CN116453979A - Wafer cleaning equipment - Google Patents

Wafer cleaning equipment Download PDF

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Publication number
CN116453979A
CN116453979A CN202310496320.XA CN202310496320A CN116453979A CN 116453979 A CN116453979 A CN 116453979A CN 202310496320 A CN202310496320 A CN 202310496320A CN 116453979 A CN116453979 A CN 116453979A
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CN
China
Prior art keywords
liquid
opening
gas channel
shell
gas
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202310496320.XA
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Chinese (zh)
Inventor
姜岩松
王红明
李朋
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ningbo All Semi Micro Electronics Equipment Co ltd
Original Assignee
Ningbo All Semi Micro Electronics Equipment Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ningbo All Semi Micro Electronics Equipment Co ltd filed Critical Ningbo All Semi Micro Electronics Equipment Co ltd
Priority to CN202310496320.XA priority Critical patent/CN116453979A/en
Publication of CN116453979A publication Critical patent/CN116453979A/en
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Abstract

The present invention provides a wafer cleaning apparatus, comprising: a housing; the shell is provided with a first opening and a second opening; a deflector; the guide plate is provided with a third opening; a liquid-gas passage; the inside of the shell is provided with a liquid-gas channel, the liquid-gas channel is provided with a first liquid outlet and an exhaust structure, the first liquid outlet is used for discharging liquid, and the exhaust structure is used for exhausting gas; a carrying platform; the bearing table is provided with a bearing surface, and the bearing surface is arranged on one side of the first opening, which is close to the third opening, so that liquid and/or gas on the wafer flows to the guide plate; a liquid blocking structure; the liquid blocking structure is arranged at the periphery of the third opening and is connected with the guide plate, and the liquid blocking structure part protrudes out of the guide plate towards the first opening. The invention solves the problem that the liquid easily flows back into the motor of the bearing table due to overlarge liquid flow in the process of cleaning the wafer by using the liquid or the gas, thereby influencing the normal work of the bearing table.

Description

Wafer cleaning equipment
Technical Field
The invention relates to the technical field of semiconductors, in particular to wafer cleaning equipment.
Background
Wafer refers to a wafer used for manufacturing a silicon semiconductor circuit, and the wafer is cleaned, and the process of cleaning pollutants generated by contact with various organic matters, particles and metals in the process of continuously processing, forming and polishing the wafer is an important process step in the wafer manufacturing process.
In the process of semiconductor cleaning, especially Gao Jiejing wafer products such as logic integrated circuits, memory, power devices and the like, the wafer products are processed by various photolithography, wet methods, deposition, oxidation and other related processes, and the process of cleaning the substrate is performed before or after each process to remove foreign matters and particles generated in each process, so that the accuracy and reproducibility of the subsequent process yield are ensured.
However, in the actual construction process, there is a problem that: in the process of cleaning the wafer by using liquid or gas, the liquid flows excessively, so that the liquid easily flows back into the motor of the bearing table, and the normal operation of the bearing table is further affected.
Disclosure of Invention
Therefore, the invention provides the wafer cleaning equipment, which solves the problem that the liquid easily flows back into the motor of the bearing table due to overlarge liquid flow in the process of cleaning the wafer by using the liquid or the gas, thereby affecting the normal operation of the bearing table.
In order to solve the above problems, the present invention provides a wafer cleaning apparatus, comprising: a housing; the shell is provided with a first opening and a second opening; the first opening and the second opening are correspondingly arranged; the first opening is arranged on one side of the second opening away from the inner part of the shell; a deflector; the guide plate is arranged around the second opening, the guide plate is provided with a third opening, the third opening is arranged corresponding to the first opening, and the third opening is arranged on one side, close to the first opening, of the second opening; a liquid-gas passage; the shell is internally provided with a liquid-gas channel, the liquid-gas channel is arranged on at least one side of the guide plate, the guide plate guides liquid and/or gas to the liquid-gas channel, the liquid-gas channel is provided with a first liquid outlet and an exhaust structure, the first liquid outlet is arranged on one side of the exhaust structure, the first liquid outlet is used for discharging liquid, and the exhaust structure is used for discharging gas; a carrying platform; the bearing table is provided with a bearing surface, the bearing surface is used for bearing the wafer, and the bearing surface is arranged on one side of the first opening, which is close to the third opening, so that liquid and/or gas on the wafer flows to the guide plate; a liquid blocking structure; the liquid blocking structure is arranged at the periphery of the third opening and is connected with the guide plate, and the liquid blocking structure part protrudes out of the guide plate towards the first opening; and the motor is provided with a rotating shaft for driving the bearing table to rotate, and the rotating shaft is arranged at the second opening.
