CN115011118A - 一种第三代半导体器件封装用马来酰亚胺树脂基组合物 - Google Patents
一种第三代半导体器件封装用马来酰亚胺树脂基组合物 Download PDFInfo
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- CN115011118A CN115011118A CN202210618233.2A CN202210618233A CN115011118A CN 115011118 A CN115011118 A CN 115011118A CN 202210618233 A CN202210618233 A CN 202210618233A CN 115011118 A CN115011118 A CN 115011118A
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- maleimide
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- generation semiconductor
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- 239000000203 mixture Substances 0.000 title claims abstract description 50
- 229920005989 resin Polymers 0.000 title claims abstract description 43
- 239000011347 resin Substances 0.000 title claims abstract description 43
- 239000004065 semiconductor Substances 0.000 title claims abstract description 31
- PEEHTFAAVSWFBL-UHFFFAOYSA-N Maleimide Chemical compound O=C1NC(=O)C=C1 PEEHTFAAVSWFBL-UHFFFAOYSA-N 0.000 title claims abstract description 26
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 18
- RRAFCDWBNXTKKO-UHFFFAOYSA-N eugenol Chemical compound COC1=CC(CC=C)=CC=C1O RRAFCDWBNXTKKO-UHFFFAOYSA-N 0.000 claims abstract description 67
- -1 polysiloxane Polymers 0.000 claims abstract description 52
- NPBVQXIMTZKSBA-UHFFFAOYSA-N Chavibetol Natural products COC1=CC=C(CC=C)C=C1O NPBVQXIMTZKSBA-UHFFFAOYSA-N 0.000 claims abstract description 36
- 239000005770 Eugenol Substances 0.000 claims abstract description 36
- UVMRYBDEERADNV-UHFFFAOYSA-N Pseudoeugenol Natural products COC1=CC(C(C)=C)=CC=C1O UVMRYBDEERADNV-UHFFFAOYSA-N 0.000 claims abstract description 36
- 229960002217 eugenol Drugs 0.000 claims abstract description 36
- 229920001296 polysiloxane Polymers 0.000 claims abstract description 35
- 239000003822 epoxy resin Substances 0.000 claims abstract description 30
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 30
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 23
- 150000004982 aromatic amines Chemical class 0.000 claims abstract description 21
- ATVJXMYDOSMEPO-UHFFFAOYSA-N 3-prop-2-enoxyprop-1-ene Chemical compound C=CCOCC=C ATVJXMYDOSMEPO-UHFFFAOYSA-N 0.000 claims abstract description 17
- XDOBJOBITOLMFI-UHFFFAOYSA-N pyrrole-2,5-dione;toluene Chemical compound CC1=CC=CC=C1.O=C1NC(=O)C=C1 XDOBJOBITOLMFI-UHFFFAOYSA-N 0.000 claims abstract description 17
- 238000000034 method Methods 0.000 claims abstract description 14
- 239000011256 inorganic filler Substances 0.000 claims abstract description 12
- 229910003475 inorganic filler Inorganic materials 0.000 claims abstract description 12
- 239000000126 substance Substances 0.000 claims description 13
- 125000005439 maleimidyl group Chemical group C1(C=CC(N1*)=O)=O 0.000 claims description 11
- 125000004432 carbon atom Chemical group C* 0.000 claims description 10
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 10
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 claims description 9
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 8
- 125000003118 aryl group Chemical group 0.000 claims description 8
- WZJUBBHODHNQPW-UHFFFAOYSA-N 2,4,6,8-tetramethyl-1,3,5,7,2$l^{3},4$l^{3},6$l^{3},8$l^{3}-tetraoxatetrasilocane Chemical compound C[Si]1O[Si](C)O[Si](C)O[Si](C)O1 WZJUBBHODHNQPW-UHFFFAOYSA-N 0.000 claims description 7
- 239000002253 acid Substances 0.000 claims description 7
- 150000001875 compounds Chemical class 0.000 claims description 7
- 125000005843 halogen group Chemical group 0.000 claims description 7
- 150000002430 hydrocarbons Chemical group 0.000 claims description 7
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 claims description 7
