CN115031509A - Lifting type semiconductor wafer drying device - Google Patents
Lifting type semiconductor wafer drying device Download PDFInfo
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- CN115031509A CN115031509A CN202210542479.6A CN202210542479A CN115031509A CN 115031509 A CN115031509 A CN 115031509A CN 202210542479 A CN202210542479 A CN 202210542479A CN 115031509 A CN115031509 A CN 115031509A
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 97
- 238000001035 drying Methods 0.000 title claims abstract description 77
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 53
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 claims abstract description 50
- 239000007788 liquid Substances 0.000 claims abstract description 37
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims abstract description 19
- 239000007921 spray Substances 0.000 claims abstract description 16
- 238000005507 spraying Methods 0.000 claims abstract description 15
- 230000007246 mechanism Effects 0.000 claims abstract description 8
- 229910052757 nitrogen Inorganic materials 0.000 claims abstract description 8
- 239000007789 gas Substances 0.000 claims abstract description 6
- 235000012431 wafers Nutrition 0.000 claims description 105
- 238000001514 detection method Methods 0.000 claims description 26
- 230000007547 defect Effects 0.000 claims description 24
- 238000003860 storage Methods 0.000 claims description 15
- 238000002347 injection Methods 0.000 claims description 11
- 239000007924 injection Substances 0.000 claims description 11
- 229910001873 dinitrogen Inorganic materials 0.000 claims description 3
- 230000003028 elevating effect Effects 0.000 claims 10
- 230000000694 effects Effects 0.000 abstract description 14
- 238000007689 inspection Methods 0.000 abstract description 8
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 7
- 229910052710 silicon Inorganic materials 0.000 description 7
- 239000010703 silicon Substances 0.000 description 7
- 239000013078 crystal Substances 0.000 description 5
- 238000000034 method Methods 0.000 description 4
- 238000005070 sampling Methods 0.000 description 4
- 238000004140 cleaning Methods 0.000 description 3
- 238000005192 partition Methods 0.000 description 2
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000001795 light effect Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Images
Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F26—DRYING
- F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
- F26B11/00—Machines or apparatus for drying solid materials or objects with movement which is non-progressive
- F26B11/18—Machines or apparatus for drying solid materials or objects with movement which is non-progressive on or in moving dishes, trays, pans, or other mainly-open receptacles
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F26—DRYING
- F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
- F26B25/00—Details of general application not covered by group F26B21/00 or F26B23/00
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F26—DRYING
- F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
- F26B25/00—Details of general application not covered by group F26B21/00 or F26B23/00
- F26B25/02—Applications of driving mechanisms, not covered by another subclass
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F26—DRYING
- F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
- F26B25/00—Details of general application not covered by group F26B21/00 or F26B23/00
- F26B25/06—Chambers, containers, or receptacles
- F26B25/14—Chambers, containers, receptacles of simple construction
- F26B25/18—Chambers, containers, receptacles of simple construction mainly open, e.g. dish, tray, pan, rack
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F26—DRYING
- F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
- F26B5/00—Drying solid materials or objects by processes not involving the application of heat
- F26B5/16—Drying solid materials or objects by processes not involving the application of heat by contact with sorbent bodies, e.g. absorbent mould; by admixture with sorbent materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Molecular Biology (AREA)
- Drying Of Solid Materials (AREA)
Abstract
The application discloses a lifting type semiconductor wafer drying device which comprises a case, a lifting unit, a loading unit, a liquid path unit and a spraying unit; the chassis comprises a vertical panel and a horizontal panel, wherein a display unit is arranged on the vertical panel, a rectangular opening is arranged on the horizontal panel, and a movable cover part and a cover part driving unit for driving the movable cover part are arranged on the horizontal panel; the drying space is arranged in the case, the water tank is arranged in the drying space, the top end of the water tank is provided with an overflow groove, and the liquid path unit can inject water into the water tank and can drain the water tank and the drying space; the lifting unit comprises a lifting driving mechanism and a lifting flower basket driven by the lifting driving mechanism; the spray unit is capable of spraying a gas containing isopropyl alcohol and nitrogen. The drying device of this application drying effect is good, and can realize drying effect's automated inspection.
Description
Technical Field
The application relates to the field of semiconductors, in particular to a lifting type semiconductor wafer drying device.
