CN115121568B - Groove type cleaning machine for wafer production - Google Patents

Groove type cleaning machine for wafer production Download PDF

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Publication number
CN115121568B
CN115121568B CN202210752403.6A CN202210752403A CN115121568B CN 115121568 B CN115121568 B CN 115121568B CN 202210752403 A CN202210752403 A CN 202210752403A CN 115121568 B CN115121568 B CN 115121568B
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CN
China
Prior art keywords
cleaning
pipe
wafer production
cleaning machine
stoving case
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Active
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CN202210752403.6A
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Chinese (zh)
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CN115121568A (en
Inventor
顾雪平
时新宇
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Suzhou Zhicheng Semiconductor Technology Co ltd
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Suzhou Zhicheng Semiconductor Technology Co ltd
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Priority to CN202210752403.6A priority Critical patent/CN115121568B/en
Publication of CN115121568A publication Critical patent/CN115121568A/en
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B11/00—Cleaning flexible or delicate articles by methods or apparatus specially adapted thereto
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B11/00—Cleaning flexible or delicate articles by methods or apparatus specially adapted thereto
    • B08B11/02—Devices for holding articles during cleaning
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B13/00—Accessories or details of general applicability for machines or apparatus for cleaning
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/02—Cleaning by the force of jets or sprays
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F26—DRYING
    • F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
    • F26B21/00—Arrangements or duct systems, e.g. in combination with pallet boxes, for supplying and controlling air or gases for drying solid materials or objects
    • F26B21/004—Nozzle assemblies; Air knives; Air distributors; Blow boxes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/6773—Conveying cassettes, containers or carriers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cleaning By Liquid Or Steam (AREA)

Abstract

The invention discloses a groove type cleaning machine for wafer production, which relates to the technical field of semiconductor cleaning and comprises a cleaning device, a conveying device and a drying device, wherein the conveying device is used for conveying a flower basket to the cleaning device and the drying device, and wafers are processed through the cleaning device and the drying device.

