CN115036879A - 一种微型气密封四芯端子 - Google Patents
一种微型气密封四芯端子 Download PDFInfo
- Publication number
- CN115036879A CN115036879A CN202210534130.8A CN202210534130A CN115036879A CN 115036879 A CN115036879 A CN 115036879A CN 202210534130 A CN202210534130 A CN 202210534130A CN 115036879 A CN115036879 A CN 115036879A
- Authority
- CN
- China
- Prior art keywords
- lead
- lead wires
- leads
- module
- glass
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011521 glass Substances 0.000 claims abstract description 36
- 239000012212 insulator Substances 0.000 claims abstract description 16
- 238000007789 sealing Methods 0.000 claims abstract description 13
- 238000003466 welding Methods 0.000 claims abstract description 9
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims abstract description 8
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 10
- 229910002804 graphite Inorganic materials 0.000 claims description 10
- 239000010439 graphite Substances 0.000 claims description 10
- 238000002844 melting Methods 0.000 claims description 2
- 230000008018 melting Effects 0.000 claims description 2
- 230000009286 beneficial effect Effects 0.000 abstract description 7
- 238000005245 sintering Methods 0.000 description 8
- 238000000034 method Methods 0.000 description 5
- 238000007747 plating Methods 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000008358 core component Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 230000003044 adaptive effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000000306 component Substances 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000006056 electrooxidation reaction Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000009827 uniform distribution Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02G—INSTALLATION OF ELECTRIC CABLES OR LINES, OR OF COMBINED OPTICAL AND ELECTRIC CABLES OR LINES
- H02G15/00—Cable fittings
- H02G15/013—Sealing means for cable inlets
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02G—INSTALLATION OF ELECTRIC CABLES OR LINES, OR OF COMBINED OPTICAL AND ELECTRIC CABLES OR LINES
- H02G3/00—Installations of electric cables or lines or protective tubing therefor in or on buildings, equivalent structures or vehicles
- H02G3/22—Installations of cables or lines through walls, floors or ceilings, e.g. into buildings
Landscapes
- Engineering & Computer Science (AREA)
- Architecture (AREA)
- Civil Engineering (AREA)
- Structural Engineering (AREA)
- Connections Arranged To Contact A Plurality Of Conductors (AREA)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202210534130.8A CN115036879A (zh) | 2022-05-17 | 2022-05-17 | 一种微型气密封四芯端子 |
PCT/CN2023/089734 WO2023221733A1 (fr) | 2022-05-17 | 2023-04-21 | Borne miniature étanche à l'air à quatre conducteurs |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202210534130.8A CN115036879A (zh) | 2022-05-17 | 2022-05-17 | 一种微型气密封四芯端子 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN115036879A true CN115036879A (zh) | 2022-09-09 |
Family
ID=83120777
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202210534130.8A Pending CN115036879A (zh) | 2022-05-17 | 2022-05-17 | 一种微型气密封四芯端子 |
Country Status (2)
Country | Link |
---|---|
CN (1) | CN115036879A (fr) |
WO (1) | WO2023221733A1 (fr) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2023221733A1 (fr) * | 2022-05-17 | 2023-11-23 | 泰州市航宇电器有限公司 | Borne miniature étanche à l'air à quatre conducteurs |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001093596A (ja) * | 1999-09-28 | 2001-04-06 | Nec Kansai Ltd | 気密端子 |
JP2005353291A (ja) * | 2004-06-08 | 2005-12-22 | Fuji Denka:Kk | 気密端子及びその製造方法 |
CN103985995A (zh) * | 2014-05-29 | 2014-08-13 | 泰州市航宇电器有限公司 | 一种用于金丝键合的超小型连接端子 |
JP2016178034A (ja) * | 2015-03-20 | 2016-10-06 | 株式会社フジ電科 | 気密端子の製造方法 |
CN112332140A (zh) * | 2020-10-30 | 2021-02-05 | 东南大学 | 玻璃封接多芯微波绝缘子的圆形装置及其制作方法 |
CN214754652U (zh) * | 2021-04-16 | 2021-11-16 | 深圳市宏钢机械设备有限公司 | 一种1x激光器封装管壳结构 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102007061175B3 (de) * | 2007-12-17 | 2009-08-27 | Schott Ag | Verfahren zur Herstellung einer elektrischen Durchführung |
CN104091787A (zh) * | 2014-06-13 | 2014-10-08 | 浙江长兴电子厂有限公司 | 一种金属封装外壳及其制备工艺 |
CN105428957B (zh) * | 2015-12-29 | 2018-06-26 | 泰州市航宇电器有限公司 | 一种可焊接混合金属封装外壳的制作方法 |
CN207166918U (zh) * | 2017-09-07 | 2018-03-30 | 合肥伊丰电子封装有限公司 | 一种精确控制金属封装外壳上引线的定位结构 |
CN115036879A (zh) * | 2022-05-17 | 2022-09-09 | 泰州市航宇电器有限公司 | 一种微型气密封四芯端子 |
-
2022
- 2022-05-17 CN CN202210534130.8A patent/CN115036879A/zh active Pending
-
2023
- 2023-04-21 WO PCT/CN2023/089734 patent/WO2023221733A1/fr unknown
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001093596A (ja) * | 1999-09-28 | 2001-04-06 | Nec Kansai Ltd | 気密端子 |
JP2005353291A (ja) * | 2004-06-08 | 2005-12-22 | Fuji Denka:Kk | 気密端子及びその製造方法 |
CN103985995A (zh) * | 2014-05-29 | 2014-08-13 | 泰州市航宇电器有限公司 | 一种用于金丝键合的超小型连接端子 |
JP2016178034A (ja) * | 2015-03-20 | 2016-10-06 | 株式会社フジ電科 | 気密端子の製造方法 |
CN112332140A (zh) * | 2020-10-30 | 2021-02-05 | 东南大学 | 玻璃封接多芯微波绝缘子的圆形装置及其制作方法 |
CN214754652U (zh) * | 2021-04-16 | 2021-11-16 | 深圳市宏钢机械设备有限公司 | 一种1x激光器封装管壳结构 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2023221733A1 (fr) * | 2022-05-17 | 2023-11-23 | 泰州市航宇电器有限公司 | Borne miniature étanche à l'air à quatre conducteurs |
Also Published As
Publication number | Publication date |
---|---|
WO2023221733A1 (fr) | 2023-11-23 |
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