Background
Wafer refers to a silicon wafer used for making silicon semiconductor circuits, the starting material of which is silicon. And dissolving the high-purity polycrystalline silicon, doping the dissolved high-purity polycrystalline silicon into silicon crystal seed crystals, and slowly pulling out the silicon crystal seed crystals to form cylindrical monocrystalline silicon. After the silicon crystal bar is ground, polished and sliced, a silicon wafer, namely a wafer, is formed. The wafer is a basic material for producing the chip, the chip is undoubtedly the most advanced production and manufacturing process in the world at present, the production of the chip needs to make a large number of microelectronic elements on the wafer, various operations such as cleaning, drying, glue evening, developing and the like exist in the production process of the wafer, the operations need to be carried out repeatedly, the failure of any one operation can cause the production failure of the chip, therefore, the production of the chip has very high requirements on the preparation process, the consumption of the chip is very large, the effect of the process needs to be ensured, and the production efficiency needs to be ensured. The drying of the semiconductor wafer is also an important part of the drying, and some existing drying devices for semiconductor wafers may generate water marks on the surface of the wafer after drying, resulting in poor drying effect. And the drying effect needs manual detection after drying, and automatic detection cannot be realized.
Disclosure of Invention
The purpose of the invention is as follows: the application aims to overcome the defects of the prior art and provides a lifting type semiconductor wafer drying device.
The technical scheme is as follows: a lifting type semiconductor wafer drying device comprises a case, a lifting unit, a loading unit, a liquid path unit and a spraying unit; the chassis comprises a vertical panel and a horizontal panel, wherein the vertical panel is provided with a display unit and a vertical strip-shaped through groove, the horizontal panel is provided with a rectangular opening, and the horizontal panel is provided with a movable cover part and a cover part driving unit for driving the movable cover part; the drying device comprises a case, a loading unit and a liquid path unit, wherein the case is internally provided with a drying space, a water tank is arranged in the drying space, the loading unit comprises two bearing beams fixed in the water tank and a loading flower basket supported between the two bearing beams, the loading flower basket can bear a plurality of vertically arranged semiconductor wafers distributed at equal intervals, the top end of the water tank is provided with an overflow groove, the liquid path unit can inject water into the water tank, and can drain the water tank and the drying space; the lifting unit comprises a lifting driving mechanism and a lifting basket driven by the lifting driving mechanism, the lifting basket can bear a plurality of vertically placed semiconductor wafers distributed at equal intervals, the maximum number of the semiconductor wafers borne by the lifting basket is equal to the maximum number of the semiconductor wafers borne by the loading basket, and the lifting basket can ascend from the lower part of the loading basket and jack up all the semiconductor wafers at the loading basket so that the bottom ends of all the semiconductor wafers are higher than the top end of the water tank; the spray unit includes a plurality of spray heads installed at the movable cover portion, the spray heads being capable of spraying a gas containing isopropyl alcohol and nitrogen.
Furthermore, a positioning protrusion is arranged at the bearing cross beam, and a positioning hole matched with the positioning protrusion is arranged at the loading flower basket.
Thereby realizing better positioning of the bearing flower basket. The position of placing the bearing flower basket is more accurate.
Further, the upper surface of activity lid is fixed with the bar fixed block, lid drive unit including install in the motor cabinet of horizontal panel department, install in the lid driving motor of motor cabinet department and by lid driving motor driven lid lead screw, bar fixed block department have with lid lead screw complex screw channel, activity lid department has the bar spout, horizontal panel department have with bar spout complex bar slide rail.
Further, the lift unit include with the connecting rod unit that the flower basket of going up and down is connected, the elevator of being connected with the connecting rod unit, pass the vertical guide arm of elevator, pass the vertical lead screw of elevator, with the vertical lead screw complex vertical lead screw bearing and with vertical lead screw complex elevator motor, the elevator passes the vertical logical groove of bar, the elevator have with vertical guide arm complex smooth hole and with vertical lead screw complex screw hole, the connecting rod unit includes the first vertical connecting rod of being connected with the elevator, the vertical connecting rod of second of being connected with the flower basket of going up and down and connects the horizontal connecting rod between first vertical connecting rod and the vertical connecting rod of second.
Further, the liquid path unit comprises a liquid storage tank, a liquid injection hole and a first liquid discharge hole which are positioned at the bottom of the water tank, a second liquid discharge hole which is positioned at the bottom of the drying space, and a liquid injection pump which can inject liquid in the liquid storage tank into the water tank through the liquid injection hole.
