JP2007075963A - Cutting device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a cutting device which removes cutting fluid adhering to the surface of an end material, and dries the end material. <P>SOLUTION: The cutting device is equipped with a treatment means for the end material treating the end material P generated from the cutting of workpiece. The treatment means for the end material is equipped with an end material drying means 90 storing the end material to dry. The end material drying means 90 is equipped with: a storage container 93 which is opened at the upper part, and stores the end material P where a plurality of smaller holes than the end material P are formed; a rotating drive part 98 rotating the storage container 93; a cutting fluid recovery tank 94 enclosing the periphery of the storage container 93; and an end material guide plate 95a inclinedly disposed at the outside of the cutting fluid recovery tank 94. The cutting liquid adhering to the end material P is discharged from the plurality of holes 93a by a centrifugal force generated by the rotation of the storage container 93, and recovered in the cutting fluid recovery tank 94. On the other hand, the end material P is discharged from the upper part 93b of the storage container 93 by the centrifugal force, drops on the end material guide plate 95a, and guided to a vent 95b to be discharged. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a cutting device, and more particularly to a cutting device having an end material processing device for processing an end material generated when a workpiece is cut.

  Recently, CSP (Chip Size Package) has been put into practical use as a semiconductor device suitable for use in small electronic devices such as mobile phones and notebook personal computers. Such a CSP is usually formed by disposing a chip such as an IC or LSI in each of a plurality of rectangular areas partitioned by cutting streets arranged in a grid on an appropriate substrate such as a synthetic resin substrate. . A substrate in which a plurality of CSPs are formed on this substrate is generally called a CSP substrate.

  The CSP substrate is cut along a cutting street and separated into individual CSPs. The CSP substrate is cut using a device different from a normal thin silicon wafer cutting device in order to cut a synthetic resin substrate on which a packaged IC or LSI is formed.

  As shown in Patent Document 1, a cutting apparatus for cutting a CSP substrate along a cutting street includes a chuck table that holds a workpiece (CSP substrate), and a cutting unit that cuts the workpiece. Yes. The chuck table is installed so as to reciprocate, and the cutting means includes, for example, a substantially ring-shaped cutting blade containing diamond particles. Further, the cutting means is provided with a cutting liquid injection means for injecting a cutting liquid using, for example, pure water, and at the time of cutting, the cutting blade and the CSP substrate are cooled by the injection of the cutting liquid.

  When the CSP substrate is set on the chuck table, the chuck table moves forward and / or backward, and a cutting blade acts on the CSP substrate to perform cutting of the CSP substrate.

  At this time, due to the rotation direction of the cutting blade, the cutting waste (chips and the like) and the cutting fluid are scattered. For example, when the cutting blade rotates in the forward movement direction of the chuck table, cutting waste and cutting fluid are scattered in the forward movement direction of the chuck table. Also, part of the cutting fluid becomes mist and scatters in the direction opposite to the forward movement direction of the chuck table.

  The cutting apparatus described in Patent Document 1 is provided with an end material processing apparatus for processing the end material and the cutting fluid that are scattered due to the cutting of the CSP substrate. In this end material processing apparatus, the scattered end material and cutting fluid are received by groove-shaped receiving and conveying members provided on both sides in the forward movement direction of the chuck table, and flow down to the end portion to serve as an end material conveying means. Drop onto an endless belt. The end material dropped on the endless belt is transported by the movement of the endless belt, and dropped into the end material recovery container and collected at the direction change portion of the endless belt. Also, instead of transporting the end material by the endless belt, the end material is received by a receiving member made of a metal plate, and then the end material on the receiving member is pushed out by a pressing member such as a brush member, and the end material collecting container It has also been proposed to make it fall inside.

JP 2002-239888 A

  Here, a number of holes are formed on the surface of the receiving member made of an endless belt or a metal plate, and the cutting fluid is easily drained from the surface of the receiving member through the holes. However, the cutting fluid still adheres to the surface of the end material. For example, when the end material is pushed out by the pressing member, the end material to which the cutting fluid adheres is pushed out and falls into the end material collecting container. . For this reason, the cutting fluid accumulates in the scrap material collection container, and when discarding the scrap material in the scrap material collection container, the cutting fluid in the scrap material collection container must be drained, which is very laborious. There was a problem.

  Therefore, the present invention has been made in view of the above problems, and the object of the present invention is to remove the cutting fluid adhering to the surface of the end material and dry the end material. It is to provide a new and improved cutting apparatus.