Compared with the prior art, the technical effect achieved by adopting the technical scheme is as follows: the first opening is used for spraying cleaning liquid or gas to the bearing table, the second opening is used for driving the bearing table to rotate through the rotating shaft, the third opening is used for accommodating the wafer, the influence on the wafer when the wafer or the wafer is placed to rotate is prevented, the first opening, the bearing surface, the third opening and the second opening are sequentially formed in the wafer cleaning equipment from the top to the bottom, liquid and/or gas is sprayed out of the wafer on the bearing surface through the first opening, the bearing surface rotates to throw out the liquid and/or gas to the guide plate through centrifugal force, the liquid blocking structure is used for placing the liquid and/or gas to flow back to the motor rotating shaft to further influence the motor to work, the liquid and/or gas channel is used for guaranteeing that the liquid and/or gas is discharged through the first liquid discharging port and/or the gas structure, and further the problem that the wafer is used in the cleaning process of liquid or gas, the liquid easily flows back to the motor of the bearing table due to overlarge liquid flow is solved, and normal work of the bearing table is further influenced.
Further, keep off liquid structure includes: a first liquid blocking protrusion; the first liquid blocking protrusion protrudes from the guide plate towards the first opening direction, and the first liquid blocking protrusion is inclined towards the guide plate from the third opening direction.
Compared with the prior art, the technical effect achieved by adopting the technical scheme is as follows: the protruding slope setting of first fender liquid can further prevent the liquid from striking the sputtering condition that keeps off the liquid structure and appear in the backward flow in-process to realize further preventing that liquid from flowing back to the effect of rotation axis department.
Further, the liquid-gas channel includes: a receiving chamber; the accommodating cavity is arranged around the second opening, and the accommodating cavity is arranged on one side of the guide plate close to the second opening; the holding cavity is provided with a second liquid blocking protrusion, the second liquid blocking protrusion protrudes from the second opening to the third opening, the second liquid blocking protrusion is arranged on the periphery of the second opening, the holding cavity is far away from the periphery of the second liquid blocking protrusion, a liquid discharge groove is formed in the periphery of the second liquid blocking protrusion, and a second liquid discharge port is formed in the liquid discharge groove.
Compared with the prior art, the technical effect achieved by adopting the technical scheme is as follows: the holding chamber can hold the liquid that overflows from keeping off the liquid structure, and the bellied setting of second keeps off liquid makes the liquid that holds the intracavity no longer flow back to rotation axis department, and the flowing back groove can have the guide effect to liquid, makes the liquid can follow the second leakage fluid dram in the flowing back groove and discharges to hold the chamber, prevents to hold piling up of intracavity liquid.
Further, keep off liquid structure still includes: a first guide surface and a second guide surface; the first guide surface is arranged on one side of the first liquid blocking protrusion, which is close to the third opening, the second guide surface is connected with one side of the first guide surface, which is close to the accommodating cavity, the second guide surface is vertically arranged, and the first guide surface and the second guide surface are used for guiding liquid into the liquid discharging groove.
Compared with the prior art, the technical effect achieved by adopting the technical scheme is as follows: the first guide surface and the second guide surface can guide overflowed liquid into the liquid discharge groove, so that liquid in the accommodating cavity can be conveniently discharged.
Further, the housing includes: a first housing and a second housing; the first shell is movably connected with the second shell, the first opening is formed in the first shell, the second opening is formed in the second shell, the guide plate is arranged on one side, close to the first shell, of the second shell, and the accommodating cavity is formed in one side, close to the second opening, of the second shell.
