CN115148623A - Wafer post-processing device - Google Patents
Wafer post-processing device Download PDFInfo
- Publication number
- CN115148623A CN115148623A CN202111671422.8A CN202111671422A CN115148623A CN 115148623 A CN115148623 A CN 115148623A CN 202111671422 A CN202111671422 A CN 202111671422A CN 115148623 A CN115148623 A CN 115148623A
- Authority
- CN
- China
- Prior art keywords
- wafer
- retainer ring
- post
- edge
- processing device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F26—DRYING
- F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
- F26B5/00—Drying solid materials or objects by processes not involving the application of heat
- F26B5/08—Drying solid materials or objects by processes not involving the application of heat by centrifugal treatment
Abstract
The invention discloses a wafer post-processing device, which comprises: the driving mechanism vertically clamps the wafer and drives the wafer to rotate; a supply arm which swings at a side surface of the wafer and supplies liquid to a surface of the wafer through a nozzle thereon; a retainer ring provided on an outer peripheral side of the drive mechanism; the retainer ring is provided with a diversion trench which is arranged along the edge of the contour of the retainer ring, and the diversion trench accumulates and guides the fluid thrown out from the wafer to the lower part of the retainer ring.
Description
Technical Field
The invention belongs to the technical field of wafer drying, and particularly relates to a wafer post-processing device.
Background
Wafer fabrication is a key link in the development of the Integrated Circuit (IC) industry. As integrated circuit feature sizes continue to shrink, wafer surface quality requirements become higher and higher, and wafer fabrication processes have tighter and tighter control over the size and number of defects. The contaminants are important factors causing the quality reduction and even the generation of defects on the surface of the wafer, so that the contaminants on the surface of the wafer need to be desorbed by adopting a cleaning technology so as to obtain an ultra-clean surface, and particularly in the post-cleaning and drying process of chemical mechanical polishing, the liquid mark defects are easily encountered, the local change of the thickness of the oxide is caused, and the chip manufacturing yield is seriously influenced.
Patent CN111540702B discloses a vertical marangoni wafer processing device, which adopts a semicircular retaining ring structure with an arc-shaped inner wall surface, wherein the retaining ring has hydrophilicity, and can catch liquid thrown out from the edge of a wafer and guide the liquid towards two ends of the retaining ring, so as to prevent the liquid from being thrown to the wall surface of a higher position such as the top wall of a chamber and prevent fine liquid drops caused by liquid impact and sputtering at the positions from polluting the front space of the wafer and the surface of the wafer.
When liquid is thrown from the wafer onto the inner arc surface of the semi-ring-shaped check ring, most of the liquid flows away along the inner wall of the check ring towards the two terminal directions of the semi-ring-shaped outer check ring; however, a small amount of liquid exists and flows along the inner wall of the retaining ring in the direction away from the back plate, so that liquid drops are accumulated at the edge of the retaining ring and randomly drop onto the surface of the wafer, and the treatment effect of the surface of the wafer is affected.
Disclosure of Invention
The present invention aims to solve at least to some extent one of the technical problems existing in the prior art.
To this end, an embodiment of the present invention provides a wafer post-processing apparatus, which includes:
the driving mechanism vertically clamps the wafer and drives the wafer to rotate;
a supply arm which swings at a side surface of the wafer and supplies liquid to a surface of the wafer through a nozzle thereon;
a retainer ring provided on an outer peripheral side of the drive mechanism;
the retainer ring is provided with a diversion trench which is arranged along the edge of the contour of the retainer ring, and the diversion trench accumulates and guides the fluid thrown out from the wafer to the lower part of the retainer ring.
In a preferred embodiment, the diversion trench is disposed on the inner side surface and/or the outer end surface of the retainer ring edge.
As a preferred embodiment, the number of the flow guide grooves is at least one.
In a preferred embodiment, the diversion trench is arranged perpendicular to the side surface of the retainer ring edge.
