CN115046921A - Testing method and testing device for representing film adhesion of plastic optical element - Google Patents

Testing method and testing device for representing film adhesion of plastic optical element Download PDF

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Publication number
CN115046921A
CN115046921A CN202210962337.5A CN202210962337A CN115046921A CN 115046921 A CN115046921 A CN 115046921A CN 202210962337 A CN202210962337 A CN 202210962337A CN 115046921 A CN115046921 A CN 115046921A
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accompanying sheet
plating
plating accompanying
film layer
optical element
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CN115046921B (en
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刘浩
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Sichuan Zhizhen Precision Optics Co ltd
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Sichuan Zhizhen Optoelectronics Co ltd
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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N19/00Investigating materials by mechanical methods
    • G01N19/04Measuring adhesive force between materials, e.g. of sealing tape, of coating
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/17Systems in which incident light is modified in accordance with the properties of the material investigated
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N25/00Investigating or analyzing materials by the use of thermal means

Abstract

The invention belongs to the technical field of optical element performance test, and discloses a test method and a test device for representing the adhesive force of a plastic optical element film layer, wherein the test method for representing the adhesive force of the plastic optical element film layer comprises the following steps: providing a strip-shaped plating accompanying sheet which is made of the same material as the optical substrate to be characterized, wherein the plating accompanying sheet is provided with a film coating surface suitable for film coating; fixing one end of the plating accompanying sheet and suspending the other end of the plating accompanying sheet to enable the plating accompanying sheet to be in an overhanging state; a light source and a CCD signal collector are arranged above the plating accompanying sheet, and the CCD signal collector is positioned on a reflection path of light source light reflected by a film layer on the plating accompanying sheet. The invention can be applied to the evaluation and test of the film adhesion of plastic optical elements such as PC, PMMA and the like, provides a new evaluation visual angle for optical injection molding and coating processes, and is expected to reduce the occurrence of failure phenomena such as foaming, falling off and the like of a product film layer.

Description

Testing method and testing device for representing film adhesion of plastic optical element
Technical Field
The invention belongs to the technical field of optical element performance testing, and particularly relates to a testing method and a testing device for representing the adhesive force of a plastic optical element film layer.
Background
The plastic optical element is widely applied to optical systems such as smart phones and VR/AR. Film adhesion is a commonly used indicator for evaluating the performance of plastic optical elements. The film with poor adhesive force is easy to fall off and can not meet the use requirement. For example, the adhesion of the coating film on the acrylic is insufficient, and an additional hardened layer is usually needed for use.
Until now, there has been no direct quantitative characterization of film adhesion. Alternative characterization means are: the adhesive tape with certain viscosity is used for pulling the film, and if the film layer falls off, the adhesive force of the film is poor.
The adhesive force of the film is evaluated by the tape pulling method, although the cost is low, the precision is poor, and the guiding significance is difficult to provide for the regulation of the coating process. For example, if the change in the amount of charged oxygen affects the adhesion of the film, no conclusion can be drawn by the tape pulling method. The method for developing the method capable of measuring the film adhesion of the plastic element has guiding significance for characterizing the performance of the optical film, evaluating and improving the film coating process, can provide quantitative data support for the optical film coating of the plastic element, and is expected to promote the development and application of the plastic element.
Disclosure of Invention
The invention aims to provide a test method for representing the adhesive force of a plastic optical element film layer, which aims to solve the problem that the existing test method can not accurately and effectively represent the adhesive force of the film layer on the optical element; meanwhile, the invention also provides a testing device for representing the adhesive force of the plastic optical element film layer, and the testing device can implement the testing method and can achieve the testing conditions required by implementation.
