CN115122247A - Putty polishing abrasive paper and putty polishing device using same - Google Patents
Putty polishing abrasive paper and putty polishing device using same Download PDFInfo
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- CN115122247A CN115122247A CN202210783773.6A CN202210783773A CN115122247A CN 115122247 A CN115122247 A CN 115122247A CN 202210783773 A CN202210783773 A CN 202210783773A CN 115122247 A CN115122247 A CN 115122247A
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- 238000005498 polishing Methods 0.000 title claims abstract description 68
- 238000000227 grinding Methods 0.000 claims abstract description 51
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 42
- 244000137852 Petrea volubilis Species 0.000 claims abstract description 31
- 239000000463 material Substances 0.000 claims abstract description 28
- 239000007767 bonding agent Substances 0.000 claims abstract description 6
- 239000010410 layer Substances 0.000 claims description 92
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims description 59
- 239000005011 phenolic resin Substances 0.000 claims description 59
- 229920001568 phenolic resin Polymers 0.000 claims description 59
- 239000000839 emulsion Substances 0.000 claims description 41
- 239000004576 sand Substances 0.000 claims description 34
- 239000012790 adhesive layer Substances 0.000 claims description 29
- 239000011280 coal tar Substances 0.000 claims description 21
- 239000002245 particle Substances 0.000 claims description 18
- 238000010438 heat treatment Methods 0.000 claims description 16
- 239000010453 quartz Substances 0.000 claims description 14
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 14
- 238000007761 roller coating Methods 0.000 claims description 9
- 238000003825 pressing Methods 0.000 claims description 6
- 239000011248 coating agent Substances 0.000 claims description 4
- 238000000576 coating method Methods 0.000 claims description 4
- 239000010426 asphalt Substances 0.000 claims description 3
- 239000003245 coal Substances 0.000 claims description 3
- 230000000149 penetrating effect Effects 0.000 claims description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 2
- 239000011259 mixed solution Substances 0.000 claims description 2
- 239000002994 raw material Substances 0.000 claims description 2
- 230000000694 effects Effects 0.000 abstract description 8
- 230000013011 mating Effects 0.000 abstract description 2
- 238000005728 strengthening Methods 0.000 abstract description 2
- 230000001276 controlling effect Effects 0.000 description 8
- 239000011230 binding agent Substances 0.000 description 7
- 230000005484 gravity Effects 0.000 description 7
- 238000000034 method Methods 0.000 description 6
- 239000004575 stone Substances 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 5
- 238000002791 soaking Methods 0.000 description 5
- 230000008569 process Effects 0.000 description 3
- 230000008901 benefit Effects 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000001105 regulatory effect Effects 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/10—Single-purpose machines or devices
- B24B7/18—Single-purpose machines or devices for grinding floorings, walls, ceilings or the like
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
- B24D11/001—Manufacture of flexible abrasive materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
- B24D11/02—Backings, e.g. foils, webs, mesh fabrics
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Polishing Bodies And Polishing Tools (AREA)
Abstract
A putty polishing abrasive paper and a putty polishing device using the same are provided, wherein original abrasive paper is pre-polished to obtain polishing abrasive paper; the original abrasive paper comprises base paper, a flexible layer is arranged on the base paper, a bonding agent doped with a friction agent is coated on the flexible layer to form an auxiliary bonding layer, a friction agent layer formed by the friction agent is arranged on the auxiliary bonding layer, and a bonding agent layer is arranged on the outer side of the original abrasive paper to obtain the original abrasive paper; and pre-grinding the original sand paper by using a material with the hardness of not less than 6 in the Rich hardness as a pre-grinding material to obtain the grinding sand paper. This application adopts the mode that sets up the flexible layer on the base paper for when strengthening base paper intensity, can also have certain bonding ability, make supplementary tie coat stable connection, the effect on supplementary tie coat is at first to guarantee joint strength, and secondly just can strengthen the connection stability of frictioning agent, has certain mating reaction with the frictioning agent.
Description
Technical Field
The application relates to putty polishing sand paper and a putty polishing device using the same.