In a preferred embodiment, the cross section of the flow guide groove is in a long strip shape, and the ratio of the depth to the width of the flow guide groove is matched with the capillary force of the hydrophilic fluid.
As a preferred embodiment, the ratio of the depth to the width of the flow guide groove is 0.1-50.
In a preferred embodiment, the retainer ring is of an annular structure, and the edge of the retainer ring extends towards the center of the retainer ring; the inner side surface of the edge is provided with guide grooves which are arranged at intervals along the radial direction of the retainer ring.
In a preferred embodiment, the width of the guide groove near the center of the retainer ring is smaller than the width of the guide groove far from the center of the retainer ring.
In a preferred embodiment, the diversion trench is obliquely arranged relative to the side surface of the retainer ring edge.
In a preferred embodiment, the retaining ring is detachably fixed on a back plate of the wafer post-processing device so as to cover the driving mechanism as a whole.
The beneficial effects of the invention include: the flow guide groove arranged on the retainer ring accumulates and guides the fluid thrown out from the wafer to the lower part of the retainer ring, so that the liquid drops at the top of the retainer ring are effectively prevented from accumulating and dripping, and the effect of surface treatment of the wafer is effectively ensured.
Drawings
The advantages of the invention will become clearer and more readily appreciated from the detailed description given with reference to the following drawings, which are given by way of illustration only, and which do not limit the scope of protection of the invention, wherein:
FIG. 1 is a schematic structural diagram of a wafer post-processing apparatus according to the present invention;
fig. 2 is a schematic view of an embodiment of the channels of the present invention;
fig. 3 is a schematic view of another embodiment of the channels of the present invention;
fig. 4 is a schematic view of a further embodiment of the channels of the present invention.
Detailed Description
The technical solution of the present invention will be described in detail with reference to the following embodiments and accompanying drawings. The embodiments described herein are specific embodiments of the present invention for the purpose of illustrating the concepts of the invention; the description is intended to be illustrative and exemplary and should not be taken to limit the scope of the invention. In addition to the embodiments described herein, those skilled in the art will be able to employ other technical solutions which are obvious based on the disclosure of the claims and the specification thereof, and these technical solutions include technical solutions which make any obvious replacement or modification of the embodiments described herein.
The drawings in the present specification are schematic views to assist in explaining the concept of the present invention, and schematically show the shapes of respective portions and their mutual relationships. It should be understood that the drawings are not necessarily to scale, the same reference numerals being used to identify the same elements in the drawings in order to clearly show the structure of the elements of the embodiments of the invention.
In the present invention, "Chemical Mechanical Polishing (CMP)" is also referred to as "Chemical Mechanical Planarization (CMP)", and a Wafer (Wafer, W) is also referred to as a Substrate (Substrate), which means equivalent to the actual function.
Fig. 1 is a schematic structural diagram of a wafer post-processing apparatus 100 according to the present invention, which includes a driving mechanism 10 and a supply arm 20, both of which are disposed in a box. Wherein, the driving mechanism 10 is a disk-shaped structure, and the outer edge thereof is configured with a claw to reliably clamp the wafer; the rear side of the driving mechanism 10 is provided with a driving motor to drive the wafer to rotate in the vertical plane. The feed arm 20 is driven by a motor assembly to oscillate in a vertical plane parallel to the plane of the wafer W, the feed arm 20 being provided with a nozzle at its free end so that liquid can be supplied to the global surface of the rotating wafer W via the nozzle moving with the feed arm 20.
The wafer post-processing apparatus 100 further includes a retaining ring 30 disposed at the outer periphery of the driving mechanism 10 to prevent the liquid thrown off by the centrifugal force on the surface of the wafer from falling to the top wall of the chamber of the box body, so as to prevent the liquid from impacting and sputtering at these positions to cause fine liquid droplets to contaminate the front space of the wafer and the surface of the wafer, and prevent the liquid droplets formed by the accumulation of the liquid on the top wall of the chamber from falling downward to contaminate the wafer.
