CN115119425A - Super-thick multilayer board and pressing manufacturing method thereof - Google Patents
Super-thick multilayer board and pressing manufacturing method thereof Download PDFInfo
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- CN115119425A CN115119425A CN202210739946.4A CN202210739946A CN115119425A CN 115119425 A CN115119425 A CN 115119425A CN 202210739946 A CN202210739946 A CN 202210739946A CN 115119425 A CN115119425 A CN 115119425A
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- copper foil
- positioning hole
- optical substrate
- multilayer board
- pressing
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- 238000003825 pressing Methods 0.000 title claims abstract description 59
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 44
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 101
- 239000011889 copper foil Substances 0.000 claims abstract description 90
- 230000003287 optical effect Effects 0.000 claims abstract description 39
- 239000000758 substrate Substances 0.000 claims abstract description 39
- 238000005530 etching Methods 0.000 claims abstract description 15
- 239000003292 glue Substances 0.000 claims abstract description 15
- 238000000034 method Methods 0.000 claims description 14
- 229910052802 copper Inorganic materials 0.000 claims description 11
- 239000010949 copper Substances 0.000 claims description 11
- 238000005553 drilling Methods 0.000 claims description 9
- 238000010030 laminating Methods 0.000 claims description 5
- 238000005520 cutting process Methods 0.000 claims description 3
- 239000000463 material Substances 0.000 claims description 3
- 238000003801 milling Methods 0.000 claims description 3
- 239000011265 semifinished product Substances 0.000 claims description 3
- -1 respectively Substances 0.000 claims description 2
- 239000000047 product Substances 0.000 description 13
- 239000002023 wood Substances 0.000 description 8
- 239000000945 filler Substances 0.000 description 6
- 238000010586 diagram Methods 0.000 description 4
- 238000003475 lamination Methods 0.000 description 4
- 230000009286 beneficial effect Effects 0.000 description 2
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
- H05K1/0298—Multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The invention discloses an ultra-thick multilayer board and a pressing manufacturing method thereof, which are manufactured according to the following steps: preparing a copper foil, an optical substrate and PP; step two, copper foil treatment; carrying out controlled deep etching on the copper foil, and etching the copper foil into a first pressed groove; step three, optical substrate processing; step four, PP treatment; pre-routing the PP to form a second pressing groove; step five, pressing and filling glue; aligning the first indent of the copper foil to the first bump in the PP for embedding connection, and performing pressing and glue filling on the first indent; step six: etching the copper foil; step seven: and repeating the fifth step and the sixth step until the multilayer board is manufactured. By designing the manufacturing method of the super-thick multilayer board, the problem that the product quality is reduced due to the fact that the super-thick multilayer board is produced by adopting direct glue filling is solved, the super-thick multilayer board can be normally and stably produced, the production quality of the super-thick multilayer board is effectively guaranteed, the product quality is guaranteed, and the production yield is effectively improved.
Description
Technical Field
The invention belongs to the technical field of production of super-thick multilayer boards, and particularly relates to a super-thick multilayer board and a pressing manufacturing method thereof.
Background
The mode that many high glues PP direct glue-filling are often adopted to prior art super thick multiply wood, but this mode carries out the pressfitting glue-filling to super thick copper and leads to the fact the face uneven easily, and the pressfitting explodes the board scheduling problem, is difficult to guarantee super thick multiply wood production quality, influences the product quality, greatly reduced production yield.
Disclosure of Invention
The embodiment of the application provides the super-thick multilayer board and the press-fit manufacturing method thereof, and by designing the super-thick multilayer board manufacturing method, the problem that the product quality is reduced due to the fact that the super-thick multilayer board is produced by adopting direct glue filling is solved, the super-thick multilayer board can be normally and stably produced, the production quality of the super-thick multilayer board is effectively guaranteed, the product quality is guaranteed, and the production yield is effectively improved.
