CN110267497B

CN110267497B - Electronic equipment heat dissipation method and heat radiator

Info

Publication number: CN110267497B
Application number: CN201910555532.4A
Authority: CN
Inventors: 崔巍; 王家喜; 李恺锋
Original assignee: Guizhou Yonghong Heat Transfer & Cooling Technology Co ltd
Current assignee: Guizhou Yonghong Heat Transfer & Cooling Technology Co ltd
Priority date: 2019-06-25
Filing date: 2019-06-25
Publication date: 2020-08-28
Anticipated expiration: 2039-06-25
Also published as: CN110267497A

Abstract

The invention discloses a heat dissipation method of electronic equipment and a heat radiator, wherein the heat radiator comprises at least two metal plates; the metal plates are arranged in parallel at intervals, fins are arranged between the adjacent metal plates, and the outer sides of the metal plates at the left end and the right end are connected with the side plates; two outer end faces of the fins along the flow direction of the cooling medium are provided with seals. The invention transmits the heat emitted by the electronic equipment to the cooling medium through three different paths of the seal, the metal plate and the fin, meets the heat dissipation requirement of the electronic equipment by the lightest structural weight, has high heat transmission efficiency, can design different installation structures according to different installation requirements of the electronic equipment, and has low structural weight and good mechanical structural performance.

Description

Electronic equipment heat dissipation method and heat radiator

Technical Field

The invention relates to the technical field of electronic equipment radiator design, in particular to a novel efficient heat exchange radiating method and a radiator.

Background

Since the advent of silicon integrated circuits, the use of electronic devices in military and civilian applications has increased dramatically. With the increasing of the heating power and the decreasing of the volume of the electronic device, the heating density rises rapidly, and the temperature of the electronic device rises rapidly, so that the electronic device has more and more faults, which greatly affects the reliability of the system or the device, even causes catastrophic consequences, and the heat dissipation problem of the electronic device becomes the key point of the miniaturization of the electronic device. Therefore, in order to meet the cooling requirement of modern electronic equipment, it is important to develop a new efficient heat sink for improving the reliability of the electronic equipment and reducing the total life cost of the electronic equipment.

As shown in fig. 5, the heat sink for electronic devices is an extruded profile, and is only suitable for electronic devices with small heat generating power. Fig. 6 shows another heat sink for electronic devices, which uses internal fins to increase the heat transfer area between the heat sink and the cooling medium to achieve the heat dissipation requirement of the electronic devices. As shown in fig. 7, the heat sink for electronic equipment uses fins to increase the heat transfer area between the heat sink and the cooling medium, so as to meet the heat dissipation requirement of the electronic equipment. When the heat generating power of the electronic device is high, the heat sink shown in fig. 5, 6 and 7 cannot meet the heat dissipation requirement of the electronic device.

Disclosure of Invention

The invention aims to design a novel efficient electronic equipment heat dissipation method and a radiator, which meet the heat dissipation requirement of electronic equipment by the lightest structural weight, have high heat transfer efficiency, can design different installation structures according to different installation requirements of the electronic equipment, have low structural weight and good mechanical structural performance.

The invention is realized by the following technical scheme:

a kind of electronic equipment radiator, including at least two metal plates; the metal plates are arranged in parallel at intervals, fins are arranged between the adjacent metal plates, and the outer sides of the metal plates at the left end and the right end are connected with the side plates;

two outer end faces of the fins along the flow direction of the cooling medium are provided with seals.

Furthermore, the metal plate is connected with the side plate and the fin through welding.

Furthermore, the metal plates are flat plates with equal thickness or different thicknesses (the equal thickness or different thicknesses mean that the thicknesses of a plurality of metal plates are equal or different, and the thickness change is mainly suitable for remote heat transfer), and the shapes of the metal plates are designed according to requirements.

Further, adjacent metal plates may be spaced apart at equal or unequal distances (the spacing being varied to accommodate remote heat transfer).

Further, the fins positioned between different metal plates include heat transfer structures such as triangular fins, zigzag fins, straight-through fins, corrugated fins, louver-shaped fins and the like.

Further, the thickness of the metal plate is much greater than the thickness of the fins (e.g., the thickness of the metal plate is several times the thickness of the fins).

Further, the surface of the seal is provided with a bulge or a sunken hole. The bulge structure is processed by a machining mode, and is opposite to the bulge.

Further, the surface of the side plate is provided with a mounting structure connected with the electronic equipment. For example, the mounting surface (heat transfer surface) of the electronic device may be on the seal side, on the large reference surface on the fin side, on the boss structure on the header side, or on the sink structure on the fin side. Similarly, the installation form, position and size of the radiator can be determined according to the installation structure of the radiator, and the installation form, position and size can be determined by machining, and the installation form, position and size can be determined on a large reference surface of the fin side, on a convex structure of the end socket side or on a sunken structure of the fin side.