Background
After the putty is coated, in order to ensure the construction effect, the flatness of the surface of the putty needs to be ensured, and the putty needs to have certain connection adhesion capacity. Therefore putty need polish after the construction and handle, owing to need certain control adjustment effect at the in-process of polishing, therefore the above-mentioned demand of difficult meeting of machine equipment, now mostly utilize the manual work to accomplish. In the manual work process of polishing, generally need adopt a grinding machanism and supplementary sanding abrasive paper above that to realize, present grinding device generally adopts the form of bonding abrasive paper, and stability is limited, still can take place the fold in the use, must lead to the fact the damage to putty after taking place the fold, if observe carelessly, must have great use risk, and also be difficult to fix once more after taking place the fold, use short time just need to change, need guarantee its roughness in the change process, it also has certain degree of difficulty to operate.
Disclosure of Invention
In order to solve the problems, the application provides putty polishing abrasive paper on one hand, and the original abrasive paper is pre-polished to obtain polishing abrasive paper; the original sand paper comprises base paper, a flexible layer is arranged on the base paper, a bonding agent doped with a friction agent is coated on the flexible layer to form an auxiliary bonding layer, a friction agent layer formed by the friction agent is arranged on the auxiliary bonding layer, and a bonding agent layer is arranged on the outer side of the original sand paper to obtain the original sand paper; and pre-grinding the original sand paper by using a material with the hardness of not less than 6 in the Rich hardness as a pre-grinding material to obtain the grinding sand paper. This application adopts the mode that sets up the flexible layer on the base paper for when strengthening base paper intensity, can also have certain bonding ability, make supplementary tie coat stable connection, the effect on supplementary tie coat is at first to guarantee joint strength, and secondly just can strengthen the connection stability of frictional agent, has certain mating reaction with the frictional agent.
Preferably, the flexible layer is processed as follows:
immersing the base paper in phenolic resin for not less than 30s, treating the paper on a roller coating machine, and performing primary curing treatment at 80-100 ℃.
Preferably, the flexible layer is processed as follows: coating a mixed solution of phenolic resin, coal-based asphalt and SiC on the base paper subjected to primary curing treatment to form an auxiliary bonding layer, then carrying out sand planting operation on the auxiliary bonding layer, and putting a product subjected to sand planting into an environment at 80-100 ℃ for 20-30 min; then setting an adhesive layer, controlling the thickness of the adhesive layer to be 1.5-2mm to form the adhesive layer, then placing the adhesive layer into an oxygen-isolated environment, heating to 140-; and then, grinding by using a pre-grinding material to obtain grinding abrasive paper.
Preferably, the grain size of SiC in the auxiliary bonding layer is 30-100 nm;
the sand planting operation adopts SiC particles, and the mesh number of the SiC particles is 180-240 meshes;
the adhesive layer adopts acrylic emulsion;
the auxiliary bonding layer is prepared from the following raw materials in a manner that:
firstly adding SiC into the phenolic resin emulsion, then heating coal tar to 60-80 ℃, and dropwise adding the coal tar into the phenolic resin emulsion, wherein the addition amount of the coal tar is 10-20 wt% of the total amount of the phenolic resin in the phenolic resin emulsion, the addition amount of the SiC is 3-5 wt% of the total amount of the phenolic resin in the phenolic resin emulsion, and the pre-grinding material is quartz.
On the other hand, the application discloses putty grinding device, including first friction plate and the second friction plate that is the angle setting, be provided with the handle in the inboard of first friction plate or second friction plate, hang in the outside of first friction plate and second friction plate and be equipped with the abrasive paper of polishing. This application adopts first friction plate and second friction plate to form a body member, then sets up the abrasive paper of polishing on it, sets up the tensioning regulating part on it afterwards, can the tensioning sand paper of polishing, guarantees the result of use, and after using, if cause the abrasive paper of polishing to relax owing to the use, also can make the abrasive paper of polishing be in the tight state through the adjustment.
Preferably, a tensioning adjusting part is arranged at one end of the first friction plate far away from the second friction plate and at one end of the second friction plate far away from the first friction plate; tensioning adjustment portion includes a movable block that sets up with the abrasive paper butt of polishing and the location chamber that sets up with first friction plate or second friction plate link firmly, the movable block slides and sets up in the location intracavity.
