CN114980537A - Manufacturing method of PCB - Google Patents
Manufacturing method of PCB Download PDFInfo
- Publication number
- CN114980537A CN114980537A CN202210750450.7A CN202210750450A CN114980537A CN 114980537 A CN114980537 A CN 114980537A CN 202210750450 A CN202210750450 A CN 202210750450A CN 114980537 A CN114980537 A CN 114980537A
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- light
- hole
- copper
- light guide
- layer
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/105—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by conversion of non-conductive material on or in the support into conductive material, e.g. by using an energy beam
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
The invention relates to the technical field of PCB processing, and discloses a PCB manufacturing method, which comprises the following steps: providing a multi-layer copper-clad substrate, and drilling a through hole on the multi-layer copper-clad substrate; spraying a mixed coating containing photosensitive resin and conductive particles on the wall of the through hole; the light guide piece extends into the through hole, detection light and irradiation light are emitted through the light guide piece, the detection light detects the copper-clad layer in the through hole, and the irradiation light exposes the mixed coating between at least two preset copper-clad layers; removing the unexposed mixed coating on the wall of the through hole; a conductive layer is formed on the exposed mixed dope. The manufacturing method of the PCB provided by the invention can selectively conduct a plurality of copper-clad layers on a multilayer copper-clad substrate, has low requirements on material characteristics, does not influence normal copper treatment, and ensures the conduction performance and reliability of the hole wall conducting layer.
Description
Technical Field
The invention relates to the technical field of PCB processing, in particular to a manufacturing method of a PCB.
Background
Along with the rapid development of PCB trade, the product structure upgrades step by step, presents diversified, complicated, and the preparation degree of difficulty promotes by a wide margin, has a multilayer PCB product at present, need set up the copper facing disconnection of being connected between the appointed layer, and present main realization technique is: firstly, adopting a special material, and realizing a disconnection effect by the characteristic that copper can not be deposited and electroplated on the material; secondly, the activating agent is treated through a chemical copper deposition process; and thirdly, after copper is dissolved, carrying out washing treatment to remove the copper dissolving layer on the specified layer of the hole wall. The three main process methods have high requirements on material characteristics, and meanwhile, the treatment mode is special, so that the influence on normal copper treatment exists, the hole copper at a normal position falls off and does not have copper in serious cases, and the conductivity and reliability of a hole wall copper plating layer are seriously influenced, thereby limiting the popularization and application of the technology.
Therefore, a method for manufacturing a PCB is needed to solve the above technical problems.
Disclosure of Invention
Based on the above, the present invention aims to provide a method for manufacturing a PCB, which can selectively conduct a plurality of copper-clad layers on a multilayer copper-clad substrate, has low requirements on material characteristics, does not affect normal copper-melting treatment, and ensures the conductivity and reliability of a hole-wall conductive layer.
In order to achieve the purpose, the invention adopts the following technical scheme:
provided is a method for manufacturing a PCB, comprising the following steps:
providing a multi-layer copper-clad substrate, and drilling a through hole on the multi-layer copper-clad substrate;
spraying a mixed coating containing photosensitive resin and conductive particles on the wall of the through hole;
a light guide piece extends into the through hole, and probe light and irradiation light are emitted through the light guide piece, the probe light detects the copper-coated layer in the through hole, and the irradiation light exposes at least two mixed coatings preset between the copper-coated layers;
removing the unexposed mixed coating on the wall of the through hole;
forming a conductive layer on the exposed mixed dope.
As an optional technical solution of the PCB manufacturing method, the step of exposing the mixed paint between the copper-clad layers by the irradiation light specifically includes the steps of:
the light guide piece gradually extends into the through hole;
the detection light detects a first preset copper-clad layer;
the irradiation light is emitted into the light guide piece, and the irradiation light emitted by the light guide piece rotates around the axis direction of the through hole;
the detection light detects a second preset copper-clad layer, and the light guide piece stops extending into the through hole;
the light guide part completely exits the through hole, or the light guide part completely exits the through hole after reciprocating between the first preset copper-coated layer and the second preset copper-coated layer at least once along the through hole.
As an optional technical solution of the PCB manufacturing method, the step of exposing the mixed paint between the copper-clad layers by the irradiation light specifically includes the steps of:
the light guide piece extends into the through hole;
the detection light detects a second preset copper-clad layer;
the irradiation light is emitted into the light guide piece, and the irradiation light emitted by the light guide piece rotates around the axis direction of the through hole;
the light guide part gradually exits from the through hole, and the detection light detects a first preset copper-clad layer;
the light guide part completely exits the through hole, or the light guide part completely exits the through hole after reciprocating between the first preset copper-coated layer and the second preset copper-coated layer at least once along the through hole.