Further, the spraying unit comprises an isopropanol storage container and a nitrogen storage container, and the plurality of spraying heads at the movable cover part are distributed in a rectangular array.
Thereby realizing better spraying effect.
The detection unit comprises a beam motor, a horizontal lead screw bearing, a movable beam, a horizontal lead screw and two horizontal guide rails, wherein the movable beam is arranged at the two horizontal guide rails and can slide along the two horizontal guide rails; the movable cross beam is in an inverted U shape, a first motor and a second bearing are installed at one end of the movable cross beam, a second motor and a first bearing are installed at the other end of the movable cross beam, a first lead screw is connected between the first motor and the first bearing, a second lead screw is connected between the second motor and the second bearing, a first sliding block driven by the first lead screw is installed at the first lead screw, a second sliding block driven by the second lead screw is installed at the second lead screw, horizontal guide rods are further installed at two ends of the movable cross beam, and the first sliding block and the second sliding block are respectively provided with a limiting guide hole matched with the horizontal guide rods; the first sliding block is connected with a first arc-shaped plate, the end part of the first arc-shaped plate is connected with a first push plate, and a first accommodating groove for accommodating the edge of a semiconductor wafer is formed in the first push plate; the second slider fixedly connected with second arc, second arc department has the arc holding tank that is used for holding semiconductor wafer edge, first push pedal with the cooperation of second arc can with arbitrary one semiconductor wafer of lift basket of flowers department promotes and the centre gripping between first holding tank and arc holding tank to under the drive of crossbeam motor, make this semiconductor wafer remove along the direction of horizontal lead screw, the machine incasement still installs the detection mounting panel, detect mounting panel department and install a plurality of light source portions and a plurality of first image acquisition portion.
Further, the lifting basket can be at a first height and a second height above the first height, and when the lifting basket is at the first height, the lifting basket is located below the loading basket; when the lifting basket is at the second height, the lifting basket jacks up all the semiconductor wafers at the loading basket, so that the bottom ends of all the semiconductor wafers are higher than the top end of the water tank; the semiconductor wafer detection device is characterized in that a dry defect bearing frame is further installed in the case, a plurality of bearing positions capable of bearing the semiconductor wafer are arranged at the dry defect bearing frame, and the first push plate and the second arc-shaped plate can be matched to place the semiconductor wafer with the dry defect after detection at the dry defect bearing frame.
Further, electric putter is still installed to second arc department, second arc department has the breach, breach department has the second push pedal, second arc department still has the perforation, electric putter's movable rod passes the perforation with the second push pedal is connected, second push pedal department has and can hold the second holding tank at semiconductor wafer edge.
Furthermore, the end part of the first arc-shaped plate, which is far away from the first push plate, is fixed with a mounting block, and a second image acquisition part is installed at the mounting block.
Further, the lifting motor is a servo motor.
Thereby realizing more accurate distance control and lifting speed control.
Further, the loading flower basket can be called as a loading frame.
Further, the lifting flower basket can be called as a lifting frame.
Further, the nitrogen storage container is connected with an isopropanol storage container through a first pipeline (a valve is arranged at the first pipeline), and the isopropanol storage container is communicated with all the spray heads through a second pipeline (a valve is arranged at the second pipeline).
Further, the spray head can spray gas containing isopropyl alcohol (IPA) and nitrogen, and is used for forming an IPA film on the water surface in the water tank.
Specifically, see (CN 1368755A; 9/11/2002; semiconductor wafer drying method), (CN 100456430C; 2009/1/28/CN 108831848A; system and method for rinsing and drying semiconductor substrates), (CN 108831848A; a semiconductor wafer cleaning and drying apparatus; 11/16/2018) and the like. So long as make the atomising head can spout the gas that contains nitrogen gas and isopropyl alcohol, produce the isopropyl alcohol film in the surface of water in the water tank department.
Further, the first slide block is provided with a first through hole, and the first through hole is penetrated by the second screw rod and is not contacted with the second screw rod.
Further, a second through hole is formed in the second sliding block, and the second through hole is penetrated by the first screw rod and is not in contact with the first screw rod.
Thereby being more convenient for the installation of the first and the second sliding blocks and not influencing the independent driving of the first and the second sliding blocks.
Further, a vertical partition plate is arranged between the drying space and the detection space, and the top end of the vertical partition plate is lower than the bottommost end of the first arc-shaped plate and the bottommost end of the second arc-shaped plate.
Further, the drying defect bearing frame is fixedly connected with the inner side wall of the case.