Preferably, a power rod is arranged on one side of the movable block facing the positioning cavity, and a driving rod is meshed with the power rod and extends out of the positioning cavity; a plurality of sliding positioning parts are respectively arranged on two sides of the power rod, each sliding positioning part comprises a first sleeving positioning part fixedly connected with the movable block, and a second sleeving positioning part sleeved with the second sleeving positioning part is arranged in the positioning cavity; one of the first sleeving and positioning part and the second sleeving and positioning part is a positioning sleeve, and the other one is a positioning rod inserted into the positioning sleeve; and an accommodating extension cavity is arranged at the position corresponding to the power rod on the inner side of the positioning cavity. This application has three places to guarantee overall structure's slip stability, is that the sliding block sets up for the butt with location chamber itself on the one hand, and on the other hand is that power rod and actuating lever meshing set up, and itself has better stability, and last one side then adopts the stability that sliding positioning portion guaranteed overall structure reciprocating motion.
Preferably, the power rod is arranged in the middle, and the number of the sliding positioning parts is two and is symmetrically arranged relative to the power rod.
Preferably, a pressing plate is further arranged at the position where the first friction plate and the second friction plate are matched with the tensioning adjusting part, the pressing plate is an L-shaped plate with an outward opening, a plurality of pressure screws penetrating through the L-shaped plate are arranged on the L-shaped plate, and screw holes matched with the pressure screws are arranged on the cavity wall of the positioning cavity. This application adopts L shaped plate and forcing screw to come to compress tightly the operation to the abrasive paper of polishing, can guarantee after compressing tightly that abrasive paper self is more stable to do benefit to the tensioning operation on next step.
Preferably, the first friction plate and the second friction plate are arranged at 90 °.
This application can bring following beneficial effect:
1. the mode that the flexible layer is arranged on the base paper is adopted, so that the base paper can have certain bonding capacity while the strength of the base paper is enhanced, the auxiliary bonding layer is stably connected, the auxiliary bonding layer has the effects of ensuring the connection strength firstly, enhancing the connection stability of the friction agent secondly and having a certain matching effect with the friction agent;
2. according to the application, the first friction plate and the second friction plate are adopted to form a main body component, then the polishing abrasive paper is arranged on the main body component, then the tensioning adjusting part is arranged on the main body component, the polishing abrasive paper can be tensioned, the using effect is ensured, and after the main body component is used, if the polishing abrasive paper is loosened due to use, the polishing abrasive paper can be also in a tight state through adjustment;
3. the sliding stability of the whole structure is ensured by three parts, namely, the sliding block and the positioning cavity are arranged in a butting mode on one hand, the power rod and the driving rod are arranged in a meshing mode on the other hand, the stability is good, and finally the stability of the reciprocating motion of the whole structure is ensured by the sliding positioning part;
4. this application adopts L shaped plate and forcing screw to come to compress tightly the operation to the abrasive paper of polishing, can guarantee after compressing tightly that abrasive paper of polishing self is more stable to do benefit to the tensioning operation on next step.
Drawings
The accompanying drawings, which are included to provide a further understanding of the application and are incorporated in and constitute a part of this application, illustrate embodiment(s) of the application and together with the description serve to explain the application and not to limit the application. In the drawings:
FIG. 1 is a schematic structural diagram of the present application;
FIG. 2 is an enlarged view of portion A of FIG. 1;
fig. 3 is a schematic structural view of a movable block driving portion.
Detailed Description
In order to clearly explain the technical features of the present invention, the present application will be explained in detail by the following embodiments and the accompanying drawings.
This application includes abrasive paper and specifically uses this abrasive paper's putty grinding device.