The technical scheme provided by the embodiment of the application is as follows:
a pressing manufacturing method of an ultra-thick multilayer board comprises the following steps:
step one, preparing materials; cutting a copper foil with a required size, preparing an optical substrate with the same size as the copper foil, and preparing a PP with the same size as the copper foil;
step two, copper foil treatment; drilling a first positioning hole in the copper foil, carrying out controlled deep etching on the copper foil, and etching the copper foil into a first pressing groove;
step three, optical substrate processing; drilling a second positioning hole on the optical substrate, wherein the second positioning hole and the first positioning hole are correspondingly arranged;
step four, PP treatment; drilling a third positioning hole in the PP, wherein the third positioning hole and the first positioning hole are correspondingly arranged; pre-milling the PP to form a second pressing groove, wherein the first pressing groove and the second pressing groove are arranged in a staggered mode, a first bump is formed between the second pressing grooves, and the first bump is embedded in the first pressing groove and connected with the first pressing groove;
step five, pressing and filling glue; aligning the first pressing groove of the copper foil with the first bump in the PP for embedding connection, and aligning the third positioning hole in the PP with the second positioning hole in the optical substrate; sequentially placing the copper foil, the PP, the optical substrate, the PP and the copper foil from top to bottom, and carrying out pressing and glue filling on the copper foil, the PP, the optical substrate, the PP and the copper foil to form a semi-finished product;
step six: etching the copper foil; etching the residual copper foil corresponding to the first pressing groove to form an inner layer circuit;
step seven: sequentially adding PP and copper foil on the copper foil according to the specific requirements of the multilayer board for laminating layer by layer; and repeating the fifth step and the sixth step until the multilayer board is manufactured.
Wherein, the second step to the fourth step can be independently operated, can be simultaneously carried out, and can also be operated in a mixed sequence.
According to the invention, the first pressing groove of the copper foil and the first bump of the PP are arranged, and the first bump is pressed in the first pressing groove, so that the pressing and glue filling quality between the copper foil and the PP can be effectively ensured, the pressing smoothness between the copper foil and the PP is ensured, the stable smoothness of the production of the ultra-thick multilayer board is ensured, the production yield of the ultra-thick multilayer board is improved, and the product quality is effectively ensured. And all set up the locating hole through PP, smooth base plate, copper foil, effectively improve the accurate nature of lamination process, improve the simple operation nature of production process. Through the whole step setting for the ply pressfitting filler one by one, the operation is smooth and stable, effectively guarantees the production quality.
Further, the height of the first bump is smaller than the depth of the first indent. The height of the first bump is 3-10mil less than the depth of the first indent. Through this setting, effectively improve the level gomphosis degree of pressfitting filler, guarantee high-quality pressfitting filler.
Further, the depth of the first pressing groove is 3/7-5/7 of the thickness of the copper foil. Through this setting, guarantee that copper foil and PP pressfitting are stable, guarantee super thick multiply wood production quality.
Further, the copper foil has a mass greater than 6 ounces. The production method can be suitable for the production of multi-layer plates of over 6 ounces of ultra-thick copper foils and is suitable for the lamination of multi-layer plates of copper foils with different thicknesses.
An ultra-thick multi-layer board manufactured by the pressing method according to claim 1, comprising an optical substrate, PP layers arranged symmetrically to the optical substrate and connected to the upper and lower sides of the optical substrate, respectively, and a copper foil layer arranged symmetrically to the optical substrate and connected to the side of the PP layer away from the optical substrate;
the copper foil layer comprises a first body and first pressing grooves which are opposite to the PP layer and arranged on the first body in an array mode; the PP layer comprises a second body and a first bump arranged opposite to the first pressing groove; the first lug is embedded in the first pressing groove for connection;
a copper column is formed between the adjacent first pressing grooves; and a second pressing groove is formed between the adjacent first lugs.
Through the setting of above-mentioned structure, effectively guarantee the roughness of super thick multiply wood pressfitting, improve super thick multiply wood production yield, effectively guarantee the product quality.
