CN115122247B - Putty polishing sand paper and putty polishing device using same - Google Patents
Putty polishing sand paper and putty polishing device using same Download PDFInfo
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- CN115122247B CN115122247B CN202210783773.6A CN202210783773A CN115122247B CN 115122247 B CN115122247 B CN 115122247B CN 202210783773 A CN202210783773 A CN 202210783773A CN 115122247 B CN115122247 B CN 115122247B
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- 244000137852 Petrea volubilis Species 0.000 title claims abstract description 88
- 238000005498 polishing Methods 0.000 title claims abstract description 76
- 239000010410 layer Substances 0.000 claims abstract description 84
- 239000012790 adhesive layer Substances 0.000 claims abstract description 48
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 42
- 239000000463 material Substances 0.000 claims abstract description 28
- 239000007767 bonding agent Substances 0.000 claims abstract description 6
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims description 59
- 239000005011 phenolic resin Substances 0.000 claims description 59
- 229920001568 phenolic resin Polymers 0.000 claims description 59
- 239000000839 emulsion Substances 0.000 claims description 41
- 239000004576 sand Substances 0.000 claims description 34
- 239000002245 particle Substances 0.000 claims description 26
- 239000011280 coal tar Substances 0.000 claims description 21
- 239000010453 quartz Substances 0.000 claims description 14
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 14
- 239000004575 stone Substances 0.000 claims description 14
- 238000010438 heat treatment Methods 0.000 claims description 10
- 239000011248 coating agent Substances 0.000 claims description 4
- 238000000576 coating method Methods 0.000 claims description 4
- 239000010426 asphalt Substances 0.000 claims description 3
- 239000003245 coal Substances 0.000 claims description 3
- 239000011259 mixed solution Substances 0.000 claims description 3
- 230000000149 penetrating effect Effects 0.000 claims description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 2
- 239000002994 raw material Substances 0.000 claims description 2
- 230000000694 effects Effects 0.000 abstract description 7
- 230000005484 gravity Effects 0.000 description 7
- 238000000034 method Methods 0.000 description 7
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 6
- 229910052760 oxygen Inorganic materials 0.000 description 6
- 239000001301 oxygen Substances 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 3
- 230000037303 wrinkles Effects 0.000 description 3
- 230000006835 compression Effects 0.000 description 2
- 238000007906 compression Methods 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 238000007517 polishing process Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
Abstract
The putty polishing sand paper and the putty polishing device using the sand paper are characterized in that original sand paper is pre-ground to obtain polishing sand paper; the original sand paper comprises base paper, a flexible layer is arranged on the base paper, a bonding agent doped with a friction agent is coated on the flexible layer to form an auxiliary bonding layer, a friction agent layer formed by the friction agent is arranged on the auxiliary bonding layer, and a bonding agent layer is arranged on the outer side of the original sand paper to obtain the original sand paper; and (3) pre-grinding the original sand paper by taking a material with the Brinell hardness not lower than 6 as a pre-grinding material to obtain the grinding sand paper. The application adopts the mode of arranging the flexible layer on the base paper, so that the strength of the base paper is enhanced, and the adhesive layer has certain bonding capability, so that the auxiliary adhesive layer is stably connected, the auxiliary connecting layer firstly ensures the connection strength, and secondly can enhance the connection stability of the friction agent and has certain matching effect with the friction agent.
Description
Technical Field
The application relates to putty polishing sand paper and a putty polishing device using the sand paper.
Background
After the putty is coated, in order to ensure the construction effect, the flatness of the putty surface needs to be ensured and certain connection adhesion capability is provided. Therefore, the putty needs to be polished after construction, and because a certain control and adjustment function is needed in the polishing process, the machine equipment is difficult to meet the requirements, and the putty is finished by manpower at present. In the manual polishing process, a polishing mechanism is generally needed and is used for assisting in polishing sand paper, the conventional polishing device is generally in the form of bonded sand paper, the stability is limited, wrinkles can be generated in the use process, the putty is damaged after the wrinkles are generated, if the observation is not careful, the use risk is relatively high, the sand paper is not easy to fix again after the wrinkles are generated, the sand paper needs to be replaced in a relatively short time, the flatness of the sand paper needs to be ensured in the replacement process, and certain difficulty is also brought to operation.