- HMMGMWAXVFQUOA-UHFFFAOYSA-N octamethylcyclotetrasiloxane Chemical compound C[Si]1(C)O[Si](C)(C)O[Si](C)(C)O[Si](C)(C)O1 HMMGMWAXVFQUOA-UHFFFAOYSA-N 0.000 claims description 7
- 230000005855 radiation Effects 0.000 claims description 7
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 claims description 6
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 claims description 6
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims description 6
- 239000003054 catalyst Substances 0.000 claims description 6
- 125000002091 cationic group Chemical group 0.000 claims description 6
- 239000003086 colorant Substances 0.000 claims description 6
- 239000005350 fused silica glass Substances 0.000 claims description 6
- 239000001257 hydrogen Substances 0.000 claims description 6
- 229910052739 hydrogen Inorganic materials 0.000 claims description 6
- 239000002245 particle Substances 0.000 claims description 6
- BWHMMNNQKKPAPP-UHFFFAOYSA-L potassium carbonate Chemical compound [K+].[K+].[O-]C([O-])=O BWHMMNNQKKPAPP-UHFFFAOYSA-L 0.000 claims description 6
- KWEKXPWNFQBJAY-UHFFFAOYSA-N (dimethyl-$l^{3}-silanyl)oxy-dimethylsilicon Chemical compound C[Si](C)O[Si](C)C KWEKXPWNFQBJAY-UHFFFAOYSA-N 0.000 claims description 5
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 5
- 239000006087 Silane Coupling Agent Substances 0.000 claims description 5
- 239000003999 initiator Substances 0.000 claims description 5
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 claims description 4
- VHYFNPMBLIVWCW-UHFFFAOYSA-N 4-Dimethylaminopyridine Chemical compound CN(C)C1=CC=NC=C1 VHYFNPMBLIVWCW-UHFFFAOYSA-N 0.000 claims description 4
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 claims description 4
- 239000011230 binding agent Substances 0.000 claims description 4
- 238000005538 encapsulation Methods 0.000 claims description 4
- VLTRZXGMWDSKGL-UHFFFAOYSA-N perchloric acid Chemical class OCl(=O)(=O)=O VLTRZXGMWDSKGL-UHFFFAOYSA-N 0.000 claims description 4
- 239000002994 raw material Substances 0.000 claims description 4
- 239000002841 Lewis acid Substances 0.000 claims description 3
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 claims description 3
- YRKCREAYFQTBPV-UHFFFAOYSA-N acetylacetone Natural products CC(=O)CC(C)=O YRKCREAYFQTBPV-UHFFFAOYSA-N 0.000 claims description 3
- 150000007513 acids Chemical class 0.000 claims description 3
- 239000000654 additive Substances 0.000 claims description 3
- 125000000217 alkyl group Chemical group 0.000 claims description 3
- 229910000019 calcium carbonate Inorganic materials 0.000 claims description 3
- AXCZMVOFGPJBDE-UHFFFAOYSA-L calcium dihydroxide Chemical compound [OH-].[OH-].[Ca+2] AXCZMVOFGPJBDE-UHFFFAOYSA-L 0.000 claims description 3
- 239000000920 calcium hydroxide Substances 0.000 claims description 3
- 229910001861 calcium hydroxide Inorganic materials 0.000 claims description 3
- 150000007517 lewis acids Chemical class 0.000 claims description 3
- 125000000962 organic group Chemical group 0.000 claims description 3
- 150000002903 organophosphorus compounds Chemical class 0.000 claims description 3
- 150000002978 peroxides Chemical class 0.000 claims description 3
- 229910000027 potassium carbonate Inorganic materials 0.000 claims description 3
- 150000003512 tertiary amines Chemical class 0.000 claims description 3
- QCMKXHXKNIOBBC-UHFFFAOYSA-N 3-fluoroprop-1-ene Chemical compound FCC=C QCMKXHXKNIOBBC-UHFFFAOYSA-N 0.000 claims description 2
- OSDWBNJEKMUWAV-UHFFFAOYSA-N Allyl chloride Chemical compound ClCC=C OSDWBNJEKMUWAV-UHFFFAOYSA-N 0.000 claims description 2
- ATRRKUHOCOJYRX-UHFFFAOYSA-N Ammonium bicarbonate Chemical compound [NH4+].OC([O-])=O ATRRKUHOCOJYRX-UHFFFAOYSA-N 0.000 claims description 2