As an optional technical solution of the PCB manufacturing method, the step of rotating the irradiated light emitted by the light guide around the axis direction of the through hole specifically includes:
the light guide member rotates around the axis direction of the through hole.
As an optional technical solution of the PCB manufacturing method, the detecting light detects the first predetermined copper-clad layer, and after the irradiating light is incident into the light guide member, the method further includes the steps of:
the light guide member is suspended from penetrating into the through hole;
the irradiation light emitted by the light guide piece rotates at least one circle around the axis direction of the through hole;
the light guide continues deep into the through hole.
As an optional technical solution of the PCB manufacturing method, after the detection light detects the second preset copper-clad layer, the method further includes the following steps:
the irradiation light emitted by the light guide piece rotates at least one circle around the axis direction of the through hole.
As an optional technical solution of the PCB manufacturing method, forming the conductive layer on the exposed mixed paint specifically includes the following steps:
depositing a copper layer on the exposed hybrid coating material;
and thickening the copper layer deposited on the wall of the through hole by electroplating.
As an optional technical solution of the PCB manufacturing method, the light guide member is an optical fiber, a first light path and a second light path are arranged in the optical fiber in parallel along an axial direction of the optical fiber, the probe light is incident along the first light path, and the irradiation light is incident along the second light path.
As an optional technical solution of the PCB manufacturing method, a reflection portion is disposed at an end of the optical fiber, the probe light is emitted along a first direction after being reflected by the reflection portion, the illumination light is emitted along a second direction after being reflected by the reflection portion, and the first direction and the second direction are different from each other.
As an optional technical solution of the PCB manufacturing method, the first direction and the second direction have opposite projection directions on the cross section of the optical fiber.
As an optional technical scheme of the manufacturing method of the PCB, the reflection portion is provided with a groove structure, the groove structure is provided with an isosceles right triangle, and the detection light and the illumination light are respectively reflected by two right-angle sides of the groove structure and then emitted in opposite directions.
The invention has the beneficial effects that:
according to the manufacturing method of the PCB, the mixed coating containing the photosensitive resin and the conductive particles is sprayed on the inner wall of the through hole, the photosensitive resin in the mixed coating is solidified after exposure and is not easy to dissolve, and the conductive particles enable the exposed mixed coating and the conductive layer to have good bonding force. The light guide piece provides a guiding function for detection light and irradiation light simultaneously, after the detection light detects a copper-clad layer in a through hole, the irradiation light irradiates mixed paint on a hole wall corresponding to a preset target copper-clad layer, so that the mixed paint in a target area is solidified, after unexposed mixed paint is removed, a conductive layer is formed on the exposed mixed paint in the target area, at least two target copper-clad layers are conducted, the purpose of selectively conducting a plurality of copper-clad layers on a multilayer copper-clad substrate is achieved, the requirement on material characteristics is not high, normal copper melting treatment is not influenced, and the conducting performance and reliability of the hole wall conductive layer can be guaranteed.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings used in the description of the embodiments of the present invention will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the contents of the embodiments of the present invention and the drawings without creative efforts.
FIG. 1 is a schematic diagram illustrating steps of a method for fabricating a PCB according to the present invention;
FIG. 2 is a flow chart of a method of fabricating a PCB provided by the present invention;
FIG. 3 is a detailed flowchart of step S3 provided by the present invention;
FIG. 4 is a schematic view of the light guide and the light source according to the present invention;
fig. 5 is a detailed flowchart of step S5 provided by the present invention.
In the figure:
1. a through hole; 2. the lower surface is coated with a copper layer; 3. coating a copper layer on the upper surface; 4. a first copper clad interlayer; 5. a second copper clad interlayer; 6. mixing the coating; 7. a conductive layer; 10. detecting light; 20. irradiating light; 100. a light guide; 110. a first optical path; 120. a second optical path; 101. a reflection part.
Detailed Description
In order to make the technical problems solved, technical solutions adopted and technical effects achieved by the present invention clearer, the technical solutions of the embodiments of the present invention will be described in further detail below with reference to the accompanying drawings, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The embodiment provides a method for manufacturing a PCB, which is suitable for manufacturing a multilayer copper-clad substrate requiring selective conduction of at least two copper-clad layers through a conductive hole.
As shown in fig. 1 and 2, the manufacturing method mainly includes the following steps:
s1, providing a multilayer copper-clad substrate, and drilling a through hole 1 on the multilayer copper-clad substrate.
The upper surface layer (upper surface covers copper layer 3), the lower surface layer (lower surface covers copper layer 2) and at least one interlayer of the multilayer copper-clad substrate cover copper, as shown in fig. 2, in this embodiment, the multilayer copper-clad substrate includes two interlayers covering copper, which are respectively a first copper-clad interlayer 4 and a second copper-clad interlayer 5, wherein the copper covering on the first copper-clad interlayer 4 is penetrated through by a through hole 1, and is exposed on the hole wall, the second copper-clad interlayer 5 is arranged between the first copper-clad interlayer 4 and the lower surface layer, the copper covering of the second copper-clad interlayer 5 is arranged at an interval with the through hole 1, and the interval is at least 0.2mm, so that the second copper-clad interlayer 5 is prevented from being conducted with other layers through the copper layer on the through hole 1.