Disclosure of Invention
In order to solve the problems, the application provides putty polishing sand paper, which is obtained by pre-grinding original sand paper; the original sand paper comprises base paper, a flexible layer is arranged on the base paper, a bonding agent doped with a friction agent is coated on the flexible layer to form an auxiliary bonding layer, a friction agent layer formed by the friction agent is arranged on the auxiliary bonding layer, and a bonding agent layer is arranged on the outer side of the original sand paper to obtain the original sand paper; and (3) pre-grinding the original sand paper by taking a material with the Brinell hardness not lower than 6 as a pre-grinding material to obtain the grinding sand paper. The application adopts the mode of arranging the flexible layer on the base paper, so that the strength of the base paper is enhanced, and the adhesive layer has certain bonding capability, so that the auxiliary adhesive layer is stably connected, the auxiliary connecting layer firstly ensures the connection strength, and secondly can enhance the connection stability of the friction agent and has certain matching effect with the friction agent.
Preferably, the flexible layer is processed as follows:
immersing the base paper into phenolic resin for not less than 30s, then placing the base paper on a roll coater for treatment, and then carrying out primary curing treatment at 80-100 ℃.
Preferably, the flexible layer is processed as follows: coating a mixed solution of phenolic resin, coal-based asphalt and SiC on the base paper after primary curing treatment to form an auxiliary bonding layer, then performing sand planting operation on the auxiliary bonding layer, and placing the product after sand planting in an environment of 80-100 ℃ for 20-30min; setting an adhesive layer, controlling the thickness of the adhesive layer to be 1.5-2mm to form the adhesive layer, then putting the adhesive layer into an oxygen-isolated environment, and heating to 140-160 ℃ for 3-4h; and then polishing by using a pre-polishing material to obtain polishing sand paper.
Preferably, the particle size of SiC in the auxiliary bonding layer is 30-100nm;
The sand planting operation adopts SiC particles, wherein the mesh number of the SiC particles is 180-240 meshes;
The adhesive layer adopts acrylic emulsion;
The raw materials of the auxiliary bonding layer are obtained in the following manner:
Adding SiC into the phenolic resin emulsion, then heating coal tar to 60-80 ℃, dropwise adding the coal tar into the phenolic resin emulsion, wherein the adding amount of the coal tar is 10-20wt% of the total amount of phenolic resin in the phenolic resin emulsion, the adding amount of the SiC is 3-5wt% of the total amount of phenolic resin in the phenolic resin emulsion, and the pre-grinding material is quartz stone.
On the other hand, the application discloses a putty polishing device, which comprises a first friction plate and a second friction plate which are arranged in an angle, wherein a handle is arranged on the inner side of the first friction plate or the second friction plate, and polishing sand paper is hung on the outer sides of the first friction plate and the second friction plate. The application adopts the first friction plate and the second friction plate to form a main body component, then the polishing sand paper is arranged on the main body component, and then the tensioning adjusting part is arranged on the main body component, so that the polishing sand paper can be tensioned, the use effect is ensured, and after the polishing sand paper is used, if the polishing sand paper is loosened due to the use, the polishing sand paper can be in a tight state through adjustment.
Preferably, a tensioning adjusting part is arranged at one end of the first friction plate far away from the second friction plate and one end of the second friction plate far away from the first friction plate; the tensioning adjusting part comprises a movable block which is arranged in a manner of being abutted with the polishing sand paper and a positioning cavity which is fixedly connected with the first friction plate or the second friction plate, and the movable block is arranged in the positioning cavity in a sliding manner.
