluminum heat sink base plates 2-2-3 are symmetrically mounted on the aluminum heat sink outer plate 2-2-1.
An aluminum radiating block outer plate 2-2-1 serves as a bottom plate of the whole integral radiating block 2-2, plays a role of a fixed supporting frame and is fixed with a radiating module outer cavity 2-1 in a welding mode; the surface of the heat sink is directly bonded to the hot side of the TE chip, and the heat source is conducted to the aluminum heat sink substrate 2-2-3. The aluminum heat dissipation block base plate 2-2-3 is located between the aluminum heat dissipation block outer plate 2-2-1 and the aluminum heat dissipation block fins 2-2-2, internal stress is mainly absorbed in the processing process of the aluminum heat dissipation block fins 2-2-2 to ensure that the aluminum heat dissipation block fins 2-2-2 are not deformed in the processing process, and the heat dissipation block base plate 2-3 conducts heat conducted from the aluminum heat dissipation block outer plate 2-2-1 to the aluminum heat dissipation block fins 2-2-2.
The aluminum radiating block fins 2-2-2 are processed by a relieving process, eight groups of fins are arranged in two rows according to the flow direction of liquid, the fins are arranged in the two rows and are continuous and provided with multiple line segments, the aluminum radiating block fins 2-2-2 are dense, the integral forming is realized, and the relieving process difficulty is high. Compared with the existing multi-group small fin series connection assembly, the heat exchanger is simple in assembly, high in heat exchange efficiency, small in overall structure volume and light in weight.
Referring to fig. 10 and 11, the integral heat dissipation block 5 includes a heat dissipation module outer cavity 5-1, fin heat dissipation blocks 5-2, water inlets and water outlets 5-3, fixing bolts 5-4, and second O-ring seals 5-5, at least two groups of the fin heat dissipation blocks 5-2 are provided, and are all disposed inside the heat dissipation module outer cavity 5-1, and the second O-ring seals 5-5 seal the fin heat dissipation blocks 5-2 inside the heat dissipation module outer cavity 5-1 through the fixing bolts 5-4.
Referring to fig. 10, 11 and 12, the finned heat sink 5-2 includes a copper heat sink outer plate 5-2-1, a copper heat sink base plate 5-2-2 and at least two sets of copper heat sink fins 5-2-3, the copper heat sink base plate 5-2-2 is disposed on the copper heat sink outer plate 5-2-1, and the copper heat sink fins 5-2-3 are fixed on the copper heat sink base plate 5-2-2.
An outer plate 5-2-1 of the copper radiating block is used as a bottom plate of the whole radiating block, plays a role of a fixed support frame and is fixed with an outer cavity 5-1 of a radiating module through a fixing bolt 5-4; the surface of the heat sink is directly bonded to the hot surface of the TE chip, and the heat source is conducted to the copper heat sink substrate 5-2-2.
The copper radiating block base plate 5-2-2 is positioned between the copper radiating block outer plate 5-2-1 and the copper radiating block fin 5-2-3, and internal stress is mainly absorbed in the processing process of the copper radiating block fin 5-2-3 so as to ensure that the copper radiating block fin 5-2-3 is not deformed in the processing process. The copper radiating block base plate 5-2-2 conducts heat conducted from the radiating block outer plate to the copper radiating block fin 5-2-3.
The copper radiating block fins 5-2-3 are processed by a relieved tooth process, eight groups of fins with double rows are arranged according to the flow direction of liquid, the fins with double rows and continuous multiple line sections are arranged, the copper radiating block fins 5-2-3 are dense, the integral forming is realized, and the relieved tooth process difficulty is high. Compare with the equipment of establishing ties of current multiunit small fin, the assembly is simple, and the radiating efficiency is high, and overall structure is small, and sealed face becomes one by a plurality of faces, reveals risk greatly reduced.
It is to be understood that the above description is not intended to limit the present invention, and the present invention is not limited to the above examples, and those skilled in the art may make various changes, modifications, additions and substitutions within the spirit and scope of the present invention.
Claims (10)
1. A high-power high-efficiency semiconductor vertical cooler is characterized by comprising:
the combined heat exchanger (B2) comprises a shell (B1) and a combined heat exchanger (B2) arranged in the shell (B1), wherein the inside of the combined heat exchanger (B2) comprises a cold liquid flow channel and a hot liquid flow channel;
a TANK TANK (B3), said TANK TANK (B3) being mounted on one side of said combined heat exchanger (B2);
at least three bulk water TANKs (B5), the three bulk water TANKs (B5) being installed at the upper and lower sides of the combined heat exchanger (B2) and at the top of the TANK TANK (B3), respectively;
the magnetic pump (B4), the said magnetic pump (B4) is installed on bottom plate of the body (B1);
the water tank bracket (B7) is arranged on the bottom plate of the shell (B1), and the block-shaped water tank (B5) is arranged on the water tank bracket (B7).