Since the upper side of the baffle 30 also accumulates some droplets, these droplets also have an effect on the post-processing of the wafer. In order to solve the above technical problem, the baffle ring 30 of the present invention is provided with a guiding groove 30a, as shown in fig. 2, which is disposed along an edge of the outline of the baffle ring 30, and the guiding groove 30a can guide the liquid thrown from the wafer to the lower portion of the baffle ring 30. Specifically, the liquid droplets accumulated on the top of the inner sidewall of the retaining ring 30 can flow toward the lower portion of the retaining ring 30 under the guidance of the flow guiding structure, so as to prevent the liquid droplets from dropping onto the surface of the wafer under the action of gravity.
In the embodiment shown in fig. 2, the number of the guide grooves 30a is two, and they are spaced apart in the radial direction of the retainer 30. The liquid drops on the liquid receiving surface 31 on the inner side wall of the retainer ring 30 slide towards the edge of the retainer ring and slide into the guide groove.
Further, the cross section of the flow guide groove 30a is a long strip shape, and the ratio of the depth and the width thereof is matched with the capillary force of the hydrophilic liquid. Specifically, channels 30a are provided with a width such that they provide a suitable capillary force to accumulate liquid in channels 30a and to reliably confine the liquid to flow within channels 30 a. It will be appreciated that the capillary force of channels 30a should not be too strong, which would result in liquid not being easily drained from the ends of the channels by gravity and siphoning.
The width of the diversion trench 30a is 0.02 mm-8 mm, and the width of the diversion trench can be comprehensively determined according to the working conditions of the wafer post-processing device, such as the flow rate of cleaning and drying water.
In order to ensure that the flow guide groove 30a has sufficient water storage capacity and does not affect the capillary force, the ratio of the depth to the width of the flow guide groove 30a is 0.1-50. Preferably, the ratio of the depth to the width of the guide groove 30a is 0.5 to 10.
In the wafer post-processing process, liquid drops gradually gathered at the top of the inner side of the check ring 30 can move to the edge of the side of the check ring 30 far away from the chamber back plate along the liquid receiving surface 31 under the action of gravity; when the liquid droplets contact the opening of channel 30a, they are drawn into channel 30a rapidly by capillary action of the channel slit structure.
If the amount of liquid in the position of the flow guide groove 30a is increased, the increased liquid is still in the flow guide groove 30a due to capillary action and is conveyed towards two sides or one side of the position along the flow guide groove 30 a; when the adhesion between the liquid and the inner wall surface of the guide groove 30a is not sufficient to counteract the gravity of the liquid, the liquid flows down along the guide groove 30a to the end of the guide groove.
When the liquid in the end groove of the diversion groove 30a is accumulated to the critical discharge height in the vertical direction, the liquid newly added at the end can flow out from the end of the diversion groove 30a and the liquid with the same amount as the newly added liquid due to the fact that the capillary force of the diversion groove cannot resist the gravity, so that the circulation of liquid flow accumulation and diversion drainage of the diversion groove 30a is formed, and the redundant liquid at the top is continuously and smoothly discharged without dripping to pollute the wafer.
In fig. 2, two guide grooves 30a perpendicular to the side surface of the rim, a first guide groove 30a-1 and a second guide groove 30a-2, are formed in the rim of the retainer ring 30. The depth and width of the diversion trench 30a are millimeter-sized to form a trench structure with a large sectional area, thereby ensuring the diversion capability and realizing rapid and efficient diversion.
When the flow rate of the liquid locally required to be guided exceeds the capacity of the first guide groove 30a-1 for accumulating the liquid flow, the overflowing liquid will be accumulated and guided by the second guide groove 30a-2. It can be understood that the second diversion trench 30a-2 near the lower end face of the edge of the retaining ring 30 is equivalent to a second defense line, which effectively enhances the reliability of the drip-proof effect of the retaining ring 30.
Furthermore, the geometric dimension of the diversion trench 30a is millimeter level, which is beneficial to ensuring the structural strength; meanwhile, the millimeter-scale groove structure is convenient to select machining and form, so that the machining cost is controlled.
