CN115004362B - Cooling structure and radiator - Google Patents
Cooling structure and radiator Download PDFInfo
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- CN115004362B CN115004362B CN202080090152.9A CN202080090152A CN115004362B CN 115004362 B CN115004362 B CN 115004362B CN 202080090152 A CN202080090152 A CN 202080090152A CN 115004362 B CN115004362 B CN 115004362B
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- path
- refrigerant
- cooling
- flow path
- inflow
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
Abstract
The heat sink (1) has a cooling body (10) to which a plurality of elements (2) are mounted in parallel. An inflow path (11) for the refrigerant, a flow path (12) for the refrigerant supplied from the inflow path (11), and an outflow path (13) for the refrigerant supplied from the flow path (12) are formed in the cooling body (10). The flow path (12) is formed corresponding to the mounting location of the element (2). A plurality of fin sections (14) are closely arranged on one surface of the flow path (12).
Description
Technical Field
The present invention relates to a cooling structure of a radiator.
Background
For cooling a component with high heat generation exemplified by a power semiconductor module or the like, for example, heat sinks shown in patent documents 1 to 3 are applied.
The radiator of patent document 1 has a plurality of fins arranged in a refrigerant inflow path in order to minimize pressure loss of the refrigerant, increase heat radiation effect, and minimize temperature deviation over the entire surface of the element. In particular, the fins are closely aligned in the direction of the discharge portion of the refrigerant. In addition, the contact surface area with the refrigerant is increased from the inflow side to the discharge side of the refrigerant, thereby realizing a reduction in the flow pressure loss of the refrigerant.
In the radiator of patent document 2, pin-shaped fins having low fluid resistance are arranged in a region where high cooling performance is required in order to suppress an increase in pressure loss in the same radiator. Further, a fin having a shape in which a plurality of serpentine grooves are juxtaposed may be disposed in a region having relatively low cooling performance, thereby suppressing an increase in pressure loss.
The radiator of patent document 3 has a plurality of pin-shaped fins standing on a base surface opposite to the heat generating body, and the fins are accommodated in a water jacket. In particular, the plurality of fins are arranged locally and closely on the base surface, thereby adjusting the flow resistance.
Prior art literature
Patent literature
Patent document 1: japanese patent laid-open publication No. 2013-98530
Patent document 2: japanese patent application laid-open No. 2018-120904
Patent document 3: japanese patent application laid-open No. 2015-226039
Non-patent literature
Non-patent document 1: tian Zhengguang, well regulation, "psychology study", tokyo university of Motor publication, 10 nd 1999
Disclosure of Invention
The radiator of patent document 1 is effective when the heat generation amounts of the plurality of elements disposed in the same radiator are different from each other, but cannot be said to be effective when the heat generation amounts of the disposed elements are the same, and when temperature imbalance occurs. In addition, when water paths are formed in parallel in the radiator, water path walls need to be provided between the water paths to ensure flow balance, which leads to an increase in pressure loss.
The radiator of patent document 2 is provided with a flow path that meanders the flow of the refrigerant, and when the flow rate increases, the pressure loss increases in a considerable proportion as compared with the pin-shaped fin structure. In addition, even if the size is reduced, the cooling efficiency of the pressure loss is reduced.
In the heat sinks of patent documents 1 to 3, when the inlet and the outlet of the refrigerant are provided at the diagonal positions of the cooling body due to restrictions on the device structure or the like, the arrangement of the fins in the cooling body is not fixed, and thus the flow of the refrigerant is not uniform.
In view of the above, an object of the present invention is to provide a cooling structure of a radiator having a plurality of heating elements mounted thereon, in which the entire radiator is efficiently and uniformly cooled by a fin structure having a simple processing, and in which the pressure loss is reduced and reduced.
In one embodiment of the present invention, the cooling body portion includes a plurality of heat generating elements mounted in parallel, an inflow path of the refrigerant, a flow path of the refrigerant supplied from the inflow path, and an outflow path of the refrigerant supplied from the flow path are formed in the cooling body portion, the flow path is formed in correspondence with a mounting portion of the heat generating elements, and a plurality of fin portions are closely erected on one surface of the flow path.