Compared with the prior art, the technical effect achieved by adopting the technical scheme is as follows: the first shell and the second shell can be mutually separated, wafers with various heights are adapted, liquid and/or gas cannot splash out from the first opening, the guide plate is arranged between the second shell and the first shell, the liquid and/or gas flows to the second shell through the guide plate, and the first shell is used for preventing the liquid and/or gas from splashing out.
Further, the guide plate comprises a first guide part and a second guide part; the second guide part is connected with one end of the first guide part far away from the third opening, and both the first guide part and the second guide part incline from the first shell direction to the second shell direction.
Compared with the prior art, the technical effect achieved by adopting the technical scheme is as follows: the liquid flows to the second flow guiding part through the first flow guiding part, the liquid can be discharged through the liquid-gas channel more smoothly due to the two-section flow guiding effect, and the inclined arrangement of the first flow guiding part and the second flow guiding part further prevents the liquid from flowing back to the rotating shaft.
Further, the liquid-gas channel includes: a first liquid-gas channel and a second liquid-gas channel; a first liquid-gas channel is formed between the first shell and the second flow guiding part, the second liquid-gas channel is arranged on one side, close to the second shell, of the second flow guiding part, one end, far away from the first flow guiding part, of the second flow guiding part is a first end, the first liquid-gas channel is communicated with the second liquid-gas channel at the first end, and the first liquid outlet and the exhaust structure are arranged on the second liquid-gas channel.
Compared with the prior art, the technical effect achieved by adopting the technical scheme is as follows: the first liquid-gas channel is used for limiting liquid and/or gas thrown out of the wafer to flow into the second liquid-gas channel, so that the thrown liquid and/or gas can not splash or flow out of the shell and flow to the rotating shaft, and the first liquid outlet and the exhaust structure are arranged at the bottom of the second liquid-gas channel, so that the liquid and/or gas can be conveniently discharged from the second liquid-gas channel.
Further, the exhaust structure protrudes from the bottom of the second liquid-gas channel.
Compared with the prior art, the technical effect achieved by adopting the technical scheme is as follows: the exhaust structure protrusion sets up can prevent that liquid from passing through exhaust structure and discharges, guarantees that exhaust structure can exhaust gas only, conveniently handles exhaust gas to the existence of avoiding handling in-process liquid leads to the treatment work can not continue.
Further, the wafer cleaning apparatus includes: a first lifting mechanism and a second lifting mechanism; the first elevating system is arranged at the bottom of the second liquid-gas channel, the first elevating system is used for elevating the guide plate, the second elevating system is used for elevating the first shell, and the second elevating system is arranged at the outer side of the second shell.
Compared with the prior art, the technical effect achieved by adopting the technical scheme is as follows: the first lifting mechanism and the second lifting mechanism can lift the first shell and the guide plate to a proper height, and the first shell, the guide plate and the second shell are sequentially arranged from top to bottom, so that liquid and/or gas on the wafer can flow to the guide plate instead of the first shell, and the first shell can play a role in splashing prevention.
Further, be equipped with around the first elevating system and keep off the liquid wall, keep off the liquid wall and be first part from second liquid gas channel bottom to first liquid gas channel direction bulge, keep off the liquid wall and be the second part from second liquid gas channel bottom to keeping away from first part direction bulge, the one end that the second part was kept away from to the first part is equipped with the inlet, the second part is equipped with the third leakage fluid dram.
Compared with the prior art, the technical effect achieved by adopting the technical scheme is as follows: the liquid blocking wall is arranged to prevent liquid from affecting the first lifting mechanism preliminarily, the third liquid outlet is arranged on the adjacent side of the liquid inlet, and when the liquid is accumulated to the liquid inlet, the liquid can be discharged from the third liquid outlet rapidly through the liquid inlet to the first lifting mechanism, so that the liquid is prevented from being accumulated in the liquid blocking wall.