Further, when the lifting flower basket is at the second height, the drying defect bearing frame and the lifting flower basket are at the same horizontal height, and the drying defect bearing frame is farther away from the vertical strip-shaped through groove relative to the lifting flower basket.
Further, when the electric push rod is in the shortest state, the side edge of the second push plate close to the first arc-shaped plate is flush with the inner side edge of the second arc-shaped plate.
Further, the first accommodating groove is provided with a first abutting cambered surface for abutting against the edge of the semiconductor wafer, and the first abutting cambered surface protrudes towards the direction of the semiconductor wafer.
Further, the second accommodating groove is provided with two abutting arc surfaces for abutting the edge of the semiconductor wafer, and the second abutting arc surfaces are protruded towards the direction of the semiconductor wafer.
Therefore, when the first abutting arc surface and the second abutting arc surface abut against the edge of the semiconductor wafer, the first abutting arc surface and the second abutting arc surface both abut against the semiconductor wafer in a tangent mode.
Thereby when first, two butt cambered surfaces and semiconductor wafer edge butt, more nimble, and both can take place relative displacement to make the semiconductor wafer can imbed in the arc recess of second arc better, and drop from the arc recess.
Further, the movable lid portion can close the rectangular lid portion.
Further, the inner diameter of the first arc-shaped plate is larger than the diameter of the semiconductor wafer.
Thereby obtaining that the first arc-shaped plate can move across a plurality of semiconductor wafers when the beam moves horizontally (the semiconductor wafers are positioned below the first arc-shaped plate)
Further, the distance between two adjacent loading positions of the loading flower basket is equal to the distance between two adjacent loading positions in the lifting flower basket.
Further, the distance between every two adjacent loading positions in the loading flower basket is more than 1 cm. Preferably 2cm or more.
Other spacings may be provided as desired to achieve as large an image capture viewing angle as possible.
Has the advantages that: the application discloses drying device adopts the drying mode of IPA to disposable can dry a great amount of wafers, and drying effect is good, because the residual water mark that effectively avoids conventional nitrogen gas drying to lead to. And after the detection is finished, an automatic sampling detection mode can be adopted. Therefore, the drying effect can be automatically judged, and the drying process can be better monitored.
Drawings
FIG. 1 is a schematic view of a drying apparatus;
figure 2 is another schematic view from an angle of figure 1,
FIG. 3 is another schematic view from the perspective of FIG. 1;
FIG. 4 is a schematic view of the lifting basket lifting the semiconductor wafer;
FIG. 5 is an enlarged view of area A;
FIG. 6 is a schematic view of a semiconductor wafer undergoing a spot inspection being transferred to a second curved plate;
FIG. 7 is an enlarged view of area B;
FIG. 8 is a schematic view of a semiconductor wafer being spot inspected having been transferred to a second arcuate plate;
FIG. 9 is an enlarged view of area C;
FIG. 10 is a schematic view of a semiconductor wafer being spot inspected at an inspection position;
FIG. 11 is an enlarged view of area D;
FIG. 12 is a schematic view of the semiconductor wafer at the second arcuate plate being returned to the lifting basket;
FIG. 13 is an enlarged view of area E;
fig. 14 is a schematic view of a drying apparatus in example 2.
With fig. 2-14 hidden from view a portion of the horizontal panel for clarity of illustration.
Detailed Description
Reference numerals: 1, a chassis; 1.1 a drying space; 1.2 detecting space; 1.3 horizontal panel 1.3.1 strip-shaped slide rail; 1.4 rectangular opening; 1.5 vertical panels; 1.6 vertical strip-shaped through grooves; 1.7 a display unit; 1.8 a separator; 2.1 a movable cover part; 2.2 fixing block; 2.3 cover driving motor; 2.4 cover screw rod; 3.1, a water tank; 3.2, overflowing the groove; 3.3 carrying beam; 3.4 loading a flower basket; 4.1 lifting the flower basket; 4.2 connecting the rod unit; 4.3 lifting block; 5.1 movable beam; 5.2 horizontal screw rods; 5.3 horizontal guide rails; 5.4 horizontal guide rod; 6.1 a first motor; 6.2 first lead screw; 6.3 first slide block; 6.4 first arc plate; 6.4.1 mounting blocks; 6.4.2 a second image acquisition part; 6.5 first push plate; 6.6 first holding tank; 7.3 second slide block; 7.4 second arc plate; 7.4.1 perforation; 7.5 a second accommodating groove; 7.6 a second push plate; 7.6.1 a second receiving groove; 7.7 electric push rod; 8 drying the defect carrier; 9.1 detecting the mounting plate; 9.2 a first image acquisition part; 9.3 light source part; 10 semiconductor wafer.