The heat dissipation method for electronic equipment transfers the heat from electronic equipment to cooling medium via three different paths including seal, metal plate and fins.

Further, heat emitted by the electronic equipment exchanges heat with a cooling medium sequentially through the seal, the metal plate and the fins.

Compared with the existing radiator, the radiator has the following advantages:

(1) the heat transfer efficiency is high;

(2) different mounting structures can be designed according to different mounting requirements of electronic equipment, the mounting modes comprise a mounting mode of a radiator and a mounting mode of an electronic component needing cooling on the surface of the radiator, specifically, all parts of a product are integrated after a welding procedure, different structural appearances are designed according to the difference between the mounting structure of the radiator and the mounting structure of the electronic component, and the required appearance structures, such as a boss structure, and the following counter bore structures, such as the size and the direction of a mounting hole position, are processed after a machining procedure;

(3) the structure weight is low;

(4) the mechanical structure performance is good.

The invention welds the side plate, the seal, the metal plate, the fin and other parts together by a welding process mode, and finally processes the side plate, the seal, the metal plate, the fin and other parts into the radiator of the electronic equipment by a mechanical processing mode. Compared with a plate-fin radiator, the main differences of the invention are as follows: the plate-fin heat exchanger relates to heat exchange among 2 or more than 2 flowing media, and heat is transferred from a high-temperature flowing medium to a low-temperature medium, and the starting point of the invention is as follows: the heat dissipation capacity of the traditional electronic equipment radiator is improved, the heat dissipation capacity of the electronic equipment is greatly improved by increasing the heat exchange area through fins and the like on a relatively small heat transfer surface of the electronic equipment, and the heat emitted by the electronic equipment is greatly transferred to a flowing cooling medium through the heat dissipation device.

The invention can reasonably select the parameters of the seal, the fin and the metal plate according to the heat productivity of the electronic equipment, reasonably design the structure, meet the heat dissipation requirement of the electronic equipment by the lightest structural weight, and has great effect on the civil field and more obvious significance on the aerospace field with strict weight requirement.

Drawings

FIG. 1 is a schematic diagram of a high efficiency electronic device heat sink configuration of the present invention;

FIG. 2 is a schematic diagram of the components of the high efficiency electronic heat sink of the present invention;

FIG. 3 is a general view of the heat dissipation principle of the heat sink of the present invention;

FIG. 4 is a partial schematic view (schematic view of heat transfer path) of the heat sink of the present invention;

FIGS. 5-7 are schematic diagrams of three different conventional electronic device heat sinks;

FIGS. 8 and 9 are two conventional cross-flow plate-fin heat sink forms;

fig. 10 is a partial heat transfer path of the conventional cross-flow plate-fin heat sink corresponding to fig. 8 and 9.

In the figure: 1-side plate, 2-metal plate, 3-fin and 4-seal.

Detailed Description

The invention is further described with reference to the accompanying drawings, but the scope of protection claimed is not limited thereto.

As shown in fig. 8 to 10, in a conventional heat sink, heat is transferred from a hot fluid to a cold fluid only between two hot fluids, a part of the heat is transferred to the cold fluid through a metal plate (primary heat transfer path), a part of the heat is transferred to the cold fluid through the metal plate and fins (secondary heat transfer path), the heat of the hot fluid is transferred to the cold fluid, the thinner fins provide heat transfer amount by increasing heat transfer area, the thinner fins can only transfer the heat in a short distance, and the larger the distance from the metal plate, the lower the heat transfer efficiency of the fins.

In this embodiment, the radiator mainly includes four parts, namely, a side plate 1, a metal plate 2, a fin 3, and a seal 4, and the final state of the radiator is obtained by assembling, welding, machining, and the like of each part. As shown in fig. 1 and 2, the heat sink includes a plurality of metal plates 2, the plurality of metal plates 2 are arranged in parallel at intervals, fins 3 are arranged between adjacent metal plates 2, and the outer sides of the metal plates 2 at the left and right ends are respectively connected with a side plate 1; both outer end faces of the fins 3 in the flow direction of the cooling medium are provided with seals 4. The metal plate 2 is connected with the side plate 1, the fin 3 and the seal 4 in a welding mode. The metal plates 2 are flat plates with equal thickness, and the spacing distance between the adjacent metal plates 2 is different. The types of the fins 3 between different metal plates 2 may be different or the same according to different heat dissipation requirements. The surface of the seal 4 is provided with a bulge or a lower counter bore.