After the technical scheme of the invention is adopted, the following technical effects can be achieved:
(1) The first opening is used for spraying cleaning liquid or gas to the bearing table, the second opening is used for driving the bearing table to rotate through the rotating shaft, the third opening is used for accommodating the wafer, the influence on the wafer when the wafer is placed or rotated is prevented, the first opening, the bearing surface, the third opening and the second opening are sequentially arranged from the top to the bottom of the wafer cleaning equipment, the liquid and/or the gas are sprayed out of the wafer on the bearing surface through the first opening, the bearing surface rotates to throw out the liquid and/or the gas to the guide plate by utilizing centrifugal force, the liquid blocking structure is used for placing the liquid and/or the gas to flow back to the motor rotating shaft to influence the motor, the liquid and/or the gas is used for being discharged through the liquid and/or the gas through the first liquid discharging port and/or the gas discharging structure, and the problem that the liquid easily flows back to the motor of the bearing table to influence the normal work of the bearing table due to overlarge liquid flow is solved in the cleaning process of the wafer;
(2) The first liquid blocking protrusion is obliquely arranged, so that the liquid can be further prevented from impacting the liquid blocking structure in the backflow process to generate sputtering conditions, and the effect of further preventing the liquid from flowing back to the rotating shaft is achieved;
(3) The holding chamber can hold the liquid that overflows from keeping off the liquid structure, bellied setting makes the liquid that holds the intracavity no longer flow back to rotation axis department, and the flowing back groove can have the guide effect to the liquid, makes the liquid can follow the second leakage fluid dram in the flowing back groove and discharges the holding chamber, prevents to hold the piling up of intracavity liquid.
Drawings
Fig. 1 is a schematic structural diagram of a wafer cleaning apparatus according to an embodiment of the present invention.
Fig. 2 is a schematic view of a wafer cleaning apparatus of fig. 1 after lifting.
FIG. 3 is a schematic view of a wafer cleaning apparatus of FIG. 2 from another perspective.
Fig. 4 is a cross-sectional view taken along the direction A-A in fig. 3.
Fig. 5 is a schematic view illustrating an internal structure of the wafer cleaning apparatus of fig. 2.
Fig. 6 is a schematic view of a further view of the interior of the wafer cleaning apparatus of fig. 2.
Fig. 7 is a schematic view of a wafer cleaning apparatus according to fig. 2 from another view.
Fig. 8 is a schematic view of the baffle of fig. 4.
Fig. 9 is a cross-sectional view of the baffle of fig. 8.
Fig. 10 is a partial enlarged view at B in fig. 8.
Reference numerals illustrate:
100. a wafer cleaning apparatus; 110. a housing; 110a, a first housing; 110b, a second housing; 111. a first opening; 112. a second opening; 120. a deflector; 121. a third opening; 122. a first flow guiding part; 123. a second flow guiding part; 130. a liquid-gas passage; 130a, a first liquid-gas channel; 130b, a second liquid-gas channel; 131. a first liquid discharge port; 132. an exhaust structure; 133. a receiving chamber; 134. a second liquid blocking protrusion; 135. a liquid discharge tank; 136. a second liquid outlet; 140. a carrying platform; 141. a bearing surface; 150. a liquid blocking structure; 151. a first liquid blocking protrusion; 152. a first guide surface; 153. a second guide surface; 161. a drive shaft; 171. a first lifting mechanism; 172. a second lifting mechanism; 173. a liquid blocking wall; 174. a first portion; 175. a second portion; 176. a liquid inlet; 177. a third liquid outlet; 180. an exhaust gas collecting member; 200. and (3) a wafer.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Referring to fig. 1 to 10, which are a wafer cleaning apparatus 100 according to an embodiment of the present invention, the wafer cleaning apparatus 100 includes: a housing 110; the housing 110 is provided with a first opening 111 and a second opening 112; the first opening 111 is disposed corresponding to the second opening 112; the first opening 111 is provided at a side of the second opening 112 away from the inside of the housing 110; a baffle 120; the deflector 120 is arranged around the second opening 112, the deflector 120 is provided with a third opening 121, the third opening 121 is arranged corresponding to the first opening 111, and the third opening 121 is arranged on one side of the second opening 112 close to the first opening 111; a liquid-gas passage 130; the inside of the shell 110 is provided with a liquid-gas channel 130, the liquid-gas channel 130 is arranged on at least one side of the guide plate 120, the guide plate 120 guides liquid and/or gas to the liquid-gas channel 130, the liquid-gas channel 130 is provided with a first liquid outlet 131 and an exhaust structure 132, the first liquid outlet 131 is arranged on one side of the exhaust structure 132, the first liquid outlet 131 is used for discharging liquid, and the exhaust structure 132 is used for discharging gas; a carrying table 140; the carrying platform 140 is provided with a carrying surface 141, the carrying surface 141 is used for carrying the wafer 200, and the carrying surface 141 is arranged on one side of the first opening 111 close to the third opening 121, so that liquid and/or gas on the wafer 200 flows to the guide plate 120; a liquid blocking structure 150; the liquid blocking structure 150 is disposed at the periphery of the third opening 121, the liquid blocking structure 150 is connected to the baffle 120, and a portion of the liquid blocking structure 150 protrudes from the baffle 120 toward the first opening 111.