- 239000004215 Carbon black (E152) Substances 0.000 claims description 2
- JGFZNNIVVJXRND-UHFFFAOYSA-N N,N-diisopropylethylamine Substances CCN(C(C)C)C(C)C JGFZNNIVVJXRND-UHFFFAOYSA-N 0.000 claims description 2
- VMHLLURERBWHNL-UHFFFAOYSA-M Sodium acetate Chemical compound [Na+].CC([O-])=O VMHLLURERBWHNL-UHFFFAOYSA-M 0.000 claims description 2
- 239000003513 alkali Substances 0.000 claims description 2
- BHELZAPQIKSEDF-UHFFFAOYSA-N allyl bromide Chemical compound BrCC=C BHELZAPQIKSEDF-UHFFFAOYSA-N 0.000 claims description 2
- HFEHLDPGIKPNKL-UHFFFAOYSA-N allyl iodide Chemical compound ICC=C HFEHLDPGIKPNKL-UHFFFAOYSA-N 0.000 claims description 2
- 239000001099 ammonium carbonate Substances 0.000 claims description 2
- 235000012501 ammonium carbonate Nutrition 0.000 claims description 2
- FJDQFPXHSGXQBY-UHFFFAOYSA-L caesium carbonate Chemical compound [Cs+].[Cs+].[O-]C([O-])=O FJDQFPXHSGXQBY-UHFFFAOYSA-L 0.000 claims description 2
- 229910000024 caesium carbonate Inorganic materials 0.000 claims description 2
- CHVJITGCYZJHLR-UHFFFAOYSA-N cyclohepta-1,3,5-triene Chemical class C1C=CC=CC=C1 CHVJITGCYZJHLR-UHFFFAOYSA-N 0.000 claims description 2
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 claims description 2
- 229930195733 hydrocarbon Natural products 0.000 claims description 2
- 150000002736 metal compounds Chemical class 0.000 claims description 2
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 2
- 239000006082 mold release agent Substances 0.000 claims description 2
- 229910000510 noble metal Inorganic materials 0.000 claims description 2
- 150000001451 organic peroxides Chemical class 0.000 claims description 2
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 claims description 2
- 239000001632 sodium acetate Substances 0.000 claims description 2
- 235000017281 sodium acetate Nutrition 0.000 claims description 2
- 239000001488 sodium phosphate Substances 0.000 claims description 2
- 229910000162 sodium phosphate Inorganic materials 0.000 claims description 2
- JRMUNVKIHCOMHV-UHFFFAOYSA-M tetrabutylammonium bromide Chemical compound [Br-].CCCC[N+](CCCC)(CCCC)CCCC JRMUNVKIHCOMHV-UHFFFAOYSA-M 0.000 claims description 2
- RYFMWSXOAZQYPI-UHFFFAOYSA-K trisodium phosphate Chemical compound [Na+].[Na+].[Na+].[O-]P([O-])([O-])=O RYFMWSXOAZQYPI-UHFFFAOYSA-K 0.000 claims description 2
- 125000002221 trityl group Chemical group [H]C1=C([H])C([H])=C([H])C([H])=C1C([*])(C1=C(C(=C(C(=C1[H])[H])[H])[H])[H])C1=C([H])C([H])=C([H])C([H])=C1[H] 0.000 claims description 2
- 239000012757 flame retardant agent Substances 0.000 claims 1
- 235000014413 iron hydroxide Nutrition 0.000 claims 1
- NCNCGGDMXMBVIA-UHFFFAOYSA-L iron(ii) hydroxide Chemical compound [OH-].[OH-].[Fe+2] NCNCGGDMXMBVIA-UHFFFAOYSA-L 0.000 claims 1
- 238000006116 polymerization reaction Methods 0.000 claims 1
- 238000004100 electronic packaging Methods 0.000 abstract description 7
- 229920006336 epoxy molding compound Polymers 0.000 abstract description 7
- 238000005452 bending Methods 0.000 abstract description 6
- 230000008569 process Effects 0.000 abstract description 6
- 239000005022 packaging material Substances 0.000 abstract description 5
- 238000012545 processing Methods 0.000 abstract description 5
- 230000009477 glass transition Effects 0.000 abstract description 4
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 abstract description 3
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 abstract description 3
- 239000011342 resin composition Substances 0.000 description 24
- 230000000052 comparative effect Effects 0.000 description 15
- 239000000047 product Substances 0.000 description 12