It is understood that the number of the diversion grooves of the baffle 30 may be one, three, or more, as long as the diversion capability of the baffle 30 is matched with the process technology of the wafer post-processing device.
As an embodiment of the present invention, diversion trench 30a is provided on inner side 33 and outer end 34 of the rim of retaining ring 30, as shown in fig. 3. The retainer ring 30 has a plurality of guide grooves, and the guide grooves 30a may have different widths and depths when viewed from a longitudinal section. The channels 30a having a smaller width have a stronger capillary suction force, but a decrease in cross-sectional area reduces the flow conductivity. The flow guide grooves 30a are configured in a larger number, so that the flow guide capacity can be supplemented. One channel 30a has no time to accumulate and guide the liquid, and the adjacent channel 30a accumulates and guides the liquid. Because the width and the depth of the diversion trench 30a used in the embodiment are smaller, the outer edge of the retainer ring 30 far away from the direction of the box body back plate does not need to be obviously thickened due to the arrangement of the diversion trench 30a, so that other operation spaces in the box body cavity are avoided being occupied.
Fig. 4 is a schematic view of another embodiment of the diversion trench of the present invention, which is capable of diverting relatively small liquid flow and is suitable for a scene with a small liquid flow. The diversion trench 30a is located at the lower end surface 34 of the edge of the check ring 30, so that the profile line design of the liquid receiving surface 31 of the check ring 30 is steeper, the included angle between the liquid throwing direction of the wafer and the liquid receiving surface 31 is smaller, and the anti-sputtering capability is enhanced.
As a variation of the embodiment of fig. 2, the diversion trench 30a may also be disposed obliquely with respect to the side surface of the edge of the retaining ring 30, so that the diversion effect of the diversion trench 30a can also be ensured, and the post-processing effect of the wafer is prevented from being affected by the liquid drops on the top of the inner sidewall of the retaining ring 30.
In the description herein, references to the description of the term "one embodiment," "some embodiments," "an illustrative embodiment," "an example," "a specific example," or "some examples" or the like mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
While embodiments of the invention have been shown and described, it will be understood by those of ordinary skill in the art that: various changes, modifications, substitutions and alterations can be made to the embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the claims and their equivalents.
Claims (10)
1. A wafer post-processing apparatus, comprising:
the driving mechanism vertically clamps the wafer and drives the wafer to rotate;
a supply arm which swings at a side surface of the wafer and supplies liquid to a surface of the wafer via a nozzle thereon;
a retainer ring provided on an outer peripheral side of the drive mechanism;
the retainer ring is provided with a diversion trench which is arranged along the edge of the contour of the retainer ring, and the diversion trench accumulates and guides the fluid thrown out from the wafer to the lower part of the retainer ring.
2. The wafer post-processing device according to claim 1, wherein the diversion trench is disposed on an inner side surface and/or an outer side surface of the retainer ring edge.
3. The wafer post-processing apparatus of claim 1, wherein the number of flow channels is at least one.
4. The wafer post-processing device according to claim 1, wherein the diversion trench is disposed perpendicular to a side surface of the retainer ring edge.
5. The wafer post-processing apparatus as claimed in claim 1, wherein the guiding groove has a cross section of a long strip shape, and a ratio of a depth to a width thereof is matched with a capillary force of the hydrophilic fluid.
6. The wafer post-processing device according to claim 5, wherein the ratio of the depth to the width of the guiding groove is 0.1-50.
7. The wafer post-processing device according to claim 1, wherein the retainer ring has an annular structure, and the edge of the retainer ring extends towards the center of the retainer ring; the inner side surface of the edge is provided with guide grooves which are arranged at intervals along the radial direction of the retainer ring.
8. The wafer post-processing apparatus as claimed in claim 7, wherein the width of the channels near the center of the retaining ring is smaller than the width of the channels away from the center of the retaining ring.