In another aspect of the present invention, in the cooling structure, a partition is provided in the flow path at a position corresponding to the space between the parallel heating elements.
In another aspect of the present invention, in the cooling structure, a plurality of fin portions facing the inflow path and the outflow path among the plurality of fin portions are formed to have a smaller diameter than the other plurality of fin portions.
In another aspect of the present invention, in the cooling structure, the plurality of fin portions form a cylinder.
In another aspect of the present invention, in the cooling structure, the plurality of fin portions form a prism, and a corner of the prism faces the flow of the refrigerant.
In another aspect of the present invention, in the cooling structure, the cooling body portion is formed in a long plate shape, the inflow path is formed along one longitudinal end of the cooling body portion, the outflow path is formed along the other longitudinal end of the cooling body portion, and the outflow port of the refrigerant communicating with the outflow path is formed at a diagonal position of the cooling body portion with respect to the inflow port of the refrigerant communicating with the inflow path.
Another aspect of the present invention is a radiator having the cooling structure of any one of the aspects described above.
With the above-described invention, in the cooling structure of the radiator, the entire radiator can be efficiently and uniformly cooled with the fin portion structure having a simple processing, and the pressure loss can be reduced and miniaturized.
Drawings
Fig. 1 is a plan view showing an internal structure of a radiator according to a first embodiment of the present invention.
Fig. 2 is a plan view showing an internal structure of a radiator according to a second embodiment of the present invention.
Fig. 3 is a plan view showing an internal structure of a radiator according to a third embodiment of the present invention.
Fig. 4 (a) is a plan view showing the internal structure of a radiator according to a fourth embodiment of the present invention, and (b) is a plan view of a fin portion according to this embodiment.
Detailed Description
Hereinafter, embodiments of the present invention will be described with reference to the drawings.
First embodiment
A radiator 1 having a cooling structure as an embodiment of the present invention shown in fig. 1 is provided with a plurality of elements 2 as heating elements. As the element 2, for example, a power semiconductor module is cited. In this embodiment, 4 elements 2 are mounted, but the number of heating elements of the present invention is not limited to the number of elements of this embodiment.
The heat sink 1 has a cooling body 10, and 4 elements 2 are mounted in parallel to the cooling body 10. The cooling body 10 is formed into a rectangular parallelepiped with a long plate shape, and is made of a steel material having relatively high heat conductivity, such as an aluminum alloy. An inflow path 11, a flow path 12, and an outflow path 13 are formed in the cooling body 10.
The inflow path 11 is configured to circulate a refrigerant (e.g., cooling water) flowing in from an inflow port 17 at an upstream end of the cooling body 10. The inflow path 11 is formed along one longitudinal end of the cooling body 10. The communication surface 111, in which the inner surface of the inflow path 11 communicates with the inner surface of the upstream-most flow path 12, is curved. Similarly, the communication surface 112, in which the inner surface of the inflow path 11 communicates with the inner surface of the downstream-most flow path 12, is also formed into a curved surface.
The flow path 12 is configured to circulate the refrigerant supplied from the inflow path 11. The flow paths 12 are formed corresponding to the mounting portions of the respective elements 2. A plurality of fin portions 14 are provided so as to stand closely on one surface of the flow path 12. The fin portion 14 is formed into a cylinder. The fin portions 14 are arranged closely along the flow direction of the refrigerant at a pitch of, for example, "interval perpendicular to the flow direction of the refrigerant x interval in the flow direction=3×2".
In the flow path 12, a partition 15 is provided at a portion corresponding to the space between the parallel elements 2. The downstream side corner 151 of the end of the partition 15 facing the inflow path 11 forms a curved surface. On the other hand, the upstream side corner 152 of the end of the partition 15 facing the outflow path 13 is also formed into a curved surface. Further, curved convex portions 153 are provided on the upstream side and downstream side surfaces of the partition portion 15 in the flow direction of the refrigerant. Further, curved surface convex portions 121 having the same shape as the curved surface convex portions 153 are also provided in the same direction on the inner side surfaces of the flow paths 12 on the most upstream side and the most downstream side.