- 238000002360 preparation method Methods 0.000 description 11
- 229920003192 poly(bis maleimide) Polymers 0.000 description 10
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 9
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 description 8
- 238000000465 moulding Methods 0.000 description 8
- ULKLGIFJWFIQFF-UHFFFAOYSA-N 5K8XI641G3 Chemical compound CCC1=NC=C(C)N1 ULKLGIFJWFIQFF-UHFFFAOYSA-N 0.000 description 7
- 238000006243 chemical reaction Methods 0.000 description 7
- 229920001187 thermosetting polymer Polymers 0.000 description 7
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 6
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 6
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- HCKPQGBXPQNMKU-UHFFFAOYSA-N 2,3-bis[(dimethylamino)methyl]phenol Chemical compound CN(C)CC1=CC=CC(O)=C1CN(C)C HCKPQGBXPQNMKU-UHFFFAOYSA-N 0.000 description 1
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- ZQNVWAQNCHHONO-UHFFFAOYSA-N 2-methyl-1-phenylimidazole Chemical compound CC1=NC=CN1C1=CC=CC=C1 ZQNVWAQNCHHONO-UHFFFAOYSA-N 0.000 description 1
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- WECDUOXQLAIPQW-UHFFFAOYSA-N 4,4'-Methylene bis(2-methylaniline) Chemical compound C1=C(N)C(C)=CC(CC=2C=C(C)C(N)=CC=2)=C1 WECDUOXQLAIPQW-UHFFFAOYSA-N 0.000 description 1
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- TYOXIFXYEIILLY-UHFFFAOYSA-N 5-methyl-2-phenyl-1h-imidazole Chemical compound N1C(C)=CN=C1C1=CC=CC=C1 TYOXIFXYEIILLY-UHFFFAOYSA-N 0.000 description 1
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- QAZYYQMPRQKMAC-FDGPNNRMSA-L calcium;(z)-4-oxopent-2-en-2-olate Chemical compound [Ca+2].C\C([O-])=C\C(C)=O.C\C([O-])=C\C(C)=O QAZYYQMPRQKMAC-FDGPNNRMSA-L 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- XTHPWXDJESJLNJ-UHFFFAOYSA-N chlorosulfonic acid Substances OS(Cl)(=O)=O XTHPWXDJESJLNJ-UHFFFAOYSA-N 0.000 description 1
- XEHUIDSUOAGHBW-UHFFFAOYSA-N chromium;pentane-2,4-dione Chemical compound [Cr].CC(=O)CC(C)=O.CC(=O)CC(C)=O.CC(=O)CC(C)=O XEHUIDSUOAGHBW-UHFFFAOYSA-N 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 229910052570 clay Inorganic materials 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 238000000748 compression moulding Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 239000012043 crude product Substances 0.000 description 1
- 229910002026 crystalline silica Inorganic materials 0.000 description 1
- BLCKNMAZFRMCJJ-UHFFFAOYSA-N cyclohexyl cyclohexyloxycarbonyloxy carbonate Chemical compound C1CCCCC1OC(=O)OOC(=O)OC1CCCCC1 BLCKNMAZFRMCJJ-UHFFFAOYSA-N 0.000 description 1
- 239000008367 deionised water Substances 0.000 description 1
- 229910021641 deionized water Inorganic materials 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- LSXWFXONGKSEMY-UHFFFAOYSA-N di-tert-butyl peroxide Chemical compound CC(C)(C)OOC(C)(C)C LSXWFXONGKSEMY-UHFFFAOYSA-N 0.000 description 1
- 229960005215 dichloroacetic acid Drugs 0.000 description 1
- PBWZKZYHONABLN-UHFFFAOYSA-N difluoroacetic acid Chemical compound OC(=O)C(F)F PBWZKZYHONABLN-UHFFFAOYSA-N 0.000 description 1
- XXBDWLFCJWSEKW-UHFFFAOYSA-N dimethylbenzylamine Chemical compound CN(C)CC1=CC=CC=C1 XXBDWLFCJWSEKW-UHFFFAOYSA-N 0.000 description 1
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- 238000002347 injection Methods 0.000 description 1
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- 150000002500 ions Chemical class 0.000 description 1
- IEECXTSVVFWGSE-UHFFFAOYSA-M iron(3+);oxygen(2-);hydroxide Chemical compound [OH-].[O-2].[Fe+3] IEECXTSVVFWGSE-UHFFFAOYSA-M 0.000 description 1