In order to achieve the purpose, the invention adopts the following technical scheme:
in one aspect, a test method for characterizing adhesion of a film layer of a plastic optical element is provided, comprising the steps of:
providing a strip-shaped plating accompanying sheet which is the same as the optical substrate to be characterized in material, wherein the plating accompanying sheet is provided with a film coating surface suitable for film coating;
fixing one end of the plating accompanying sheet and suspending the other end of the plating accompanying sheet to enable the plating accompanying sheet to be in an overhanging state;
a light source and a CCD signal collector are arranged above the plating accompanying sheet, and the CCD signal collector is positioned on a reflection path of light source reflected by a film layer on the plating accompanying sheet;
recording the position of a reflection light spot on the CCD when no film is coated at an initial temperature, then coating a film layer to be characterized on a film coating surface of a plating accompanying sheet, gradually cooling the plating accompanying sheet, wherein the plating accompanying sheet shrinks, and when the film layer is cooled to generate bubbles or fall off, collecting light offset through a CCD signal collector;
and calculating the current stress sigma of the film layer according to the optical offset by using a Stoney formula, wherein the current stress sigma can be regarded as the adhesive force of the film layer on the plating accompanying sheet.
In a possible implementation, the Stoney formula is
Figure 38525DEST_PATH_IMAGE001
Wherein E is s Is Young's modulus, v, of the plated sheet s Is Poisson's ratio, t, of the accompanying plated sheet s Is the thickness of the substrate, t f The thickness of the film layer, L is the length of the plating accompanying sheet, h is the vertical distance between the CCD signal collector and the plating accompanying sheet, and w is the light offset of the CCD signal collector when the film layer has bubbles or falls off.
In a possible implementation mode, the plating assistant sheet has the same surface roughness as the optical element substrate, and the material of the plating assistant sheet is PMMA, PC or K26R.
In a possible implementation mode, the film coating surface of the plating accompanying sheet is polished, and the surface roughness of the plating accompanying sheet is less than 1 mu m.
On the other hand, the testing device for representing the adhesive force of the plastic optical element film layer is also provided, and the testing method for representing the adhesive force of the plastic optical element film layer based on any one technical scheme comprises a strip-shaped plating accompanying sheet and a positioning seat;
the positioning seat is arranged on a detection plane and used for fixing one end of the plating accompanying sheet so that the other end of the plating accompanying sheet is suspended, the plating accompanying sheet is provided with a film coating surface suitable for coating, and the film coating surface is used for coating a film layer to be characterized; a light source and a CCD signal collector are arranged above the detection plane, and the light source and the signal collector are arranged oppositely and are respectively positioned at two sides above the plating accompanying sheet; a cooling device is arranged at the bottom of the detection plane and used for cooling the plating accompanying sheet;
the CCD signal collector and the cooling device are electrically connected with a computer through a collecting card.
In a possible implementation mode, the positioning seat is provided with a vertical clamping groove, a clamping block is connected in the clamping groove in a sliding mode, the top of the clamping block is connected with the top of the clamping groove through a spring, and a clamping space capable of clamping one end of the plating accompanying sheet is formed between the bottom of the clamping block and the bottom of the clamping groove.
In a possible implementation manner, the testing device further comprises a heating seat, the heating seat is provided with a groove-shaped mounting part and a heating part detachably connected to the bottom of the mounting part, and the inner bottom surface of the mounting part is the detection plane; the bottom of heating portion can be dismantled and be connected with heat sink.
In a possible implementation manner, the cooling device comprises a gas pipeline coiled at the bottom of the heating part, one end of the gas pipeline is connected with a liquid nitrogen source through a flow regulating valve, and the other end of the gas pipeline is connected with an air outlet; the heating part and the flow regulating valve are electrically connected with the computer.
In a possible implementation mode, a temperature probe is arranged in the installation part and electrically connected with the computer through the acquisition card.
Compared with the prior art, the invention has the following beneficial effects:
the testing method for representing the film adhesion of the plastic optical element can be suitable for evaluating and testing the film adhesion of plastic optical elements such as PC, PMMA and the like, provides a new evaluation visual angle for optical injection molding and coating processes, and is expected to reduce the occurrence of failure phenomena such as foaming, falling off and the like of a product film.
