CN115091360A - Paste arm and wax subsides machine of wax machine - Google Patents
Paste arm and wax subsides machine of wax machine Download PDFInfo
- Publication number
- CN115091360A CN115091360A CN202210713668.5A CN202210713668A CN115091360A CN 115091360 A CN115091360 A CN 115091360A CN 202210713668 A CN202210713668 A CN 202210713668A CN 115091360 A CN115091360 A CN 115091360A
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- wafer
- wax
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- grabbing
- arm
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- 230000007246 mechanism Effects 0.000 claims abstract description 102
- 235000012431 wafers Nutrition 0.000 claims description 72
- 230000007704 transition Effects 0.000 claims description 18
- 238000010438 heat treatment Methods 0.000 claims description 16
- 125000006850 spacer group Chemical group 0.000 claims description 6
- 230000008878 coupling Effects 0.000 claims description 5
- 238000010168 coupling process Methods 0.000 claims description 5
- 238000005859 coupling reaction Methods 0.000 claims description 5
- 241000252254 Catostomidae Species 0.000 claims description 4
- 230000009471 action Effects 0.000 claims description 4
- 230000003014 reinforcing effect Effects 0.000 claims description 3
- 238000013021 overheating Methods 0.000 claims 1
- 238000002360 preparation method Methods 0.000 abstract description 2
- 238000000034 method Methods 0.000 description 9
- 239000003638 chemical reducing agent Substances 0.000 description 7
- 230000008569 process Effects 0.000 description 7
- 238000003825 pressing Methods 0.000 description 6
- 239000000919 ceramic Substances 0.000 description 3
- 238000005498 polishing Methods 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 2
- 230000003028 elevating effect Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000001179 sorption measurement Methods 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000007517 polishing process Methods 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/34—Accessories
- B24B37/345—Feeding, loading or unloading work specially adapted to lapping
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
- B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
- B65G47/90—Devices for picking-up and depositing articles or materials
- B65G47/91—Devices for picking-up and depositing articles or materials incorporating pneumatic, e.g. suction, grippers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G2201/00—Indexing codes relating to handling devices, e.g. conveyors, characterised by the type of product or load being conveyed or handled
- B65G2201/02—Articles
- B65G2201/0214—Articles of special size, shape or weigh
- B65G2201/022—Flat
Abstract
The invention relates to a mechanical arm of a wax pasting machine and the wax pasting machine, wherein the mechanical arm comprises: the first end of the rotating mechanism is connected with the driving mechanism, and the driving mechanism drives the rotating mechanism to rotate in the horizontal plane; the first end of the lifting mechanism is connected with the second end of the rotating mechanism, and the second end of the lifting mechanism is connected with the grabbing mechanism through a universal assembly; the rotating mechanism and the lifting mechanism drive the grabbing mechanism to rotate and lift, and the universal assembly enables the grabbing mechanism to have grabbing stability. The invention can effectively improve the positioning precision of the wafer. The invention can be applied in the technical field of chip preparation.
Description
Technical Field
The invention relates to the technical field of chip preparation, in particular to a mechanical arm of a wax pasting machine and the wax pasting machine.
Background
The chip is required to be polished and polished repeatedly during the manufacturing process, so that the surface of the wafer is guaranteed to be as flat and thin as possible, the consistency of the chip in the thickness direction can be guaranteed, the performance is stable, the heat dissipation is easy, and the polishing process is an essential step in the chip production process.
In the process of polishing the wafer, the wafer needs to be fixed on a ceramic disc, however, in the prior art, wax is dropped and thrown on the upper surface of the wafer, and then the wafer is placed on the ceramic disc after being turned over by a mechanical arm, so that the wafer is fixed. The method has more working procedures and complex operation, and the overturning process can cause the positioning precision of the wafer to be lower, thereby further influencing the subsequent polishing work. In addition, the loading and unloading process of the wafer is usually carried out manually by workers, so that the precision is low, and the suction of the suction cup is not stable enough.
Disclosure of Invention
In view of the above problems, an object of the present invention is to provide a robot arm of a wax-applying machine and a wax-applying machine, which can effectively improve the positioning accuracy of a wafer.