- LZKLAOYSENRNKR-LNTINUHCSA-N iron;(z)-4-oxoniumylidenepent-2-en-2-olate Chemical compound [Fe].C\C(O)=C\C(C)=O.C\C(O)=C\C(C)=O.C\C(O)=C\C(C)=O LZKLAOYSENRNKR-LNTINUHCSA-N 0.000 description 1
- 229910052746 lanthanum Inorganic materials 0.000 description 1
- FZLIPJUXYLNCLC-UHFFFAOYSA-N lanthanum atom Chemical compound [La] FZLIPJUXYLNCLC-UHFFFAOYSA-N 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 229940018564 m-phenylenediamine Drugs 0.000 description 1
- ZLNQQNXFFQJAID-UHFFFAOYSA-L magnesium carbonate Chemical compound [Mg+2].[O-]C([O-])=O ZLNQQNXFFQJAID-UHFFFAOYSA-L 0.000 description 1
- 239000001095 magnesium carbonate Substances 0.000 description 1
- 229910000021 magnesium carbonate Inorganic materials 0.000 description 1
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 description 1
- 239000000347 magnesium hydroxide Substances 0.000 description 1
- 229910001862 magnesium hydroxide Inorganic materials 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000012044 organic layer Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- VLTRZXGMWDSKGL-UHFFFAOYSA-M perchlorate Inorganic materials [O-]Cl(=O)(=O)=O VLTRZXGMWDSKGL-UHFFFAOYSA-M 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 229920002589 poly(vinylethylene) polymer Polymers 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 1
- BWJUFXUULUEGMA-UHFFFAOYSA-N propan-2-yl propan-2-yloxycarbonyloxy carbonate Chemical compound CC(C)OC(=O)OOC(=O)OC(C)C BWJUFXUULUEGMA-UHFFFAOYSA-N 0.000 description 1
- 238000007151 ring opening polymerisation reaction Methods 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 239000000779 smoke Substances 0.000 description 1
- 238000007655 standard test method Methods 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 239000011593 sulfur Substances 0.000 description 1
- QAOWNCQODCNURD-UHFFFAOYSA-N sulfuric acid Substances OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 230000000930 thermomechanical effect Effects 0.000 description 1
- HPGGPRDJHPYFRM-UHFFFAOYSA-J tin(iv) chloride Chemical compound Cl[Sn](Cl)(Cl)Cl HPGGPRDJHPYFRM-UHFFFAOYSA-J 0.000 description 1
- XJDNKRIXUMDJCW-UHFFFAOYSA-J titanium tetrachloride Chemical compound Cl[Ti](Cl)(Cl)Cl XJDNKRIXUMDJCW-UHFFFAOYSA-J 0.000 description 1
- 239000012745 toughening agent Substances 0.000 description 1
- YNJBWRMUSHSURL-UHFFFAOYSA-N trichloroacetic acid Chemical compound OC(=O)C(Cl)(Cl)Cl YNJBWRMUSHSURL-UHFFFAOYSA-N 0.000 description 1
- UHUUYVZLXJHWDV-UHFFFAOYSA-N trimethyl(methylsilyloxy)silane Chemical compound C[SiH2]O[Si](C)(C)C UHUUYVZLXJHWDV-UHFFFAOYSA-N 0.000 description 1
- 238000003828 vacuum filtration Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 239000010456 wollastonite Substances 0.000 description 1
- 229910052882 wollastonite Inorganic materials 0.000 description 1
- 239000011592 zinc chloride Substances 0.000 description 1
- 235000005074 zinc chloride Nutrition 0.000 description 1
Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
- C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08L79/085—Unsaturated polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/12—Polysiloxanes containing silicon bound to hydrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/38—Polysiloxanes modified by chemical after-treatment
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/014—Additives containing two or more different additives of the same subgroup in C08K
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
- C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/05—Polymer mixtures characterised by other features containing polymer components which can react with one another
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Epoxy Resins (AREA)
Abstract