Example 1
The following detailed description is made with reference to the accompanying drawings: a lifting type semiconductor wafer drying device comprises a case 1, a lifting unit, a loading unit, a liquid path unit and a spraying unit; the case 1 comprises a vertical panel 1.5 and a horizontal panel 1.3, wherein a display unit 1.7 and a vertical strip-shaped through groove 1.6 are arranged at the position of the vertical panel 1.5, a rectangular opening 1.4 is arranged at the position of the horizontal panel 1.3, and a movable cover part 2.1 and a cover part driving unit for driving the movable cover part 2.1 are arranged at the position of the horizontal panel 1.3; the drying device is characterized in that a drying space 1.1 is arranged in the case 1, a water tank 3.1 is installed in the drying space 1.1, the loading unit comprises two bearing beams 3.3 fixed in the water tank 3.1 and a loading flower basket 3.4 loaded between the two bearing beams 3.3, the loading flower basket 3.4 can bear a plurality of semiconductor wafers 10 which are vertically placed and distributed at equal intervals, an overflow groove 3.2 is formed in the top end of the water tank 3.1, the liquid path unit can inject water into the water tank, and can drain the water tank 3.1 and the drying space 1.1; the lifting unit comprises a lifting driving mechanism and a lifting basket 4.1 driven by the lifting driving mechanism, the lifting basket 4.1 can bear a plurality of vertically placed semiconductor wafers 10 distributed at equal intervals, the maximum number of the semiconductor wafers 10 borne by the lifting basket 4.1 is equal to the maximum number of the semiconductor wafers 10 borne by the loading basket 3.4, and the lifting basket 4.1 can ascend from the lower part of the loading basket 3.4 and lift all the semiconductor wafers 10 at the loading basket 3.4 so that the bottom ends of all the semiconductor wafers 10 are higher than the top end of the water tank 3.1; the spraying unit comprises a plurality of spray heads mounted at the movable cover part 2.1, which spray heads are capable of spraying a gas containing isopropyl alcohol and nitrogen.
The bearing cross beam 3.3 is provided with a positioning bulge, and the loading flower basket 3.4 is provided with a positioning hole matched with the positioning bulge. The last fixed surface of activity lid 2.1 has bar fixed block 2.2, lid drive unit is including installing in the motor cabinet of horizontal panel department, installing in lid driving motor 2.3 of motor cabinet department and by lid driving motor 2.3 driven lid lead screw 2.4, bar fixed block 2.2 department have with lid lead screw 2.4 complex screw channel, activity lid 2.1 department has the bar spout, horizontal panel department have with bar spout complex bar slide rail 1.3.1. The lift unit include with the connecting rod unit 4.2 that the lift basket is connected, the elevator 4.3 of being connected with connecting rod unit 4.2, pass the vertical guide arm of elevator 4.3, pass the vertical lead screw of elevator 4.3, with the vertical lead screw complex vertical lead screw bearing and with vertical lead screw complex elevator motor, elevator 4.3 passes the vertical logical groove of bar, elevator 4.3 have with vertical guide arm complex smooth hole and with vertical lead screw complex screw hole, connecting rod unit 4.2 includes the first vertical connecting rod of being connected with elevator 4.3, the vertical connecting rod of second of being connected with lift basket 4.1 and connects the horizontal connecting rod between first vertical connecting rod and the vertical connecting rod of second. The liquid path unit comprises a liquid storage tank, a liquid injection hole and a first liquid discharge hole which are positioned at the bottom of the water tank, a second liquid discharge hole which is positioned at the bottom of the drying space, and a liquid injection pump which can inject liquid in the liquid storage tank into the water tank through the liquid injection hole. The spraying unit comprises an isopropanol storage container and a nitrogen storage container, and a plurality of spraying heads at the movable cover part are distributed in a rectangular array.