2. The high-power high-efficiency semiconductor direct cooling machine according to claim 1, wherein the block water TANK (B5) comprises a cold end water TANK and a hot end water TANK, and the cold end is respectively connected with the cold end outlet of the combined heat exchanger (B2) and the outlet of the TANK TANK (B3); the heat end of the heat exchanger is respectively connected with the heat end inlet and the heat end outlet of the combined heat exchanger (B2) and the outlet and the inlet of the external cooling water joint (B9).
3. The high-power high-efficiency semiconductor vertical cooler according to claim 1, further comprising a soft-hard pipe adapter (B6), wherein the soft-hard pipe adapter (B6) is connected with the inlet end of the magnetic pump (B4) through a high-temperature and low-temperature resistant butadiene acrylonitrile rubber hose (B8), and the outlet end of the magnetic pump (B4) is connected with the customer using end through a high-temperature and low-temperature resistant butadiene acrylonitrile rubber hose (B8).
4. The high-power high-efficiency semiconductor direct cooling machine according to claim 3, characterized in that the soft and hard pipe adapter (B6) is arranged above the TANK TANK (B3), the soft and hard pipe adapter (B6) is communicated with the TANK TANK (B3) through a hole, and the joint of the soft and hard pipe adapter and the TANK TANK (B3) is sealed by an O-shaped ring.
5. The high power high efficiency semiconductor direct cooling machine according to claim 1, wherein the combined heat exchanger (B2) comprises:
an upper case (1) and a lower case (3);
the middle heat exchange module (2) is positioned between the upper shell (1) and the lower shell (3);
the pair of integral radiating blocks (5) are symmetrically arranged at the positions of two sides of the middle heat exchange module (2), the integral radiating blocks (5) and the middle heat exchange module (2) are welded into a whole to form three independent integral structures with heat exchange cavities, and cooling liquid is injected into the heat exchange cavities;
the heat exchanger comprises at least two semiconductor chips (4), wherein the semiconductor chips (4) are symmetrically arranged at positions between the integral heat dissipation block (5) and the middle heat exchange module (2).
6. The high-power high-efficiency semiconductor direct cooling machine according to claim 5, wherein a pair of integral radiating blocks (5) are respectively connected with the upper shell (1) and the lower shell (3) through bolts; and first O-shaped sealing rings (6) for sealing are uniformly distributed on the integral radiating block (5).
7. The high-power high-efficiency semiconductor direct cooling machine according to claim 5, wherein the intermediate heat exchange module (2) further comprises a heat dissipation module outer cavity (2-1), an integral heat dissipation block upper part (2-2) and an integral heat dissipation block lower part (2-3), wherein the integral heat dissipation block upper part (2-2) and the integral heat dissipation block lower part (2-3) are symmetrically arranged on two sides of the heat dissipation module outer cavity (2-1), and the integral heat dissipation block upper part (2-2) and the integral heat dissipation block lower part (2-3) have the same structure.
8. The high-power high-efficiency semiconductor direct cooling machine according to claim 7, wherein the integral radiating block upper part (2-2) comprises an aluminum radiating block outer plate (2-2-1), aluminum radiating block fins (2-2-2) and two aluminum radiating block base plates (2-2-3), wherein the aluminum radiating block fins (2-2-2) are arranged on the aluminum radiating block outer plate (2-2-1), and the aluminum radiating block base plates (2-2-3) are symmetrically arranged on the aluminum radiating block outer plate (2-2-1).
9. The high-power high-efficiency semiconductor direct cooling machine according to claim 5, wherein the integral heat dissipation block (5) comprises a heat dissipation module outer cavity (5-1), fin heat dissipation blocks (5-2), a water inlet/outlet (5-3), a fixing bolt (5-4) and a second O-shaped sealing ring (5-5), at least two groups of the fin heat dissipation blocks (5-2) are arranged and are arranged in the heat dissipation module outer cavity (5-1), and the second O-shaped sealing ring (5-5) seals the fin heat dissipation blocks (5-2) in the heat dissipation module outer cavity (5-1) through the fixing bolt (5-4).
10. The high-power high-efficiency semiconductor direct cooling machine according to claim 9, wherein the fin radiating block (5-2) comprises a copper radiating block outer plate (5-2-1), a copper radiating block base plate (5-2-2) and at least two groups of copper radiating block fins (5-2-3), the copper radiating block base plate (5-2-2) is arranged on the copper radiating block outer plate (5-2-1), and the copper radiating block fins (5-2-3) are fixed on the copper radiating block base plate (5-2-2).
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| CN115164490B (en) | 2023-03-10 |
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