Description

Groove type cleaning machine for wafer production
Technical Field
The invention relates to the technical field of semiconductor cleaning, in particular to a groove type cleaning machine for wafer production.
Background
The multi-tank ultrasonic cleaning machine adopts pure water or weakly acidic water-based solvent as a cleaning agent, is combined with cleaning modes such as spraying, jet flow, hot dipping and ultrasonic megasonic bubbling, and is matched with a proper product drying mode to form a semi-automatic ultrasonic cleaning production line. In the prior art, the multi-tank type cleaning machine is too large and occupies a large area, most of the multi-tank type cleaning machines are used for mechanical arms to operate, and programming data required by the mechanical arms are very complex, so that the multi-tank type cleaning machine which is simple in structure, easy to operate and small in size and occupied area is needed.
The utility model discloses a chinese utility model patent that publication number is CN212976079U discloses a slot type cleaning machine, including box and installation component, it has the clean groove that is used for holding the sanitizer to inject in the box, the installation component includes the mounting panel, is used for installing the swivel mount and the rotary drive device of wafer, rotary drive device with the swivel mount is all installed on the mounting panel, the swivel mount with rotary drive device's output links to each other, mounting panel demountable installation is in on the notch in clean groove, the device discloses a rotatory abluent structure, but the operation is complicated, and area is big, and the simultaneous control is complicated.
Disclosure of Invention
The invention discloses a groove type cleaning machine for wafer production, which comprises a cleaning device and a drying device, wherein a conveying device is arranged between the cleaning device and the drying device, a flower basket is arranged on the conveying device, the cleaning device comprises a box body, a rotary shell is rotatably arranged on the box body, three cleaning boxes are uniformly arranged in the rotary shell, each cleaning box is provided with an upper opening and a lower opening, a sealing plate is axially and slidably arranged at the upper opening and is radially fixed, small holes are formed in the sealing plate, a baffle is vertically and slidably arranged in the box body and corresponds to the lower opening of the cleaning box in position, a pipeline assembly is arranged on the cleaning box, a three-way pipe is arranged on the pipeline assembly, a first end of the three-way pipe is connected with the pipeline assembly, a communicating pipe is communicated with a second end of the three-way pipe, a cleaning liquid pipe is communicated with a third end of the three-way pipe, a spherical valve is arranged in the three-way pipe, two openings are formed in the spherical valve, the two openings are communicated with the communicating pipe or communicated with the communicating pipe and the cleaning liquid pipe, a gear is fixedly arranged on one side of the spherical valve, a rack is fixedly arranged on the baffle, the baffle is engaged with the gear, and the rack and the spherical valve is driven to rotate by the lifting of the baffle.
Furthermore, a floater is vertically arranged in the cleaning box in a sliding mode, rises along with the cleaning liquid, and blocks the small hole in the sealing plate when the floater rises to the top end.
Furthermore, one end of the pipeline assembly, which is positioned in the cleaning box, is connected with a spray head.
Furthermore, one end of the sealing plate is fixedly provided with a return spring, and the return spring is fixedly connected with the rotating shell.
Furthermore, the conveying device comprises a supporting plate, a transverse moving assembly is arranged on the supporting plate, a taking and placing frame is arranged on the transverse moving assembly, the transverse moving assembly drives the taking and placing frame to penetrate through the rotary shell, a clamping plate is arranged on the lower side of the taking and placing frame, a flower basket is placed on the upper surface of the clamping plate, a driving rod is rotationally arranged on one side of the taking and placing frame, a torsion spring is fixedly arranged between the driving rod and the taking and placing frame, and the bottom end of the driving rod is in contact with the sealing plate in the moving process.
Furthermore, a supporting plate is vertically and slidably arranged on the supporting plate, a lifting cylinder is fixedly arranged on the supporting plate, and a cylinder arm of the lifting cylinder is fixedly connected with the supporting plate.
Further, drying device includes the stoving case, and the stoving case is gone up to slide and is equipped with the upper cover, sets up the blowing pipe on the stoving case, and the one end intercommunication that lies in the stoving incasement on the blowing pipe has the air-jet head, and the air-jet head is annular and fixed mounting on the four sides inner wall of stoving case, and the vertical slip of stoving incasement is equipped with the ventilating board, and the ventilating board length and width all are less than the inboard length and the width of air-jet head.
Furtherly, the both sides of ventilating board set up the stairstepping opening, and stoving incasement is fixed and is equipped with the inclined plane, and the least significant end on inclined plane has an output duct, the inclined plane is located stairstepping opening downside.
Compared with the prior art, the invention has the beneficial effects that: (1) According to the invention, the three cleaning boxes are arranged in the cleaning box and are rotated for switching, so that the space is saved, the parts are also saved, and the cost is further saved; (2) The cleaning device can quickly discharge the deionized liquid in the cleaning box through pressurization, so that the quick discharge speed is further increased; (3) The flower basket can be transported without adding a clamping device through the matching of the clamping plates; (4) The stepped opening on the ventilating plate realizes the control of the air exhaust amount through the matching with the inner wall of the drying box.
Drawings
Fig. 1 is an overall schematic view of the present invention.
FIG. 2 is a partial schematic view of the conveyor of the present invention.
Fig. 3 is an overall schematic view of the conveying device of the present invention.
Fig. 4 is an enlarged schematic view of a in fig. 3.
FIG. 5 is a schematic view of a cleaning apparatus of the present invention.
FIG. 6 is a schematic view of the internal structure of the cleaning device of the present invention.
Fig. 7 is an enlarged schematic view of C in fig. 6.
Fig. 8 is a schematic view of the shape of the ball valve of the present invention.