本发明涉及电子封装材料技术领域,具体涉及一种第三代半导体器件封装用马来酰亚胺树脂基组合物。该马来酰亚胺树脂基组合物包括苯甲烷马来酰亚胺寡聚物、多官能环氧树脂、芳香胺固化剂、固化促进剂、无机填料和丁香酚烯丙基醚聚硅氧烷,适用于现有环氧模塑料的加工和成型工艺;其固化物具有高的玻璃化转变温度,且在常温和250℃下均表现出高的弯曲强度,适用于碳化硅(SiC)、氮化镓(GaN)等第三代半导体功率器件封装。
Description
技术领域
本发明涉及电子封装材料技术领域,具体涉及一种第三代半导体器件封装用马来酰亚胺树脂基组合物。
背景技术
近年来,以碳化硅(SiC)、氮化镓(GaN)等为代表的第三代半导体材料发展迅速。与第一代(Si)和第二代(GaAs)半导体材料相比,第三代半导体材料具有更宽的禁带宽度、更高的击穿电场、更高的热导率、更高的电子饱和速率及更高的抗辐射能力,更适合于制作高温、高频、抗辐射及大功率器件,未来在各个现代工业领域包括5G通信、物联网、自动驾驶、新能源汽车等将发挥重要革新作用,应用前景和市场潜力巨大。
基于第三代半导体制作的大功率器件的工作温度将远远高于目前传统功率器件,达到250℃以上,这对封装技术及材料提出了新的要求。环氧模塑料作为主要的电子封装材料之一,在起到机械支撑作用的同时,可以保护芯片不受外界灰尘、潮气、离子、辐射和机械冲击等影响,对电子电路起到非常重要的保护作用。然而,传统环氧塑封料在温度达到175~200℃时,已不能胜任新一代半导体封装的需求。因此,针对第三代半导体功率器件开发具有高玻璃化转变温度(Tg)和热稳定性的塑封料产品具有重要研究意义和应用价值。
双马来酰亚胺(BMI)是由聚酰亚胺衍生的一类树脂体系,是以马来酰亚胺(MI)基团为活性端基的双官或多官能团化合物。双马来酰亚胺树脂固化物具有优良的耐热性(Tg通常高于250℃)、电绝缘性、阻燃性及力学性能。此外,双马来酰亚胺树脂有与环氧树脂相似的流动性和可模塑性,可用与环氧树脂相似的方法加工成型,将双马来先酰亚胺树脂用于电子封装模塑料体系中,有望改善模塑料的耐热性能,克服环氧树脂耐热性较低的缺点,满足第三代半导体器件封装的性能要求。然而,双马来酰亚胺树脂单体熔点通常高于150℃,固化温度较高,加工成型条件苛刻,不符合现有电子封装模塑料的加工成型工艺;此外,双马来酰亚胺树脂固化物的交联密度较高,固化物脆性较大,韧性不足,应用于电子封装材料中往往存在因内应力过大而造成的翘曲开裂等问题。
中国专利号为ZL 202010737297.5的发明专利提供了一种热固性树脂组合物,将马来酰亚胺树脂、环氧树脂与酚醛树脂进行共固化,制得加工和固化成型条件较为温和的热固性树脂固化物,介电常数和介电损耗较低,并在一定程度上提高了树脂组合物固化后的耐热性及韧性。然而,将现有环氧模塑料的固化成型工艺条件用于该热固性树脂组合物时,发现其在175℃下的凝胶时间仍然过长,且得到的固化物的Tg小于300℃,在250℃高温下的弯曲强度相比室温下的弯曲强度下降明显,如应用于第三代半导体大功率器件封装时仍不够理想。
因此,有必要通过研究提供一种第三代半导体器件封装用马来酰亚胺树脂基组合物,以解决上述问题。
发明内容
为了解决上述问题,本发明提供了一种第三代半导体器件封装用马来酰亚胺树脂基组合物。本发明采用苯甲烷马来酰亚胺寡聚物,以克服传统双马来酰亚胺树脂单体熔点较高难以捏合加工的不足;同时,采用芳香胺作为固化剂,配合固化促进剂的使用,通过芳香胺与马来酰亚胺基团发生加成反应有效提高了树脂体系的固化反应活性,从而改善了成型工艺性,且固化后的树脂具有高Tg;此外,本发明在组合物中引入了一种丁香酚烯丙基醚聚硅氧烷,在基体树脂中具有良好相容性和分散性,能够在不牺牲固化物交联密度和Tg的情况下有效提高固化物的韧性。
为了实现上述目的,本发明采用的技术方案如下:
本发明提供了一种第三代半导体器件封装用马来酰亚胺树脂基组合物,包括苯甲烷马来酰亚胺寡聚物、多官能环氧树脂、芳香胺固化剂、固化促进剂、无机填料和丁香酚烯丙基醚聚硅氧烷;
所述丁香酚烯丙基醚聚硅氧烷具有以下式(6)所示的结构:
其中,m和n为0~30范围内的整数;
所述多官能环氧树脂和苯甲烷马来酰亚胺寡聚物的质量比为1∶1~1∶5,优选1∶1~1∶3;
所述芳香胺固化剂的含量为多官能环氧树脂和苯甲烷马来酰亚胺寡聚物二者总量的5~15wt%,优选10~15wt%;
所述丁香酚烯丙基醚聚硅氧烷的含量为苯甲烷马来酰亚胺寡聚物、多官能环氧树脂、芳香胺固化剂三者总量的1~15wt%,优选3~10wt%;
所述固化促进剂的含量为苯甲烷马来酰亚胺寡聚物、多官能环氧树脂、芳香胺固化剂三者总量的0.5~5wt%,优选0.5~3wt%;
所述无机填料的含量为马来酰亚胺树脂基组合物总量的70~90wt%,优选75~85wt%。
进一步地,所述苯甲烷马来酰亚胺寡聚物,至少含有两个马来酰亚胺基团,包括以下式(1)所示化学结构的物质:
式(1)中不同位置的R1各自独立地为氢原子、含有1~4个碳原子的烃基或卤素原子;n为0~15的整数。
进一步地,所述多官能环氧树脂包括以下式(2)所示化学结构的物质:
式(2)中R1为氢原子或有1~6个碳原子的烷基,R′为氢原子、甲基或乙基,n为0~6的整数。
更进一步地,所述多官能环氧树脂可以选用日本化药株式会社的EPPN-501H、EPPN-501HY或EPPN-502H中的一种或两种以上组合使用。
进一步地,所述芳香胺固化剂主要为芳香二胺,包括以下式(3)、式(4)和式(5)所示化学结构的物质。
式(3)中的R1为氢原子、卤素原子、或含有1~4个碳原子的烃基。
式(4)中的R1各自独立地为氢原子、卤素原子、或含有1~4个碳原子的烃基。
式(5)中R′为具有1~30个碳原子的烃类,或为含有芳环结构的有机基团;R′也可以为一个或多个氧原子、氮原子、硫原子、磷原子或卤素原子的有机基团;R1各自独立地为氢原子,或为含有1~4个碳原子的烃基或卤素原子。
更进一步地,所述芳香胺固化剂可以是间苯二胺、邻苯二胺、氯邻苯二胺、联苯胺、3,3′-二甲基联苯胺、4,4′-二氨基二苯甲烷(DDM)、3,3′-二氯-4,4′-二氨基二苯甲烷、3,3′-二甲基-4,4′-二氨基二苯甲烷、3,3′-二乙基-4,4′-二氨基二苯甲烷、4,4′-二氨基二苯砜(DDS)、4,4′-二氨基二苯醚、4,4′-二氨基二苯硫醚、3,3′-二氨基二苯砜的一种或两种以上组合使用;本发明的芳香胺固化剂优选4,4′-二氨基二苯甲烷、4,4′-二氨基二苯砜和3,3′-二甲基-4,4′-二氨基二苯甲烷中的一种或两种以上组合使用。
进一步地,所述固化促进剂为叔胺、咪唑类化合物、有机磷化合物、乙酰丙酮金属络合物、过氧化物中的一种或两种以上组合使用。
更进一步地,所述叔胺包括1,8-二氮杂二环十一碳-7-烯(DBU)、1,5-二氮杂双环壬-5-烯(DBN)、N-甲基哌嗪、三乙胺、三乙醇胺、苄基二甲胺、二甲胺基甲基苯酚(DMP-10)、双-(二甲胺基甲基)苯酚(DMP-20)、三-(二甲胺基甲基)苯酚(DMP-30);所述咪唑类化合物包括咪唑、2-甲基咪唑、2-乙基-4-甲基咪唑、2-苯基咪唑、2-苯基-4-甲基咪唑、1-苯基-2-甲基咪唑、1-氰乙基-2-甲基咪唑、1-氰乙基-2-苯基咪唑、2-乙基-4-甲基咪唑-四苯基硼酸盐;所述有机磷化合物包括三苯基磷、三苯基磷-对苯醌加合物、三对甲苯基磷-对苯醌加合物、乙基三苯基醋酸磷、四苯基磷-四苯基硼酸盐、丁基三苯基磷-四苯基硼酸盐;所述乙酰丙酮金属络合物包括乙酰丙酮铁、乙酰丙酮锰、乙酰丙酮铬、乙酰丙酮铂、乙酰丙酮钙、乙酰丙酮钡、乙酰丙酮钼、乙酰丙酮镉、乙酰丙酮镧、乙酰丙酮氧钒、乙酰丙酮钛、乙酰丙酮锆;所述过氧化物包括过氧化苯甲酰、过氧化月桂酰、过氧化二叔丁基、过氧化二异丙苯、过氧化苯甲酰叔丁酯、过氧化叔戊酸叔丁酯、过氧化甲乙酮、过氧化环己酮、异丙苯过氧化氢、叔丁基过氧化氢、过氧化二碳酸二异丙酯、过氧化二碳酸二环己酯;本发明的固化促进剂优选1,8-二氮杂二环十一碳-7-烯(DBU)、1,5-二氮杂双环壬-5-烯(DBN)、2-甲基咪唑、2-乙基-4-甲基咪唑、三苯基膦、三苯基磷-对苯醌加合物和过氧化二异丙苯。
进一步地,所述无机填料包括球形熔融二氧化硅,所述球形熔融二氧化硅的平均粒径为0.01~30μm,含量为无机填料总量的50~100wt%,优选90~100wt%。
更进一步地,所述无机填料还可包括结晶型二氧化硅、气相二氧化硅、氧化铝、氢氧化铝、碳酸钙、氧化镁、氢氧化镁、氮化硼、氮化铝、氮化硅、碳酸镁、氢氧化钙、黏土、硅灰石、滑石粉中的一种或几种。
更进一步地,所述丁香酚烯丙基醚聚硅氧烷制备方法如下:
步骤1,将八甲基环四硅氧烷、1,3,5,7-四甲基环四硅氧烷、1,1,3,3-四甲基二硅氧烷和阳离子聚合引发剂加入容器中,在0~100℃,反应4~48h,得到含氢聚硅氧烷;
步骤2,将上述步骤1制备的含氢聚硅氧烷、丁香酚和溶剂加入容器中,添加催化剂或辐射条件下,40~200℃,反应4~48h,得到丁香酚基聚硅氧烷;
步骤3,将上述步骤2制备的丁香酚基聚硅氧、烯丙基卤代烃、缚酸剂和溶剂加入容器中,在40~180℃,反应4~48h,得到丁香酚烯丙基聚硅氧烷。
进一步地,步骤1中,所述八甲基环四硅氧烷和1,3,5,7-四甲基环四硅氧烷可按任意重量比例调配;所述1,1,3,3-四甲基二硅氧烷的含量为八甲基环四硅氧烷和1,3,5,7-四甲基环四硅氧烷两者质量总和的5~20wt%;所述阳离子聚合引发剂包括质子酸类、路易斯酸类或其他阳离子引发剂中的一种或多种的组合;
进一步地,所述的质子酸包括但不限于浓硫酸、磷酸、高氯酸、氯磺酸、氟磺酸、二氯乙酸、二氟乙酸、三氯乙酸、三氟乙酸和三氟甲磺酸;所述的路易斯酸包括但不限于三氟化硼、三氯化铝、四氯化钛、四氯化锡、氯化锌和五氯化锑;所述的其他阳离子引发条件包括但不限于碘、氧鎓离子、高氯酸盐、环庚三烯盐和三苯基甲基盐。
进一步地,步骤2中,所述含氢聚硅氧烷与丁香酚的按硅氢键和双键反应官能团摩尔比为1∶1~10的比例混合;所述催化剂包括有机碱类化合物、有机过氧化物、偶氮类化合物、贵金属化合物中的至少一种;所述辐射条件包括紫外线(UV)、阿尔法(α)射线、贝塔(β)射线、伽马(γ)射线、X射线、中子射线中的至少一种;所述溶剂包括N,N-二甲基甲酰胺、二甲基亚砜、乙腈、乙醇、丙醇、丙酮、2-丁酮、二氯甲烷中的至少一种。
进一步地,步骤3中,所述丁香酚基聚硅氧烷与烯丙基卤代烃按酚羟基和卤素反应官能团摩尔比为1∶1~10的比例混合;所述的缚酸剂包括三乙胺、吡啶、N,N-二异丙基乙胺、4-二甲氨基吡啶、三乙醇胺、四丁基溴化铵、碳酸钾、碳酸铵、碳酸钠、氢氧化钠、氢氧化钙、氢氧化钾、氢氧化铁、碳酸钙、碳酸铯、磷酸钠、醋酸钠中的至少一种;所述烯丙基卤代烃包括烯丙基碘、烯丙基氯、烯丙基溴、烯丙基氟中的至少一种。
所述丁香酚烯丙基聚硅氧烷,含有端烯丙基结构,可与马来酰亚胺基团发生加成反应,达到增加其在树脂组合物中相容性并增韧的效果。
进一步地,在本发明的一种第三代半导体器件封装用马来酰亚胺树脂基组合物中可根据需要加入其他添加剂,包括硅烷偶联剂、阻燃剂、着色剂如炭黑和氧化铁红、以及脱模剂如天然蜡和合成蜡。
本发明组合物的生产或制备方法不受特别限制。例如,苯甲烷马来酰亚胺寡聚物、多官能环氧树脂、芳香胺固化剂、固化促进剂、无机填料、丁香酚烯丙基醚聚硅氧烷和其他添加剂使用混合机或类似器件充分混合在一起,接着使用加热辊或捏合机进行熔融捏合,再对所得产物冷却和粉碎。本发明的组合物可通过传递模塑、模压或注射模塑进行固化成型,用于对第三代半导体器件进行封装。
基于上述技术方案,本发明具有以下优点和有益效果:
1、本发明采用苯甲烷马来酰亚胺寡聚物,克服了传统双马来酰亚胺树脂单体熔点较高难以捏合加工的不足;同时,采用芳香胺作为固化剂,配合固化促进剂的使用,通过芳香胺与马来酰亚胺基团发生加成反应和固化促进剂通过阴离子聚合原理促进环氧树脂开环聚合,有效提高了树脂体系的固化反应活性,从而改善了成型工艺性。相比“双马来酰亚胺树脂/环氧树脂/酚醛树脂”组合物(中国发明专利ZL 202010737297.5),本发明组合物的马来酰亚胺树脂含有大量芳香环结构,马来酰亚胺基团与丁香酚烯丙基醚硅氧烷的烯丙基发生加成反应交联,且组合物中含有在较低温度下固化的环氧树脂,本发明的组合物在175℃下的凝胶时间更短,固化成型性更好,且固化物具有更高的Tg(大于350℃)。
2、本发明的组合物中含有一种丁香酚烯丙基醚聚硅氧烷,在基体树脂中具有良好相容性和分散性,其结构中含有芳香环和烯丙基结构,烯丙基能够与马来酰亚胺基团进行加成反应,保证固化物的交联密度和Tg,并有效提高固化物的韧性,本发明的组合物固化后在室温和高温(250℃)下均具有高的弯曲强度。
具体实施方式
以下通过优选实施例将对本发明作进一步说明,本实施例在以本发明技术方案为前提下进行实施,给出了详细的实施方式和过程,但本发明的保护范围不限于下述的实施例,下列实施例中未注明具体条件的实验方法,通常按照常规条件,或按照制造厂商所建议的条件。
本发明实施例所用原料如下所示,但不以此为限:
八甲基环四硅氧烷(D4),购自上海阿拉丁生化科技股份有限公司,CAS号为556-67-2;
1,3,5,7-四甲基环四硅氧烷(D4H),购自上海泰坦科技股份有限公司,CAS号为2370-88-9;
1,1,3,3-四甲基二硅氧烷(TMDS),购自上海阿拉丁生化科技股份有限公司,CAS号为3277-26-7;
三氟甲磺酸(TfOH),购自上海阿拉丁生化科技股份有限公司,CAS号为;
丁香酚(EG),购自上海麦克林生化科技有限公司,CAS号为97-53-0;
1,3-二乙烯基-1,1,3,3-四甲基二硅氧烷铂(0)(Karstedt催化剂),购自上海麦克林生化科技有限公司,CAS号为68478-92-2。
苯甲烷马来酰亚胺寡聚物,购自日本大和化成工业株式会社,型号为BMI-2300;
4,4′-二氨基二苯甲烷(DDM),购自上海阿拉丁生化科技股份有限公司,CAS号为101-77-9;
多官能环氧树脂,购自Nippon Kayaku Co.,Ltd,型号为EPPN-501H;
2-乙基-4-甲基咪唑(2E4MZ),购自上海阿拉丁生化科技股份有限公司,CAS号为931-36-2;
γ-缩水甘油醚氧丙基三甲氧基硅烷(KBM-403),购自日本信越公司;
球形熔融二氧化硅,平均粒径为20μm和8μm的购自日本电气化学株式会社;
阻燃剂:三聚氰胺多聚磷酸盐,购自上海旭森非卤消烟阻燃剂有限公司;
着色剂:炭黑,购自三菱瓦斯公司;
脱模剂:巴西棕榈蜡,购自上海易巴化工贸易公司。
实施例1~3
本发明实施例1~3所用原料及用量如下表1所示:
表1
表1中,丁香酚烯丙基醚聚硅氧烷(PMES-Ally)的制备方法包括以下三个步骤:
S1、含氢聚硅氧烷(PMHS)的制备:将36g的八甲基环四硅氧烷、16g的1,3,5,7-四甲基环四硅氧烷、5.5g四甲基二硅氧烷和102μL的三氟甲磺酸依次加入至烧瓶中,25℃反应24小时。反应结束后加入过量的无水硫酸镁,搅拌过夜,减压抽滤,旋蒸浓缩,真空干燥之后即可得到含氢聚硅氧烷(PMHS)。
S2、丁香酚基聚硅氧烷(PMES)的制备:将20g的PMHS、20g的丁香酚、20μL的卡斯特(karstedt)铂碳催化剂和50mL的甲苯依次加入到烧瓶中,100℃下反应12小时。反应结束后旋蒸浓缩,用正己烷萃取并洗涤多次,取下层产物旋蒸浓缩并真空干燥即可得到丁香酚基聚硅氧烷(PMES)。
S3、丁香酚烯丙基聚硅氧烷(PMES-Ally)的制备:取20g的PMES、18mL的溴丙烯、8g的无水碳酸钾和50mL的二甲基甲酰胺依次加入至烧瓶中,80℃下反应12小时。反应结束后,过滤去滤液旋蒸浓缩,将粗产物溶于二氯甲烷,用去离子水多次洗涤,取有机层旋蒸浓缩真空干燥即可得到目标产物丁香酚烯丙基聚硅氧烷(PMES-Ally)。
本发明实施例1~3的一种第三代半导体器件封装用马来酰亚胺树脂基组合物的制备方法为:
按表1所示配比,将上述苯甲烷马来酰亚胺寡聚物(BMI-2300)、多官能环氧树脂(EPPN-501H)、4,4′-二氨基二苯甲烷(DDM)、2-乙基-4-甲基咪唑(2E4MZ)、丁香酚烯丙基醚聚硅氧烷(PMES-Ally)、球形熔融二氧化硅(平均粒径为20μm、8μm)、阻燃剂(三聚氰胺多聚磷酸盐)、硅烷偶联剂(γ-缩水甘油醚氧丙基三甲氧基硅烷)、着色剂(炭黑)和脱模剂(巴西棕榈蜡)通过高速混合机在室温下以800rpm的转速充分混合后,于90~110℃通过双螺杆捏合机进行熔融捏合,然后将捏合后的物料冷却和粉碎,即得到所述热固性树脂组合物。
对比例1~2
本发明对比例1~2所用原料及用量如下表2所示:
表2
对比例1为传统的环氧模塑料的制备方法,具体步骤为:按表2所示配比,将多官能环氧树脂(EPPN-501H)、对二甲苯型芳烷基酚醛树脂(购自Meiwa Plastic Industries公司,型号为MEH-78004S)、固化促进剂2-乙基-4-甲基咪唑(2-Et-4-MZ)、球形熔融二氧化硅(平均粒径为1μm、15μm、24μm,对应型号分别为SC2500、FB-15D、FB-20D)、硅烷偶联剂,型号为KBM-403)、着色剂(炭黑,型号为MA600)和脱模剂(巴西棕榈蜡)通过高速混合机在室温下以800rpm的转速充分混合;再将制备的混合物于70~110℃通过双螺杆捏合机进行熔融捏合;然后将捏合后出料的混合物冷却和粉碎得到所述环氧模塑料。