And the film-plated accompanying plating piece can contract through cooling in a cantilever state, and can obtain the light deflection amount after the film is deformed under the cooperation of a CCD signal collector, so that the quantitative data of the current stress sigma of the film can be obtained according to the light deflection amount, the adhesive force of the film can be represented, and the test method can enable the representation data to be more accurate and effective and also enable the test to be more standard.
The testing device for representing the film adhesion of the plastic optical element can test the plating accompanying sheet in an overhanging state through the positioning seat, can provide a cooling effect, can obtain the optical offset by matching with the light source and the CCD signal collector, can be adjusted and controlled through a computer, and can finally obtain data representing the adhesion of the film on the plating accompanying sheet, and has the advantages of simple structure and reasonable design.
Drawings
FIG. 1 is a schematic structural diagram of a testing apparatus for characterizing adhesion of a plastic optical element film layer according to an embodiment of the present disclosure at a first viewing angle;
FIG. 2 is a schematic structural diagram of a testing apparatus for characterizing adhesion of a plastic optical element film layer according to an embodiment of the present disclosure at a second viewing angle;
FIG. 3 is a schematic cross-sectional view of a testing apparatus for characterizing adhesion of a plastic optical element film according to an embodiment of the present disclosure;
fig. 4 is a schematic structural diagram of a positioning seat of a testing apparatus for characterizing adhesion of a plastic optical element film layer according to an embodiment of the present disclosure at a first viewing angle;
fig. 5 is a schematic structural diagram of a positioning seat of a testing apparatus for characterizing adhesion of a plastic optical element film layer according to an embodiment of the present disclosure at a second viewing angle;
FIG. 6 is a schematic diagram illustrating the calculation principle of Stoney formula of a testing method for characterizing the adhesion of a plastic optical element film layer according to an embodiment of the present application.
In the figure: 1-plating a piece; 2-a light source; 3-a CCD signal collector; 4-a computer; 5-a heating seat; 51-a mounting portion; 52-a heating part; 6-positioning seat; 61-a spring; 62-a clamping block; 63-a clamping groove; 7-temperature probe; 8-a gas pipeline; 9-flow regulating valve.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. The components of embodiments of the present invention generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations.
The invention is further described with reference to the following figures and specific embodiments.
The embodiment of the application provides a test method for representing the adhesive force of a plastic optical element film layer, which comprises the following steps:
step S1, providing a strip-shaped plating accompanying sheet with the same material as the optical substrate to be characterized, wherein the plating accompanying sheet has a plating surface suitable for plating.
The material of the plating accompanying sheet is the same as that of the optical substrate to be characterized, so that quantitative data of the film layer to be characterized can be more effectively and truly obtained, and the adhesive force characterization number which accords with the reality is obtained. The plating accompanying sheet is in a strip shape, the structure can be convenient for testing in an overhanging state, and meanwhile, the obtained quantitative data can meet the premise of a Stoney formula, namely the warping degree of the glass is far smaller than the length of the glass. The film coating surface of the plating accompanying sheet can be coated with a film layer, wherein the film layer is a film layer to be characterized and can be different types of films.
Step S2: one end of the plating accompanying sheet is fixed and the other end is suspended in the air, so that the plating accompanying sheet is in a cantilever state.
The structure of encorbelmenting is adopted to accompany the piece of plating, can make its unsettled one end test under being close natural state, and the relevant data that obtain is more accurate, also is convenient for carry out more natural shrink under the cooling state, has improved the accuracy of test. Of course, in the overhanging state, the plating accompanying sheet can be horizontally placed or vertically placed, and when the plating accompanying sheet is vertically placed, the light source and the CCD are also horizontally arranged.
And step S3, arranging a light source and a CCD signal collector above the plating assistant sheet, wherein the CCD signal collector is positioned on a reflection path of the light source reflected by the film layer on the plating assistant sheet.