In the embodiment of the polishing device, as shown in fig. 1-3, a putty polishing sand paper and a putty polishing device using the same, comprising a first friction plate 1 and a second friction plate 2 which are arranged in an angle, wherein a handle 3 is arranged on the inner side of the first friction plate 1 or the second friction plate 2, polishing sand paper 4 is hung on the outer sides of the first friction plate 1 and the second friction plate 2, and a tension adjusting part 5 is arranged at one end of the first friction plate 1 far away from the second friction plate 2 and one end of the second friction plate 2 far away from the first friction plate 1; tensioning regulating part 5 includes one and polishes the movable block 6 that 4 butts of abrasive paper set up and with first friction plate 1 or the location chamber 7 that second friction plate 2 linked firmly the setting, and movable block 6 slides and sets up in location chamber 7. A power rod 8 is arranged on one side of the movable block 6 facing the positioning cavity 7, and a driving rod 9 is meshed with the power rod 8 and extends out of the positioning cavity 7. A plurality of sliding positioning parts 10 are respectively arranged on two sides of the power rod 8, each sliding positioning part 10 comprises a first sleeving positioning part 11 fixedly connected with the movable block 6, and a second sleeving positioning part 12 sleeved with a second sleeving positioning part 12 is arranged in the positioning cavity 7; one of the first nesting positioning portion 11 and the second nesting positioning portion 12 is a positioning sleeve, and the other one is a positioning rod inserted into the positioning sleeve. An accommodating extension cavity 13 is arranged at the position corresponding to the power rod 8 inside the positioning cavity 7. The power rod 8 is provided centrally, and the number of the slide positioning portions 10 is two and is provided symmetrically with respect to the power rod 8. A pressing plate 14 is further arranged at the position where the first friction plate 1 and the second friction plate 2 are matched with the tensioning adjusting part 5, the pressing plate 14 is an L-shaped plate with an outward opening, a plurality of pressurizing screws 16 penetrating through the L-shaped plate are arranged on the L-shaped plate, and screw holes 15 matched with the pressurizing screws 16 are arranged on the cavity wall of the positioning cavity 7. The first friction plate 1 and the second friction plate 2 are arranged at 90 degrees.
During the assembly, select suitable first friction plate 1 of size and second friction plate 2, then set up the abrasive paper 4 of polishing on it, utilize L shaped plate and forcing screw to will polish abrasive paper 4 fixed setting in the both sides of polishing abrasive paper 4, after fixed, both sides utilize actuating lever 9 (the head generally sets up and sets up knob or bolt etc.) drive power rod 8 respectively, power rod 8 drives the sliding block action, and the position sleeve and the locating lever of sliding block both sides also can play certain guiding orientation function, avoid the unstability of drive process, in the use, if polish abrasive paper 4 and lead to lax owing to using, can adopt same operating means to reach the effect of tensioning.
For the preparation of sanding sandpaper, the following steps are included:
s1, arranging a flexible layer:
the original sand paper comprises base paper, and a flexible layer is arranged on the base paper;
immersing base paper into the phenolic resin emulsion for not less than 30s, then putting the base paper on a roller coating machine for treatment, and then carrying out primary curing treatment for 10min at the temperature of 80 ℃;
s2, setting an auxiliary bonding layer:
coating mixed liquid of phenolic resin, coal-based asphalt and SiC on the base paper subjected to primary curing treatment to form an auxiliary bonding layer; the grain size of SiC in the auxiliary bonding layer is 30-100 nm; firstly, adding SiC into the phenolic resin emulsion, heating coal tar to 60-80 ℃, and dropwise adding the coal tar into the phenolic resin emulsion, wherein the addition amount of the coal tar is 10-20 wt% of the total amount of the phenolic resin in the phenolic resin emulsion, and the addition amount of the SiC is 3-5 wt% of the total amount of the phenolic resin in the phenolic resin emulsion;
s3, setting a friction agent layer:
then, carrying out sand planting operation on the auxiliary bonding layer, placing the product after sand planting in an environment of 80-100 ℃ for 20-30min, arranging a friction agent layer consisting of friction agents on the auxiliary bonding layer, and arranging a binder layer on the outer side of the original sand paper to obtain the original sand paper;
then setting an adhesive layer, controlling the thickness of the adhesive layer to be 1.5-2mm to form the adhesive layer, then placing the adhesive layer into an oxygen-isolated environment, heating to 140-;
the sand planting operation adopts SiC particles, and adopts a gravity sand planting mode, and the mesh number of the SiC particles is 180-240 meshes.
S4, pre-polishing:
pre-grinding the original abrasive paper by using a material with the hardness of not less than 6 in the Richter scale as a pre-grinding material to obtain grinding abrasive paper; the pre-grinding material is quartz.