Further, the depth of the second indent is smaller than the height of the copper pillar. The difference between the depth of the second indent and the height of the copper pillar is 3-10 mil. Through this setting, guarantee that the pressfitting is accurate, the gomphosis degree is high, guarantees production quality.
Furthermore, the copper foil layer also comprises first positioning holes arranged at four ends of the first body; the PP layer also comprises third positioning holes arranged at four ends of the second body; the optical substrate comprises a third body and second positioning holes arranged at four ends of the third body; the first positioning hole, the second positioning hole and the third positioning hole are arranged correspondingly. The aperture of the first positioning hole is 5-15 mm. Through this setting, can guarantee the stability of smooth base plate, copper foil layer, PP layer in the pressfitting in-process, improve the pressfitting precision, guarantee product quality.
The invention has the beneficial effects that:
by designing the manufacturing method of the super-thick multilayer board, the problem that the product quality is reduced due to the fact that the super-thick multilayer board is produced by adopting direct glue filling is solved, the manufacturing method of the super-thick multilayer board can be used for producing the super-thick multilayer board normally and stably, the production quality of the super-thick multilayer board is effectively guaranteed, the product quality is guaranteed, and the production yield is effectively improved.
Drawings
FIG. 1 is a flow chart illustrating the fabrication of the present invention;
FIG. 2 is a schematic view of the copper foil layer structure of the present invention;
FIG. 3 is a schematic view of the structure of a PP layer according to the present invention;
FIG. 4 is a schematic view of an optical substrate structure according to the present invention;
FIG. 5 is a diagram of a one-time pressing state in the process of the present invention;
FIG. 6 is a diagram illustrating the state of the etched copper foil after one pressing step in the process of the present invention;
FIG. 7 is a diagram illustrating a state of the copper foil being pressed twice in the process of the present invention;
FIG. 8 is a diagram illustrating the state of the copper foil etched after the second press bonding in the process of the present invention.
The labels in the figure are: the optical substrate 1, the third body 11, the second positioning hole 12; the PP layer 2, the second body 21, the first bump 22, the second indent 23, the third positioning hole 24; the copper foil layer 3, the first body 31, the first indent 32, the copper pillar 33, and the first positioning hole 34.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Example 1
To facilitate an understanding of the present invention for those skilled in the art, the present invention will be described in further detail below with reference to specific embodiments and accompanying drawings.
As shown in fig. 1 to 8, a method for laminating a super-thick multilayer board according to an embodiment of the present invention includes the following steps:
step one, preparing materials; cutting a copper foil with a required size, preparing an optical substrate 1 with the same size as the copper foil, and preparing a PP with the same size as the copper foil;
step two, copper foil treatment; drilling a first positioning hole 34 on the copper foil, carrying out controlled deep etching on the copper foil, and etching the copper foil into a first pressure groove 32;
step three, processing the optical substrate 1; drilling a second positioning hole 12 on the optical substrate 1, wherein the second positioning hole 12 and the first positioning hole 34 are correspondingly arranged;
step four, PP treatment; drilling a third positioning hole 24 on the PP, wherein the third positioning hole 24 and the first positioning hole 34 are correspondingly arranged; pre-milling the PP to form a second pressing groove 23, wherein the first pressing groove 32 and the second pressing groove 23 are arranged in a staggered mode, a first bump 22 is formed between the second pressing grooves 23, and the first bump 22 is embedded in the first pressing groove 32 for connection;
step five, pressing and filling glue; aligning the first indent 32 of the copper foil to the first bump 22 in the PP for embedding connection, and aligning the third positioning hole 24 in the PP to the second positioning hole 12 in the optical substrate 1; sequentially placing the copper foil, the PP, the optical substrate 1, the PP and the copper foil from top to bottom, and carrying out pressing and glue filling on the copper foil, the PP and the copper foil to form a semi-finished product;
step six: etching the copper foil; etching the residual copper foil corresponding to the first indent 32 to form an inner layer circuit;
step seven: sequentially adding PP and copper foil on the copper foil according to the specific requirements of the multilayer board for laminating layer by layer; and repeating the fifth step and the sixth step until the multilayer board is manufactured.