  In order to solve the above problems, according to an aspect of the present invention, a chuck table for holding a workpiece, a cutting means for cutting the workpiece with a cutting blade, and an end for processing the end material generated by the cutting are provided. And a cutting device provided with the material processing means, wherein the end material processing means is disposed adjacent to the chuck table and is scattered by cutting of the workpiece and a cutting fluid used for the cutting. Receiving and conveying means for receiving and moving the end material and cutting fluid to the end; Receiving draining means for receiving the end material dropped from the end of the receiving and conveying means and flowing down the cutting fluid; and Receiving draining means Cutting fluid collecting means for collecting cutting fluid flowing down from the end; end material moving means for moving the end material falling on the receiving draining means to the end of the receiving draining means; and dropping from the end of the receiving draining means Housed and housed Characterized in that it comprises a; and the end material collecting container for collecting the scraps dried by the end material drying means; wood scraps drying means and drying by centrifugal force.

  In this invention, in order to remove the cutting fluid adhering to the end material, an end material drying means for drying the end material is provided. The edge material drying means accommodates the edge material dropped from the receiving draining means and rotates the accommodated edge material. Using the centrifugal force generated by this rotation, the cutting fluid adhering to the end material can be discharged and the end material can be dried. The dried milled material can be collected by being discharged into a milled material recovery container. Thus, since the milling material and the cutting fluid are separated, it is possible to prevent the cutting fluid from staying in the milling material collection container.

  According to another aspect of the present invention, a chuck table for holding a workpiece, a cutting means for cutting the workpiece with a cutting blade, and an end material processing means for processing the end material generated by the cutting are provided. A provided cutting device is provided. Here, the end material processing means is disposed adjacent to the chuck table, receives the end material scattered by cutting the workpiece and the cutting fluid used for the cutting, and moves the end material and the cutting fluid to the end portion. A receiving and conveying means; an end material drying means for containing the end material and cutting fluid dropped from the end of the receiving and conveying means and drying the end material by centrifugal force; and an end material dried by the end material drying means A scrap collection container to be collected.

  In such a configuration, the end material and the cutting fluid falling from the end material conveying means are separated by the end material drying means for directly drying the end material. Similarly to the above, the mill material drying means accommodates the mill material dropped from the mill material conveying means, and rotates the milled material. Using the centrifugal force generated by this rotation, the cutting fluid adhering to the end material can be discharged and the end material can be dried. The dried milled material can be collected by being discharged into a milled material recovery container. Thus, since the milling material and the cutting fluid are separated, it is possible to prevent the cutting fluid from staying in the milling material collection container. Moreover, the structure of the end material processing means of the cutting device can be simplified.

  Here, the end material drying means surrounds the container around which the upper part is opened and the main body is formed with a plurality of holes smaller than the end material, the rotational drive unit for rotating the container, and the container. The cutting fluid collecting tank to be arranged and the end material guide plate inclined to the outside of the cutting fluid collecting tank can be configured. The container accommodates the end material dropped from the end of the receiving and conveying means. Then, the cutting fluid adhering to the end material is discharged from a plurality of holes formed in the main body of the container by the centrifugal force generated by rotating the container by the rotation drive unit, and is collected in the cutting liquid recovery tank. . Further, the end material is discharged from the upper portion of the container and dropped onto the end material guide plate by the centrifugal force generated by the container being rotated by the rotation drive unit. The end material dropped on the end material guide plate is guided to the discharge port by the end material guide plate and discharged. With this configuration, the end material and the cutting fluid can be separated by centrifugal force and discharged to each discharge destination. Therefore, the cutting fluid is not retained in the scrap material collecting container, so that the cutting fluid removing operation by the user can be made unnecessary.

  As described above, according to the present invention, it is possible to provide a cutting device capable of removing the cutting fluid adhering to the surface of the end material and drying the end material.

  Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the present specification and drawings, components having substantially the same functional configuration are denoted by the same reference numerals, and redundant description is omitted.

(First embodiment)
First, a cutting apparatus according to a first embodiment of the present invention will be described.

  The present invention relates to an end as cutting waste generated when cutting a CSP substrate in which a CSP (Chip Size Packages) is formed in each of a plurality of rectangular regions partitioned by cutting streets arranged in a grid pattern. The present invention relates to an end material processing apparatus suitable for collecting and processing a material.

  First, the outline of the cutting apparatus and the cutting operation will be briefly described below. A schematic perspective view of the cutting apparatus according to the present embodiment is shown in FIG. The cutting device 10 includes a chucking area 4, an alignment area 5, a cutting area 6, an end material processing area 8 and an end material drying processing area 9 which is a feature of the present embodiment on the housing 2.