In order to achieve the purpose, the invention adopts the following technical scheme: a robotic arm, comprising: the first end of the rotating mechanism is connected with the driving mechanism, and the driving mechanism drives the rotating mechanism to rotate in the horizontal plane; the first end of the lifting mechanism is connected with the second end of the rotating mechanism, and the second end of the lifting mechanism is connected with the grabbing mechanism through a universal assembly; the rotating mechanism and the lifting mechanism drive the grabbing mechanism to rotate and lift, and the universal assembly enables the grabbing mechanism to have grabbing stability.
Further, the universal assembly comprises a transition plate, a universal adjusting head, a spring and a connecting piece;
the end surface of one side of the transition plate is connected with the second end of the lifting mechanism, the middle part of the end surface of the other side of the transition plate is connected with the first end of the connecting piece through the universal adjusting head, and the second end of the connecting piece is connected with the grabbing mechanism;
the spring is further arranged on the end face of one side of the transition plate, a screw is arranged at the bottom of the spring, and the screw is sequentially screwed into the transition plate and the first end of the connecting piece; the distance between each sucker of the grabbing mechanism and the grabbed wafer is equal under the combined action of the elastic force of the spring and the universal adjusting head.
Further, the elastic force of the spring is in direct proportion to the screwing amount of the screw.
Furthermore, the rotating mechanism and the lifting mechanism are connected into an L-shaped structure, and reinforcing ribs are arranged at corners.
Further, the rotating mechanism comprises a support, a coupler, a rotating shaft, a bearing, a spacer bush and a swing arm;
the upper part of the support is connected with the output end of the driving mechanism through the coupler;
the rotating shaft is arranged in the support and supported in the inner wall of the support through two bearings, and the two bearings are separated through the spacer bush;
the support is extended out of the lower portion of the rotating shaft to form an extending portion, the extending portion is connected with the first end of the swing arm, and the second end of the swing arm serves as the second end of the rotating mechanism and is connected with the first end of the lifting mechanism.
Further, the lifting mechanism includes a cylinder block and a cylinder rod;
the cylinder body is fixed at the second end of the rotating mechanism through a fixing plate, and the tail end of the cylinder rod is used as the second end of the lifting mechanism and is connected with the universal assembly;
the cylinder rod slides up and down in the cylinder body to drive the grabbing mechanism to move up and down.
Further, the number of the lifting mechanisms is two; the two cylinder bodies are arranged in parallel, and the tail ends of the two cylinder rods are used as the second ends of the lifting mechanisms together.
Further, the grabbing mechanism comprises a sucker mounting plate and a sucker;
the top of sucking disc mounting disc with universal subassembly is connected, the bottom of sucking disc mounting disc evenly is provided with a plurality ofly the sucking disc, through the inside vacuum that produces of sucking disc adsorbs the wafer, realizes snatching.
A wax pasting machine comprises the mechanical arm, an upper frame, a lower frame, a wafer feeding device, a wax dripping disc, a heating disc and a pressure head; the upper rack is arranged at the upper part of the lower rack, the wafer feeding device, the wax dripping disc and the heating disc are all positioned on the working table surface of the lower rack, the wax dripping disc is positioned at the middle part, and the heating discs are respectively arranged at two sides of the wax dripping disc; the wax dropping device, the pressure head with the arm is all installed go up in the frame, drop the wax device with the arm is located the middle part, the pressure head sets up in both sides and is located directly over the heating plate.
Further, the wafer feeding device is arranged in a drawer type, a wafer placing disc is arranged in the wafer feeding device, and circular grooves with the same number as that of the suckers are formed in the wafer placing disc and used for placing wafers;
an opening is formed in the bottom of the side face of the upper rack, and the drawer type wafer feeding device is pulled out from the opening to feed wafers.
Due to the adoption of the technical scheme, the invention has the following advantages:
1. the mechanical arm does not have a turning process in the process of grabbing the wafer, so that the operation is more stable, and the positioning precision of the wafer is effectively improved.
2. The wafer chuck adopts the universal assembly, so that the wafer chuck can adsorb the wafer more accurately and firmly due to the action of the universal assembly.
3. According to the invention, through the drawer type wafer feeding device, the wafer feeding work is more efficient, and the space is saved.
4. The double-station pressing plate is adopted, so that the working efficiency is improved, and the working space is saved.