According to the invention, the first pressing groove 32 of the copper foil and the first bump 22 of the PP are arranged, and the first bump 22 is pressed in the first pressing groove 32, so that the pressing and glue filling quality between the copper foil and the PP can be effectively ensured, the pressing and leveling between the copper foil and the PP can be ensured, the stable smoothness of the production of the ultra-thick multilayer board can be ensured, the production yield of the ultra-thick multilayer board can be improved, and the product quality can be effectively ensured. And all set up the locating hole through PP, smooth base plate 1, copper foil, effectively improve the accurate nature of lamination process, improve the simple operation nature of production process. Through the whole step setting for the ply pressfitting filler one by one, the operation is smooth and stable, effectively guarantees the production quality.
In one embodiment, the height of the first bump 22 is less than the depth of the first indent 32. The height of the first bump 22 is 3-10 mils less than the depth of the first indent 32. Through this setting, effectively improve the level gomphosis degree of pressfitting filler, guarantee high-quality pressfitting filler.
In one embodiment, the depth of the first indent 32 is 1/2 the thickness of the copper foil. Through this setting, guarantee that copper foil and PP pressfitting are stable, guarantee super thick multiply wood production quality.
In one embodiment, the copper foil has a mass greater than 6 ounces. The production method can be suitable for the production of multilayer boards of over 6 ounces of ultra-thick copper foils and is suitable for the lamination of the multilayer boards of copper foils with different thicknesses.
An ultra-thick multilayer board, according to the press-fit manufacturing method of claim 1, comprising an optical substrate 1, PP layers 2 disposed symmetrically to the optical substrate 1 and connected to the upper and lower sides of the optical substrate 1, respectively, and a copper foil layer 3 disposed symmetrically to the optical substrate 1 and connected to a side of the PP layers 2 away from the optical substrate 1;
the copper foil layer 3 comprises a first body 31 and first press grooves 32 which are opposite to the PP layer 2 and are arranged on the first body 31 in an array manner; the PP layer 2 includes a second body 21, and a first bump 22 disposed opposite to the first indent 32; the first bump 22 is embedded in the first indent 32 for connection;
Through the setting of above-mentioned structure, effectively guarantee the roughness of super thick multiply wood pressfitting, improve super thick multiply wood production yield, effectively guarantee the product quality.
In one embodiment, the depth of the second indent 23 is less than the height of the copper pillar 33. The depth of the second indent 23 and the height of the copper pillar 33 differ by 3-10 mil. Through this setting, guarantee that the pressfitting is accurate, the gomphosis degree is high, guarantees production quality.
In one embodiment, the copper foil layer 3 further includes first positioning holes 34 disposed at four ends of the first body 31; the PP layer 2 further includes a third positioning hole 24 disposed at four ends of the second body 21; the optical substrate 1 comprises a third body 11 and second positioning holes 12 arranged at four ends of the third body 11; the first positioning hole 34, the second positioning hole 12 and the third positioning hole 24 are correspondingly arranged. The aperture of the first positioning hole 34 is 5-15 mm. Through this setting, can guarantee the stability of smooth base plate 1, copper foil layer 3, PP layer 2 in the pressfitting in-process, improve the pressfitting precision, guarantee product quality.
The invention has the beneficial effects that:
by designing the manufacturing method of the super-thick multilayer board, the problem that the product quality is reduced due to the fact that the super-thick multilayer board is produced by adopting direct glue filling is solved, the super-thick multilayer board can be normally and stably produced, the production quality of the super-thick multilayer board is effectively guaranteed, the product quality is guaranteed, and the production yield is effectively improved.
It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art. It should be noted that the technical features not described in detail in the present invention can be implemented by any prior art.