The functions of the components are as follows:

(1) the side plate 1, its main effect is:

a. connecting the seal 4 and the metal plate 2 to weld all parts into a whole;

b. as the main bearing structure of the radiator;

(2) the metal plate 2, its main effect is:

a. parts such as the seal 4, the fin 2, the side plate 1 and the like are connected and supported to form a whole;

b. a main body serving as a heat sink for conducting heat generated from the electronic device to a cooling medium;

c. bearing parts of the radiator.

The metal plate 2 may be made of a metal material having high thermal conductivity such as aluminum alloy or copper.

(3) Fin 3, its main effect is:

a. connecting and supporting the metal plate 2;

b. the radiator is used as a main body of the radiator, the radiating area of the radiator is increased, and heat emitted by the electronic equipment is conducted to the air;

c. bearing parts of the radiator.

The working principle of the high-efficiency radiator is as follows:

as shown in fig. 3 and 4, when the electronic apparatus generates heat and a cooling medium such as air flows through the heat sink when the electronic apparatus is operating, the seal 4, the metal plate 2, and the fins 3 come into contact with the cooling medium (for example, air), and the total heat of the electronic apparatus is transferred to the cooling medium all through the primary, secondary, and tertiary heat transfer paths. The primary heat transfer path is a path through which heat of the electronic equipment is directly transferred to the cooling medium through the seal 4, and the secondary and tertiary heat transfer paths are paths through which heat emitted from the electronic equipment is transferred to the cooling medium through the metal plate 2 and the fins 3.

The thicker metal plate 2 is beneficial to long-distance heat transfer, and because of the huge contact area of the fins 3 and the cooling medium, most heat is transferred by the secondary and tertiary heat transfer paths, so that the higher heat exchange capacity of the radiator is completed.

Specifically, as shown in fig. 4, a part of heat is transferred from the hot fluid to the cold fluid through the primary heat transfer path, and a part of heat is transferred from the hot fluid to the cold fluid through the secondary heat transfer path, as in the case of heat transfer of the conventional heat sink, in the secondary heat transfer path, although the heat transfer efficiency of the metal plate 2 is lower as the distance from the heat source is larger, similarly to the fin heat transfer efficiency of the conventional heat sink, the thickness of the metal plate 2 is several times larger than that of the fin 3, the heat transfer path of the metal plate 2 is longer than that of the fin of the conventional heat sink (only comparing the secondary heat transfer path), and heat can be transferred to cold air through the tertiary heat transfer path at a place far from the heat source. The secondary heat transfer path has the greatest effect of transferring heat in a long distance, and the heat can be maximally transferred out at the positions close to and far away from the heat source by matching with the tertiary heat transfer path. The third heat transfer area, which is the main heat transfer path in the invention, is large, thus being beneficial to the heat transfer.

In the traditional radiator, a heat source can increase the heat transfer area through structures such as fins and the like, and heat is transferred to cold fluid. In the application of heat dissipation of electronic devices, the heat can not be transferred out by infinitely utilizing structural components such as fins like the traditional heat radiator, the electronic equipment is only transferred on a heat transfer surface, the heat transfer area of the electronic equipment is limited, and the heat transfer quantity of the traditional heat radiator of the electronic equipment is very limited. (although electronic devices may also use liquid cooling to increase the heat transfer area using heat sinks, the need for a cooling system increases the liability of the system compared to the present invention.

In the invention, the long-distance heat transfer of the secondary heat transfer path is mainly utilized, and the fins and other tertiary heat transfer paths are matched, so that the heat transfer area is increased (the heat transfer area of the traditional electronic equipment is limited), and the heat is efficiently transferred out.

Claims

1. A heat dissipation method for electronic equipment is characterized in that: the heat emitted by the electronic equipment is transferred to the cooling medium through three different paths of the seal, the metal plate and the fin, and the heat emitted by the electronic equipment exchanges heat with the cooling medium sequentially through the seal, the metal plate and the fin;

the adopted radiator of the electronic equipment comprises at least two metal plates, the metal plates are arranged in parallel at intervals, fins are arranged between the adjacent metal plates, the outer sides of the metal plates at the left end and the right end are connected with the side plates, and the fins are provided with sealing strips along two outer end faces of the flow direction of a cooling medium.

2. The method for dissipating heat of an electronic device according to claim 1, wherein: the metal plate is connected with the side plate and the fins through welding.

3. The method for dissipating heat of an electronic device according to claim 1, wherein: the metal plate is a flat plate with equal thickness or different thicknesses.

4. The method for dissipating heat of an electronic device according to claim 1, wherein: the adjacent metal plates are spaced at equal or unequal distances.

5. The method for dissipating heat of an electronic device according to claim 1, wherein: the types of fins located between different metal plates include triangular fins, zigzag fins, straight-through fins, corrugated fins, and louver fins.