In addition, the drying device further comprises a detection unit, a detection space is arranged in the case, the detection unit comprises a beam motor, a horizontal lead screw bearing, a movable beam 5.1, a horizontal lead screw 5.2 and two horizontal guide rails 5.3, the movable beam 5.1 is installed at the position of the two horizontal guide rails 5.3 and can slide along the two horizontal guide rails 5.3, the horizontal lead screw 5.2 is driven by the beam motor in cooperation with the horizontal lead screw bearing, and the horizontal lead screw 5.2 penetrates through the movable beam 5.1; the movable cross beam 5.1 is in an inverted U shape, one end of the movable cross beam 5.1 is provided with a first motor 6.1 and a second bearing, the other end of the movable cross beam is provided with a second motor and a first bearing, a first lead screw 6.2 is connected between the first motor 6.1 and the first bearing, a second lead screw is connected between the second motor and the second bearing, a first slide block 6.3 driven by the first lead screw 6.2 is arranged at the first lead screw 6.2, a second slide block 7.3 driven by the second lead screw is arranged at the second lead screw, horizontal guide rods are further arranged at two ends of the movable cross beam 5.1, and the first slide block 6.3 and the second slide block 7.3 are both provided with limiting guide holes matched with the horizontal guide rods; the first sliding block 6.3 is connected with a first arc-shaped plate 6.4, the end part of the first arc-shaped plate 6.4 is connected with a first push plate 6.5, and a first accommodating groove 6.6 for accommodating the edge of the semiconductor wafer 10 is formed in the first push plate 6.5; second slider 7.3 fixedly connected with second arc 7.4, second arc 7.4 department has the arc holding tank that is used for holding semiconductor wafer 10 edge, first push pedal 6.5 with second arc 7.4 cooperation can with arbitrary one semiconductor wafer 10 promotion and the centre gripping of lift basket of flowers 4.1 department is between first holding tank 6.6 and arc holding tank to under the drive of crossbeam motor, make this semiconductor wafer 10 remove along the direction of horizontal lead screw 5.2, still install in the quick-witted case 1 and detect mounting panel 9.1, detect mounting panel 9.1 department and install a plurality of light source portions 9.3 and a plurality of first image acquisition portion 9.2.
The lifting basket 4.1 can be at a first height and a second height above the first height, and when the lifting basket 4.1 is at the first height, the lifting basket 4.1 is below the loading basket 3.4; when the lifting basket 4.1 is at the second height, the lifting basket 4.1 jacks up all the semiconductor wafers 10 at the loading basket 3.4, so that the bottom ends of all the semiconductor wafers 10 are higher than the top end of the water tank 3.1; a dry defect bearing frame 8 is further installed in the case 1, a plurality of bearing positions capable of bearing the semiconductor wafer 10 are arranged at the dry defect bearing frame 8, and the first push plate 6.5 and the second arc-shaped plate 7.6 can be matched to place the semiconductor wafer 10 with the dry defect after detection at the dry defect bearing frame 8. Electric putter 7.7 is still installed to second arc 7.4 department, second arc 7.4 department has the breach, breach department has second push pedal 7.6, second arc 7.4 department still has perforation 7.4.1, electric putter 7.7's movable rod passes perforation 7.4.1 with second push pedal 7.6 is connected, second push pedal 7.6 department has and to hold the second holding tank 7.6.1 at semiconductor wafer 10 edge.
The drying device of this application is shown in the figure, when the movable cover portion was opened, can put into the manual work and load the basket of flowers to the water injection makes the water in the water tank cover all semiconductor wafer, thereby plays certain cleaning performance. When the drying, make the water injection hole incessantly inject water to incessantly overflow from the overflow recess, thereby play the effect of running water. And the spray head continuously sprays, a layer of IPA film is formed on the water surface, the lifting unit jacks up the semiconductor wafer and slowly jacks up the water surface, and water on the surface of the semiconductor wafer can be removed under the action of the IPA film, so that drying is realized. After drying, the water is drained (during which the IPA film passes through the loading basket, completely drying it) and spraying is stopped. The test is then performed without opening the flap, as shown. First push pedal can promote semiconductor wafer to the direction of second arc (at this in-process, the wafer can be supported and go up and down the basket of flowers and take place certain rotation), make the wafer after that realized stable centre gripping (the power of centre gripping is not big by the centre gripping between first push pedal and second arc, because the basket of flowers that goes up and down, first push pedal, the position of second arc, the size is fixed, consequently, the operation of each motor is degree automated drive), and remove this wafer, make the wafer move to the detection position (the detection position faces the detection mounting panel), a plurality of first image acquisition portions that detect mounting panel department can realize image acquisition (the collection order of opening of light source portion and first image acquisition portion can set up and adjust as required). After the detection is finished, if the drying has defects, the drying defect bearing frame is placed on the drying defect bearing frame, if the drying does not have defects, the lifting basket is placed at the lifting basket, and the first push plate, the second push plate and the second arc-shaped plate are operated in the same way by placing the lifting basket and the drying defect bearing frame, but the positions of the movable cross beams are different. When the reset device is placed, the second push plate and the electric push rod are arranged, so that the reset operation is smoother. And the detection can adopt a sampling inspection mode, the drying does not have defects under normal conditions, and when the defects exist, an alarm is given in time, so that an engineer inspects the drying device.