Claims (10)
1. The method for laminating and manufacturing the ultra-thick multilayer board is characterized by comprising the following steps:
step one, preparing materials; cutting a copper foil with a required size, preparing an optical substrate with the same size as the copper foil, and preparing a PP with the same size as the copper foil;
step two, copper foil treatment; drilling a first positioning hole in the copper foil, carrying out controlled deep etching on the copper foil, and etching the copper foil into a first pressing groove;
step three, optical substrate processing; drilling a second positioning hole on the optical substrate, wherein the second positioning hole and the first positioning hole are correspondingly arranged;
step four, PP treatment; drilling a third positioning hole in the PP, wherein the third positioning hole and the first positioning hole are correspondingly arranged; pre-milling the PP to form a second pressing groove, wherein the first pressing groove and the second pressing groove are arranged in a staggered mode, a first bump is formed between the second pressing grooves, and the first bump is embedded in the first pressing groove and connected with the first pressing groove;
step five, pressing and filling glue; aligning the first pressing groove of the copper foil with the first bump in the PP for embedding connection, and aligning the third positioning hole in the PP with the second positioning hole in the optical substrate; sequentially placing the copper foil, the PP, the optical substrate, the PP and the copper foil from top to bottom, and carrying out pressing and glue filling on the copper foil, the PP, the optical substrate, the PP and the copper foil to form a semi-finished product;
step six: etching the copper foil; etching the residual copper foil corresponding to the first pressing groove to form an inner layer circuit;
step seven: sequentially adding PP and copper foil on the copper foil according to the specific requirements of the multilayer board for laminating layer by layer; and repeating the fifth step and the sixth step until the multilayer board is manufactured.
2. The method of claim 1, wherein the first bump is shorter than the first indent.
3. The method of claim 2, wherein the height of the first bump is 3-10mil less than the depth of the first indent.
4. The method of claim 1, wherein the depth of the first indent is 3/7-5/7 of the thickness of the copper foil.
5. The method of claim 1 wherein the copper foil has a mass greater than 6 ounces.
6. An ultra-thick multilayer board, characterized in that, according to the press-fit manufacturing method of claim 1, comprises an optical substrate, PP layers disposed symmetrically to the optical substrate and connected to the upper and lower sides of the optical substrate, respectively, and a copper foil layer disposed symmetrically to the optical substrate and connected to the side of the PP layer away from the optical substrate;
the copper foil layer comprises a first body and first pressing grooves which are opposite to the PP layer and arranged on the first body in an array mode; the PP layer comprises a second body and a first bump arranged opposite to the first pressing groove; the first lug is embedded in the first pressing groove for connection;
a copper column is formed between the adjacent first pressing grooves; and a second pressure groove is formed between the adjacent first lugs.
7. An ultra-thick multi-layer board according to claim 6, wherein the depth of said second indent is less than the height of said copper pillar.
8. An ultra-thick multilayer board according to claim 7, wherein the depth of said second indent and the height of said copper pillar differ by 3-10 mil.
9. The ultra-thick multilayer board of claim 6, wherein the copper foil layer further comprises first positioning holes disposed at the four ends of the first body; the PP layer also comprises third positioning holes arranged at four ends of the second body; the optical substrate comprises a third body and second positioning holes arranged at four ends of the third body; the first positioning hole, the second positioning hole and the third positioning hole are arranged correspondingly.
10. An ultra-thick multilayer plate according to claim 9, wherein the first positioning hole has a hole diameter of 5 to 15 mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210739946.4A CN115119425B (en) | 2022-06-28 | 2022-06-28 | Super-thick multilayer board and laminating manufacturing method thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210739946.4A CN115119425B (en) | 2022-06-28 | 2022-06-28 | Super-thick multilayer board and laminating manufacturing method thereof |
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| CN115119425A true CN115119425A (en) | 2022-09-27 |
| CN115119425B CN115119425B (en) | 2024-09-27 |
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2022
- 2022-06-28 CN CN202210739946.4A patent/CN115119425B/en active Active
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