In conclusion, the invention effectively solves the problem of uneven wax dropping and throwing caused by unstable wafer feeding before wax dropping. And the problem that the precision is difficult to ensure in the process of sticking the wax on the wafer.
Drawings
FIG. 1 is a schematic view of the overall structure of a robotic arm according to an embodiment of the present invention;
FIG. 2 is a left side view of the robotic arm in one embodiment of the present invention;
FIG. 3 is a right side cross-sectional view of a robotic arm in accordance with an embodiment of the present invention;
FIG. 4 is a schematic structural view of a wax-applying machine according to an embodiment of the present invention;
reference numerals:
1-motor, 2-speed reducer, 3-support, 4-coupler, 5-rotating shaft, 6-bearing, 7-spacer bush, 8-lock nut, 9-swing arm, 10-pressing plate, 11-cylinder block, 12-cylinder rod, 13-transition plate, 14-universal adjusting head, 15-spring, 16-sucker mounting plate, 17-sucker, 18-connecting piece, 19-reinforcing rib, 20-upper frame, 21-lower frame, 22-wafer feeding device, 23-wax dropping device, 24-wax dropping plate, 25-heating plate, 26-pressing head and 27-wafer placing plate.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the drawings of the embodiments of the present invention. It is to be understood that the embodiments described are only a few embodiments of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the described embodiments of the invention, are within the scope of the invention.
It is noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of example embodiments according to the present application. As used herein, the singular forms "a", "an", and "the" are intended to include the plural forms as well, and it should be understood that when the terms "comprises" and/or "comprising" are used in this specification, they specify the presence of stated features, steps, operations, devices, components, and/or combinations thereof, unless the context clearly indicates otherwise.
In one embodiment of the present invention, a robotic arm for a wax applicator is provided. In this embodiment, as shown in fig. 1 to 3, the robot arm includes:
the first end of the rotating mechanism is connected with the driving mechanism, and the driving mechanism drives the rotating mechanism to rotate in the horizontal plane;
the first end of the lifting mechanism is connected with the second end of the rotating mechanism, and the second end of the lifting mechanism is connected with the grabbing mechanism through the universal assembly;
the rotating mechanism and the lifting mechanism drive the grabbing mechanism to rotate and lift, and the grabbing mechanism has grabbing stability due to the universal assembly.
In the above embodiment, the gimbal assembly includes the transition plate 13, the gimbal adjustment head 14, the spring 15, and the connecting member 18.
The end face of one side of the transition plate 13 is connected with the second end of the lifting mechanism, the middle part of the end face of the other side of the transition plate 13 is connected with the first end of the connecting piece 18 through the universal adjusting head 14, and the second end of the connecting piece 18 is connected with the grabbing mechanism. A spring 15 is further arranged on the end face of one side of the transition plate 13, a screw is arranged at the bottom of the spring 15, and the screw is sequentially screwed into the transition plate 13 and the first end of the connecting piece 18; the distance between each suction cup 17 of the grabbing mechanism and the grabbed wafer is equal under the combined action of the elastic force of the spring 15 and the universal adjusting head 14, so that the suction cups 17 can adsorb the wafer more firmly. Wherein, the universal adjusting head 14 adopts a spherical or semi-spherical structure.
In this embodiment, the elastic force of the spring 15 is proportional to the screw-in amount. And the spring 15 is a rectangular coil spring.
In the present embodiment, four springs 15 and four screws are preferably provided. Two of the springs 15 are located in front of the transition plate 13 and the other two springs 15 are located behind the transition plate 13.
When the device is used, the universal adjusting head 14 at the joint of the lifting mechanism and the grabbing mechanism is utilized, the screwing amount of the four screws is adjusted, and then the elastic force of the four springs 15 is adjusted, so that the sucker mounting plate 16 and the sucker 17 in the grabbing mechanism are leveled, the distance between each sucker 17 and a grabbed wafer is equal, and the distance error between the sucker 17 and the grabbed wafer is ensured to be not more than 0.3 mm. Make each sucking disc 17 vacuum suction each wafer can keep unanimous, more stable absorption and firm conveying wafer, avoided because the operation panel that bears the weight of the wafer is uneven and the partial adsorption affinity of sucking disc 17 that produces is not enough, the problem of unable firm absorption wafer.