Example 2
The main difference between example 2 and example 1 is that example 2 adds the following features to example 1: the inner diameter of the first curved plate 6.4 is greater than the diameter of the semiconductor wafer 10. The end part of the first arc-shaped plate 6.4 far away from the first push plate 6.5 is fixed with a mounting block 6.4.1, and a second image acquisition part 6.4.2 is installed at the mounting block 6.4.1. The distance between two adjacent loading positions in the loading flower basket 3.4 is more than 1 cm.
Specifically, in embodiment 2, the semiconductor wafer may be subjected to the sampling inspection, and the semiconductor wafer subjected to the sampling inspection is moved to the inspection position to acquire the image for the inspection. In the process of the translation of movable cross beam, the second image acquisition part can acquire images of all semiconductor wafers, and only acquires images from the gap between two adjacent semiconductor wafers, the acquired visual angle is very small, and the light source is not independently arranged, and the light source plate directly adopting the detection mounting plate is opened, so that the light effect inside the case is illuminated. The second image part is used as an auxiliary detection means, and when obvious water marks are detected according to the images, the drying effect is alarmed.
While the invention has been shown and described with respect to the preferred embodiments, it will be understood by those skilled in the art that various changes and modifications may be made without departing from the scope of the invention as defined in the following claims.
Claims (10)
1. A lifting type semiconductor wafer drying device is characterized by comprising a case, a lifting unit, a loading unit, a liquid path unit and a spraying unit; the chassis comprises a vertical panel and a horizontal panel, wherein the vertical panel is provided with a display unit and a vertical strip-shaped through groove, the horizontal panel is provided with a rectangular opening, and the horizontal panel is provided with a movable cover part and a cover part driving unit for driving the movable cover part; the drying device comprises a case, a loading unit and a liquid path unit, wherein the case is internally provided with a drying space, a water tank is arranged in the drying space, the loading unit comprises two bearing beams fixed in the water tank and a loading flower basket supported between the two bearing beams, the loading flower basket can bear a plurality of vertically arranged semiconductor wafers distributed at equal intervals, the top end of the water tank is provided with an overflow groove, the liquid path unit can inject water into the water tank, and can drain the water tank and the drying space; the lifting unit comprises a lifting driving mechanism and a lifting basket driven by the lifting driving mechanism, the lifting basket can bear a plurality of vertically-placed and equally-spaced semiconductor wafers, the maximum number of the semiconductor wafers borne by the lifting basket is equal to the maximum number of the semiconductor wafers borne by the loading basket, the lifting basket can ascend from the lower part of the loading basket and jack up all the semiconductor wafers at the loading basket so that the bottom ends of all the semiconductor wafers are higher than the top end of the water tank; the spray unit includes a plurality of spray heads installed at the movable cover portion, the spray heads being capable of spraying a gas containing isopropyl alcohol and nitrogen.
2. The lifting type semiconductor wafer drying device as claimed in claim 1, wherein the carrying beam has a positioning protrusion, and the loading basket has a positioning hole matching with the positioning protrusion.
3. The lifting type semiconductor wafer drying device as claimed in claim 1, wherein a bar-shaped fixing block is fixed on the upper surface of the movable cover part, the cover part driving unit comprises a motor base installed at a horizontal panel, a cover part driving motor installed at the motor base, and a cover part screw driven by the cover part driving motor, the bar-shaped fixing block is provided with a threaded channel engaged with the cover part screw, the movable cover part is provided with a bar-shaped sliding groove, and the horizontal panel is provided with a bar-shaped sliding rail engaged with the bar-shaped sliding groove.