Preferably, a power rod is arranged on one side of the movable block facing the positioning cavity, and a driving rod is meshed with the power rod and extends out of the positioning cavity; the two sides of the power rod are also respectively provided with a plurality of sliding positioning parts, each sliding positioning part comprises a first sleeving positioning part fixedly connected with the movable block, and a second sleeving positioning part sleeved with the second sleeving positioning part is arranged in the positioning cavity; one of the first sleeving and positioning part and the second sleeving and positioning part is a positioning sleeve, and the other is a positioning rod which is inserted with the positioning sleeve; an accommodating extension cavity is arranged at the inner side of the positioning cavity and corresponds to the power rod. The application has three parts to ensure the sliding stability of the integral structure, on one hand, the sliding block is in abutting connection with the positioning cavity, on the other hand, the power rod is meshed with the driving rod, so that the integral structure has better stability, and on the other hand, the sliding positioning part is adopted to ensure the reciprocating stability of the integral structure.
Preferably, the power rod is arranged in the middle, and the number of the sliding positioning parts is two and symmetrically arranged relative to the power rod.
Preferably, a pressing plate is further arranged at the position where the first friction plate and the second friction plate are matched with the tensioning adjusting part, the pressing plate is an L-shaped plate with an outward opening, a plurality of pressing screws penetrating through the L-shaped plate are arranged on the L-shaped plate, and screw holes matched with the pressing screws are arranged on the cavity wall of the positioning cavity. According to the application, the L-shaped plate and the pressurizing screw are adopted to compress the sanding paper, so that the sanding sand paper can be ensured to be stable after compression, and the next tensioning operation is facilitated.
Preferably, the first friction plate and the second friction plate are disposed at 90 °.
The application has the following beneficial effects:
1. The application adopts the mode of arranging the flexible layer on the base paper, so that the strength of the base paper is enhanced, and the adhesive layer has certain bonding capability, so that the auxiliary adhesive layer is stably connected, the auxiliary connecting layer firstly ensures the connection strength, and secondly can enhance the connection stability of the friction agent and has certain matching effect with the friction agent;
2. The application adopts the first friction plate and the second friction plate to form a main body component, then the polishing sand paper is arranged on the main body component, and then the tensioning adjusting part is arranged on the main body component, so that the polishing sand paper can be tensioned, the use effect is ensured, and after the main body component is used, if the polishing sand paper is loosened due to use, the polishing sand paper can be in a tight state through adjustment;
3. the application has three parts to ensure the sliding stability of the integral structure, on one hand, the sliding block is in abutting connection with the positioning cavity, on the other hand, the power rod is meshed with the driving rod, so that the integral structure has better stability, and on the other hand, the sliding positioning part is adopted to ensure the stability of the reciprocating motion of the integral structure;
4. According to the application, the L-shaped plate and the pressurizing screw are adopted to compress the sanding paper, so that the sanding sand paper can be ensured to be stable after compression, and the next tensioning operation is facilitated.
Drawings
The accompanying drawings, which are included to provide a further understanding of the application and are incorporated in and constitute a part of this specification, illustrate embodiments of the application and together with the description serve to explain the application and do not constitute a limitation on the application. In the drawings:
FIG. 1 is a schematic diagram of the structure of the present application;
FIG. 2 is an enlarged schematic view of portion A of FIG. 1;
Fig. 3 is a schematic structural view of the movable block driving portion.
Detailed Description
In order to clearly illustrate the technical features of the present solution, the present application will be described in detail below with reference to the following detailed description and the accompanying drawings.
The application comprises sand paper and a putty polishing device using the sand paper.