S2, spraying a mixed paint 6 on the wall of the through hole 1, wherein the mixed paint 6 comprises photosensitive resin and conductive particles.
S3, the light guide piece 100 extends into the through hole 1, the light guide piece 100 is emitted into the detection light 10 and the irradiation light 20, the detection light 10 detects the copper-clad layer in the through hole 1, and the irradiation light 20 exposes at least two mixed coatings 6 between the preset copper-clad layers.
Specifically, the copper-clad layer is detected according to the difference of the reflection rates of the resin on the hole wall and the copper-clad layer, the reflection rate of the copper-clad layer is greater than that of the resin, and when the detection equipment receives reflected light with the intensity greater than a preset value, the copper-clad layer is judged; in addition, since the photosensitive resin is sensitive to light of a specified wavelength (typically, wavelength 320-440nm ultraviolet light), when irradiated with light of a specified wavelength, polymerization occurs and curing occurs.
And S4, removing the unexposed mixed coating 6 on the wall of the through hole 1.
S5, a conductive layer 7 is formed on the exposed mixed dope 6.
Specifically, in the method for manufacturing a PCB provided in this embodiment, the mixed coating 6 including the photosensitive resin and the conductive particles is sprayed on the inner wall of the through hole 1, the photosensitive resin in the mixed coating 6 is cured after exposure and thus is not easily dissolved, and on the other hand, the conductive particles enable the exposed mixed coating 6 and the conductive layer 7 to have good bonding force. The light guide member 100 provides a guiding function for the detection light 10 and the irradiation light 20 at the same time, after the detection light 10 detects copper-coated layers in the through hole 1, the irradiation light 20 irradiates mixed paint 6 on corresponding hole walls between preset target copper-coated layers to cure the mixed paint 6 in a target area, after the unexposed mixed paint 6 is removed, a conductive layer 7 is formed on the exposed mixed paint 6 in the target area, so that at least two target copper-coated layers are conducted, the purpose of selectively conducting a plurality of copper-coated layers on a multilayer copper-coated substrate is achieved, the requirement on material characteristics is not high, normal copper melting treatment is not influenced at the same time, and the conducting performance and reliability of the hole wall conductive layer 7 can be ensured.
Preferably, the conductive particles are made into tiny particles dispersed in photosensitive resin, and the photosensitive resin needs to be made into transparent or semitransparent liquid mixed coating 6 so as to avoid influencing the light reflection rate of the resin and the copper layer on the hole wall of the through hole 1.
Preferably, the mixed paint 6 is uniformly sprayed on the wall of all the through holes 1 by using a spraying device, and the thickness is controlled to be between 10 and 20 mu m. The unexposed coating can be dissolved away by soaking in alkaline solution.
Preferably, the photosensitive resin may be made of a polyol acrylic polymer or the like.
Preferably, copper powder, silver powder or nickel powder can be used as the conductive particles, and the particle size of the particles can be nano-scale or micro-scale.
As shown in S3, step S3 specifically includes the following steps:
s31, gradually extending the light guide member 100 into the through hole 1;
s32, detecting the first preset copper-clad layer by the detection light 10, and judging the first preset copper-clad layer to be an initial copper layer;
s33, the light 20 is incident into the light guide 100, and the light 20 emitted from the light guide 100 rotates around the axis of the through-hole 1;
s37, the detecting light 10 detects the second predetermined copper clad layer, and the light guide 100 stops extending into the through hole 1.
In the present embodiment, the first predetermined copper-clad layer is the lower surface copper-clad layer 2 of the multi-layer copper-clad substrate, and the second predetermined copper-clad layer is the first copper-clad interlayer 4; the light guide member 100 extends into the through hole 1 from bottom to top, when the detection light 10 irradiates on the copper layer 2 coated on the lower surface, the irradiating light 20 starts to irradiate into the light guide member 100, and the irradiating light 20 emitted by the light guide member 100 rotates around the axis direction of the through hole 1, namely, the emitted irradiating light 20 spirally rises, when penetrating into the through hole 1, the hole wall of the through hole 1 is irradiated around the axis in a rotating way, so that the hole wall in a target area is fully and uniformly covered, and a reliable exposure effect is realized until the detection light 10 detects the first copper-clad interlayer 4, and the light guide member 100 stops not to further penetrate into the through hole 1.
