CN115039340A - 弹性波装置 - Google Patents

弹性波装置 Download PDF

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Publication number
CN115039340A
CN115039340A CN202180012374.3A CN202180012374A CN115039340A CN 115039340 A CN115039340 A CN 115039340A CN 202180012374 A CN202180012374 A CN 202180012374A CN 115039340 A CN115039340 A CN 115039340A
Authority
CN
China
Prior art keywords
angle
piezoelectric film
film
silicon layer
intermediate layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202180012374.3A
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English (en)
Chinese (zh)
Inventor
大门克也
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Publication of CN115039340A publication Critical patent/CN115039340A/zh
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/25—Constructional features of resonators using surface acoustic waves
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02535—Details of surface acoustic wave devices
    • H03H9/02543—Characteristics of substrate, e.g. cutting angles
    • H03H9/02574—Characteristics of substrate, e.g. cutting angles of combined substrates, multilayered substrates, piezoelectrical layers on not-piezoelectrical substrate
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02535—Details of surface acoustic wave devices
    • H03H9/02543—Characteristics of substrate, e.g. cutting angles
    • H03H9/02559—Characteristics of substrate, e.g. cutting angles of lithium niobate or lithium-tantalate substrates
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/125—Driving means, e.g. electrodes, coils
    • H03H9/145—Driving means, e.g. electrodes, coils for networks using surface acoustic waves
    • H03H9/14538—Formation
    • H03H9/14541—Multilayer finger or busbar electrode
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02535—Details of surface acoustic wave devices
    • H03H9/02992—Details of bus bars, contact pads or other electrical connections for finger electrodes

Landscapes

  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
CN202180012374.3A 2020-02-17 2021-02-16 弹性波装置 Pending CN115039340A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020024257 2020-02-17
JP2020-024257 2020-02-17
PCT/JP2021/005611 WO2021166875A1 (ja) 2020-02-17 2021-02-16 弾性波装置

Publications (1)

Publication Number Publication Date
CN115039340A true CN115039340A (zh) 2022-09-09

Family

ID=77392082

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202180012374.3A Pending CN115039340A (zh) 2020-02-17 2021-02-16 弹性波装置

Country Status (4)

Country Link
US (1) US12445108B2 (https=)
JP (1) JP7355210B2 (https=)
CN (1) CN115039340A (https=)
WO (1) WO2021166875A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN118432574A (zh) * 2024-05-21 2024-08-02 无锡市好达电子股份有限公司 纵波型漏声表面波谐振器、滤波器及多工器

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024154491A1 (ja) * 2023-01-18 2024-07-25 株式会社村田製作所 弾性波装置及び複合フィルタ装置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101018046A (zh) * 2006-02-06 2007-08-15 精工爱普生株式会社 声表面波装置及电子设备
KR20090016960A (ko) * 2007-08-13 2009-02-18 국방과학연구소 표면 탄성파를 이용한 자이로스코프
CN101889347A (zh) * 2007-11-22 2010-11-17 罗姆股份有限公司 ZnO系半导体元件
JP2019106698A (ja) * 2017-12-12 2019-06-27 株式会社村田製作所 電子部品モジュール

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006217281A (ja) 2005-02-03 2006-08-17 Toshiba Corp 薄膜バルク音響装置の製造方法
CN106209007B (zh) 2010-12-24 2019-07-05 株式会社村田制作所 弹性波装置
JP6621384B2 (ja) 2016-07-20 2019-12-18 信越化学工業株式会社 弾性表面波デバイス用複合基板の製造方法
CN110249527B (zh) * 2017-02-14 2024-01-23 京瓷株式会社 弹性波元件
CN110352557B (zh) 2017-03-09 2023-02-24 株式会社村田制作所 弹性波装置
JP6954378B2 (ja) 2018-01-12 2021-10-27 株式会社村田製作所 弾性波装置、マルチプレクサ、高周波フロントエンド回路及び通信装置
KR102722445B1 (ko) * 2019-04-08 2024-10-25 가부시키가이샤 무라타 세이사쿠쇼 탄성파 장치 및 멀티플렉서
JP7424473B2 (ja) * 2020-04-17 2024-01-30 株式会社村田製作所 弾性波装置
CN116601871A (zh) * 2020-10-06 2023-08-15 株式会社村田制作所 弹性波装置
WO2022168796A1 (ja) * 2021-02-04 2022-08-11 株式会社村田製作所 弾性波装置
CN116584041A (zh) * 2021-02-04 2023-08-11 株式会社村田制作所 弹性波装置
WO2022168798A1 (ja) * 2021-02-04 2022-08-11 株式会社村田製作所 弾性波装置
WO2022168799A1 (ja) * 2021-02-04 2022-08-11 株式会社村田製作所 弾性波装置
JP2025015129A (ja) * 2023-07-20 2025-01-30 株式会社村田製作所 弾性波装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101018046A (zh) * 2006-02-06 2007-08-15 精工爱普生株式会社 声表面波装置及电子设备
KR20090016960A (ko) * 2007-08-13 2009-02-18 국방과학연구소 표면 탄성파를 이용한 자이로스코프
CN101889347A (zh) * 2007-11-22 2010-11-17 罗姆股份有限公司 ZnO系半导体元件
JP2019106698A (ja) * 2017-12-12 2019-06-27 株式会社村田製作所 電子部品モジュール

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN118432574A (zh) * 2024-05-21 2024-08-02 无锡市好达电子股份有限公司 纵波型漏声表面波谐振器、滤波器及多工器

Also Published As

Publication number Publication date
US20220385271A1 (en) 2022-12-01
US12445108B2 (en) 2025-10-14
WO2021166875A1 (ja) 2021-08-26
JP7355210B2 (ja) 2023-10-03
JPWO2021166875A1 (https=) 2021-08-26

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