In the embodiment of the polishing device, as shown in fig. 1-3, a putty polishing sand paper and a putty polishing device using the sand paper comprise a first friction plate 1 and a second friction plate 2 which are arranged in an angle, wherein a handle 3 is arranged on the inner side of the first friction plate 1 or the second friction plate 2, polishing sand paper 4 is hung on the outer sides of the first friction plate 1 and the second friction plate 2, and a tensioning adjusting part 5 is arranged on one end of the first friction plate 1 far away from the second friction plate 2 and one end of the second friction plate 2 far away from the first friction plate 1; the tensioning adjusting part 5 comprises a movable block 6 which is arranged in a propping way with the sanding paper 4 and a positioning cavity 7 which is fixedly connected with the first friction plate 1 or the second friction plate 2, and the movable block 6 is arranged in the positioning cavity 7 in a sliding way. A power rod 8 is arranged on one side of the movable block 6 facing the positioning cavity 7, and a driving rod 9 is meshed with the power rod 8 and extends out of the positioning cavity 7. A plurality of sliding positioning parts 10 are respectively arranged on two sides of the power rod 8, the sliding positioning parts 10 comprise a first sleeving positioning part 11 fixedly connected with the movable block 6, and a second sleeving positioning part 12 sleeved with a second sleeving positioning part 12 is arranged in the positioning cavity 7; one of the first sleeving and positioning part 11 and the second sleeving and positioning part 12 is a positioning sleeve, and the other is a positioning rod which is inserted into the positioning sleeve. An accommodating extension cavity 13 is arranged at a position corresponding to the power rod 8 inside the positioning cavity 7. The power rod 8 is centrally arranged, and the number of the sliding positioning parts 10 is two and symmetrically arranged relative to the power rod 8. The first friction plate 1 and the second friction plate 2 are also provided with a pressing plate 14 at the position matched with the tensioning adjusting part 5, the pressing plate 14 is an L-shaped plate with an outward opening, a plurality of pressing screws 16 penetrating through the L-shaped plate are arranged on the L-shaped plate, and screw holes 15 matched with the pressing screws 16 are arranged on the cavity wall of the positioning cavity 7. The first friction plate 1 and the second friction plate 2 are arranged at 90 °.
During assembly, the first friction plate 1 and the second friction plate 2 with proper sizes are selected, then the grinding sand paper 4 is arranged on the first friction plate, the grinding sand paper 4 is fixedly arranged on two sides of the grinding sand paper 4 by using the L-shaped plates and the pressurizing screws, after the grinding sand paper 4 is fixed, the two sides of the grinding sand paper are respectively driven by using the driving rod 9 (the head is generally provided with a setting knob or a bolt and the like) to drive the power rod 8, the power rod 8 drives the sliding block to act, the positioning sleeve and the positioning rod on two sides of the sliding block can also play a certain guiding and positioning function, the instability of the driving process is avoided, and in the using process, if the grinding sand paper 4 is loosened due to use, the tensioning effect can be achieved by adopting the same operation mode.
For the preparation of the sanding paper, the method comprises the following steps:
s1, setting a flexible layer:
The original sand paper comprises base paper, and a flexible layer is arranged on the base paper;
Immersing base paper into phenolic resin emulsion for not less than 30s, then placing the base paper on a roll coater for treatment, and then carrying out primary curing treatment for 10min at 80 ℃;
S2, setting an auxiliary bonding layer:
Coating phenolic resin, coal-based asphalt and SiC mixed solution on the base paper after primary curing treatment to form an auxiliary bonding layer; the particle size of SiC in the auxiliary bonding layer is 30-100nm; adding SiC into a phenolic resin emulsion, and then heating coal tar to 60-80 ℃, dropwise adding the coal tar into the phenolic resin emulsion, wherein the adding amount of the coal tar is 10-20wt% of the total phenolic resin in the phenolic resin emulsion, and the adding amount of the SiC is 3-5wt% of the total phenolic resin in the phenolic resin emulsion;
S3, arranging a friction agent layer:
then, sand planting operation is carried out on the auxiliary adhesive layer, a product after sand planting is placed in an environment of 80-100 ℃ for 20-30min, a friction agent layer formed by friction agents is arranged on the auxiliary adhesive layer, and an adhesive layer is arranged on the outer side of the original sand paper to obtain the original sand paper;
setting an adhesive layer, controlling the thickness of the adhesive layer to be 1.5-2mm to form the adhesive layer, then putting the adhesive layer into an oxygen-isolated environment, and heating to 140-160 ℃ for 3-4h;
The sand planting operation adopts SiC particles, and adopts a gravity sand planting mode, wherein the mesh number of the SiC particles is 180-240 meshes.