Fig. 9 is a schematic view showing the fitting of the cleaning tank and the sealing plate of the present invention.
Fig. 10 is a sectional view of the cleaning tank of the present invention.
FIG. 11 is a cross-sectional view of the cleaning device of the present invention.
Fig. 12 is a schematic view of a drying apparatus according to the present invention.
Fig. 13 is a sectional view of the drying apparatus of the present invention.
Fig. 14 is a schematic view of the shape of the ventilation board of the present invention.
Reference numerals: 1-a cleaning device; 2-a conveying device; 3-drying device; 4-basket of flowers; 101-a box body; 102-an electric machine; 103-a belt; 104-a cleaning box; 105-a rotating housing; 106-pipeline I; 107-transverse ducts; 108-line II; 109-a vent pipe; 110-a cleaning liquid tube; a 111-tee; 112-gear; 113-a rack; 114-a trace; 115-ball valve; 116-a communicating tube; 117-a slide bar; 118-a cylinder; 119-a baffle; 120-sealing plate; 121-a return spring; 122-floating; 123-a spray header; 201-a support plate; 202-a pick-and-place frame; 203-a mounting plate; 204-a moving motor; 205-a movement axis; 206-a lead screw; 207-deflector rod; 208-a torsion spring; 209-pallet; 210-an auxiliary frame; 211-lifting cylinder; 301-drying box; 302-an upper cover; 303-uncovering the cylinder; 304-a blowpipe; 305-a jet cylinder; 306-a gas jet head; 307-ventilation board.
Detailed Description
The technical scheme of the invention is further explained by the specific implementation mode in combination with the attached drawings.
Wherein the showings are for the purpose of illustration only and are shown by way of illustration only and not in actual form, and are not to be construed as limiting the present patent; to better illustrate the embodiments of the present invention, some parts of the drawings may be omitted, enlarged or reduced, and do not represent the size of an actual product; it will be understood by those skilled in the art that certain well-known structures in the drawings and descriptions thereof may be omitted.
Example (b): the groove type cleaning machine for wafer production shown in fig. 1-14 comprises a cleaning device 1, a conveying device 2 and a drying device 3, wherein the conveying device 2 is used for conveying a flower basket 4 to the cleaning device 1 and the drying device 3, and the cleaning device 1 and the drying device 3 are used for processing wafers, the conveying device 2 comprises a supporting plate 201, the supporting plate 201 is composed of a bottom plate and a door frame, an auxiliary frame 210 is fixedly arranged on the supporting plate 201, a supporting plate 209 is vertically arranged on the door frame and the auxiliary frame 210 in a sliding mode, the flower basket 4 is arranged on the supporting plate 209, a lifting cylinder 211 is fixedly arranged on the supporting plate 201, a cylinder arm of the lifting cylinder 211 is fixedly connected with the supporting plate 209, at the moment, the flower basket 4 is placed on the supporting plate 209, and the lifting cylinder 211 drives the supporting plate 209 to lift.
The sideslip subassembly includes mounting panel 203, mounting panel 203 fixed mounting is in drying device 3 is last, the fixed moving motor 204 that is equipped with on the mounting panel 203, the fixed lead screw 206 that is equipped with in the pivot of moving motor 204, the fixed removal axle 205 that is equipped with between the portal of backup pad 201 and the mounting panel 203, it has access frame 202 to remove to slide on the axle 205, set up the screw hole on the access frame 202, the screw hole cooperates with lead screw 206, the downside that access frame 202 sets up cardboard I, basket of flowers 4 upside sets up cardboard II, the lower surface of cardboard II and the upper surface contact of cardboard I, it is equipped with driving lever 207 to rotate on the access frame 202, the fixed first end that is equipped with torsion spring 208 on the driving lever 207, the second end fixed mounting of torsion spring 208 is on access frame 202.
Cleaning device 1 includes box 101, rotatory shell 105 is equipped with in the rotation on box 101, the fixed motor 102 that is equipped with in side of box 101, motor 102 passes through belt 103 and drives rotatory shell 105 rotatory, evenly set up by three washing case 104 in the rotatory shell 105, wash case 104 for the cavity and set up two upper and lower openings, the upper shed department slides and is equipped with sealing plate 120, but sealing plate 120 slidable mounting is on rotatory shell 105, also slidable mounting is at the upper shed department of washing case 104, in this embodiment: the cleaning device comprises a rotary shell 105, a sliding groove is axially formed in the rotary shell 105, a sealing plate 120 is slidably mounted in the sliding groove and is kept fixed in the radial direction, the sealing plate 120 covers an upper opening of a cleaning box 104 tightly, a return spring 121 is fixedly mounted at one end of the sealing plate 120, the return spring 121 is fixedly connected with the rotary shell 105, in the moving process of a taking and placing frame 202, the bottom of a shifting rod 207 is in contact with the sealing plate 120 and pushes the sealing plate 120, the return spring 121 is stretched, an air cylinder 118 is fixedly mounted in a box body 101, a baffle 119 is fixedly mounted on an arm of the air cylinder 118, the baffle 119 is slidably mounted at a lower opening of the cleaning box 104, a sliding rod 117 is fixedly mounted at the lower side of the sliding rod 117, a linkage rod 114 is fixedly mounted at the lower end of the sliding rod 114, a rack 113 is fixedly mounted on the linkage rod 114, a communicating pipeline assembly is arranged in the cleaning box 104, an input end of the pipeline assembly is connected with a first end of a three-way pipe 111, a second end of the three-way pipe 111 is communicated with a cleaning liquid pipe 110, a spherical valve 115 is mounted in the three-way pipe 111, two openings of the spherical valve 115 are arranged on one side of the spherical valve 115, the spherical valve 115 is communicated with the gear 112, the rack 113, the two openings of the spherical valve 115 are communicated with the cleaning liquid pipe 116 and communicated with a cleaning liquid level of the cleaning box 120, the cleaning liquid pipe 116, the cleaning box 120 or the cleaning box, the floating box 104, the floating small floating pipe 122, the floating pipe 116 is communicated with the floating small floating pipe 122, and the floating pipe 122, the floating pipe, when the cleaning box 104, the floating pipe 122, the floating tank.