Among these, the light emitted by a light source has three characteristics: approximately parallel light; an approximately linear light source; the light energy is sensed by the CCD signal collector. Typical light sources such as lasers and shaped white light sources, all light sources satisfying the above characteristics can be used in the test method. The CCD signal collector is mainly used for collecting light offset, and the position of the CCD signal collector is opposite to the light source, so that light reflected by the film layer can be accurately sensed. The CCD signal collector can be a linear array CCD.
And S4, recording the position of the reflection light spot on the CCD when no film is coated at the initial temperature, then coating a film layer to be characterized on the film coating surface of the plating accompanying sheet, gradually cooling the plating accompanying sheet, shrinking the plating accompanying sheet, and collecting the light offset through a CCD signal collector when the film layer is cooled to generate bubbles or fall off.
The step is a step of testing, the position of a reflection light spot on the CCD is recorded at the initial temperature when no film is coated, so as to obtain the initial offset w0 of a film layer on the accompanying coated sheet, then the film is coated, when the accompanying coated sheet is cooled, the accompanying coated sheet can shrink, and thus after the temperature is gradually cooled and bubbles appear or fall off, the CCD signal collector can sense the offset of light, and further the light offset w can be obtained.
And step S5, calculating the current stress sigma of the film layer according to the optical offset by using a Stoney formula, wherein the current stress sigma can be regarded as the adhesive force of the film layer on the co-plated sheet.
The thermal expansion coefficient of the film layer is far smaller than that of the plating accompanying sheet, so the warping degree of the plating accompanying sheet is increased, the light deflection amount is also changed, namely, the extrusion force to the film is increased. When the film layer is foamed or falls off, the light offset of the CCD is recorded, and the light offset can be favorable for calculating the extrusion stress applied to the film layer by the cantilever beam, namely the current stress sigma, so that the film can be regarded as the adhesive force of the film on the plating assistant sheet. When the material and the forming condition of the plating accompanying sheet are selected, the material and the forming condition are kept consistent with the plastic sample to be detected, and the adhesive force of the film layer on the plastic element can be characterized.
Through the technical scheme, in the initial state, light emitted by the light source irradiates to the position near the center of the CCD signal collector after being reflected by the plating accompanying sheet, and after being coated and cooled, the plating accompanying sheet is bent under the stress action of the film layer, and the reflected light can deviate. The reflected light is shifted to the left or right depending on whether the film stress is compressive or tensile. The CCD signal collector reads the deviation of the reflected light beam, and then the stress of the current film layer can be calculated according to the light deviation through a Stoney formula, so that the current stress sigma of the film layer can be further obtained through mechanical selection, and the stress can be regarded as the adhesive force of the film layer on the plating assistant sheet.
In one embodiment, as shown in FIG. 6, the Stoney equation is
Figure 649635DEST_PATH_IMAGE001
(ii) a Wherein Es is Young's modulus of the plating-accompanying sheet, v s Is Poisson's ratio, t, of the accompanying plated sheet s Is the thickness of the substrate, t f The thickness of the film layer, L is the length of the plating accompanying sheet, h is the vertical distance between the CCD signal collector and the plating accompanying sheet, and w is the light offset of the CCD signal collector when the film layer has bubbles or falls off.
After knowing the dimensional data and performance data of the coslated sheet, the current stress σ can be calculated by such Stoney formula. The above formula is a modification of the original Stoney formula, and the conditions are as follows: the warping degree of the plating accompanying sheet is far less than the length of the plating accompanying sheet.
Further, in order to obtain quantitative data more in line with the actual situation, the plating-accompanying sheet has the same surface roughness as the optical element substrate, and the material of the plating-accompanying sheet is PMMA, PC or K26R.
Specifically, the film coating surface of the plating accompanying sheet is polished, and the surface roughness of the plating accompanying sheet is less than 1 μm. Polishing the upper surface of the plating accompanying sheet, wherein the surface roughness is less than 1 μm, the length is far greater than the width, and the width is far greater than the thickness, so that a plating surface suitable for plating is formed on the upper surface of the plating accompanying sheet. The typical dimension of the plating accompanying sheet to be measured is 100 multiplied by 10 multiplied by 0.5mm, the material is PMMA, the upper surface is polished, the roughness is about 100nm, and the plating accompanying sheet is used as a thin film to be characterized.