In the above embodiment, the drive mechanism includes the motor 1 and the speed reducer 2. The output end of the motor 1 is coaxially connected with the input end of the speed reducer 2, the motor 1 is positioned at the upper part of the speed reducer 2, and the output end of the speed reducer 2 is connected with the first end of the rotating mechanism.
In the present embodiment, the motor 1 is preferably a servomotor.
In the above embodiment, the rotating mechanism includes the support 3, the coupling 4, the rotating shaft 5, the bearing 6, the spacer 7 and the swing arm 9. In this embodiment, the support 3 is a hollow structure, and the coupling 4 is a diaphragm coupling.
The upper part of the support 3 is connected with the output end of the speed reducer 2 in the driving mechanism through a coupler 4; the rotating shaft 5 is arranged inside the carrier 3 and is supported in the inner wall of the carrier 3 by two bearings 6, which bearings 6 are separated by a spacer 7. The support 3 is extended below the rotating shaft 5 to form an extending part, the extending part is connected with a first end of the swing arm 9, and a second end of the swing arm 9 is used as a second end of the rotating mechanism and is connected with a first end of the lifting mechanism.
The extension part and the outer end part of the support 3 are fixed through a locking nut 8, and the extension part and the swing arm 9 are fixed together through a pressing plate 10.
In the above embodiment, the elevating mechanism includes the cylinder block 11 and the cylinder rod 12. The cylinder body 11 is fixed at the second end of the swing arm 9 in the rotating mechanism through a fixing plate, and one end of the fixing plate is connected with the second end of the swing arm 9; the end of the cylinder rod 12 serves as the second end of the lifting mechanism and is connected to the gimbal assembly. The cylinder rod 12 slides up and down in the cylinder block 11 to drive the gripping mechanism to move up and down.
Wherein, two lifting mechanisms are arranged; the two cylinder blocks 11 are arranged in parallel, and the tail ends of the two cylinder rods 12 are used as the second ends of the lifting mechanisms together, so that the lifting of the grabbing mechanism is more stable.
In the above embodiment, the rotating mechanism and the lifting mechanism are connected to form an L-shaped structure, and the reinforcing ribs 19 are disposed at the corners (i.e., between the swing arm 9 and the fixing plate).
In each of the above-mentioned embodiments, swing arm 9 can be at horizontal rotation under motor 1's drive, and the radius of rotation R of preferred swing arm 9 in this embodiment is 312mm, and radius of rotation is very little, so cantilever length is little to adopt strengthening rib 19 to consolidate swing arm 9 and elevating system, make whole cantilever structure's rigidity better, and then can realize the steady rotation of higher rotational speed, make mechanism work efficiency higher.
In the above embodiment, the gripping mechanism includes the suction cup mounting plate 16 and the suction cup 17. The top of the suction cup mounting plate 16 is connected to the gimbal assembly, which in turn is connected to the gimbal adjustment head 14 and transition plate 13 by a connector 18. The bottom of the sucker mounting plate 16 is uniformly provided with a plurality of suckers 17, and the wafer is adsorbed by vacuum generated in the suckers 17 to realize grabbing.
In the present embodiment, the suction cups 17 are preferably provided in 7.
In summary, when the mechanical arm of the present invention is used, the motor 1 rotates to provide power, and the power is reduced by the speed reducer 2 and then transmitted to the rotating shaft 5. In order to ensure the stability of the rotation of the rotating shaft 5, the power input end of the rotating shaft 5 is provided with a coupling 4 and is supported inside the support 3 through a bearing 6. The rotating shaft 5 is fixedly connected with the swing arm 9, so that the swing arm 9 is driven to rotate in the horizontal plane; the tail end of the swing arm 9 is fixedly connected with a cylinder body 11, and a sucker mounting plate 16 and a sucker 17 are arranged below the cylinder body 11. The cylinder rod 12 slides up and down in the cylinder block 11, so as to drive the sucker 17 to move up and down, and a universal component is arranged between the sucker mounting plate 16 and the cylinder rod 12 in order to ensure the stability of the sucker 17 during adsorption. When sucking disc 17 was located the wafer top, cylinder rod 12 slided downwards to drive sucking disc 17 downstream, and then snatch the wafer, then cylinder rod 12 shifts up, drives sucking disc 17 and shifts up, and motor 1 drives pivot 5 and rotates after that, thereby drives swing arm 9 rotatory, makes sucking disc 17 move the top of another station. Finally, the air cylinder rod 12 moves downwards to drive the suction cup 17 to move downwards, so that the wafer is placed on the operating platform of another station, and the transfer process of the wafer from one station to another station is completed.