The pipeline assembly comprises two channels arranged in the cleaning box 104, spray heads 123 are fixedly arranged on the inner sides of the channels, the outer sides of the two channels are communicated with the two channels arranged in the box body 101, a pipeline I106 and a pipeline II 108 are respectively connected with the two channels on the box body 101, the pipeline I106 and the pipeline II 108 are communicated through a transverse pipeline 107, the transverse pipeline 107 is communicated with a communicating pipe 116, and a three-way pipe 111 is arranged on the upper side of the communicating pipe 116.
Drying device 3 includes stoving case 301, stoving case 301 is hollow structure, the fixed inclined plane that is equipped with in the inside middle section of stoving case 301, the inside bottom mounting of stoving case 301 is equipped with jet-propelled cylinder 305, the jar arm of jet-propelled cylinder 305 passes the inclined plane and fixedly is equipped with ventilating board 307, the inside upper strata space of stoving case 301 is greater than lower floor's space, the inner wall of the top laminating lower floor's space of ventilating board 307, be provided with jet-propelled head 306 on the inside wall of stoving case 301 upper strata space, jet-propelled head 306 is the annular, ventilating board 307 can pass from the middle of jet-propelled head 306, the outside of jet-propelled head 306 is fixed with blowing pipe 304, the one end that blowing pipe 304 stretched into stoving case 301 communicates with jet-propelled head 306, the both sides of ventilating board 307 set up the stairstepping opening, stoving case 301 internal fixation is equipped with the inclined plane, the lower extreme on inclined plane has the output pipeline, the inclined plane is located stairstepping opening downside, stoving case 301 is gone up and is equipped with lid 302, stoving case 301 is last to fix is equipped with uncapping cylinder 303, uncapping cylinder 303 is fixed on the jar arm of uncapping cylinder 303 is equipped with lid 302.
The working principle is as follows: firstly, the lifting cylinder 211 drives the supporting plate 209 to descend, the wafer is placed in the flower basket 4 on the supporting plate 209, the wafer is placed in the flower basket 4, the supporting plate 209 conveys the flower basket 4 to a position aligned with the pick-and-place frame 202, the moving motor 204 is started, the moving motor 204 drives the pick-and-place frame 202 to be close to the flower basket 4 through the lead screw 206, finally, the clamping plate I is contacted with the clamping plate II, the supporting plate 209 descends, the flower basket 4 is located on the pick-and-place frame 202, the moving motor 204 is reversed, the pick-and-place frame 202 drives the flower basket 4 to be close to the cleaning device 1, the poking rod 207 pokes the sealing plate 120 to slide when being close to the sealing plate 120, the stiffness coefficient of the return spring 121 is smaller than that of the torsion spring 208, when the sealing plate 120 is completely separated from the cleaning box 104, although the torsion spring 208 is twisted, the poking rod 207 is not separated from the contact with the sealing plate 120, the return spring 121 is stretched until the sealing plate 120 is completely separated from the cleaning box 104, at this moment, the cylinder 118 is started, and the cylinder 118 lifts up the flower basket 4, so that the flower basket 4 is separated from the pick-and the flower basket 202. At the moment, the air cylinder 118 retracts, the pick-and-place frame 202 returns to the original position, the sealing plate 120 completely covers the cleaning box 104, the air cylinder 118 drives the baffle 119 to continuously descend until the vent pipe 109 blocks the lower opening of the cleaning box 104, at the moment, the spherical valve 115 is communicated with the cleaning liquid pipe 110 and the communicating pipe 116, deionized water is sprayed into the cleaning box 104 through the pipeline assembly to spray wafers, as the water level in the cleaning box 104 rises, the float 122 also rises along with the rise of the water level until the float 122 blocks the small hole in the sealing plate 120, at the moment, the air cylinder 118 drives the baffle 119 to rise, the baffle 119 still seals the cleaning box 104, meanwhile, the slide rod 117 rises along with the rise of the water level, the linkage rod 114 also drives the rack 113 to rise and drives the gear 112 to rotate, so that the spherical valve 115 is communicated with the vent pipe 109 and the communicating pipe 116, at the moment, deionized water is not sprayed into the cleaning box 104 any more, pressurized spraying paint starts, the pressure in the cleaning box 104 rises, when the baffle 119 rises to separate from the lower opening of the cleaning box 104, the deionized water in the cleaning box 104 quickly flows downwards, and impurities on the wafers are taken away.
Thereafter, the baffle 119 moves downward to make the wafer on the baffle 119 under the rotary housing 105, at this time, the motor 102 is started to drive the rotary housing 105 to rotate, the other cleaning box 104 is aligned with the baffle 119, the baffle 119 ascends to seal the cleaning box 104 to repeat the previous cleaning steps, after all three cleaning boxes 104 clean the wafer once, the pick-and-place frame 202 moves over, the sealing plate 120 is opened through the lever 207, then the wafer is lifted by the baffle 119, the pick-and-place frame 202 moves again to make the clamping plate I and the clamping plate II contact, then the baffle 119 descends, the pick-and-place frame 202 moves to the drying device 3, at the beginning, the lever 207 drives the sealing plate 120 to move, since the stiffness coefficient of the return spring 121 is smaller than that of the torsion spring 208, when the sealing plate 120 is completely separated from the cleaning box 104, although the torsion spring 208 is twisted, however, the shifting rod 207 is at the limit position in contact with the sealing plate 120 and is not separated, the sealing plate 120 continues to move the torsion spring 208 to continue to be twisted, the shifting rod 207 is separated from the sealing plate 120, the sealing plate 120 is returned under the guidance of the return spring 121, the pick-and-place frame 202 drives the basket 4 to move above the upper cover 302, the cover opening cylinder 303 starts to open the upper cover 302, the air injection cylinder 305 ascends to push the basket 4 upwards, the basket 4 descends along with the ventilation plate 307 after the pick-and-place frame 202 moves, the upper cover 302 is closed, the blowing pipe 304 sprays hot nitrogen gas onto the wafer through the air injection head 306 for drying, the air injection cylinder 305 drives the ventilation plate 307 to ascend and descend in a short distance, the stepped opening on one side of the ventilation plate 307 can control the air exhaust amount, the bottom end of the inclined plane is provided with an output pipeline, and the hot nitrogen gas is exhausted from the output pipeline.