  Here, a CSP substrate which is an example of a workpiece to be cut will be briefly described with reference to FIG. As the CSP substrate, a plurality of CSPs (Chip Size Packages) are formed on, for example, a synthetic resin substrate. The CSP substrate 50 has a rectangular shape, cutting streets 51 are arranged in a lattice pattern, and a plurality of rectangular regions 52 are partitioned. A CSP is formed in each of the rectangular regions 52, and an edge portion 53 where no CSP is formed is provided at the end of the CSP substrate 50.

  The CSP substrate 50 is placed on and loaded into a mounting jig 60 for setting in a cutting device. The mounting jig 60 is made of, for example, a metal plate and has a rectangular shape that is somewhat larger than the CSP substrate 50. Grooves 61 are arranged in a lattice pattern at the center of the upper surface of the mounting jig 60, and a plurality of rectangular regions 62 are partitioned by the grooves 61. The rectangular area 62 corresponds to the rectangular area 52 of the CSP substrate 50, and the dimensions of the rectangular area 62 in the plan view are the same as the dimensions of the rectangular area 52.

  In addition, a suction hole 63 that penetrates is formed in each of the rectangular regions 62, and suction grooves (not shown) that connect all the suction holes 63 are formed on the back surface of the mounting jig 60. Yes. The CSP substrate 50 is placed on the mounting jig 60 so that the respective rectangular regions are aligned, and the mounting jig 60 on which the CSP substrate 50 is thus placed is carried into the cutting apparatus 10.

  The loaded mounting jig 60 is placed on the chuck table 40 provided in the chucking area 4. The chuck table 40 has a rectangular suction disk 41 that is larger than the mounting jig 60. The chuck table 40 is mounted with the CSP substrate 50 mounted thereon by vacuum suction from an opening 42 of a suction tube formed at the center of the suction disk 41. The jig 60 is vacuum-sucked.

  When the mounting jig 60 is vacuum-sucked on the chuck table 40, the chuck table 40 moves forward in the x-axis direction, and the mounting jig 60 on which the CSP substrate 50 is placed is positioned in the alignment area 5. The alignment area 5 is provided with an imaging means 55, and the surface of the CSP substrate 50 is imaged and analyzed, whereby the arrangement state of the CSP substrate 50 and the position of the cutting street 51 can be confirmed. The position or inclination in the x direction or y direction is recognized. The image of the imaging means 55 is also displayed on the monitor 56.

  Next, the chuck table 40 is moved to the cutting area 6 and the CSP substrate 50 is cut by the cutting means 65. At this time, the cutting is performed not by moving the cutting means 65 but by reciprocating the chuck table 40, for example. The cutting means 65 is composed of a cutting blade (rotary cutting blade) fixed to the tip of the rotating shaft, and the cutting blade can be a thin ring-shaped cutting blade containing diamond abrasive grains or the like. Further, the cutting means 65 includes a cutting fluid injection means (not shown) for injecting a cutting fluid (for example, cutting water) using pure water, for example. As a result, the cutting fluid is sprayed toward the CSP substrate 50 and the cutting blade to cool the processing point and the cutting blade.

  When cutting the CSP substrate 50, since the end material and cutting fluid, which are large cutting waste, such as the peripheral portion 53 (see FIG. 2) of the CSP substrate 50 described above scatter, this is collected and processed. For this purpose, an end material processing area 8 is provided.

  As shown in FIG. 3, the chuck table 40 has one end position (a position where the chuck table 40 is in the positive x-axis direction from the alignment area 5) and the other end position (the chuck table 40 is in the negative x-axis direction from the cutting means 65). Position). The chuck table 40 is provided with a reciprocating mechanism (not shown) for reciprocating the chuck table 40. Further, the reciprocating mechanism is covered with a bellows member 66 in order to protect against cutting waste generated in the cutting area 6 and cutting fluid sprayed in the cutting area 6.

  In order to further protect the bellows member 66, a plurality of plate members 67 respectively attached to a plurality of peak portions of the bellows member 66 may be provided. The plate member 67 has a length equal to or greater than the width of the bellows member 66 (width in a direction perpendicular to the expansion / contraction direction of the bellows member) and a width larger than the interval between the adjacent peak portions when the bellows member 66 is extended. And one side is mounted on the peak portion and the other side is slidably superposed on the surface of the adjacent plate member 67. The structure of the plate member 67 on the bellows member 66 prevents the bellows member 66 from being damaged by the end material P.