S4, pre-polishing:
Pre-grinding the original sand paper by taking a material with the Brinell hardness not lower than 6 as a pre-grinding material to obtain grinding sand paper; the pre-grinding material is quartz stone.
The phenolic resin emulsion of the present application has a solids content of 60wt%.
Example 1:
s1, setting a flexible layer:
Immersing base paper into phenolic resin emulsion for 30s, then placing the base paper on a roll coater for treatment, and then carrying out primary curing treatment for 10min at 80 ℃;
S2, setting an auxiliary bonding layer:
The particle size of SiC in the auxiliary bonding layer is 30-100nm; adding SiC into a phenolic resin emulsion, and then heating coal tar to 60 ℃, dropwise adding the coal tar into the phenolic resin emulsion, wherein the adding amount of the coal tar is 10wt% of the total phenolic resin in the phenolic resin emulsion, and the adding amount of the SiC is 3wt% of the total phenolic resin in the phenolic resin emulsion;
S3, arranging a friction agent layer:
Then, sand planting operation is carried out on the auxiliary bonding layer, siC particles are adopted in the sand planting operation, and a gravity sand planting mode is adopted, wherein the mesh number of the SiC particles is 180-240 meshes; placing the product after sand planting into an environment at 80 ℃ for 30min, arranging a friction agent layer consisting of friction agents on the auxiliary adhesive layer, and arranging an adhesive layer on the outer side of the original sand paper to obtain the original sand paper; the thickness of the adhesive layer is controlled to be 1.5-2mm, and then the adhesive layer is put into an environment isolated from oxygen and heated to 140 ℃ for 4 hours;
S4, pre-polishing:
Pre-grinding the original sand paper by taking a material with the Brinell hardness not lower than 6 as a pre-grinding material to obtain grinding sand paper; the pressure during polishing is 1.5kPa for 3min. The pre-grinding material is quartz stone. And obtaining a product No. 1. Taking 10cm & lt x & gt 10cm of a No. 1 product, then carrying out reciprocating polishing on quartz stone by utilizing the No. 1 product under the pressure of 10kPa, fixing the polishing frequency until the friction agent layer is obviously dropped, and recording the polishing frequency as 175 times.
Example 2:
s1, setting a flexible layer:
Immersing base paper into phenolic resin emulsion for 30s, then placing the base paper on a roll coater for treatment, and then carrying out primary curing treatment for 10min at 100 ℃;
S2, setting an auxiliary bonding layer:
The particle size of SiC in the auxiliary bonding layer is 30-100nm; adding SiC into a phenolic resin emulsion, and then heating coal tar to 80 ℃, dropwise adding the coal tar into the phenolic resin emulsion, wherein the adding amount of the coal tar is 20wt% of the total phenolic resin in the phenolic resin emulsion, and the adding amount of the SiC is 5wt% of the total phenolic resin in the phenolic resin emulsion;
S3, arranging a friction agent layer:
Then, sand planting operation is carried out on the auxiliary bonding layer, siC particles are adopted in the sand planting operation, and a gravity sand planting mode is adopted, wherein the mesh number of the SiC particles is 180-240 meshes; placing the product after sand planting into an environment of 100 ℃ for 20min, arranging a friction agent layer consisting of friction agents on the auxiliary adhesive layer, and arranging an adhesive layer on the outer side of the original sand paper to obtain the original sand paper; the thickness of the adhesive layer is controlled to be 1.5-2mm, and then the adhesive layer is put into an environment isolated from oxygen and heated to 160 ℃ for 3 hours;
S4, pre-polishing:
Pre-grinding the original sand paper by taking a material with the Brinell hardness not lower than 6 as a pre-grinding material to obtain grinding sand paper; the pressure during polishing is 1.5kPa for 3min. The pre-grinding material is quartz stone. And obtaining a No. 2 product. Taking 10cm x10cm of a No. 2 product, then carrying out reciprocating polishing on quartz stone by using the No. 2 product under the pressure of 10kPa, fixing the polishing frequency until the friction agent layer is obviously dropped, and recording the polishing frequency as 221 times.