The phenolic resin emulsion herein has a solid content of 60 wt%.
Example 1:
s1, arranging a flexible layer:
immersing base paper into the phenolic resin emulsion for 30s, then placing the base paper on a roller coating machine for treatment, and then carrying out primary curing treatment for 10min at the temperature of 80 ℃;
s2, setting an auxiliary bonding layer:
the grain size of SiC in the auxiliary bonding layer is 30-100 nm; firstly adding SiC into a phenolic resin emulsion, heating coal tar to 60 ℃, and dropwise adding the coal tar into the phenolic resin emulsion, wherein the addition amount of the coal tar is 10 wt% of the total amount of phenolic resin in the phenolic resin emulsion, and the addition amount of the SiC is 3 wt% of the total amount of phenolic resin in the phenolic resin emulsion;
s3, setting a friction agent layer:
then, carrying out sand planting operation on the auxiliary bonding layer, wherein SiC particles are adopted in the sand planting operation, and a gravity sand planting mode is adopted, and the mesh number of the SiC particles is 180-240 meshes; placing the product after sand planting in an environment of 80 ℃ for 30min, arranging a friction agent layer consisting of a friction agent on the auxiliary bonding layer, and arranging a binder layer on the outer side of the original sand paper to obtain the original sand paper; controlling the thickness of the adhesive layer to be 1.5-2mm, then putting the adhesive layer into an oxygen-isolated environment, heating the adhesive layer to 140 ℃ and keeping the temperature for 4 hours;
s4, pre-polishing:
pre-grinding the original abrasive paper by using a material with the hardness of not less than 6 in the Richter scale as a pre-grinding material to obtain grinding abrasive paper; the pressure during polishing is 1.5kPa, and the time is 3 min. The pre-grinding material is quartz. Obtain product No. 1. Taking the product No. 1 with 10cmx10cm, then utilizing the product No. 1 to perform reciprocating polishing on the quartz stone under the pressure of 10kPa, fixing the polishing frequency until the friction agent layer obviously falls off, and recording the polishing frequency as 175 times.
Example 2:
s1, setting a flexible layer:
soaking the base paper in the phenolic resin emulsion for 30s, then placing the base paper on a roller coating machine for treatment, and then carrying out primary curing treatment for 10min at the temperature of 100 ℃;
s2, setting an auxiliary bonding layer:
the grain size of SiC in the auxiliary bonding layer is 30-100 nm; firstly, adding SiC into a phenolic resin emulsion, heating coal tar to 80 ℃, and dropwise adding the coal tar into the phenolic resin emulsion, wherein the addition amount of the coal tar is 20 wt% of the total amount of phenolic resin in the phenolic resin emulsion, and the addition amount of the SiC is 5 wt% of the total amount of phenolic resin in the phenolic resin emulsion;
s3, setting a friction agent layer:
then, carrying out sand planting operation on the auxiliary bonding layer, wherein SiC particles are adopted in the sand planting operation, and a gravity sand planting mode is adopted, and the mesh number of the SiC particles is 180-240 meshes; placing the product after sand planting in an environment at 100 ℃ for 20min, arranging a friction agent layer consisting of a friction agent on the auxiliary bonding layer, and arranging a binder layer on the outer side of the original sand paper to obtain the original sand paper; controlling the thickness of the adhesive layer to be 1.5-2mm, then putting the adhesive layer into an oxygen-isolated environment, heating the adhesive layer to 160 ℃, and continuing for 3 hours;
s4, pre-polishing:
pre-grinding the original abrasive paper by using a material with the hardness of not less than 6 in the Rich hardness as a pre-grinding material to obtain grinding abrasive paper; the pressure during polishing is 1.5kPa, and the time is 3 min. The pre-grinding material is quartz. Obtain product No. 2. Taking the No. 2 product with 10cmx10cm, then utilizing the No. 2 product to perform reciprocating polishing on the quartz stone by utilizing the pressure of 10kPa, fixing the polishing frequency until the friction agent layer obviously falls off, and recording the polishing frequency as 221 times.