9. The wafer post-processing device according to claim 1, wherein the flow guide groove is disposed obliquely with respect to a side surface of the retainer ring edge.
10. The wafer post-processing apparatus according to claim 1, wherein the retainer ring is detachably fixed to a back plate of the wafer post-processing apparatus to cover the driving mechanism as a whole.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111671422.8A CN115148623A (en) | 2021-12-31 | 2021-12-31 | Wafer post-processing device |
| PCT/CN2022/074445 WO2023123603A1 (en) | 2021-12-31 | 2022-01-27 | Wafer post-processing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111671422.8A CN115148623A (en) | 2021-12-31 | 2021-12-31 | Wafer post-processing device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN115148623A true CN115148623A (en) | 2022-10-04 |
Family
ID=83405527
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111671422.8A Pending CN115148623A (en) | 2021-12-31 | 2021-12-31 | Wafer post-processing device |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN115148623A (en) |
| WO (1) | WO2023123603A1 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116654563B (en) * | 2023-07-21 | 2023-09-26 | 常州海图信息科技股份有限公司 | Belt tearing detection device for belt conveyor |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6287750B2 (en) * | 2013-12-27 | 2018-03-07 | 東京エレクトロン株式会社 | Substrate liquid processing equipment |
| JP2015176996A (en) * | 2014-03-14 | 2015-10-05 | 株式会社Ｓｃｒｅｅｎホールディングス | substrate processing apparatus |
| CN104979238B (en) * | 2014-04-14 | 2017-12-15 | 沈阳芯源微电子设备有限公司 | A kind of anti-splash and anti-adhesive type process cavity of TRACK boards spin coating unit |
| JP6769166B2 (en) * | 2016-08-10 | 2020-10-14 | 東京エレクトロン株式会社 | Liquid treatment equipment and liquid treatment method |
| CN112670207B (en) * | 2020-12-21 | 2023-10-31 | 长江存储科技有限责任公司 | Edge wafer processing equipment and processing method of wafer structure to be processed |
-
2021
- 2021-12-31 CN CN202111671422.8A patent/CN115148623A/en active Pending
-
2022
- 2022-01-27 WO PCT/CN2022/074445 patent/WO2023123603A1/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| WO2023123603A1 (en) | 2023-07-06 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP4943688B2 (en) | Cutting equipment | |
| CN115148623A (en) | Wafer post-processing device | |
| US9687960B2 (en) | Polishing pad cleaning systems employing fluid outlets oriented to direct fluid under spray bodies and towards inlet ports, and related methods | |
| JP2007075963A (en) | Cutting device | |
| JP4868764B2 (en) | Semiconductor wafer electrode processing equipment | |
| US11872671B2 (en) | Polishing pad and polishing method | |
| JP4313174B2 (en) | Wire saw | |
| CN114944344A (en) | Wafer post-processing device | |
| CN114944345A (en) | Wafer drying device | |
| CN116453979A (en) | Wafer cleaning equipment | |
| CN115472523A (en) | Substrate post-processing device | |
| US20090126761A1 (en) | Cleaning apparatus and cleaning method | |
| CN115910852A (en) | Cleaning device | |
| CN211160882U (en) | Substrate cleaning head and substrate cleaning device | |
| CN211103391U (en) | Chemical mechanical polishing ring | |
| US6306022B1 (en) | Chemical-mechanical polishing device | |
| JP2002011418A (en) | Device and method of cleaning sheet material | |
| CN107068590B (en) | Cleaning device and substrate processing device | |
| US20190096661A1 (en) | Post-CMP Cleaning and Apparatus for Performing the Same | |
| TWI762135B (en) | Plating apparatus, pre-wetting treatment method, and cleaning treatment method | |
| JP7260322B2 (en) | Polishing device and polishing method | |
| KR101939116B1 (en) | Flux cleaning device | |
| KR100614798B1 (en) | Scrap elimination apparatus | |
| JP4656285B2 (en) | Cutting equipment | |
| CN211125592U (en) | Substrate processing apparatus for removing impurities |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |