JPWO2021166875A1 - - Google Patents

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Publication number
JPWO2021166875A1
JPWO2021166875A1 JP2022501889A JP2022501889A JPWO2021166875A1 JP WO2021166875 A1 JPWO2021166875 A1 JP WO2021166875A1 JP 2022501889 A JP2022501889 A JP 2022501889A JP 2022501889 A JP2022501889 A JP 2022501889A JP WO2021166875 A1 JPWO2021166875 A1 JP WO2021166875A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2022501889A
Other languages
Japanese (ja)
Other versions
JP7355210B2 (ja
JPWO2021166875A5 (https=
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed filed Critical
Publication of JPWO2021166875A1 publication Critical patent/JPWO2021166875A1/ja
Publication of JPWO2021166875A5 publication Critical patent/JPWO2021166875A5/ja
Application granted granted Critical
Publication of JP7355210B2 publication Critical patent/JP7355210B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/25—Constructional features of resonators using surface acoustic waves
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02535—Details of surface acoustic wave devices
    • H03H9/02543—Characteristics of substrate, e.g. cutting angles
    • H03H9/02574—Characteristics of substrate, e.g. cutting angles of combined substrates, multilayered substrates, piezoelectrical layers on not-piezoelectrical substrate
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02535—Details of surface acoustic wave devices
    • H03H9/02543—Characteristics of substrate, e.g. cutting angles
    • H03H9/02559—Characteristics of substrate, e.g. cutting angles of lithium niobate or lithium-tantalate substrates
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/125—Driving means, e.g. electrodes, coils
    • H03H9/145—Driving means, e.g. electrodes, coils for networks using surface acoustic waves
    • H03H9/14538—Formation
    • H03H9/14541—Multilayer finger or busbar electrode
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02535—Details of surface acoustic wave devices
    • H03H9/02992—Details of bus bars, contact pads or other electrical connections for finger electrodes

Landscapes

  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
JP2022501889A 2020-02-17 2021-02-16 弾性波装置 Active JP7355210B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020024257 2020-02-17
JP2020024257 2020-02-17
PCT/JP2021/005611 WO2021166875A1 (ja) 2020-02-17 2021-02-16 弾性波装置

Publications (3)

Publication Number Publication Date
JPWO2021166875A1 true JPWO2021166875A1 (https=) 2021-08-26
JPWO2021166875A5 JPWO2021166875A5 (https=) 2022-08-17
JP7355210B2 JP7355210B2 (ja) 2023-10-03

Family

ID=77392082

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022501889A Active JP7355210B2 (ja) 2020-02-17 2021-02-16 弾性波装置

Country Status (4)

Country Link
US (1) US12445108B2 (https=)
JP (1) JP7355210B2 (https=)
CN (1) CN115039340A (https=)
WO (1) WO2021166875A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN120476549A (zh) * 2023-01-18 2025-08-12 株式会社村田制作所 弹性波装置以及复合滤波器装置
CN118432574A (zh) * 2024-05-21 2024-08-02 无锡市好达电子股份有限公司 纵波型漏声表面波谐振器、滤波器及多工器

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006217281A (ja) * 2005-02-03 2006-08-17 Toshiba Corp 薄膜バルク音響装置の製造方法
WO2018016169A1 (ja) * 2016-07-20 2018-01-25 信越化学工業株式会社 弾性表面波デバイス用複合基板の製造方法
WO2018151147A1 (ja) * 2017-02-14 2018-08-23 京セラ株式会社 弾性波素子
WO2018163805A1 (ja) * 2017-03-09 2018-09-13 株式会社村田製作所 弾性波装置、高周波フロントエンド回路及び通信装置
WO2019138810A1 (ja) * 2018-01-12 2019-07-18 株式会社村田製作所 弾性波装置、マルチプレクサ、高周波フロントエンド回路及び通信装置

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4412292B2 (ja) * 2006-02-06 2010-02-10 セイコーエプソン株式会社 弾性表面波装置および電子機器
KR20090016960A (ko) * 2007-08-13 2009-02-18 국방과학연구소 표면 탄성파를 이용한 자이로스코프
JP5392885B2 (ja) * 2007-11-22 2014-01-22 ローム株式会社 ＺｎＯ系半導体素子
CN103262410B (zh) 2010-12-24 2016-08-10 株式会社村田制作所 弹性波装置及其制造方法
JP6950659B2 (ja) * 2017-12-12 2021-10-13 株式会社村田製作所 電子部品モジュール
KR102722445B1 (ko) * 2019-04-08 2024-10-25 가부시키가이샤 무라타 세이사쿠쇼 탄성파 장치 및 멀티플렉서
WO2021210551A1 (ja) * 2020-04-17 2021-10-21 株式会社村田製作所 弾性波装置
WO2022075138A1 (ja) * 2020-10-06 2022-04-14 株式会社村田製作所 弾性波装置
CN116584039A (zh) * 2021-02-04 2023-08-11 株式会社村田制作所 弹性波装置
CN116584040A (zh) * 2021-02-04 2023-08-11 株式会社村田制作所 弹性波装置
WO2022168797A1 (ja) * 2021-02-04 2022-08-11 株式会社村田製作所 弾性波装置
WO2022168799A1 (ja) * 2021-02-04 2022-08-11 株式会社村田製作所 弾性波装置
JP2025015129A (ja) * 2023-07-20 2025-01-30 株式会社村田製作所 弾性波装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006217281A (ja) * 2005-02-03 2006-08-17 Toshiba Corp 薄膜バルク音響装置の製造方法
WO2018016169A1 (ja) * 2016-07-20 2018-01-25 信越化学工業株式会社 弾性表面波デバイス用複合基板の製造方法
WO2018151147A1 (ja) * 2017-02-14 2018-08-23 京セラ株式会社 弾性波素子
WO2018163805A1 (ja) * 2017-03-09 2018-09-13 株式会社村田製作所 弾性波装置、高周波フロントエンド回路及び通信装置
WO2019138810A1 (ja) * 2018-01-12 2019-07-18 株式会社村田製作所 弾性波装置、マルチプレクサ、高周波フロントエンド回路及び通信装置

Also Published As

Publication number Publication date
JP7355210B2 (ja) 2023-10-03
US12445108B2 (en) 2025-10-14
WO2021166875A1 (ja) 2021-08-26
US20220385271A1 (en) 2022-12-01
CN115039340A (zh) 2022-09-09

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