Example 3:
s1, setting a flexible layer:
soaking the base paper in the phenolic resin emulsion for 30s, then placing the base paper on a roller coating machine for treatment, and then carrying out primary curing treatment for 10min at the temperature of 90 ℃;
s2, setting an auxiliary bonding layer:
the grain size of SiC in the auxiliary bonding layer is 30-100 nm; firstly adding SiC into a phenolic resin emulsion, heating coal tar to 70 ℃, and dropwise adding the coal tar into the phenolic resin emulsion, wherein the addition amount of the coal tar is 15 wt% of the total amount of phenolic resin in the phenolic resin emulsion, and the addition amount of the SiC is 4 wt% of the total amount of phenolic resin in the phenolic resin emulsion;
s3, setting a friction agent layer:
then, carrying out sand planting operation on the auxiliary bonding layer, wherein SiC particles are adopted in the sand planting operation, and a gravity sand planting mode is adopted, and the mesh number of the SiC particles is 180-240 meshes; placing the product after sand planting in an environment at 90 ℃ for 25min, arranging a friction agent layer consisting of friction agents on the auxiliary bonding layer, and arranging a binder layer on the outer side of the original sand paper to obtain the original sand paper; controlling the thickness of the adhesive layer to be 1.5-2mm, then putting the adhesive layer into an oxygen-isolated environment, heating to 150 ℃, and continuing for 3-4 h;
s4, pre-polishing:
pre-grinding the original abrasive paper by using a material with the hardness of not less than 6 in the Richter scale as a pre-grinding material to obtain grinding abrasive paper; the pressure during polishing is 1.5kPa, and the time is 3 min. The pre-grinding material is quartz. And obtaining a product No. 3. Taking a No. 3 product 10cmx10cm, then grinding the quartz stone in a reciprocating manner by utilizing the No. 3 product under the pressure of 10kPa, fixing the grinding frequency until the friction agent layer falls off obviously, and recording the grinding frequency as 180 times.
Comparative example 1:
s1, setting a flexible layer:
soaking the base paper in the phenolic resin emulsion for 30s, then placing the base paper on a roller coating machine for treatment, and then carrying out primary curing treatment for 10min at the temperature of 90 ℃;
s2, setting an auxiliary bonding layer:
the grain size of SiC in the auxiliary bonding layer is 30-100 nm; adding SiC into the phenolic resin emulsion, wherein the adding amount of the SiC is 4 wt% of the total amount of the phenolic resin in the phenolic resin emulsion;
s3, setting a friction agent layer:
then, carrying out sand planting operation on the auxiliary bonding layer, wherein SiC particles are adopted in the sand planting operation, and a gravity sand planting mode is adopted, and the mesh number of the SiC particles is 180-240 meshes; placing the product after sand planting in an environment of 90 ℃ for 25min, arranging a friction agent layer consisting of friction agents on the auxiliary bonding layer, and arranging a binder layer on the outer side of the original sand paper to obtain the original sand paper; controlling the thickness of the adhesive layer to be 1.5-2mm, then putting the adhesive layer into an oxygen-isolated environment, heating to 150 ℃, and continuing for 3-4 h;
s4, pre-polishing:
pre-grinding the original abrasive paper by using a material with the hardness of not less than 6 in the Rich hardness as a pre-grinding material to obtain grinding abrasive paper; the pressure during polishing is 1.5kPa, and the time is 3 min. The pre-grinding material is quartz. Comparative product No. 1 was obtained. Taking a No. 1 comparison product 10cmx10cm, then utilizing the No. 1 product to perform reciprocating polishing on the quartz stone by utilizing the pressure of 10kPa, fixing the polishing frequency until the friction agent layer obviously falls off, and recording the polishing frequency as 120 times.