In this embodiment, the first opening 111 is used for spraying cleaning liquid or gas to the carrying table 140, the second opening 112 is used for driving the carrying table 140 to rotate through the rotating shaft, the third opening 121 is used for accommodating the wafer 200, preventing the wafer 200 from being affected when the wafer 200 is placed or rotated, the wafer cleaning apparatus 100 is sequentially provided with the first opening 111, the carrying surface 141, the third opening 121 and the second opening 112 from top to bottom, the liquid and/or gas is sprayed out to the wafer 200 on the carrying surface 141 through the first opening 111, the carrying surface 141 rotates to utilize centrifugal force to throw out the liquid and/or gas to the deflector 120, the liquid blocking structure 150 is used for placing the liquid and/or gas to flow back to the rotating shaft to affect the motor (not shown in the figure), and the liquid and gas channel 130 is used for ensuring that the liquid and/or gas is discharged through the first liquid outlet 131 and/or the gas to further solve the problem that the liquid flow of the wafer 200 is too large in the cleaning process using the liquid or gas, the liquid is easy to flow back to the motor to the carrying table 140 to affect the normal operation of the carrying table (not shown).
Further, the wafer cleaning apparatus 100 further includes: the exhaust gas collecting member 180 is disposed at the bottom of the housing 110, and the exhaust gas collecting member 180 is communicated with the exhaust structure 132 for collecting the gas exhausted from the exhaust structure 132 and delivering the gas to other devices.
For example, the exhaust gas collector 180 communicates with an air pump for extracting gas in the liquid-gas channel.
In a specific embodiment, the liquid blocking structure 150 includes: a first liquid blocking protrusion 151; the first liquid blocking protrusion 151 protrudes from the baffle 120 toward the first opening 111, and the first liquid blocking protrusion 151 is inclined from the third opening 121 toward the baffle 120.
It should be noted that, the inclined arrangement of the first liquid blocking protrusion 151 can further prevent the liquid from striking the liquid blocking structure 150 during the backflow process, thereby further preventing the liquid from flowing back to the rotating shaft.
Preferably, the distance between the end of the first liquid blocking protrusion 151, which is close to the wafer 200, and the wafer 200 is 1 mm-2 mm, so that the liquid blocking effect of the first liquid blocking protrusion 151 is improved, and the method is not limited herein.
In a specific embodiment, the liquid-gas channel 130 includes: a receiving chamber 133; the accommodating cavity 133 is arranged around the second opening 112, and the accommodating cavity 133 is arranged on one side of the guide plate 120 close to the second opening 112; the accommodating cavity 133 is provided with a second liquid blocking protrusion 134, the second liquid blocking protrusion 134 protrudes from the second opening 112 towards the third opening 121, the second liquid blocking protrusion 134 is arranged at the periphery of the second opening 112, the accommodating cavity 133 is provided with a liquid discharge groove 135 away from the periphery of the second liquid blocking protrusion 134, and the liquid discharge groove 135 is provided with a second liquid discharge port 136.
The accommodating cavity 133 can accommodate the liquid overflowing from the liquid blocking structure 150, the liquid in the accommodating cavity 133 is not refluxed to the rotating shaft any more due to the arrangement of the second liquid blocking protrusion 134, the liquid draining groove 135 can guide the liquid, the liquid can be drained out of the accommodating cavity 133 from the second liquid draining port 136 in the liquid draining groove 135, and accumulation of the liquid in the accommodating cavity 133 is prevented.