对比例2的一种第三代半导体器件封装用热固性树脂组合物的制备方法,包括如下步骤:
S1、共混物A的制备
按表2所示配比,将双(3-乙基-5-甲基-4-马来酰亚胺基苯)甲烷(BMI-70)在170℃下熔融,然后加入苯酚型线形酚醛树脂(PF-8011),熔融混合5min后,自然冷却至室温,即得到所述共混物A。
S2、共混物B的制备
按表2所示配比,将苯酚型线形酚醛树脂(PF-8011)在160℃下熔融,然后加入2-乙基-4-甲基咪唑(2-Et-4-MZ),搅拌混合1h后,自然冷却至室温,即得到所述共混物B。
S3、共混物C的制备
按表2所示配比,将多官能环氧树脂(EPPN-501H)和环氧化1,2-聚丁二烯(JP-100)于90℃下熔融混合5min后,自然冷却至室温,即得到所述共混物C。
S4、热固性树脂组合物的制备
将上述制得的共混物A、共混物B、共混物C与表2所示配比的球形熔融二氧化硅(平均粒径为1μm、15μm、24μm,对应型号分别为SC2500、FB-15D、FB-20D)、硅烷偶联剂(γ-环氧丙氧基丙基三甲氧基硅烷,型号为KBM-403)、着色剂(炭黑,型号为MA600)和脱模剂(巴西棕榈蜡)通过高速混合机在室温下以800rpm的转速充分混合后,于70~110℃通过双螺杆捏合机进行熔融捏合,然后将捏合后的物料冷却和粉碎,即得到所述热固性树脂组合物。
性能测试
(1)螺旋流动长度
根据《SJ/T 11197-2013环氧塑封料》所示的方法,取15g待测树脂组合物样品,于传递模塑压力机上注入EMMI-1-66的螺旋流动金属模具内,进行样品螺旋流动长度的测定,设置上下模温度均为175±3℃,传递压力为(125kg±5kg)cm-2,传递速度是(6.0cm±0.1cm)s-1,固化120s,然后从金属模具内取出样品,读出螺旋流动长度,精确到0.5cm,同一样品测试三次,取其平均值,传递压力是用总压力除以注塑头面积求得。
(2)凝胶时间
根据《SJ/T 11197-2013环氧塑封料》所示的方法,将电热板加热到175℃±2℃,取0.3~0.5g树脂组合物样品放在电热板上,样品摊平面积约为5cm2,熔融开始计,用针状搅拌尖端或平铲搅拌,粉料逐渐变成凝胶状(样品不能拉成丝)为终点,读出所需时间,同样操作重复两次,取其平均值。
(3)弯曲强度、弯曲模量
使用注射模塑机在175℃下将树脂组合物成型,再进行后固化,条件是:175℃下2小时,220℃下2小时;然后按照中华人民共和国国家标准GB/T 9341-2008《塑料弯曲性能的测定》进行测试。
(4)玻璃化转变温度(Tg)
使用注射模塑机在175℃下将树脂组合物成型,再进行后固化,条件是:175℃下2小时,220℃下4小时;使用动态热机械分析仪,按照标准ASTM E1640-2013《采用动态力学分析的玻璃转变温度分配的标准试验方法》进行Tg的测试。
实施例1~3以及对比例1~2的性能测试结果如下表3所示:
表3
从表3的测试结果可知,本发明的树脂组合物的螺旋流动长度与对比例1相近,具有良好的充模能力,符合现有商用模塑料的加工工艺。同时,本发明的树脂组合物的凝胶时间与对比例1接近,比对比例2短,这是由于在本发明的树脂组合物中,DDM胺基和马来酰亚胺基的迈克尔加成反应在较低温度下进行,可以在目前商用电子封装环氧模塑料的固化成型工艺下快速成型加工。
相较于对比例2的树脂组合物,本发明的实施例1中树脂组合物有更高的Tg(363℃),这是由于本发明的树脂组合物具有更高的交联密度,同时由于各组分含有的大量芳环结构,树脂组合物的固化网络的刚性较强,对于碳化硅(SiC)、氮化镓(GaN)等第三代半导体器件封装有更高的使用价值。
本发明的树脂组合物固化后的常温弯曲强度略低于对比例1,高于对比例2,弯曲模量高于对比例1和对比例2,这是由于本发明的组合物中含有一种丁香酚烯丙基醚聚硅氧烷,在基体树脂中具有良好相容性和分散性,其结构中含有芳香环和烯丙基结构,烯丙基能够与马来酰亚胺基团进行加成反应,保证固化物的交联密度和Tg,并有效提高固化物的韧性,同时树脂组合物中含有大量芳香环结构,保证了固化网络的刚性。
本发明的树脂组合物固化后在260℃下的弯曲强度高于常温下的弯曲强度,这是因为本发明的树脂组合物具有较高的Tg,在高温下仍呈现玻璃态,表现出良好的高温韧性,由于对比例2中采用1,2-环氧化聚丁二烯(JP-100)做为树脂组合物的增韧剂,虽然JP-100能分别与马来酰亚胺基团和酚羟基发生反应,与树脂交联网络有较好的相容性,但JP-100中缺少刚性的芳香基团,使树脂组合物的交联网络刚性不足,这点通过实施例1与对比例2的测试结果加以证实。
以上所述仅是本发明的优选实施方式,应当指出:对于本技术领域的普通技术人员来说,在不脱离本发明原理的前提下,还可以做出若干改进和润饰,这些改进和润饰也应视为本发明的保护范围。
Claims (10)
1.一种第三代半导体器件封装用马来酰亚胺树脂基组合物,其特征在于,所述组合物包括苯甲烷马来酰亚胺寡聚物、多官能环氧树脂、芳香胺固化剂、固化促进剂、无机填料和丁香酚烯丙基醚聚硅氧烷;
所述丁香酚烯丙基醚聚硅氧烷具有以下式(6)所示的结构:
其中,m和n为0~30范围内的整数;
所述多官能环氧树脂和苯甲烷马来酰亚胺寡聚物的质量比为1∶1~1∶5;
所述芳香胺固化剂的含量为多官能环氧树脂和苯甲烷马来酰亚胺寡聚物二者总量的5~15wt%;
所述丁香酚烯丙基醚聚硅氧烷的含量为苯甲烷马来酰亚胺寡聚物、多官能环氧树脂、芳香胺固化剂三者总量的1~15wt%;
所述固化促进剂的含量为苯甲烷马来酰亚胺寡聚物、多官能环氧树脂、芳香胺固化剂三者总量的0.5~5wt%;
所述无机填料的含量为马来酰亚胺树脂基组合物总量的70~90wt%。
2.根据权利要求1所述的一种第三代半导体器件封装用马来酰亚胺树脂基组合物,其特征在于,所述多官能环氧树脂和苯甲烷马来酰亚胺寡聚物的质量比为1∶1~1∶3;
所述芳香胺固化剂的含量为所述多官环氧树脂和所述苯甲烷马来酰亚胺寡聚物二者总量的10~15wt%;
所述丁香酚烯丙基醚聚硅氧烷的含量为所述苯甲烷马来酰亚胺寡聚物、所述多官能环氧树脂、所述芳香胺固化剂三者总量的3~10wt%;
所述固化促进剂的含量为所述苯甲烷马来酰亚胺寡聚物、所述多官能环氧树脂、所述芳香胺固化剂三者总量的0.5~3wt%;
所述无机填料的含量为马来酰亚胺树脂基组合物总量的75~85wt%。
3.根据权利要求1或2所述的一种第三代半导体器件封装用马来酰亚胺树脂基组合物,其特征在于,所述丁香酚烯丙基醚聚硅氧烷制备方法如下:
步骤1,以八甲基环四硅氧烷、1,3,5,7-四甲基环四硅氧烷、1,1,3,3-四甲基二硅氧烷为原料,在阳离子引发剂作用下,发生聚合反应得到含氢聚硅氧烷;
步骤2,将上述步骤1制备的含氢聚硅氧烷与丁香酚在催化剂或辐射条件下反应得到丁香酚基聚硅氧烷;
步骤3,将上述步骤2制备的丁香酚基聚硅氧烷与烯丙基卤代烃在缚酸剂存在的条件下反应得到丁香酚烯丙基醚聚硅氧烷。
4.根据权利要求3所述的一种第三代半导体器件封装用马来酰亚胺树脂基组合物,其特征在于,步骤1中,所述阳离子引发剂包括质子酸类、路易斯酸类或其他阳离子引发剂;所述其他阳离子引发剂包括碘、氧鎓离子、高氯酸盐、环庚三烯盐和三苯基甲基盐。
步骤2中,所述催化剂包括有机碱类化合物、有机过氧化物、偶氮类化合物、贵金属化合物;
步骤2中,所述辐射条件包括紫外线、阿尔法射线、贝塔射线、伽马射线、X射线、中子射线;
步骤3中,所述烯丙基卤代烃包括烯丙基碘、烯丙基氯、烯丙基溴、烯丙基氟;
步骤3中,所述缚酸剂包括三乙胺、吡啶、N,N-二异丙基乙胺、4-二甲氨基吡啶、三乙醇胺、四丁基溴化铵、碳酸钾、碳酸铵、碳酸钠、氢氧化钠、氢氧化钙、氢氧化钾、氢氧化铁、碳酸钙、碳酸铯、磷酸钠、醋酸钠。
8.根据权利要求1或2所述的一种第三代半导体器件封装用马来酰亚胺树脂基组合物,其特征在于,所述固化促进剂为叔胺、咪唑类化合物、有机磷化合物、乙酰丙酮金属络合物、过氧化物中的一种或两种以上组合使用。
9.根据权利要求1或2所述的一种第三代半导体器件封装用马来酰亚胺树脂基组合物,其特征在于,所述无机填料包括球形熔融二氧化硅,所述球形熔融二氧化硅的平均粒径为0.01~30μm,含量为无机填料总量的50~100wt%。
10.根据权利要求1或2所述的一种第三代半导体器件封装用马来酰亚胺树脂基组合物,其特征在于,所述组合物中还包括添加剂,所述添加剂包括硅烷偶联剂、着色剂、阻燃剂以及脱模剂中的一种或多种。
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