The outflow path 13 is configured to circulate the refrigerant supplied from the flow path 12. The refrigerant flows out from the outflow port 18 at the downstream end of the cooling body 10. The outflow path 13 is formed along the other longitudinal end of the cooling body 10, which is the longitudinal direction of the cooling body 11, while facing the inflow path 11. The outflow port 18 communicating with the outflow path 13 is formed at a diagonal position of the cooling body 10 with respect to the inflow port 17 communicating with the inflow path 11.
The communication surface 131, in which the inner surface of the outflow path 13 communicates with the inner surface of the upstream-most flow path 12, is formed into a curved surface. Similarly, the communication surface 132, in which the inner surface of the outflow path 13 communicates with the inner surface of the downstream-most flow path 12, is also formed into a curved surface.
With the radiator 1 described above, the refrigerant is supplied in parallel to the cooling body 10 corresponding to the mounting portion of the element 2, and the refrigerant is uniformly supplied to the flow paths 12 corresponding to the positions of the respective elements 2, so that the pressure loss is reduced.
The expression of the pressure loss flowing through the piping is generally as follows.
P＝ρ×g×h[Pa]
ρ: fluid Density [ kg/m ] 3 ]
g: gravitational acceleration [ m/s ] 2 ]
h: head loss (=hf×hb) [ m ]
hf: frictional head loss [ m ]
hb: bending head loss [ m ]
Where hf=4fx (V2/2 g) x (L/d) (van der equation).
V: pipeline flow rate [ m/s ]
L: tube length [ m ]
d: pipe inner diameter [ m ]
In addition, hb= (0.131+ (0.1632 × (d/r)/(7/2))) × ((θ/90)/(1/2))× (V2/2 g) (non-patent document 1).
r: radius of curvature [ mm ]
θ: angle of path [ ° ]
According to the above expression, since the pressure loss increases in proportion to the square of the flow velocity, the diameters of the inflow path 11 and the outflow path 13, in which the parallel branched refrigerants merge, are set to the maximum, and the fin portions 14 are closely arranged as described above, whereby the pressure loss of the radiator 1 as a whole is reduced.
Therefore, with the radiator 1 of the present embodiment, the entire body can be efficiently and uniformly cooled with a fin structure with a simple process, and the pressure loss can be reduced. In particular, since a plurality of elements 2 can be cooled by a single heat sink 1, miniaturization can be achieved.
The communication surfaces 111, 112 of the inflow path 11 and the flow path 12 are formed into curved surfaces, so that the pressure loss on the most upstream side and the most downstream side of the inflow path 11 is reduced, and the refrigerant is smoothly guided from the inflow path 11 to the most upstream side and the most downstream side of the flow path 12. The communication surfaces 131 and 132 of the flow path 12 and the outflow path 13 are curved, so that the pressure loss at the most upstream and most downstream sides of the outflow path 13 is reduced, and the refrigerant is smoothly guided from the flow path 12 at the upstream and most downstream sides to the outflow path 13.
The cooling body 10 is provided with a partition 15, so that the refrigerant introduced into the inflow path 11 is guided to each of the flow paths 12. In particular, the downstream corner 151 of the partition 15 is curved, so that the pressure loss at the end of the partition 15 facing the inflow path 11 is reduced, and the refrigerant is further smoothly guided to the flow path 12. In addition, the upstream corner 152 of the partition 15 is also formed into a curved surface, so that the pressure loss at the end of the partition 15 facing the outflow path 13 is reduced, and the flow of the refrigerant is further smoothed.
Further, by providing the curved convex portion 153 on the side surface of the partition portion 15, concentration of the flux facing the side surface of the partition portion 15 is suppressed, and heat conduction to the heat sink 1 of the element 2 is increased, so that the cooling effect of the heat sink 1 is improved.
