CN115093815B - 一种与助焊剂兼容性良好的底部填充材料 - Google Patents
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Abstract
本发明涉及一种与助焊剂兼容性良好的底部填充材料，所述底部填充材料由以下各原料组成：氨酚基三官能团型环氧树脂11～20份、二酚基甲烷型环氧树脂25～32份、增韧剂10～13份、硅烷偶联剂0.5～1份、填料29～33份、固化剂8～15份。本发明的底部填充材料具有与焊锡球中助焊剂兼容性良好,热膨胀系数小，耐温耐湿性良好等优点，相较于传统的底部填充材料具有明显的优势，使芯片封装组件具有更高的可靠性。
Description
技术领域
本发明涉及一种与助焊剂兼容性良好的底部填充材料，属于胶黏剂领域。
背景技术
随着电子科学技术的快速发展，作为其核心技术的电子芯片封装技术也越来越先进。满足智能化、轻量化、微型化，且速度快、功能强、可靠性好等消费需求成为了电子产品发展的主要趋势。底部填充材料是在芯片与基板通过焊锡球焊接后使用的，在毛细管作用下，对芯片与基板间焊锡球的间隙进行填充，再经加热固化成为热固性复合材料，从而减少芯片和基板对焊锡球的应力，并对焊点进行保护，延长芯片封装组件的使用寿命。底部填充胶是电子芯片封装中所需的关键电子材料之一，保证了芯片封装组件的加工性、可靠性和长期使用性。
随着电子芯片封装技术的发展，出现了传统底部填充材料对焊锡球中助焊剂兼容性能差的问题，严重地影响了芯片封装组件的可靠性，甚至直接引起芯片封装组件功能性的失效，此问题的有效解决在当前形势下成为了业内的紧迫需求。
发明内容
目前市售的底部填充材料普遍存在与焊锡球中助焊剂兼容性差、可靠性差等问题。本发明针对现有技术的不足，提供一种与助焊剂兼容性良好的底部填充材料，制得的底部填充材料与焊锡球中助焊剂兼容性良好,热膨胀系数小，耐温耐湿性良好，使芯片封装组件具有更高的可靠性。
本发明解决上述技术问题的技术方案如下：
一种与助焊剂兼容性良好的底部填充材料，将以下质量份数的氨酚基三官能团型环氧树脂11～20份、二酚基甲烷型环氧树脂25～32份、增韧剂10～13份、硅烷偶联剂0.5～1份、填料29～33份、固化剂8～15份，依次投入搅拌釜中，抽真空搅拌2～5小时，制得本发明的与助焊剂兼容性良好的底部填充材料。
本发明的有益效果是：本发明的底部填充材料，与焊锡球中助焊剂兼容性良好，有效的减少底部填充胶在填充过程和固化过程中助焊剂对其产生的负面影响；热膨胀系数小，有效的对芯片和基板之间的焊锡球进行保护；耐温耐湿性良好，有效的保证了芯片封装组件的可靠性。
在上述技术方案的基础上，本发明还可以做如下改进。
进一步，所述氨酚基三官能团型环氧树脂为湖南塞尔维公司生产的SW-0510。
采用上述进一步方案的有益效果是，氨酚基三官能团型环氧树脂分子结构中含有三个环氧基团和芳香环结构，在固化过程中可形成较高的交联密度，使得体系耐热性好，粘接强度高。同时与焊锡球中助焊剂的主要成分改性松香类化合物发生反应，减少助焊剂对体系产生的负面影响。这是本发明的关键核心所在。
进一步，所述的二酚基甲烷型环氧树脂为韩国可隆工业株式会社生产的KF-8110。
采用上述进一步方案的有益效果是：二酚基甲烷型环氧树脂，分子结构中的苯环赋予体系刚性，醚键、亚甲基键等赋予体系柔性，刚性和柔性的结合，有效地提高了体系的本体强度和粘接强度。且粘度低，有利于交联反应平稳进行，综合性能优异。
进一步，所述增韧剂为核壳聚合物（CSR）改性环氧树脂。优选地，为日本钟化株式会社生产的MX267。
采用上述进一步方案的有益效果是，核壳聚合物（CSR）改性环氧树脂，壳为环氧树脂能够参与固化交联；核为纳米橡胶粒子，具有良好的增韧效果，能够提高体系韧性、粘接性能。
进一步，所述硅烷偶联剂为γ-甲基丙烯酰氧基丙基三甲氧基硅烷。优选地，为日本信越化学工业株式会社生产的KBM-503。
采用上述进一步方案的有益效果是，γ-甲基丙烯酰氧基丙基三甲氧基硅烷分子结构中的甲基丙烯酰氧基团有利于提高体系对焊锡球中助焊剂的润湿性能，提高兼容性。也可以有效地提高填料与树脂之间的浸润性，有利于性能稳定并提高体系的粘接强度。
进一步，所述填料为平均粒径6～10μm的球形二氧化硅。优选地，为日本雅都玛工业株式会社生产的FE920A-SQ。