Claims (8)

1. The utility model provides a slot type cleaning machine is used in wafer production, includes belt cleaning device (1) and drying device (3), set up between belt cleaning device (1) and drying device (3) and be used for conveyor (2), put basket of flowers (4) on conveyor (2), its characterized in that: the cleaning device (1) comprises a box body (101), a rotary shell (105) is rotatably arranged on the box body (101), three cleaning boxes (104) are uniformly arranged in the rotary shell (105), the cleaning boxes (104) are provided with an upper opening and a lower opening, a sealing plate (120) is axially slidably arranged at the upper opening and is radially fixed, a small hole is formed in the sealing plate (120), a baffle plate (119) is vertically slidably arranged in the box body (101), the baffle plate (119) corresponds to the lower opening of the cleaning boxes (104), a pipeline assembly is arranged on the cleaning boxes (104), a three-way pipe (111) is arranged on the pipeline assembly, a first end of the three-way pipe (111) is connected with the pipeline assembly, a second end of the three-way pipe (111) is communicated with a vent pipe (109), a third end of the three-way pipe (111) is communicated with a cleaning liquid pipe (110), a spherical valve (115) is arranged in the three-way pipe (111), two openings are formed in the spherical valve (115), the two openings are communicated with the vent pipe (116) or the vent pipe (116) and the cleaning liquid pipe (110), a gear (112) is fixedly arranged at one side of the spherical valve (115), the baffle (119) is fixedly provided with a rack (113), the rack (113) is meshed with the gear (112), the lifting of the baffle (119) drives the ball valve (115) to rotate.
2. The trough type cleaning machine for wafer production as claimed in claim 1, wherein: the cleaning box (104) is internally provided with a float (122) in a vertical sliding way, the float (122) rises along with the cleaning liquid, and the float (122) blocks the small hole on the sealing plate (120) when rising to the top.
3. The trough type cleaning machine for wafer production as claimed in claim 2, wherein: one end of the pipeline component, which is positioned in the cleaning box (104), is connected with a spray head (123).
4. The wafer production tank cleaning machine of claim 3, wherein: one end of the sealing plate (120) is fixedly provided with a return spring (121), and the return spring (121) is fixedly connected with the rotating shell (105).
5. The wafer production tank cleaning machine of claim 1, wherein: the conveying device (2) comprises a supporting plate (201), a transverse moving assembly is arranged on the supporting plate (201), a taking and placing frame (202) is arranged on the transverse moving assembly, the transverse moving assembly drives the taking and placing frame (202) to penetrate through the rotary shell (105), a clamping plate is arranged on the lower side of the taking and placing frame (202), a flower basket (4) is placed on the upper surface of the clamping plate, a shifting rod (207) is rotationally arranged on one side of the taking and placing frame (202), a torsion spring (208) is fixedly arranged between the shifting rod (207) and the taking and placing frame (202), and the bottom end of the shifting rod (207) is in contact with the sealing plate (120) in the moving process.
6. The wafer production tank cleaning machine of claim 5, wherein: the supporting plate (209) is vertically installed on the supporting plate (201) in a sliding mode, the lifting cylinder (211) is fixedly installed on the supporting plate (201), and a cylinder arm of the lifting cylinder (211) is fixedly connected with the supporting plate (209).
7. The trough type cleaning machine for wafer production as claimed in claim 1, wherein: drying device (3) are including stoving case (301), and sliding is equipped with upper cover (302) on stoving case (301), sets up blast pipe (304) on stoving case (301), and the one end intercommunication that lies in stoving case (301) on blast pipe (304) has jet head (306), and jet head (306) are annular and fixed mounting on the four sides inner wall of stoving case (301), and vertical slip is equipped with ventilating board (307) in stoving case (301), and ventilating board (307) length and width all are less than the inboard length and the width of jet head (306).
8. The trough type cleaning machine for wafer production as claimed in claim 7, wherein: the both sides of ventilating board (307) set up the stairstepping opening, stoving case (301) internal fixation is equipped with the inclined plane, and there is the output pipeline at the lower extreme on inclined plane, the inclined plane is located stairstepping opening downside.
CN202210752403.6A 2022-06-28 2022-06-28 Groove type cleaning machine for wafer production Active CN115121568B (en)