In one embodiment of the present invention, a wax applicator is provided. In this embodiment, the wax attaching machine includes the mechanical arm in each of the above embodiments, as shown in fig. 4, the wax attaching machine further includes: the device comprises an upper frame 20, a lower frame 21, a wafer loading device 22, a wax dropping device 23, a wax dropping disc 24, a heating disc 25 and a pressure head 26.
The upper frame 20 is arranged on the upper portion of the lower frame 21, the wafer feeding device 22, the wax dropping disc 24 and the heating disc 25 are all located on the working table surface of the lower frame 21, the wax dropping disc 24 is located in the middle, and the heating discs 25 are respectively arranged on two sides of the wax dropping disc 24.
In the above embodiment, the wafer loading device 22 is configured as a drawer type, the wafer placing tray 27 is disposed inside the drawer type, and the wafer placing tray 27 is provided with circular grooves having the same number as that of the suction cups 17 for placing wafers. An opening is formed in the bottom of the side of the upper frame 20, and the drawer-type wafer loading device 22 is pulled out from the opening to load the wafer.
In the above embodiment, the heating plate 25 and the wax dropping plate 24 are both ceramic plates.
In summary, when the wax-pasting machine of the present invention is used, the wafer-loading device 22 is pulled out, the wafer is placed on the wafer-placing tray 27, and then the wafer-loading device 22 is pushed in; the wax dropping device 23 rotates to the upper part of the wax dropping disc 24 to perform wax dropping operation; then the sucking disc 17 of the mechanical arm moves to the upper part of the wafer placing disc 27, the air cylinder rod 12 slides downwards to drive the sucking disc 17 to descend, the inside of the sucking disc 17 sucks the wafer through vacuum, the air cylinder rod 12 moves upwards, the motor 1 drives the swing arm 9 to rotate, the sucking disc 17 rotates to the upper part of the wax dropping disc 24, the air cylinder rod 12 descends slowly, the sucking disc 17 places the wafer on the wax dropping disc 24, after the bottom of the wafer is in full contact with wax, the wafer is conveyed to the heating disc 25, the heating disc 25 heats the wax, the pressing head 26 moves downwards to pressurize the wafer, the wax on the wafer is distributed more uniformly through pressurization, the positioning operation of the wafer is completed, the wafer is kept horizontal and is fixed firmly, and the positioning accuracy of the wafer before polishing is ensured.
Finally, it should be noted that: the above examples are only intended to illustrate the technical solution of the present invention, but not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.
Claims (10)
1. A robot arm, comprising:
the first end of the rotating mechanism is connected with a driving mechanism, and the driving mechanism drives the rotating mechanism to rotate in a horizontal plane;
the first end of the lifting mechanism is connected with the second end of the rotating mechanism, and the second end of the lifting mechanism is connected with the grabbing mechanism through a universal assembly;
the rotating mechanism and the lifting mechanism drive the grabbing mechanism to rotate and lift, and the universal assembly enables the grabbing mechanism to have grabbing stability.
2. A robotic arm as claimed in claim 1, in which the gimbal assembly comprises a transition plate (13), a gimbal adjustment head (14), a spring (15) and a link (18);
the end surface of one side of the transition plate (13) is connected with the second end of the lifting mechanism, the middle part of the end surface of the other side of the transition plate (13) is connected with the first end of the connecting piece (18) through the universal adjusting head (14), and the second end of the connecting piece (18) is connected with the grabbing mechanism;
the spring (15) is further arranged on the end face of one side of the transition plate (13), a screw is arranged at the bottom of the spring (15), and the screw is sequentially screwed into the transition plate (13) and the first end of the connecting piece (18); the distances between the suckers of the grabbing mechanism and the grabbed wafer are equal under the combined action of the elastic force of the spring (15) and the universal adjusting head (14).
3. A robot arm according to claim 2, characterized in that the spring force of the spring (15) is proportional to the amount of the screw.
4. A robotic arm as claimed in claim 1, in which the turning mechanism is connected to the lifting mechanism in an L-shaped configuration with reinforcing ribs (19) at the corners.