Further, the fin portion 14 is formed in a cylindrical shape, and thus the pressure loss due to the fin portion 14 can be minimized.
Second embodiment
The radiator 1 shown in fig. 2 is formed in the same manner as the radiator 1 of the first embodiment except that the partition 15 is not provided. Further, the fin portions 14 are added in the space without the partition portion 15 at the same pitch as the fin portions 14 of the first embodiment.
With the radiator 1 according to the present embodiment, the effect of the radiator 1 according to the first embodiment is improved by eliminating the obstruction to the flow of the refrigerant and improving the pressure loss. Further, by adding the fin portions 14, the contact surface area between the inner surface of the cooling body portion 10 and the refrigerant is enlarged, and the cooling performance of the radiator 1 is also improved.
Third embodiment
The radiator 1 shown in fig. 3 is formed in the same manner as the radiator 1 of the second embodiment except that the plurality of fin portions 14, which are surrounded by the broken line BL and face the inflow path 11 and the outflow path 13, of the plurality of fin portions 14 are formed smaller in diameter than the other plurality of fin portions 14. For example, when the diameters of the other fin portions 14 are Φ2, the diameters of the fin portions 14 facing the inflow path 11 and the outflow path 13 are set to Φ1.5.
With the radiator 1 according to the present embodiment described above, the resistance on the inflow side and the outflow side of the flow path 12 can be reduced, and the pressure loss can be further reduced in addition to the effects of the first embodiment and the second embodiment.
Embodiment 4
The radiator 1 shown in fig. 4 (a) is formed in the same manner as the radiator 1 of the second embodiment except that the fin portions 16 are provided instead of the fin portions 14.
The fin portion 16 forms a prism, for example, a square cross-section quadrangular prism having an aspect ratio of 2×2. A corner 161 of the fin portion 16 is disposed so as to face the flow F of the refrigerant (fig. b).
In the radiator 1 according to the present embodiment, since the corner 161 of the fin portion 16 faces the flow F of the refrigerant, turbulence caused by contact between the refrigerant and the fin portion 14 is suppressed in addition to the effects of the first and second embodiments, and further reduction of pressure loss is achieved.
In another embodiment of the fin portion of the present invention, a quadrangular prism having a diamond-shaped cross section is exemplified. In particular, by disposing the quadrangular prism such that the longer diagonal line of the diamond shape extends along the flow, the pressure loss can be reduced.
Claims (6)
1. A cooling structure, wherein,
the cooling structure comprises a cooling main body part, a plurality of heating elements are arranged in parallel on the cooling main body part,
an inflow path of the refrigerant, a flow path of the refrigerant supplied from the inflow path, and an outflow path of the refrigerant supplied from the flow path are formed in the cooling body portion,
the flow path is formed corresponding to the mounting portion of the heating element,
a plurality of fin portions which form a column are closely erected on one surface of the flow path,
the cooling body portion is formed in a long plate shape,
the inflow path is formed along one longitudinal end of the cooling body part,
the outflow path is formed along the other longitudinal end of the cooling body part,
an outflow port of the refrigerant communicating with the outflow path is formed at a diagonal position of the cooling body portion with respect to an inflow port of the refrigerant communicating with the inflow path,
a communication surface of the inflow path, in which one inner surface communicates with one inner surface of the flow path on the most upstream side, forms a curved surface, and a communication surface of the inflow path, in which the other inner surface communicates with the other inner surface of the flow path on the most downstream side,
curved convex portions are arranged along the flow direction of the refrigerant on the inner side surfaces of the flow paths on the most upstream side and the most downstream side.
2. The cooling structure according to claim 1, wherein,
in the flow path, a partition is provided at a portion corresponding to the space between the parallel heating elements,
an upstream side corner of an end of the partition facing the outflow path forms a curved surface,
another curved convex portion is arranged on the upstream side and the downstream side of the partition portion in the flow direction of the refrigerant.