Example 3:
s1, setting a flexible layer:
Immersing base paper into phenolic resin emulsion for 30s, then placing the base paper on a roll coater for treatment, and then carrying out primary curing treatment for 10min at 90 ℃;
S2, setting an auxiliary bonding layer:
The particle size of SiC in the auxiliary bonding layer is 30-100nm; adding SiC into a phenolic resin emulsion, and then heating coal tar to 70 ℃, dropwise adding the coal tar into the phenolic resin emulsion, wherein the adding amount of the coal tar is 15wt% of the total phenolic resin in the phenolic resin emulsion, and the adding amount of the SiC is 4wt% of the total phenolic resin in the phenolic resin emulsion;
S3, arranging a friction agent layer:
Then, sand planting operation is carried out on the auxiliary bonding layer, siC particles are adopted in the sand planting operation, and a gravity sand planting mode is adopted, wherein the mesh number of the SiC particles is 180-240 meshes; placing the product after sand planting into an environment at 90 ℃ for 25min, arranging a friction agent layer consisting of friction agents on the auxiliary adhesive layer, and arranging an adhesive layer on the outer side of the original sand paper to obtain the original sand paper; the thickness of the adhesive layer is controlled to be 1.5-2mm, and then the adhesive layer is put into an environment isolated from oxygen and heated to 150 ℃ for 3-4 hours;
S4, pre-polishing:
Pre-grinding the original sand paper by taking a material with the Brinell hardness not lower than 6 as a pre-grinding material to obtain grinding sand paper; the pressure during polishing is 1.5kPa for 3min. The pre-grinding material is quartz stone. And obtaining a product No. 3. Taking 10cm & lt x & gt 10cm of a No. 3 product, then carrying out reciprocating polishing on quartz stone by utilizing the No. 3 product under the pressure of 10kPa, fixing the polishing frequency until the friction agent layer is obviously dropped, and recording the polishing frequency as 180 times.
Comparative example 1:
s1, setting a flexible layer:
Immersing base paper into phenolic resin emulsion for 30s, then placing the base paper on a roll coater for treatment, and then carrying out primary curing treatment for 10min at 90 ℃;
S2, setting an auxiliary bonding layer:
The particle size of SiC in the auxiliary bonding layer is 30-100nm; adding SiC into the phenolic resin emulsion, wherein the adding amount of the SiC is 4wt% of the total phenolic resin in the phenolic resin emulsion;
S3, arranging a friction agent layer:
Then, sand planting operation is carried out on the auxiliary bonding layer, siC particles are adopted in the sand planting operation, and a gravity sand planting mode is adopted, wherein the mesh number of the SiC particles is 180-240 meshes; placing the product after sand planting into an environment at 90 ℃ for 25min, arranging a friction agent layer consisting of friction agents on the auxiliary adhesive layer, and arranging an adhesive layer on the outer side of the original sand paper to obtain the original sand paper; the thickness of the adhesive layer is controlled to be 1.5-2mm, and then the adhesive layer is put into an environment isolated from oxygen and heated to 150 ℃ for 3-4 hours;
S4, pre-polishing:
Pre-grinding the original sand paper by taking a material with the Brinell hardness not lower than 6 as a pre-grinding material to obtain grinding sand paper; the pressure during polishing is 1.5kPa for 3min. The pre-grinding material is quartz stone. And obtaining a No. 1 comparison product. And (3) taking a No. 1 comparison product of 10cmx10cm, then carrying out reciprocating polishing on the quartz stone by utilizing the No. 1 product under the pressure of 10kPa, fixing the polishing frequency until the friction agent layer is obviously dropped, and recording the polishing frequency as 120 times.