5. The mechanical arm according to claim 1, wherein the rotating mechanism comprises a support (3), a coupling (4), a rotating shaft (5), a bearing (6), a spacer bush (7) and a swinging arm (9);
the upper part of the support (3) is connected with the output end of the driving mechanism through the coupler (4);
the rotating shaft (5) is arranged inside the support (3) and is supported in the inner wall of the support (3) through two bearings (6), and the two bearings (6) are separated through the spacer bush (7);
the lower part of the rotating shaft (5) extends out of the support (3) to form an extending part, the extending part is connected with the first end of the swing arm (9), and the second end of the swing arm (9) serves as the second end of the rotating mechanism and is connected with the first end of the lifting mechanism.
6. A robot arm according to claim 1, wherein said lift mechanism comprises a cylinder block (11) and a cylinder rod (12);
the cylinder body (11) is fixed at the second end of the rotating mechanism through a fixing plate, and the tail end of the cylinder rod (12) is used as the second end of the lifting mechanism and is connected with the universal assembly;
the cylinder rod (12) slides up and down in the cylinder body (11) to drive the grabbing mechanism to move up and down.
7. The mechanical arm according to claim 6, wherein the lifting mechanism is provided in two; the two cylinder bodies (11) are arranged in parallel, and the tail ends of the two cylinder rods (12) are used as the second ends of the lifting mechanisms together.
8. A robotic arm as claimed in claim 1, in which the gripping means comprises a suction cup mounting plate (16) and a suction cup (17);
the top of sucking disc mounting disc (16) with universal component connects, the bottom of sucking disc mounting disc (16) evenly is provided with a plurality ofly sucking disc (17), through the wafer is adsorbed to the vacuum that sucking disc (17) inside produced, realizes snatching.
9. A wax-pasting machine, characterized by comprising the mechanical arm according to any one of claims 1 to 8, and an upper frame (20), a lower frame (21), a wafer loading device (22), a wax dripping device (23), a wax dripping disc (24), a heating disc (25) and a pressure head (26);
the upper rack (20) is arranged at the upper part of the lower rack (21), the wafer feeding device (22), the wax dripping disc (24) and the heating disc (25) are all positioned on the working table surface of the lower rack (21), the wax dripping disc (24) is positioned in the middle, and the heating discs (25) are respectively arranged at two sides of the wax dripping disc (24);
drip wax device (23), pressure head (26) and the arm is all installed in last frame (20), drip wax device (23) with the arm is located the middle part, pressure head (26) set up in both sides and are located directly over heating plate (25).
10. The wax pasting machine as claimed in claim 9, wherein the wafer loading device (22) is configured as a drawer type, a wafer placing tray (27) is arranged in the wafer loading device, and the wafer placing tray (27) is provided with a plurality of circular grooves which are the same as the sucking discs (17) and are used for placing wafers;
an opening is formed in the bottom of the side face of the upper rack (20), and the drawer type wafer feeding device (22) is pulled out from the opening to feed the wafer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210713668.5A CN115091360A (en) | 2022-06-22 | 2022-06-22 | Paste arm and wax subsides machine of wax machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210713668.5A CN115091360A (en) | 2022-06-22 | 2022-06-22 | Paste arm and wax subsides machine of wax machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN115091360A true CN115091360A (en) | 2022-09-23 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210713668.5A Pending CN115091360A (en) | 2022-06-22 | 2022-06-22 | Paste arm and wax subsides machine of wax machine |
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| CN (1) | CN115091360A (en) |
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| KR102120799B1 (en) * | 2020-02-21 | 2020-06-17 | 주식회사 우원기술 | Loading device for electrode plate for secondary battery |
| CN212372210U (en) * | 2020-05-19 | 2021-01-19 | 合肥伟特机电装备制造有限公司 | Self-adaptive material suction manipulator |
| CN214269316U (en) * | 2020-12-02 | 2021-09-24 | 长沙矿山研究院有限责任公司 | Self-adaptive sucking disc for uneven workpiece |
| CN216072032U (en) * | 2021-09-18 | 2022-03-18 | 厦门市未来亚特科技有限公司 | Feeding and discharging swinging device and equipment |
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Application publication date: 20220923 |