The stress when the film falls off can be regarded as the adhesive force data of the characterization film on the accompanying plating sheet.
The test method for representing the film adhesion of the plastic optical element also has the following advantages:
1. by adopting the test method, the adhesive force of the optical film on the plastic optical element can be quantitatively measured;
2. adopting liquid nitrogen gasification to form a low-temperature condition, and cooling the optical element;
3. the heating plate and the cooling pipeline are simultaneously acted, so that the cooling amplitude is adjusted;
4. the characteristic that the thermal expansion coefficient of the plastic optical substrate is far larger than that of the film is utilized, and extrusion force is applied to the film through cooling;
5. the adoption of the cantilever beam-shaped plating piece can convert the extrusion force into macroscopic visible warping degree;
6. detecting the deviation of light by using a linear array CCD (charge coupled device), and quantitatively representing the change of the warping degree of the substrate;
7. the CCD signals are collected in real time, and the change of the extrusion force of the film along with the temperature can be observed in real time;
8. by applying the line light source, light deviation caused by warping of the plating accompanying sheet in the width direction can be tolerated.
Referring to fig. 1 to 5, an embodiment of the present application further provides a device for testing an adhesion property of a plastic optical element film, and a method for testing an adhesion property of a plastic optical element film based on the foregoing technical solution includes a strip-shaped plating sheet 1 and a positioning seat 6. The positioning seat 6 is arranged on a detection plane, the positioning seat 6 is used for fixing one end of the plating accompanying sheet 1 so as to enable the other end of the plating accompanying sheet 1 to be suspended, the plating accompanying sheet 1 is provided with a film coating surface suitable for film coating, and the film coating surface is used for coating a film layer to be characterized; a light source 2 and a CCD signal collector 3 are arranged above the detection plane, and the light source 2 and the signal collector are arranged oppositely and are respectively positioned at two sides above the plating accompanying sheet 1; a cooling device is arranged at the bottom of the detection plane and used for cooling the plating accompanying sheet 1; the CCD signal collector 3 and the cooling device are electrically connected with a computer 4 through a collecting card.
Wherein, the positioning seat 6 sets up on detecting the plane, and it can fix the one end of accompanying the piece 1 of plating, and the other end is then unsettled to this can make and accompany the piece 1 of plating to detect with the structure of encorbelmenting. The heat sink is used for making to accompany and plates 1 and cool down, and the cooling is the non-contact cooling, cools down through the environment to accompanying and plating 1 periphery promptly, can make through the heat sink accompany and plate 1 shrink, and then makes its angularity increase, and the light deflection volume changes promptly. The computer 4 can control the CCD signal collector 3 and the cooling device to more automatically execute the testing steps, and the computer 4 can perform corresponding calculation according to a preset mathematical calculation model, so that a corresponding calculation result can be automatically obtained.
In one embodiment, the positioning seat 6 has a vertical clamping groove 63, a clamping block 62 is slidably connected in the clamping groove 63, the top of the clamping block 62 is connected with the top of the clamping groove 63 through a spring 61, and a clamping space capable of clamping one end of the plating assistant sheet 1 is formed between the bottom of the clamping block 62 and the bottom of the clamping groove 63.
The clamping block 62 of the positioning seat 6 can slide up and down, and one end of the plating accompanying sheet 1 placed in the clamping space can be pressed and held through the spring 61, so that the plating accompanying sheet 1 can be fixed, and the plate can be conveniently disassembled and assembled, and is more convenient.