Comparative example 2:
s1, setting a flexible layer:
Immersing base paper into phenolic resin emulsion for 30s, then placing the base paper on a roll coater for treatment, and then carrying out primary curing treatment for 10min at 90 ℃;
S2, setting an auxiliary bonding layer:
The auxiliary adhesive layer is obtained by adopting a mode of coating phenolic resin emulsion;
S3, arranging a friction agent layer:
Then, sand planting operation is carried out on the auxiliary bonding layer, siC particles are adopted in the sand planting operation, and a gravity sand planting mode is adopted, wherein the mesh number of the SiC particles is 180-240 meshes; placing the product after sand planting into an environment at 90 ℃ for 25min, arranging a friction agent layer consisting of friction agents on the auxiliary adhesive layer, and arranging an adhesive layer on the outer side of the original sand paper to obtain the original sand paper; the thickness of the adhesive layer is controlled to be 1.5-2mm, and then the adhesive layer is put into an environment isolated from oxygen and heated to 150 ℃ for 3-4 hours;
S4, pre-polishing:
Pre-grinding the original sand paper by taking a material with the Brinell hardness not lower than 6 as a pre-grinding material to obtain grinding sand paper; the pressure during polishing is 1.5kPa for 3min. The pre-grinding material is quartz stone. And obtaining a No.1 comparison product. And (3) taking a No.1 comparison product of 10cmx10cm, then carrying out reciprocating polishing on the quartz stone by utilizing the No.1 product under the pressure of 10kPa, fixing the polishing frequency until the friction agent layer is obviously dropped, and recording the polishing frequency as 72 times.
Comparative example 3:
s1, setting a flexible layer:
Immersing base paper into phenolic resin emulsion for 30s, then placing the base paper on a roll coater for treatment, and then carrying out primary curing treatment for 10min at 90 ℃;
S2, setting an auxiliary bonding layer:
The particle size of SiC in the auxiliary bonding layer is 30-100nm; adding SiC into a phenolic resin emulsion, and then heating coal tar to 70 ℃, dropwise adding the coal tar into the phenolic resin emulsion, wherein the adding amount of the coal tar is 15wt% of the total phenolic resin in the phenolic resin emulsion, and the adding amount of the SiC is 4wt% of the total phenolic resin in the phenolic resin emulsion;
S3, arranging a friction agent layer:
then, sand planting operation is carried out on the auxiliary bonding layer, siC particles are adopted in the sand planting operation, and a gravity sand planting mode is adopted, wherein the mesh number of the SiC particles is 180-240 meshes; placing the product after sand planting into an environment at 90 ℃ for 25min, arranging a friction agent layer consisting of friction agents on the auxiliary adhesive layer, and arranging an adhesive layer on the outer side of the original sand paper to obtain an original sand paper, namely a No. 3 comparison product; the thickness of the adhesive layer is controlled to be 1.5-2mm, and then the adhesive layer is put into an environment isolated from oxygen and heated to 150 ℃ for 3-4 hours;
Taking a No. 3 comparison product of 10cmx10cm, then carrying out reciprocating polishing on quartz stone by using the No. 3 comparison product under the pressure of 10kPa, fixing the polishing frequency until the friction agent layer is obviously fallen off, and recording the polishing frequency as 101 times.
In this specification, each embodiment is described in a progressive manner, and identical and similar parts of each embodiment are all referred to each other, and each embodiment mainly describes differences from other embodiments. In particular, for system embodiments, since they are substantially similar to method embodiments, the description is relatively simple, as relevant to see a section of the description of method embodiments.
The foregoing is merely exemplary of the present application and is not intended to limit the present application. Various modifications and variations of the present application will be apparent to those skilled in the art. Any modification, equivalent replacement, improvement, etc. which come within the spirit and principles of the application are to be included in the scope of the claims of the present application.