Comparative example 2:
s1, setting a flexible layer:
soaking the base paper in the phenolic resin emulsion for 30s, then placing the base paper on a roller coating machine for treatment, and then carrying out primary curing treatment for 10min at the temperature of 90 ℃;
s2, setting an auxiliary bonding layer:
the auxiliary bonding layer is obtained by coating phenolic resin emulsion;
s3, setting a friction agent layer:
then, carrying out sand planting operation on the auxiliary bonding layer, wherein SiC particles are adopted in the sand planting operation, and a gravity sand planting mode is adopted, and the mesh number of the SiC particles is 180-240 meshes; placing the product after sand planting in an environment of 90 ℃ for 25min, arranging a friction agent layer consisting of friction agents on the auxiliary bonding layer, and arranging a binder layer on the outer side of the original sand paper to obtain the original sand paper; controlling the thickness of the adhesive layer to be 1.5-2mm, then putting the adhesive layer into an oxygen-isolated environment, heating to 150 ℃, and continuing for 3-4 h;
s4, pre-polishing:
pre-grinding the original abrasive paper by using a material with the hardness of not less than 6 in the Richter scale as a pre-grinding material to obtain grinding abrasive paper; the pressure during polishing is 1.5kPa, and the time is 3 min. The pre-grinding material is quartz. Comparative product No. 1 was obtained. Taking a No. 1 comparison product 10cmx10cm, then utilizing the No. 1 product to perform reciprocating polishing on the quartz stone by utilizing the pressure of 10kPa, fixing the polishing frequency until the friction agent layer obviously falls off, and recording the polishing frequency as 72 times.
Comparative example 3:
s1, setting a flexible layer:
soaking the base paper in the phenolic resin emulsion for 30s, then placing the base paper on a roller coating machine for treatment, and then carrying out primary curing treatment for 10min at the temperature of 90 ℃;
s2, setting an auxiliary bonding layer:
the grain size of SiC in the auxiliary bonding layer is 30-100 nm; firstly, adding SiC into a phenolic resin emulsion, heating coal tar to 70 ℃, and dropwise adding the coal tar into the phenolic resin emulsion, wherein the addition amount of the coal tar is 15 wt% of the total amount of phenolic resin in the phenolic resin emulsion, and the addition amount of the SiC is 4 wt% of the total amount of phenolic resin in the phenolic resin emulsion;
s3, setting a friction agent layer:
then, carrying out sand planting operation on the auxiliary bonding layer, wherein SiC particles are adopted in the sand planting operation, and a gravity sand planting mode is adopted, and the mesh number of the SiC particles is 180-240 meshes; placing the product after sand planting in an environment of 90 ℃ for 25min, arranging a friction agent layer consisting of a friction agent on the auxiliary bonding layer, and arranging a binder layer on the outer side of the original sand paper to obtain the original sand paper, namely a No. 3 comparison product; controlling the thickness of the adhesive layer to be 1.5-2mm, then putting the adhesive layer into an oxygen-isolated environment, heating the adhesive layer to 150 ℃, and keeping the temperature for 3-4 h;
taking a No. 3 comparison product 10cmx10cm, then utilizing the No. 3 comparison product to perform reciprocating polishing on the quartz stone by utilizing the pressure of 10kPa, fixing the polishing frequency until the friction agent layer obviously falls off, and recording the polishing frequency as 101.
The embodiments in the present specification are described in a progressive manner, and the same and similar parts among the embodiments are referred to each other, and each embodiment focuses on the differences from the other embodiments. In particular, for the system embodiment, since it is substantially similar to the method embodiment, the description is simple, and for the relevant points, reference may be made to the partial description of the method embodiment.
The above are merely examples of the present application and are not intended to limit the present application. Various modifications and changes may occur to those skilled in the art. Any modification, equivalent replacement, improvement or the like made within the spirit and principle of the present application shall be included in the scope of the claims of the present application.
Claims (10)
1. The putty grinding abrasive paper is characterized in that: pre-grinding original abrasive paper to obtain grinding abrasive paper; the original sand paper comprises base paper, a flexible layer is arranged on the base paper, a bonding agent doped with a friction agent is coated on the flexible layer to form an auxiliary bonding layer, a friction agent layer formed by the friction agent is arranged on the auxiliary bonding layer, and a bonding agent layer is arranged on the outer side of the original sand paper to obtain the original sand paper;
and pre-grinding the original sand paper by using a material with the hardness of not less than 6 in the Rich hardness as a pre-grinding material to obtain the grinding sand paper.
2. The sandpaper device for putty polishing as defined in claim 1, wherein: the flexible layer is processed in the following way:
immersing the base paper in phenolic resin for not less than 30s, treating the paper on a roller coating machine, and performing primary curing treatment at 80-100 ℃.