Optionally, hold and be equipped with a plurality of recovery pieces in the chamber 133, retrieve the piece protrusion and hold the chamber 133 bottom setting, retrieve the piece and be equipped with the collecting hole and be used for collecting liquid, promote the recovery efficiency of liquid.
In a specific embodiment, the liquid blocking structure 150 further includes: a first guide surface 152 and a second guide surface 153; the first guiding surface 152 is disposed on a side of the first liquid blocking protrusion 151 near the third opening 121, the second guiding surface 153 is connected to a side of the first guiding surface 152 near the accommodating cavity 133, the second guiding surface 153 is vertically disposed, and the first guiding surface 152 and the second guiding surface 153 are used for guiding the liquid into the liquid draining groove 135.
It should be noted that, the first guiding surface 152 and the second guiding surface 153 can guide the overflowed liquid into the liquid draining groove 135, so as to facilitate the draining of the liquid in the accommodating cavity 133.
Preferably, the second guiding surface 153 is inclined by a larger angle than the first guiding surface 152, so that the liquid can smoothly enter the liquid-gas channel 130 through the second guiding surface 153, and the guiding capability of the second guiding surface 153 is improved.
In a specific embodiment, the housing 110 includes: a first housing 110a and a second housing 110b; the first housing 110a is movably connected to the second housing 110b, the first opening 111 is disposed in the first housing 110a, the second opening 112 is disposed in the second housing 110b, the baffle 120 is disposed on a side of the second housing 110b adjacent to the first housing 110a, and the accommodating cavity 133 is disposed on a side of the second housing 110b adjacent to the second opening 112.
It should be noted that, the first housing 110a and the second housing 110b can be separated from each other, and adapt to wafers 200 with various heights, so that liquid and/or gas cannot splash out from the first opening 111, the baffle 120 is disposed between the second housing 110b and the first housing 110a, so that the liquid and/or gas flows to the second housing 110b through the baffle 120, and the first housing 110a is configured to prevent liquid and/or gas from splashing out.
In a specific embodiment, the baffle 120 includes a first baffle portion 122 and a second baffle portion 123; the second guiding portion 123 is connected to an end of the first guiding portion 122 away from the third opening 121, and both the first guiding portion 122 and the second guiding portion 123 are inclined toward the second housing 110b along the first housing 110 a.
It should be noted that, the liquid flows to the second diversion portion 123 via the first diversion portion 122, and the two diversion effects enable the liquid to be discharged through the liquid-gas channel 130 more smoothly, and the first diversion portion 122 and the second diversion portion 123 are inclined to further prevent the liquid from flowing back to the rotating shaft.
In a specific embodiment, the liquid-gas channel 130 includes: a first liquid-gas passage 130a and a second liquid-gas passage 130b; a first liquid-gas channel 130a is formed between the first casing 110a and the second guiding portion 123, the second liquid-gas channel 130b is disposed on one side of the second guiding portion 123 close to the second casing 110b, one end of the second guiding portion 123 away from the first guiding portion 122 is a first end, the first liquid-gas channel 130a is communicated with the second liquid-gas channel 130b at the first end, and the first liquid outlet 131 and the exhaust structure 132 are disposed on the second liquid-gas channel 130b.
It should be noted that, the first liquid-gas channel 130a is used to define the flow of the liquid and/or gas thrown out of the wafer 200 into the second liquid-gas channel 130b, so as to ensure that the thrown liquid and/or gas does not splash or flow out of the housing and flow to the rotating shaft, and the first liquid outlet 131 and the air exhaust structure 132 are disposed at the bottom of the second liquid-gas channel 130b, so that the liquid and/or gas is conveniently discharged from the second liquid-gas channel 130b.
In one particular embodiment, the vent structure 132 protrudes from the bottom of the second liquid-gas channel 130b.
It should be noted that, the protruding arrangement of the exhaust structure 132 can prevent the liquid from being discharged through the exhaust structure 132, so that the exhaust structure 132 can only discharge gas, and the exhaust gas can be conveniently treated, so that the treatment work cannot be continued due to the liquid in the treatment process.