Claims (7)
1. The putty polishing sand paper is characterized in that: pre-grinding the original sand paper to obtain grinding sand paper; the original sand paper comprises base paper, a flexible layer is arranged on the base paper, a bonding agent doped with a friction agent is coated on the flexible layer to form an auxiliary bonding layer, a friction agent layer formed by the friction agent is arranged on the auxiliary bonding layer, and a bonding agent layer is arranged on the outer side of the original sand paper to obtain the original sand paper;
pre-grinding the original sand paper by taking a material with the Brinell hardness not lower than 6 as a pre-grinding material to obtain grinding sand paper;
the flexible layer is processed in the following manner:
immersing base paper into phenolic resin for not less than 30s, then placing the base paper on a roll coater for treatment, and then carrying out primary curing treatment at 80-100 ℃;
The flexible layer is processed in the following manner: coating a mixed solution of phenolic resin, coal-based asphalt and SiC on the base paper after primary curing treatment to form an auxiliary bonding layer, then performing sand planting operation on the auxiliary bonding layer, and placing the product after sand planting in an environment of 80-100 ℃ for 20-30min; setting an adhesive layer, controlling the thickness of the adhesive layer to be 1.5-2mm to form the adhesive layer, then putting the adhesive layer into an oxygen-isolated environment, and heating to 140-160 ℃ for 3-4 h; then polishing by using a pre-polishing material to obtain polishing sand paper;
The particle size of SiC in the auxiliary bonding layer is 30-100nm;
The sand planting operation adopts SiC particles, wherein the mesh number of the SiC particles is 180-240 meshes;
The adhesive layer adopts acrylic emulsion;
The raw materials of the auxiliary bonding layer are obtained in the following manner:
adding SiC into a phenolic resin emulsion, and then heating coal tar to 60-80 ℃, dropwise adding the coal tar into the phenolic resin emulsion, wherein the adding amount of the coal tar is 10-20wt% of the total phenolic resin in the phenolic resin emulsion, and the adding amount of the SiC is 3-5wt% of the total phenolic resin in the phenolic resin emulsion;
the pre-grinding material is quartz stone.
2. A putty polishing device for polishing sandpaper using the putty as set forth in claim 1, characterized in that: the polishing device comprises a first friction plate and a second friction plate which are arranged in an angle, wherein a handle is arranged on the inner side of the first friction plate or the second friction plate, and polishing sand paper is hung on the outer sides of the first friction plate and the second friction plate.
3. A putty polishing device as set forth in claim 2 wherein: a tensioning adjusting part is arranged at one end of the first friction plate far away from the second friction plate and one end of the second friction plate far away from the first friction plate; the tensioning adjusting part comprises a movable block which is arranged in a manner of being abutted with the polishing sand paper and a positioning cavity which is fixedly connected with the first friction plate or the second friction plate, and the movable block is arranged in the positioning cavity in a sliding manner.
4. A putty polishing device as set forth in claim 2 wherein: a power rod is arranged on one side of the movable block facing the positioning cavity, and a driving rod is meshed with the power rod and extends out of the positioning cavity; the two sides of the power rod are also respectively provided with a plurality of sliding positioning parts, each sliding positioning part comprises a first sleeving positioning part fixedly connected with the movable block, and a second sleeving positioning part sleeved with the first sleeving positioning part is arranged in the positioning cavity; one of the first sleeving and positioning part and the second sleeving and positioning part is a positioning sleeve, and the other is a positioning rod which is inserted with the positioning sleeve; an accommodating extension cavity is arranged at the inner side of the positioning cavity and corresponds to the power rod.
5. The putty polishing device as set forth in claim 4, wherein: the power rod is arranged in the middle, and the number of the sliding positioning parts is two and symmetrically arranged relative to the power rod.
6. The putty polishing device as set forth in claim 4, wherein: the clamping plate is an L-shaped plate with an outward opening, a plurality of pressurizing screws penetrating through the L-shaped plate are arranged on the L-shaped plate, and screw holes matched with the pressurizing screws are arranged on the wall of the cavity of the positioning cavity.
7. A putty polishing device as set forth in claim 2 wherein: the first friction plate and the second friction plate are arranged at 90 degrees.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210783773.6A CN115122247B (en) | 2022-07-05 | Putty polishing sand paper and putty polishing device using same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210783773.6A CN115122247B (en) | 2022-07-05 | Putty polishing sand paper and putty polishing device using same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN115122247A CN115122247A (en) | 2022-09-30 |
| CN115122247B true CN115122247B (en) | 2024-06-11 |
Family
ID=
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