  On both sides of the bellows member 66 and the reciprocating mechanism, a receiving and conveying member (water case) 68 is disposed. The receiving and conveying member 68 has, for example, a bottom wall 68a that protrudes in a substantially horizontal direction from the side of the bottom of the reciprocating mechanism, and a side wall 68b that extends upward from both side edges of the bottom wall 68a. By providing the receiving and conveying member 68, grooves are formed on both sides of the bellows member 66.

  In this manner, the receiving and conveying member 68 is disposed so as to cover both sides of the reciprocating chuck table 40 and can receive the cutting fluid and the end material P scattered by the cutting process. The receiving and conveying member 68 is used to cause the cutting fluid and the end material P to flow to the end material processing apparatus 80, that is, for example, to flow in the forward movement direction (x-axis negative direction) of the chuck table 40. It is preferable to incline slightly downward in the negative direction. In addition, in order to ensure the flow of the cutting fluid and the end material P, liquid ejecting means (not shown) is arranged to allow the liquid (for example, water) to flow in the negative conveying direction in the receiving and conveying member 68. It can also be set up.

  In the cutting apparatus 10 as described above, when the CSP substrate 50 is cut, the chuck table 40 is returned to the chucking area 4 (see FIG. 1). Thereafter, each CSP is accommodated in the accommodation case from the mounting jig 60 on the chuck table 40 and conveyed, and a series of cutting steps is completed.

  Next, based on FIG. 3, the end material processing apparatus 80 according to the present embodiment will be described in detail. Here, FIG. 3 is a schematic perspective view of the end material processing apparatus 80 of the cutting apparatus 10 according to the present embodiment.

  For example, as shown in FIG. 3, the end material processing apparatus 80 of the cutting apparatus 10 according to the present embodiment is disposed adjacently so as to surround the side surface and the lower surface of the chuck table 40, and the scattered end material P and the cutting fluid are scattered. Receiving conveying member 68 for receiving, end material P falling from the end of receiving conveying member 68, receiving draining member 71 for flowing the cutting fluid, and cutting fluid flowing from receiving draining member 71 are collected The cutting fluid recovery device 81 that is provided, and a moving member 75 that is provided at one end portion of the receiving drainage member 71 and can reciprocate between one end portion and the other end portion of the receiving drainage member 71, and is attached to the moving member 75 As the moving member 75 moves forward, for example, a brush member (not shown), which is an extrusion member that pushes the end material P remaining on the receiving draining member 71 to the other end of the receiving draining member 71. And swept out by the brush member And a scrap material collecting container 90 for accommodating the end material P that falls from the other end of the receiving draining member 71.

  As described above, the receiving and conveying member 68 is disposed, for example, slightly inclined downward in the negative x-axis direction, so that the cutting fluid and the end material P received by the receiving and conveying member 68 are not received. It flows to the end of the stop conveying member 68 and falls to the receiving draining member 71. The receiving draining member 71 is installed, for example, such that the longitudinal direction (y-axis direction) is substantially perpendicular to the reciprocating direction of the chuck table.

  The receiving draining member 71 is configured such that, for example, the bottom of the receiving draining member 71 is allowed to flow in order to allow the cutting fluid that has fallen from the receiving conveying member 68 to flow down. For example, a plurality of through holes are provided at regular intervals. . The size of the through hole is such a size that the end material P does not fall down. For example, a hard member such as resin or metal can be used for the bottom of the receiving draining member 71 and a sufficient size and number of through holes can be provided, so that the cutting fluid can be sufficiently discharged.

  The end material P is received and remains by the receiving draining member 71, and the cutting fluid flows down from a plurality of through holes formed in the bottom of the receiving draining member 71 and is collected by the cutting fluid collecting device 81. . The cutting fluid recovery device 81 includes, for example, a drain pump (not shown) and the like, and discharges the recovered cutting water to the outside through the water distribution pipe 81a.

  As shown in the explanatory view of FIG. 3, a cylinder 77 is provided at one end of the receiving drain member 71 (space on the negative side of the y-axis from the position where the end material P and the cutting fluid fall from the receiving conveying member 68). A moving member 75 connected to is disposed. By the cylinder 77, the moving member 75 can reciprocate within the receiving draining member 71.

  Further, a brush member (not shown) that is pivoted around the end portion is provided at, for example, the front end portion (y-axis positive end portion) of the moving member 75. The brush member is mounted so as to come into contact with the bottom portion on the receiving drainage member 71 when the moving member 75 moves from one end of the receiving drainage member 71 (which can also be set to the initial position) to the other end. Is done. As a result, the end material P remaining on the receiving draining member 71 is swept out by the brush member and moves to the other end portion (y-axis positive direction end portion) of the receiving draining member 71.