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CN202210752403.6A CN115121568B (en) 2022-06-28 2022-06-28 Groove type cleaning machine for wafer production

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Application Number Priority Date Filing Date Title
CN202210752403.6A CN115121568B (en) 2022-06-28 2022-06-28 Groove type cleaning machine for wafer production

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CN115121568A CN115121568A (en) 2022-09-30
CN115121568B true CN115121568B (en) 2023-03-28

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Citations (7)

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KR20000066966A (en) * 1999-04-22 2000-11-15 윤종용 Apparatus for cleaning semiconductor wafer
CN102231357A (en) * 2011-05-12 2011-11-02 陕西建工集团设备安装工程有限公司 Construction method for controlling cleanliness of electronic-grade multicrystal-silicon process pipe
CN108389813A (en) * 2018-02-26 2018-08-10 上海提牛机电设备有限公司 A kind of makeup of Wafer Cleaning drying integrated is set and its cleaning method
CN210187866U (en) * 2019-07-24 2020-03-27 天津创昱达光伏科技有限公司 Silicon wafer spraying cleaning machine
CN112058777A (en) * 2020-07-31 2020-12-11 南京阿兹曼电子科技有限公司 Automatic cleaning device for electronic part production and using method
CN114602873A (en) * 2022-03-24 2022-06-10 智程半导体设备科技(昆山)有限公司 Semiconductor wafer slot type cleaning machine

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CN210187866U (en) * 2019-07-24 2020-03-27 天津创昱达光伏科技有限公司 Silicon wafer spraying cleaning machine
CN112058777A (en) * 2020-07-31 2020-12-11 南京阿兹曼电子科技有限公司 Automatic cleaning device for electronic part production and using method
CN114602873A (en) * 2022-03-24 2022-06-10 智程半导体设备科技(昆山)有限公司 Semiconductor wafer slot type cleaning machine

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