Further, in order to better control the cooling amplitude, the testing device further comprises a heating seat 5, the heating seat 5 is provided with a groove-shaped mounting part 51 and a heating part 52 detachably connected to the bottom of the mounting part 51, and the inner bottom surface of the mounting part 51 is the detection plane; the bottom of the heating part 52 is detachably connected with the cooling device. The installation part 51 of the heating seat 5 is groove-shaped, a positioning seat can be arranged in the installation part 51 for testing, a groove is arranged at the inner bottom of the installation part 51, and the groove can be convenient for the disassembly and the assembly of the positioning seat 6 and keep the same position. Heating portion 52 at the bottom of heating seat 5 can be dismantled to the position of heat sink and heating portion 52 is changed according to actual demand, and is more nimble. After the heating part 52 is electrified, the whole heating seat 5 is heated, and the heating seat 5 is made of metal materials, so that heat diffusion is facilitated; the body of heated portion 52 is a resistive wire, PTC resistor, or other substance capable of converting electrical energy to thermal energy.
In order to realize better cooling, further, the cooling device comprises a gas pipeline 8 coiled at the bottom of the heating part 52, one end of the gas pipeline 8 is connected with a liquid nitrogen source through a flow regulating valve 9, and the other end of the gas pipeline 8 is connected with an air outlet; the heating unit 52 and the flow regulating valve 9 are electrically connected to the computer 4.
Thus, the liquid nitrogen source can be contacted with the gas pipeline 8 arranged at the bottom of the heating part 52 through the disc, so that the liquid nitrogen source can be conveniently conducted and cooled through the heating part 52, or can be directly cooled after the positions of the liquid nitrogen source and the heating part 52 are changed, and the liquid nitrogen source has low temperature, so that the cooling effect is better, and the nitrogen absorbing heat after being cooled can be discharged through the air outlet, and the nitrogen can be further utilized. The flow regulating valve 9 can conveniently control the entering amount of liquid nitrogen so as to accurately regulate the cooling amplitude.
In a specific implementation process, a temperature probe 7 is arranged in the mounting portion 51, and the temperature probe 7 is electrically connected with the computer 4 through a collection card. The temperature probe 7 can collect the temperature in the mounting part 51 of the heating base 5, which is the temperature to be tested, so that the temperature can be controlled by the cooling device or the heating part 52 after being known.
The working principle of the testing device for the film adhesion of the characterization plastic optical element is as follows:
1. selecting the same material as the plastic element to be tested, and preparing a plating accompanying sheet 1 according to a certain size and a forming process;
2. adopting a film coating process to be characterized to coat a film on the front surface of the plating assistant sheet 1;
3. fixing the plated accompanied plating sheet 1 on a positioning seat 6, and placing the positioning seat 6 in a heating seat 5;
4. turning on the light source 2, and receiving reflected light of the plating accompanying sheet 1 by the CCD signal collector; finely adjusting the relative position of the light source 2 and the CCD to enable the reflected light to irradiate the central area of the CCD;
5. adjusting the intensity of the light source 2 to enable the CCD to detect a signal with proper light intensity;
6. opening a flow regulating valve 9 of a gas pipeline 8, supplying power to the heating seat 5, slowly reducing the temperature detected by the temperature probe 7, and simultaneously recording the temperature and a CCD signal;
7. increasing the flow of the flow regulating valve 9, reducing the heating voltage until the film layer foams or falls off, and recording the CCD signal at the moment;
8. and calculating the current stress of the film layer according to the CCD offset, wherein the current stress can be regarded as the adhesive force of the film.
Finally, it should be noted that: the above description is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims (9)

1. A test method for representing the adhesive force of a plastic optical element film layer is characterized by comprising the following steps: the method comprises the following steps:
providing a strip-shaped plating accompanying sheet which is made of the same material as the optical substrate to be characterized, wherein the plating accompanying sheet is provided with a film coating surface suitable for film coating;
fixing one end of the plating accompanying sheet and suspending the other end of the plating accompanying sheet to enable the plating accompanying sheet to be in an overhanging state;
a light source and a CCD signal collector are arranged above the plating accompanying sheet, and the CCD signal collector is positioned on a reflection path of light source light reflected by a film layer on the plating accompanying sheet;
recording the position of a reflection light spot on the CCD when no film is coated at an initial temperature, then coating a film layer to be characterized on a film coating surface of a plating accompanying sheet, gradually cooling the plating accompanying sheet, wherein the plating accompanying sheet shrinks, and when the film layer is cooled to generate bubbles or fall off, collecting light offset through a CCD signal collector;
and calculating the current stress sigma of the film layer according to the optical offset by using a Stoney formula, wherein the current stress sigma can be regarded as the adhesive force of the film layer on the plating accompanying sheet.