  The end material P swept out to the other end portion of the receiving draining member 71 falls to the end material drying device 90 which is a characteristic part of the present invention. In the end material drying apparatus 90, the cutting fluid that adheres to the end material P and cannot be removed by the receiving draining member 71 is removed and the end material P is dried. Then, the dried end material P is discharged from the discharge port 95b and accommodated in the end material recovery container 99.

  Next, based on FIG. 4 and FIG. 5, an end material drying apparatus 90 which is a characteristic part of the present invention will be described. Here, FIG. 4 is a cross-sectional view of the end material drying apparatus 90 according to the present embodiment cut along AA of FIG. FIG. 5 is a perspective view of the end material drying apparatus 90 according to the present embodiment. In the present embodiment, as the end material P, a plate-like member having a width of about 10 mm and a length of about 50 mm is assumed.

  First, the configuration of the milling material drying apparatus 90 according to the present embodiment will be described. As shown in FIG. 4, the mill material drying device 90 includes, for example, a receiving guide portion 91, a container 93, a cutting fluid recovery tank 94 disposed so as to surround the container 93, and the container 93. An end material guide portion 95 that guides the discharged end material P to the discharge port 95b and a rotation drive portion 98 that rotates the container 93 are configured.

  The receiving guide portion 91 is an auxiliary member provided to make it easy to receive the end material P dropped from the receiving water draining member 71 into the end material drying device 90. The receiving guide part 91 has a funnel shape in which the upper part on the receiving draining member 71 side (z-axis positive direction side) has a large opening. The receiving guide portion 91 is arranged such that a lower cylinder is inserted into the housing 92 of the end material drying means 90.

  The container 93 is a container having an upper portion 93b opened to accommodate the end material P guided by the receiving guide portion 91. For example, the container 93 has a substantially conical shape expanded upward. For example, the upper portion 93b The opening diameter may be approximately 250 mm, the bottom diameter may be approximately 100 mm, and the height may be approximately 200 mm. The shape of the container 93 is determined in consideration of the rotation speed by the rotation driving unit 98, the time necessary for drying the end material P, and the like. In the main body of the container 93, a plurality of holes 93a having a size such that the end material P does not pass are formed as shown in FIG.

  The cutting fluid collection tank 94 is provided with a side surface 94a, a bottom surface 94b, a cutting fluid guide portion 94c for guiding the cutting fluid, and a cutting fluid guided by the cutting fluid guide portion 94c. In order to drain to the cutting fluid recovery device 81 side, a water pipe 94d connected to the cutting fluid recovery device 81 is provided. The cutting fluid collection tank 94 collects the cutting fluid discharged from the container 93.

  The end material guide 95 includes an end material guide plate 95a that guides the end material P discharged from the container 93 to the discharge port 95b. The end material guide plate 95a is disposed outside the cutting fluid collection tank 94 so that the discharge port 95b is inclined downward. Further, the end material P discharged from the container 93 does not stay above the cutting fluid guide portion 94c on the side of the distribution pipe 94d (the negative y-axis side in FIG. 4) of the side surface 94a of the cutting fluid collection tank 94. In addition, a reflecting wall 94e extending upward is formed.

  The rotation drive unit 98 is a drive unit that rotates the container 93 around the z-axis in FIG. 4, and a motor or the like can be used, for example. The rotation shaft 98a of the rotation drive unit 98 is connected to the bottom surface of the container 93, and the container 93 can be rotated by the rotation of the rotation shaft 98a. The rotational speed of the container 93 can be set to about 1100 rpm, for example.

  Next, the operation of the mill material drying device 90 will be described.

  First, the end material P dropped from the receiving draining member 71 is accommodated in the end material drying device 90 by the receiving guide portion 91. As shown in FIG. 4, the end material P guided by the receiving guide portion 91 falls and is accommodated in the approximate center of the container 93.

  Here, the container 93 is rotated at a constant speed around the z axis by the rotation drive unit 98. The end material P accommodated in the rotating accommodating portion 93 is gradually moved from the vicinity of the center of the container 93 toward the outer periphery due to the centrifugal force generated by the rotation of the container 93. At this time, the cutting fluid adhering to the end material P is also peeled off from the surface of the end material P by centrifugal force, and is discharged to the outside of the container 93 through a plurality of holes 93 a formed in the container 93.