采用上述进一步方案的有益效果是，球形二氧化硅有利于体系对芯片封装组件中焊锡球的空隙进行填充，降低体系的热膨胀系数，有效降低芯片和电路板由于材料本身热膨胀系数差距大在受热过程中引起的形变，达到保护焊锡球和焊点的效果。
进一步，所述固化剂为改性咪唑加成物或改性胺类化合物的两种混合。优选地，改性咪唑加成物为日本味之素精细化学株式会社生产的PN-40J；改性胺类化合物为日本味之素精细化学株式会社生产的MY-H。
采用上述进一步方案的有益效果是，两种固化剂相互促进固化，满足不同固化温度、固化速度的要求，以及通过协同作用对氨酚基三官能团型环氧树脂和助焊剂中的主要成分改性松香类化合物进行更有效的固化交联，达到体系与助焊剂兼容性良好的效果。
具体实施方式
以下对本发明的原理和特征进行描述，所举实例只用于解释本发明，并非用于限定本发明的范围。
实施例1
称取氨酚基三官能团型环氧树脂SW-0510 200g、二酚基甲烷型环氧树脂KF-8110250g、增韧剂MX267 100g、硅烷偶联剂KBM-503 5g、填料FE920A-SQ 295g、固化剂PN-40J100g、固化剂MY-H 50g，依次投入搅拌釜中，抽真空搅拌3小时，制得本发明的与助焊剂兼容性良好的底部填充材料。
实施例2
称取氨酚基三官能团型环氧树脂SW-0510 110g、二酚基甲烷型环氧树脂KF-8110320g、增韧剂MX267 120g、硅烷偶联剂KBM-503 10g、填料FE920A-SQ 320g、固化剂PN-40J70g、固化剂MY-H 50g，依次投入搅拌釜中，抽真空搅拌3小时，制得本发明的与助焊剂兼容性良好的底部填充材料。
实施例3
称取氨酚基三官能团型环氧树脂SW-0510 150g、二酚基甲烷型环氧树脂KF-8110300g、增韧剂MX267 130g、硅烷偶联剂KBM-503 10g、填料FE920A-SQ 330g、固化剂PN-40J50g、固化剂MY-H 30g，依次投入搅拌釜中，抽真空搅拌3小时，制得本发明的与助焊剂兼容性良好的底部填充材料。
对比实施例 1
称取二酚基甲烷型环氧树脂KF-8110 470g、增韧剂MX267 120g、硅烷偶联剂KBM-503 10g、填料FE920A-SQ 300g、固化剂PN-40J 63g、固化剂MY-H 37g，依次投入搅拌釜中，抽真空搅拌3小时，制得本发明的与助焊剂兼容性良好的底部填充材料。
对比实施例 2
称取氨酚基三官能团型环氧树脂SW-0510 150g、二酚基甲烷型环氧树脂KF-8110308g、增韧剂MX267 130g、填料FE920A-SQ 330g、固化剂PN-40J 52g、固化剂MY-H 30g，依次投入搅拌釜中，抽真空搅拌3小时，制得本发明的与助焊剂兼容性良好的底部填充材料。
对比实施例3
称取氨酚基三官能团型环氧树脂SW-0510 150g、二酚基甲烷型环氧树脂KF-8110300g、增韧剂MX267 130g、硅烷偶联剂KBM-503 10g、填料FE920A-SQ 330g、固化剂PN-40J80g，依次投入搅拌釜中，抽真空搅拌3小时，制得本发明的与助焊剂兼容性良好的底部填充材料。
对比实施例4
称取氨酚基三官能团型环氧树脂SW-0510 150g、二酚基甲烷型环氧树脂KF-8110300g、增韧剂MX267 130g、硅烷偶联剂KBM-503 10g、填料FE920A-SQ 330g、固化剂MY-H80g，依次投入搅拌釜中，抽真空搅拌3小时，制得本发明的与助焊剂兼容性良好的底部填充材料。
对比实施例 5
普通市售底部填充材料配方为：称取环氧树脂828EL 120g、环氧树脂983U 400g、硅烷偶联剂KH560 6g、填料204g、固化剂FXR-1020 180g、环氧活性稀释剂AGE 90g，依次投入搅拌釜中，抽真空搅拌4小时，即得产品。
具体试验实施例
通过下面的试验，测试本发明上述实施例1～3和对比实施例1～5的底部填充材料的性能。其中，与助焊剂兼容性由空洞率数值和焊锡球四周底部填充材料形貌来表征；芯片封装组件的可靠性由热膨胀系数（CTE）的数值和双85老化环境箱粘接性能变化率数值来表征。
试验实施例1 与助焊剂兼容性测试
将产品填充芯片封装组件（含有助焊剂），经130℃加热固化10min，取出后室温放置4h，做切片，用显微镜观察，计算空洞率，单位%。