3. The sandpaper device for putty sanding of claim 2, wherein: the flexible layer is processed in the following way: coating a mixed solution of phenolic resin, coal-based asphalt and SiC on the base paper subjected to primary curing treatment to form an auxiliary bonding layer, then carrying out sand planting operation on the auxiliary bonding layer, and putting a product subjected to sand planting into an environment at 80-100 ℃ for 20-30 min; then setting an adhesive layer, controlling the thickness of the adhesive layer to be 1.5-2mm to form the adhesive layer, then placing the adhesive layer into an oxygen-isolated environment, heating to 140-; and then, grinding by using a pre-grinding material to obtain grinding abrasive paper.
4. The sandpaper device for putty polishing as defined in claim 2, wherein: the grain size of SiC in the auxiliary bonding layer is 30-100 nm;
the sand planting operation adopts SiC particles, and the mesh number of the SiC particles is 180-240 meshes;
the adhesive layer adopts acrylic emulsion;
the auxiliary bonding layer is prepared from the following raw materials in a manner that:
firstly adding SiC into the phenolic resin emulsion, then heating coal tar to 60-80 ℃, and dropwise adding the coal tar into the phenolic resin emulsion, wherein the addition amount of the coal tar is 10-20 wt% of the total amount of the phenolic resin in the phenolic resin emulsion, and the addition amount of the SiC is 3-5 wt% of the total amount of the phenolic resin in the phenolic resin emulsion
The pre-grinding material is quartz.
5. A putty sanding device for sanding sandpaper as defined in any one of claims 1-4, characterized by: the abrasive paper polishing device comprises a first friction plate and a second friction plate which are arranged at an angle, a handle is arranged on the inner side of the first friction plate or the inner side of the second friction plate, and polishing abrasive paper is hung on the outer sides of the first friction plate and the second friction plate.
6. The putty polishing device of claim 5, characterized in that: a tensioning adjusting part is arranged at one end of the first friction plate far away from the second friction plate and at one end of the second friction plate far away from the first friction plate; tensioning adjustment portion includes a movable block that sets up with the abrasive paper butt of polishing and the location chamber that sets up with first friction plate or second friction plate link firmly, the movable block slides and sets up in the location intracavity.
7. The putty polishing device of claim 5, further comprising: a power rod is arranged on one side of the movable block facing the positioning cavity, and a driving rod is meshed with the power rod and extends out of the positioning cavity; a plurality of sliding positioning parts are respectively arranged on two sides of the power rod, each sliding positioning part comprises a first sleeving positioning part fixedly connected with the movable block, and a second sleeving positioning part sleeved with the second sleeving positioning part is arranged in the positioning cavity; one of the first sleeving and positioning part and the second sleeving and positioning part is a positioning sleeve, and the other one is a positioning rod inserted into the positioning sleeve; and an accommodating extension cavity is arranged at the position corresponding to the power rod on the inner side of the positioning cavity.
8. The putty polishing device of claim 7, further comprising: the power rod is arranged in the middle, and the number of the sliding positioning parts is two and is symmetrically arranged relative to the power rod.
9. The putty polishing device of claim 7, further comprising: the first friction plate, the second friction plate and the tensioning adjusting part are matched, a pressing plate is further arranged at the position of the first friction plate, the position of the second friction plate and the tensioning adjusting part are matched, the pressing plate is an L-shaped plate with an outward opening, a plurality of pressurizing screws penetrating through the L-shaped plate are arranged on the L-shaped plate, and screw holes matched with the pressurizing screws are formed in the wall of the cavity of the positioning cavity.
10. The putty polishing device of claim 5, further comprising: the first friction plate and the second friction plate are arranged at an angle of 90 degrees.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202210783773.6A CN115122247B (en) | 2022-07-05 | 2022-07-05 | Putty polishing sand paper and putty polishing device using same |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210783773.6A CN115122247B (en) | 2022-07-05 | 2022-07-05 | Putty polishing sand paper and putty polishing device using same |
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| CN115122247A true CN115122247A (en) | 2022-09-30 |
| CN115122247B CN115122247B (en) | 2024-06-11 |
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