  The cutting fluid discharged to the outside of the container 93 falls down after hitting the side surface 94a of the cutting fluid collection tank 94. The bottom surface 94b of the cutting fluid recovery tank 94 is disposed so that the drainage pipe 94d side (the y-axis negative direction side in FIG. 4) is inclined downward so that the cutting fluid can easily flow toward the drainage pipe 94d. The cutting fluid is guided to the drain pipe 94d by the cutting fluid guide 94c and discharged to the cutting fluid recovery device 81 side. The drain pipe 94d is communicated with, for example, the drain pipe 81a of the cutting fluid recovery device 81, and the cutting fluid recovered by the cutting fluid recovery device 81 and the end material drying device 90 can be discharged together.

  On the other hand, the end material P in the rotating container 93 is dried while moving in the outer peripheral direction of the container 93 by centrifugal force. Then, when the outer edge of the container 93 is reached, the centrifugal force becomes maximum, and the container is pushed out by the new end material P that has fallen into the container 93 from the end of the receiving draining member 71. The end material P reaching the outer edge portion of 93 is scattered from the container 93. It takes about 10 to 20 seconds for the end material P to fall from the end portion of the receiving draining member 71 to the container 93 and to scatter from the outer edge of the container 93. Can be dried.

  The scattered end material P collides with the inner wall of the casing 92 of the end material drying apparatus 90 and falls, and is received by the end material guide plate 95 a installed outside the cutting fluid recovery tank 94. Here, if the end material P falls to the drain pipe 94d side, it will stay on the cutting fluid guide part 94c, and the end material P cannot be recovered. For this reason, by extending the side surface 94a of the cutting fluid recovery tank 94 upward and forming the reflecting wall 94e so that the end material P does not fall to the drainage pipe 94d side (the y-axis negative direction side in FIG. 4), The end material P is prevented from falling on the cutting fluid guide portion 94c.

  The end material P dropped on the end material guide plate 95a is guided by the end material guide plate 95a and discharged from the discharge port 95b. An end material recovery container 99 is disposed adjacent to the end material drying device 90 outside the discharge port 95b. The end material P discharged from the discharge port 95b falls into the end material recovery container 99 and is recovered.

  The operation of the milling material drying apparatus 90 has been described above. In the end material drying apparatus 90, the end material P supplied first is dried and discharged from the discharge port 95b until the next end material P is supplied. Accordingly, it is considered that the amount of the end material P generated in the cutting process by the normal cutting apparatus 10 can be sufficiently dried.

  Thus, the end material drying apparatus 90 concerning this embodiment removes the cutting fluid adhering to the end material P using the centrifugal force by rotation of the container 93, and dries it. Here, as other means for drying the end material P, a heating means for heating the end material P to evaporate the cutting fluid, an air spraying means for blowing air to the end material P and blowing the cutting fluid, or the like can be considered. . However, if the cutting device 10 is provided with a heating unit, the heat generated by the heating unit may adversely affect the mechanical operation of the cutting device 10. Further, if the air blowing means is provided, there is a problem that the compressed air used in the existing equipment is consumed and the production cost is increased. For these reasons, it is preferable to dry the end material P using centrifugal force as in the end material drying apparatus 90 according to the present embodiment.

  The cutting apparatus 10 according to the first embodiment has been described above. The cutting device 10 is provided with the milling material drying device 90, so that the cutting fluid that adheres to the surface of the milling material P and cannot be removed by the milling material processing device 80 is removed using centrifugal force. Can do. That is, since the end material P and the cutting fluid are separated, the end material P is collected in the end material recovery container 99 after being completely dried. Accordingly, when the user throws away the scrap P collected in the scrap collection container 99, the user can save the trouble of draining the cutting fluid accumulated in the scrap collection container and then throwing away the scrap P. The handling of the material P can be simplified.

(Second Embodiment)
Next, based on FIG. 6 and FIG. 7, a cutting apparatus 10 ′ according to a second embodiment of the present invention will be described. Here, FIG. 6 is a schematic perspective view showing the cutting apparatus 10 ′ according to the present embodiment. FIG. 7 is a schematic perspective view showing an end material drying device 90 ′ of the cutting device 10 ′ according to the present embodiment. Note that the cutting apparatus 10 ′ according to the present embodiment is different from the cutting apparatus 10 according to the first embodiment in that it does not include the end material processing apparatus 80. Therefore, hereinafter, the configuration of the end material processing apparatus 90 ′ of the cutting apparatus 10 ′ according to the present embodiment will be described, and the configuration and operation similar to those of the first embodiment, such as the cutting operation, will be described in detail. Omitted.