试验实施例2 与助焊剂兼容性测试
将产品填充芯片封装组件（含有助焊剂），经130℃加热固化10min，取出后室温放置4h，做切片，用显微镜观察焊锡球四周底部填充材料，外观均匀无色差为优良，外观存在环绕焊锡球四周的颜色差异为失效。
试验实施例3 可靠性测试
将产品经130℃加热固化10min，制成厚度3～4mm的样块，使用热机械分析仪测试CTE，温度区间-20～200℃，升温速率5℃/min，单位μm/m℃。
试验实施例4 可靠性测试
双85老化环境箱测试，设定温度85℃，设定湿度85℃，将产品经130℃加热固化10min，制成PCB粘接样片放入环境箱中168h，取出后室温放置4h，使用万用试验机测试放入老化环境箱前后的剪切强度，计算衰减率，单位%。
测试结果如下面的表1所示。
表1 实施例1～3制得的产品与对比实施例1～5产品的测试性能对比的测试结果。
从表1中的数据可以看出，本发明的底部填充材料具有与焊锡球中助焊剂兼容性良好,热膨胀系数小，耐温耐湿性良好等优点，相较于传统的底部填充材料具有明显的优势，使芯片封装组件具有更高的可靠性。
以上所述仅为本发明的较佳实施例，并不用以限制本发明，凡在本发明的精神和原则之内，所作的任何修改、等同替换、改进等，均应包含在本发明的保护范围之内。
Claims (3)
1.一种与助焊剂兼容性良好的底部填充材料，其特征在于制备步骤为：
称取氨酚基三官能团型环氧树脂SW-0510 200g、二酚基甲烷型环氧树脂KF-8110250g、增韧剂MX267 100g、硅烷偶联剂KBM-503 5g、填料FE920A-SQ 295g、固化剂PN-40J100g、固化剂MY-H 50g，依次投入搅拌釜中，抽真空搅拌3小时，制得底部填充材料。
2.一种与助焊剂兼容性良好的底部填充材料，其特征在于制备步骤为：称取氨酚基三官能团型环氧树脂SW-0510 110g、二酚基甲烷型环氧树脂KF-8110 320g、增韧剂MX267120g、硅烷偶联剂KBM-503 10g、填料FE920A-SQ 320g、固化剂PN-40J 70g、固化剂MY-H50g，依次投入搅拌釜中，抽真空搅拌3小时，制得底部填充材料。
3.一种与助焊剂兼容性良好的底部填充材料，其特征在于制备步骤为：称取氨酚基三官能团型环氧树脂SW-0510 150g、二酚基甲烷型环氧树脂KF-8110 300g、增韧剂MX267130g、硅烷偶联剂KBM-503 10g、填料FE920A-SQ 330g、固化剂PN-40J 50g、固化剂MY-H30g，依次投入搅拌釜中，抽真空搅拌3小时，制得底部填充材料。
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| CN101580684A (zh) * | 2009-06-05 | 2009-11-18 | 烟台德邦科技有限公司 | 一种低温快速固化底部填充胶及其制备方法 |
| CN103031098A (zh) * | 2011-09-29 | 2013-04-10 | 深圳市深锦泰投资发展有限公司 | Smt贴片红胶及其制备方法 |
| CN109536102A (zh) * | 2018-12-06 | 2019-03-29 | 中国建材检验认证集团厦门宏业有限公司 | 一种高密度水下环氧修补胶及其制备方法和用途 |
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| CN101580684A (zh) * | 2009-06-05 | 2009-11-18 | 烟台德邦科技有限公司 | 一种低温快速固化底部填充胶及其制备方法 |
| CN103031098A (zh) * | 2011-09-29 | 2013-04-10 | 深圳市深锦泰投资发展有限公司 | Smt贴片红胶及其制备方法 |
| CN109536102A (zh) * | 2018-12-06 | 2019-03-29 | 中国建材检验认证集团厦门宏业有限公司 | 一种高密度水下环氧修补胶及其制备方法和用途 |
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