In one specific embodiment, the wafer cleaning apparatus 100 includes: a first lifting mechanism 171 and a second lifting mechanism 172; the first lifting mechanism 171 is disposed at the bottom of the second liquid-gas channel 130b, the first lifting mechanism 171 is used for lifting the baffle 120, the second lifting mechanism 172 is used for lifting the first housing 110a, and the second lifting mechanism 172 is disposed outside the second housing 110 b.
It should be noted that, the first lifting mechanism 171 and the second lifting mechanism 172 can lift the first housing 110a and the baffle 120 to a suitable height, and the first housing 110a, the baffle 120 and the second housing 110b are sequentially arranged from top to bottom, so as to ensure that the liquid and/or the gas on the wafer 200 can flow to the baffle 120 instead of the first housing 110a, and at the same time, the first housing 110a can play a role of splash prevention.
In a specific embodiment, a liquid blocking wall 173 is disposed around the first lifting mechanism 171, a portion of the liquid blocking wall 173 protruding from the bottom of the second liquid-gas channel 130b toward the first liquid-gas channel 130a is a first portion 174, a portion of the liquid blocking wall 173 protruding from the bottom of the second liquid-gas channel 130b toward a direction away from the first portion 174 is a second portion 175, a liquid inlet 176 is disposed at an end of the first portion 174 away from the second portion 175, and a third liquid outlet 177 is disposed at the second portion 175.
The liquid blocking wall 173 is provided to primarily prevent liquid from affecting the first lifting mechanism 171, the third liquid outlet 177 is provided on an adjacent side of the liquid inlet 176, and when liquid is accumulated in the liquid inlet 176, the liquid can be rapidly discharged from the third liquid outlet 177 to the first lifting mechanism 171 through the liquid inlet 176, thereby preventing accumulation of liquid in the liquid blocking wall 173.
The flow direction of the liquid and the gas is as follows: liquid and/or gas is sprayed onto the wafer 200 from the first opening 111, the carrier 140 drives the wafer 200 to rotate, the liquid and/or gas is thrown out by centrifugal force, the liquid and/or gas enters the first liquid-gas channel 130a, the liquid enters the second liquid-gas channel 130b through the first flow guiding part 122 and the second flow guiding part 123, the gas enters the second liquid-gas channel 130b through the first liquid-gas channel 130a, the liquid is discharged from the first liquid outlet 131, and the gas is discharged from the gas discharging structure 132.
Finally, it should be noted that: the above embodiments are only for illustrating the technical solution of the present invention, and are not limiting; although the invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims (10)

1. A wafer cleaning apparatus, comprising:
a housing; the shell is provided with a first opening and a second opening; the first opening is arranged corresponding to the second opening; the first opening is arranged on one side of the second opening away from the inner part of the shell;
a deflector; the guide plate is arranged around the second opening, a third opening is formed in the guide plate, the third opening is arranged corresponding to the first opening, and the third opening is arranged on one side, close to the first opening, of the second opening;
a liquid-gas passage; the inside of the shell is provided with the liquid-gas channel, the liquid-gas channel is arranged on at least one side of the guide plate, the guide plate guides liquid and/or gas to the liquid-gas channel, the liquid-gas channel is provided with a first liquid outlet and an exhaust structure, the first liquid outlet is arranged on one side of the exhaust structure, the first liquid outlet is used for discharging liquid, and the exhaust structure is used for discharging gas;
a carrying platform; the bearing table is provided with a bearing surface which is used for bearing the wafer, and the bearing surface is arranged on one side of the first opening, which is close to the third opening, so that liquid and/or gas on the wafer flows to the guide plate;
a liquid blocking structure; the liquid blocking structure is arranged at the periphery of the third opening and is connected with the guide plate, and the liquid blocking structure part protrudes out of the guide plate towards the first opening;
the motor is provided with a rotating shaft used for driving the bearing table to rotate, and the rotating shaft is arranged at the second opening.
2. The wafer cleaning apparatus of claim 1, wherein the liquid blocking structure comprises:
a first liquid blocking protrusion;
the first liquid blocking protrusion protrudes from the guide plate towards the first opening direction, and the first liquid blocking protrusion is inclined towards the guide plate from the third opening direction.