  As shown in FIG. 6, the cutting apparatus 10 ′ according to the present embodiment includes a chucking area 4, an alignment area 5, and a cutting area 6 on the housing 2, and further occurs when cutting in the cutting area 6. An end material processing apparatus 90 ′ for separating the end material P and the cutting fluid is provided.

  For example, as shown in FIG. 7, the end material drying apparatus 90 ′ is adjacent so that the end material P falling from the receiving conveyance member and the receiving guide portion 97 that receives the cutting fluid surround the side surface and the lower surface of the chuck table 40. Arranged.

  As in the first embodiment, the mill material drying device 90 ′ includes, for example, a receiving guide portion 97, a container 93, a cutting fluid recovery tank 94 disposed so as to surround the container 93, and a housing. The end material guide part 95 which guides the end material P discharged | emitted from the container 93 to the discharge port 95b, and the rotation drive part 98 which rotationally drives the container 93 are comprised. Such a configuration is substantially the same as the end material drying apparatus 90 according to the first embodiment shown in FIGS. 4 and 5. The edge material drying apparatus 90 ′ according to the present embodiment is different from the edge material drying apparatus 90 according to the first embodiment only in the shape of the receiving guide portion 97. As described above, the receiving guide portion 97 directly receives the end material P and the cutting fluid falling from the receiving and conveying member 68, so that the opening on the receiving and conveying member 68 side has the width of the receiving and conveying member 68. Widely formed.

  The end material P and the cutting fluid dropped from the receiving and conveying member 68 are guided to the container 93 in the end material drying apparatus 90 ′ by the receiving guide part 97, and fall to the substantially central part of the container 93. At this time, a larger amount of cutting fluid flows into the container 93 than in the case of the first embodiment. Most of the large amount of cutting fluid is discharged from a plurality of holes smaller than the end material P formed on the side surface of the container 93 and is collected by the cutting fluid collection tank 94. The container 93 is rotated by the rotation drive unit 98, and the cutting fluid adhering to the surface of the end material P is also removed by the centrifugal force caused by the rotation.

  Further, the end material P in the container 93 moves to the outer edge of the bottom of the container 93 due to the centrifugal force generated by the rotation of the container 93. Then, the centrifugal force acting on the end material P increases at the outer edge portion, and is further pushed by the added end material P, so that the end material P moved to the outer edge portion is discharged from the container 93. The end material P discharged from the container 93 is guided to the discharge port 95b by the end material guide plate 95a disposed outside the cutting fluid recovery tank 94 and discharged to the end material recovery container 99.

  In this way, the end material drying apparatus 90 ′ can receive and process the end material P and the cutting fluid directly from the receiving conveyance member 68, and can separate the end material P and the cutting fluid. P is collected in the scrap collection container 99 after being completely dried. Accordingly, when the user throws away the scrap P collected in the scrap collection container 99, the user can save the trouble of draining the cutting fluid accumulated in the scrap collection container and then throwing away the scrap P. The handling of the material P can be simplified. Furthermore, the means for configuring the cutting apparatus can be reduced, and the apparatus configuration can be simplified.

  As mentioned above, although preferred embodiment of this invention was described referring an accompanying drawing, it cannot be overemphasized that this invention is not limited to the example which concerns. It will be apparent to those skilled in the art that various changes and modifications can be made within the scope of the claims, and these are naturally within the technical scope of the present invention. Understood.

  For example, in the above embodiment, the shape of the container 93 of the milling material drying apparatus 90 is a substantially conical shape, but the present invention is not limited to this example, and only the time necessary for the milling material P to be dried is used. Any shape that can be retained in the container 93 may be used. For example, the bottom surface of the container 93 may be gradually inclined so as to rise toward the outer peripheral direction, and the side surface portion of the container 93 may have a shape provided with multiple steps so as to be inclined more than the bottom surface.

  Moreover, in the said embodiment, although the upper part of the container 93 was opened, this invention is not limited to this example. For example, a lid fixed by magnetic force may be provided on the upper portion of the container 93. When the end material P and the cutting fluid are stored, the lid is opened, and the end material P and the cutting fluid can be stored in the container 93. When the end material P and the cutting fluid are stored in the container 93, the lid 93 is closed and fixed by magnetic force. Thus, by rotating the container 93 with the upper part closed, it becomes possible to lengthen the time during which the end material P stays in the container 93, and the end material P can be sufficiently dried. it can. When a certain amount of the end material P stays in the container 93, the lid is pushed up by the end material P scattered upward by centrifugal force and discharged from the container 93.