3. The cooling structure according to claim 1, wherein,
the plurality of fin portions facing the inflow path and the outflow path are formed smaller in diameter than the other plurality of fin portions.
4. A heat sink, wherein,
the heat sink has the cooling structure of claim 1 or 2.
5. A cooling structure, wherein,
the cooling structure comprises a cooling main body part, a plurality of heating elements are arranged in parallel on the cooling main body part,
an inflow path of the refrigerant, a flow path of the refrigerant supplied from the inflow path, and an outflow path of the refrigerant supplied from the flow path are formed in the cooling body portion,
the flow path is formed corresponding to the mounting portion of the heating element,
a plurality of fin portions which form prisms are closely erected on one surface of the flow path,
the cooling body portion is formed in a long plate shape,
the inflow path is formed along one longitudinal end of the cooling body part,
the outflow path is formed along the other longitudinal end of the cooling body part,
an outflow port of the refrigerant communicating with the outflow path is formed at a diagonal position of the cooling body portion with respect to an inflow port of the refrigerant communicating with the inflow path,
a communication surface of the inflow path, in which one inner surface communicates with one inner surface of the flow path on the most upstream side, forms a curved surface, and a communication surface of the inflow path, in which the other inner surface communicates with the other inner surface of the flow path on the most downstream side,
a corner of the prism is opposite the flow of the refrigerant,
an angular projection is disposed on the inner side surface of the flow path on the most upstream side and the most downstream side in the flow direction of the refrigerant.
6. A heat sink, wherein,
the heat sink has the cooling structure of claim 5.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2019235533A JP6874823B1 (en) | 2019-12-26 | 2019-12-26 | Cooling structure and heat sink |
| JP2019-235533 | 2019-12-26 | ||
| PCT/JP2020/034119 WO2021131175A1 (en) | 2019-12-26 | 2020-09-09 | Cooling structure and heatsink |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN115004362A CN115004362A (en) | 2022-09-02 |
| CN115004362B true CN115004362B (en) | 2023-06-30 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202080090152.9A Active CN115004362B (en) | 2019-12-26 | 2020-09-09 | Cooling structure and radiator |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP6874823B1 (en) |
| CN (1) | CN115004362B (en) |
| WO (1) | WO2021131175A1 (en) |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02291154A (en) * | 1989-04-28 | 1990-11-30 | Nec Corp | Ceramic package provided with heat sink |
| JP2007214157A (en) * | 2006-02-07 | 2007-08-23 | Meidensha Corp | Water-cooled cooling structure |
| JP4861840B2 (en) * | 2007-01-26 | 2012-01-25 | アイシン・エィ・ダブリュ株式会社 | Heating element cooling structure and driving device |
| JP5901343B2 (en) * | 2012-02-24 | 2016-04-06 | 三菱電機株式会社 | Cooler and cooling device |
| JP2013219127A (en) * | 2012-04-06 | 2013-10-24 | Sumitomo Light Metal Ind Ltd | Heat exchanger |
| WO2014069174A1 (en) * | 2012-10-29 | 2014-05-08 | 富士電機株式会社 | Semiconductor device |
| EP3745455B1 (en) * | 2015-06-03 | 2021-11-17 | Mitsubishi Electric Corporation | Manufacturing method for heat radiation fins in liquid-type cooling apparatus |
| CN110383470B (en) * | 2017-03-16 | 2023-05-09 | 三菱电机株式会社 | Cooling system |
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2019
- 2019-12-26 JP JP2019235533A patent/JP6874823B1/en active Active
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2020
- 2020-09-09 CN CN202080090152.9A patent/CN115004362B/en active Active
- 2020-09-09 WO PCT/JP2020/034119 patent/WO2021131175A1/en active Application Filing
Also Published As
| Publication number | Publication date |
|---|---|
| CN115004362A (en) | 2022-09-02 |
| JP2021103758A (en) | 2021-07-15 |
| JP6874823B1 (en) | 2021-05-19 |
| WO2021131175A1 (en) | 2021-07-01 |
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