4. The elevating semiconductor wafer drying apparatus as claimed in claim 1, wherein the elevating unit comprises a connecting rod unit connected to the elevating basket, an elevating block connected to the connecting rod unit, a vertical guide rod passing through the elevating block, a vertical screw bearing engaged with the vertical screw, and an elevating motor engaged with the vertical screw, the elevating block passing through the bar-shaped vertical through groove, the elevating block having a smooth hole engaged with the vertical guide rod and a threaded hole engaged with the vertical screw, the connecting rod unit comprising a first vertical connecting rod connected to the elevating block, a second vertical connecting rod connected to the elevating basket, and a horizontal connecting rod connected between the first vertical connecting rod and the second vertical connecting rod.
5. The lifting type semiconductor wafer drying apparatus as claimed in claim 1, wherein the liquid path unit comprises a liquid storage tank, a liquid injection hole and a first liquid discharge hole located at the bottom of the water tank, a second liquid discharge hole located at the bottom of the drying space, and a liquid injection pump capable of injecting the liquid in the liquid storage tank into the water tank through the liquid injection hole.
6. The lift type semiconductor wafer drying apparatus of claim 1, wherein the spray unit comprises an isopropyl alcohol storage container and a nitrogen gas storage container, and the plurality of spray heads at the movable cover part are distributed in a rectangular array.
7. The lift type semiconductor wafer drying device according to claim 1, further comprising a detection unit, wherein the cabinet has a detection space therein, the detection unit comprises a beam motor, a horizontal screw bearing, a movable beam, a horizontal screw and two horizontal rails, the movable beam is mounted at the two horizontal rails and can slide along the two horizontal rails, the horizontal screw is driven by the beam motor in cooperation with the horizontal screw bearing and passes through the movable beam; the movable cross beam is in an inverted U shape, a first motor and a second bearing are installed at one end of the movable cross beam, a second motor and a first bearing are installed at the other end of the movable cross beam, a first lead screw is connected between the first motor and the first bearing, a second lead screw is connected between the second motor and the second bearing, a first sliding block driven by the first lead screw is installed at the first lead screw, a second sliding block driven by the second lead screw is installed at the second lead screw, horizontal guide rods are further installed at two ends of the movable cross beam, and the first sliding block and the second sliding block are respectively provided with a limiting guide hole matched with the horizontal guide rods; the first sliding block is connected with a first arc-shaped plate, the end part of the first arc-shaped plate is connected with a first push plate, and a first accommodating groove for accommodating the edge of a semiconductor wafer is formed in the first push plate; the second slider fixedly connected with second arc, second arc department has the arc holding tank that is used for holding semiconductor wafer edge, first push pedal with the cooperation of second arc can with arbitrary one semiconductor wafer promotion and the centre gripping of lift basket of flowers department is between first holding tank and arc holding tank to under the drive of crossbeam motor, make this semiconductor wafer remove along the direction of horizontal lead screw, quick-witted incasement still installs the detection mounting panel, detect mounting panel department and install a plurality of light source portions and a plurality of first image acquisition portion.
8. The lift type semiconductor wafer drying apparatus of claim 7, wherein the lift basket is capable of being at a first height and a second height above the first height, the lift basket being below the loading basket when the lift basket is at the first height; when the lifting basket is at the second height, the lifting basket jacks up all the semiconductor wafers at the loading basket, so that the bottom ends of all the semiconductor wafers are higher than the top end of the water tank; the semiconductor wafer detection device is characterized in that a dry defect bearing frame is further installed in the case, a plurality of bearing positions capable of bearing the semiconductor wafer are arranged at the dry defect bearing frame, and the first push plate and the second arc-shaped plate can be matched to place the semiconductor wafer with the dry defect after detection at the dry defect bearing frame.
9. The lifting type semiconductor wafer drying device as claimed in claim 7, wherein an electric push rod is further installed at the second arc-shaped plate, the second arc-shaped plate has a notch, the notch has a second push plate, the second arc-shaped plate has a through hole, a movable rod of the electric push rod passes through the through hole to be connected with the second push plate, and the second push plate has a second accommodating groove capable of accommodating the edge of the semiconductor wafer.
10. The lift type semiconductor wafer drying device of claim 7, wherein a mounting block is fixed to an end of the first arc-shaped plate away from the first pushing plate, and a second image collecting portion is mounted on the mounting block.
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Denomination of invention: A lifting semiconductor wafer drying device Granted publication date: 20230630 Pledgee: Yangzhou Branch of Bank of Jiangsu Co.,Ltd. Pledgor: YANGZHOU SIPUER TECHNOLOGY CO. Registration number: Y2024980013857 |
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