  Furthermore, in the above embodiment, the example of the CSP substrate 50 has been described as the workpiece, but the present invention is not limited to such an example. As long as a relatively large cutting waste such as a scrap is generated by cutting, for example, various workpieces such as silicon wafers, package substrates such as GPS substrates and BGA substrates, sapphire substrates, glass materials, A synthetic resin material such as a ceramic material, a metal material, or a plastic may be used. The shape of the object to be cut may be any shape such as a substantially rectangular plate shape or a substantially disk shape. Further, the shape of the chuck table 40 and the like can be changed in accordance with the shape of the workpiece 20.

  In the above embodiment, the chuck table 40 is reciprocated in the x-axis direction and the cutting means 20 is fixed in the x-axis direction to perform the cutting process. However, the present invention is not limited to this example, and the chuck table 40 is fixed. Then, the cutting may be performed by reciprocating the cutting means 20 in the x-axis direction. In this case, since the chuck table 40 does not move, the receiving conveyance member 68 that receives the end material or the like can be disposed so as to surround the entire periphery of the fixed chuck table 40.

  The present invention can be applied to a cutting apparatus, and in particular, can be applied to a cutting apparatus having an end material processing apparatus that processes an end material generated when a workpiece is cut.

It is a schematic perspective view which shows the cutting device concerning the 1st Embodiment of this invention. It is explanatory drawing which shows the CSP board | substrate concerning the same embodiment, and the mounting jig of a cutting device. It is a schematic perspective view which shows the end material processing apparatus and end material drying apparatus of the cutting device concerning the embodiment. It is sectional drawing of the end material drying apparatus cut | disconnected in cutting line AA of FIG. It is a schematic perspective view of the end material drying apparatus concerning the embodiment. It is a schematic perspective view which shows the cutting device concerning the 2nd Embodiment of this invention. It is a schematic perspective view which shows the end material drying apparatus of the cutting device concerning the embodiment.

Explanation of symbols

10, 10 'Cutting device 80 End material processing device 90, 90' End material drying device 91, 97 Receiving guide part 92 Case 93 Container 93a Hole 94 Cutting fluid collection tank 94a Side surface 94b Bottom surface 94c Cutting fluid guide part 94d Drain pipe 94e Reflecting wall 95 End material guide part 95a End material guide plate 95b Discharge port 98 Rotation drive part 99 End material collection container P End material

Claims (3)

A cutting apparatus comprising: a chuck table for holding a workpiece; a cutting means for cutting the workpiece with a cutting blade; and an end material processing means for processing an end material generated by the cutting:
The end material processing means includes:
A receiving and conveying means disposed adjacent to the chuck table for receiving the end material scattered by cutting the workpiece and the cutting fluid used for the cutting, and moving the end material and the cutting fluid to an end; ;
Receiving water draining means for receiving the end material dropped from the end of the receiving and conveying means and causing the cutting fluid to flow down;
Cutting fluid recovery means for recovering the cutting fluid flowing down from the receiving draining means;
End material moving means for moving the end material dropped on the receiving draining means to an end of the receiving draining means;
End material drying means for storing the end material dropped from the end of the receiving draining means and drying the stored end material by centrifugal force;
An end material recovery container for recovering the end material dried by the end material drying means;
A cutting device comprising: A cutting apparatus comprising: a chuck table for holding a workpiece; a cutting means for cutting the workpiece with a cutting blade; and an end material processing means for processing an end material generated by the cutting:
The end material processing means includes:
A receiving and conveying means disposed adjacent to the chuck table for receiving the end material scattered by cutting the workpiece and the cutting fluid used for the cutting, and moving the end material and the cutting fluid to an end; ;
End material drying means for storing the end material and the cutting fluid dropped from the end of the receiving and conveying means, and drying the end material by centrifugal force;
An end material recovery container for recovering the dried end material by the end material drying means;
A cutting device comprising: The edge material drying means includes:
A container having an open top and a plurality of holes smaller than the end material formed in the main body;
A rotation drive for rotating the container;
A cutting fluid recovery tank disposed so as to surround the container;
An end material guide plate that is inclined to the outside of the cutting fluid recovery tank;
With
The container accommodates the dropped end material,
The cutting fluid adhering to the end material is discharged from the plurality of holes formed in the main body of the container by the centrifugal force generated when the container is rotated by the rotation driving unit, and the cutting liquid recovery is performed. Collected in the tank,
Due to the centrifugal force generated when the container is rotated by the rotation drive unit, the end material is discharged from the upper part of the container and dropped onto the end material guide plate, and the end material guide plate discharges the end material. The cutting apparatus according to claim 1, wherein the cutting apparatus guides and discharges.

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