3. The wafer cleaning apparatus of claim 2, wherein the liquid-gas channel comprises: a receiving chamber; the accommodating cavity is arranged around the second opening, and the accommodating cavity is arranged on one side, close to the second opening, of the guide plate;
the accommodating cavity is provided with a second liquid blocking protrusion, the second liquid blocking protrusion protrudes from the second opening to the third opening, the second liquid blocking protrusion is arranged on the periphery of the second opening, the accommodating cavity is far away from the periphery of the second liquid blocking protrusion, a liquid discharge groove is formed in the periphery of the second liquid blocking protrusion, and a second liquid discharge port is formed in the liquid discharge groove.
4. The wafer cleaning apparatus of claim 3, wherein the liquid blocking structure further comprises:
a first guide surface and a second guide surface;
the first guide surface is arranged on one side, close to the third opening, of the first liquid blocking protrusion, the second guide surface is connected with one side, close to the accommodating cavity, of the first guide surface, the second guide surface is vertically arranged, and the first guide surface and the second guide surface are used for guiding liquid into the liquid discharging groove.
5. The wafer cleaning apparatus of claim 3, wherein the housing comprises:
a first housing and a second housing;
the first shell is movably connected with the second shell, the first opening is formed in the first shell, the second opening is formed in the second shell, the guide plate is arranged on one side, close to the first shell, of the second shell, and the accommodating cavity is formed in one side, close to the second opening, of the second shell.
6. The wafer cleaning apparatus of claim 5, wherein the baffle comprises:
a first flow guiding part and a second flow guiding part;
the second flow guiding part is connected with one end, far away from the third opening, of the first flow guiding part, and both the first flow guiding part and the second flow guiding part incline towards the second shell direction from the first shell direction.
7. The wafer cleaning apparatus of claim 6, wherein the liquid-gas channel comprises:
a first liquid-gas channel and a second liquid-gas channel;
the first liquid-gas channel is formed between the first shell and the second flow guiding part, the second liquid-gas channel is arranged on one side, close to the second shell, of the second flow guiding part, one end, away from the first flow guiding part, of the second flow guiding part is a first end, the first liquid-gas channel is communicated with the second liquid-gas channel at the first end, and the first liquid outlet and the exhaust structure are arranged on the second liquid-gas channel.
8. The wafer cleaning apparatus of claim 7, wherein the vent structure protrudes from the bottom of the second liquid-gas channel.
9. The wafer cleaning apparatus of claim 7, wherein the wafer cleaning apparatus comprises:
a first lifting mechanism and a second lifting mechanism;
the first lifting mechanism is arranged at the bottom of the second liquid-gas channel and used for lifting the guide plate, the second lifting mechanism is used for lifting the first shell, and the second lifting mechanism is arranged at the outer side of the second shell.
10. The wafer cleaning apparatus according to claim 9, wherein a liquid blocking wall is disposed around the first lifting mechanism, the liquid blocking wall is a first portion from the bottom of the second liquid-gas channel toward the protruding portion of the first liquid-gas channel, the liquid blocking wall is a second portion from the bottom of the second liquid-gas channel toward the protruding portion of the second liquid-gas channel away from the first portion, a liquid inlet is disposed at one end of the first portion away from the second portion, and a third liquid outlet is disposed at the second portion.
CN202310496320.XA 2023-05-05 2023-05-05 Wafer cleaning equipment Pending CN116453979A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202310496320.XA CN116453979A (en) 2023-05-05 2023-05-05 Wafer cleaning equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202310496320.XA CN116453979A (en) 2023-05-05 2023-05-05 Wafer cleaning equipment

Publications (1)

Publication Number Publication Date
CN116453979A true CN116453979A (en) 2023-07-18

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ID=87121982

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202310496320.XA Pending CN116453979A (en) 2023-05-05 2023-05-05 Wafer cleaning equipment

Country Status (1)

Country Link
CN (1) CN116453979A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117153740A (en) * 2023-10-31 2023-12-01 宁波润华全芯微电子设备有限公司 Wafer processing device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117153740A (en) * 2023-10-31 2023-12-01 宁波润华全芯微电子设备有限公司 Wafer processing device
CN117153740B (en) * 2023-10-31 2024-02-09 宁波润华全芯微电子设备有限公司 Wafer processing device

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