2. A test method for characterizing adhesion of a plastic optical element film according to claim 1, wherein: the Stoney formula is
Figure 970418DEST_PATH_IMAGE001
Wherein E is s Is Young's modulus, v, of the plated sheet s Is Poisson's ratio, t, of the accompanying plated sheet s Is the thickness of the substrate, t f The thickness of the film layer, L is the length of the plating accompanying sheet, h is the vertical distance between the CCD signal collector and the plating accompanying sheet, and w is the light offset of the CCD signal collector when the film layer has bubbles or falls off.
3. A test method for characterizing adhesion of a plastic optical element film according to claim 1, wherein: the plating accompanying sheet has the same surface roughness as the optical element substrate, and the material of the plating accompanying sheet is PMMA, PC or K26R.
4. A test method for characterizing adhesion of a plastic optical element film according to claim 2, wherein: and the film coating surface of the plating accompanying sheet is polished, and the surface roughness of the film coating surface is less than 1 mu m.
5. A test device for characterizing the adhesion of a plastic optical element film layer is based on the test method for characterizing the adhesion of a plastic optical element film layer of any one of claims 1 to 4, and is characterized in that: comprises a strip-shaped plating piece and a positioning seat;
the positioning seat is arranged on a detection plane and used for fixing one end of the plating accompanying sheet so that the other end of the plating accompanying sheet is suspended, the plating accompanying sheet is provided with a film coating surface suitable for coating, and the film coating surface is used for coating a film layer to be characterized; a light source and a CCD signal collector are arranged above the detection plane, and the light source and the signal collector are arranged oppositely and are respectively positioned at two sides above the plating accompanying sheet; a cooling device is arranged at the bottom of the detection plane and used for cooling the plating accompanying sheet;
the CCD signal collector and the cooling device are electrically connected with a computer through a collecting card.
6. The test device for characterizing adhesion of a plastic optical element film according to claim 5, wherein: the positioning seat is provided with a vertical clamping groove, a clamping block is connected in the clamping groove in a sliding mode, the top of the clamping block is connected with the top of the clamping groove through a spring, and a clamping space capable of clamping one end of the plating accompanying sheet is formed between the bottom of the clamping block and the bottom of the clamping groove.
7. The apparatus of claim 6, wherein the test apparatus comprises: the testing device also comprises a heating seat, the heating seat is provided with a groove-shaped mounting part and a heating part detachably connected to the bottom of the mounting part, and the inner bottom surface of the mounting part is the detection plane; the bottom of heating portion can be dismantled and be connected with heat sink.
8. The test device for characterizing adhesion of a plastic optical element film according to claim 7, wherein: the cooling device comprises a gas pipeline coiled at the bottom of the heating part, one end of the gas pipeline is connected with a liquid nitrogen source through a flow regulating valve, and the other end of the gas pipeline is connected with an air outlet; the heating part and the flow regulating valve are electrically connected with the computer.
9. The test device for characterizing adhesion of a plastic optical element film according to claim 8, wherein: and a temperature probe is arranged in the mounting part and is electrically connected with the computer through the acquisition card.
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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115060582A (en) * 2022-08-11 2022-09-16 四川至臻光电有限公司 Test method and test device for measuring tensile strength of film
CN116770257A (en) * 2023-06-25 2023-09-19 广州市博泰光学科技有限公司 Optical lens coating film manufacturing system and manufacturing method thereof

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