Preferably, as shown in fig. 3, after step S33, the method further includes the following steps:
s34, the light guide member 100 stops penetrating into the through hole 1;
s35, the light 20 emitted by the light guide 100 rotates at least one circle around the axis of the through-hole 1 to fully expose the mixed paint 6 on the inner wall corresponding to the lower surface copper-clad layer 2, so as to ensure the curing effect of the area and improve the connection reliability between the lower surface copper-clad layer 2 and the conductive layer 7 on the inner wall;
s36, the light guide 100 continues to penetrate into the through hole 1.
In step S35 of the present embodiment, the irradiation light 20 emitted through the light guide 100 rotates once around the axial direction of the through-hole 1.
Preferably, as shown in fig. 3, after step S37, the method further includes the following steps:
s38, the light 20 emitted by the light guide 100 rotates at least one circle around the axis of the through hole 1 to fully expose the mixed paint 6 on the inner wall corresponding to the first copper-clad interlayer 4, thereby ensuring the curing effect of the area and improving the connection reliability between the first copper-clad interlayer 4 and the conductive layer 7 on the inner wall;
s39, taking out the light guide member 100.
In step S38 of the present embodiment, the irradiation light 20 emitted through the light guide 100 rotates once around the axial direction of the through-hole 1.
Preferably, between step S37 and step S38, the method further comprises the following steps:
In another embodiment of the present invention, the light guide 100 may also directly enter the second predetermined copper-clad layer, and then expose the first predetermined copper-clad layer from inside to outside, that is, the steps S31 to S37 may be replaced by:
the light guide 100 extends into the through hole 1;
the detection light 10 detects a second preset copper-clad layer;
the irradiating light 20 is incident into the light guide 100, and the irradiating light 20 emitted through the light guide 100 rotates around the axial direction of the through hole 1;
the light guide 100 gradually exits the through hole 1, and the detection light 10 detects the first predetermined copper-clad layer.
Preferably, one method for rotating the irradiation light 20 emitted from the light guide 100 around the axis of the through-hole 1 is: the light guide member 100 rotates around the axis direction of the through hole 1, the light source emitting the probe light 10 and the irradiation light 20 is fixed to the light guide member 100, and when the light guide member 100 rotates, the light source and the light guide member 100 rotate synchronously, so that the emitted irradiation light 20 rotates around the axis direction of the through hole 1.
Preferably, as shown in fig. 4, the light guide member 100 is an optical fiber, and the optical fiber is provided with a first light path 110 and a second light path 120 which are arranged in parallel along an axial direction thereof, the probe light 10 is incident along the first light path 110, and the irradiation light 20 is incident along the second light path 120. Of course, other transparent, long light guiding structures may be used for the light guide 100.
Further, as shown in fig. 4, a reflection portion 101 is provided at an end portion of the optical fiber, the probe light 10 is reflected by the reflection portion 101 and emitted in a first direction, and the irradiation light 20 is reflected by the reflection portion 101 and emitted in a second direction, the first direction and the second direction being different from each other.
Preferably, the first direction is opposite to the second direction in projection onto the plane of the cross-section of the optical fiber.
Preferably, as shown in fig. 4, the reflection portion 101 is configured as a groove structure, the cross section of the groove structure is configured as an isosceles right triangle, and the detection light 10 and the illumination light 20 are reflected by two right-angled sides of the groove structure and emitted in opposite directions.
In some embodiments, the groove structure may also be a cone structure, and the irradiation light 20 emitted from the light guide 100 is rotated around the axis of the through hole 1 by rotating the light source around the axis.
Optionally, the specific process of step S4 is: the entire multilayer copper-clad substrate is immersed in an alkaline solution to dissolve and remove the unexposed mixed paint 6 on the wall of the through-hole 1.
Optionally, as shown in fig. 5, step S5 specifically includes the following steps:
s51, depositing a copper layer on the exposed mixed paint 6;
and S52, thickening the copper layer deposited on the hole wall of the through hole 1 by electroplating.
The specific process of step S51 is: and immersing the whole multilayer copper-clad substrate into chemical copper deposition chemical water to perform chemical copper deposition, and depositing a compact conductive copper layer on the exposed hole wall with the conductive particles, wherein the thickness of the copper layer is 0.5-1.0 mu m.
After step S5, outer layer pattern fabrication and surface solder mask processing are performed on the multi-layer copper-clad substrate to obtain a PCB finished product, which is the prior art and will not be described herein again.
Alternatively, for other through holes 1 which do not need to be disconnected, step S3 is replaced by: turning off the probe light 10, and using the irradiation light 20 to expose the entire hole wall of the through hole 1 through the light guide 100; the rest steps are the same.
It is to be noted that the foregoing is only illustrative of the preferred embodiments of the present invention and the technical principles employed. It will be understood by those skilled in the art that the present invention is not limited to the particular embodiments described herein, but is capable of various obvious changes, rearrangements and substitutions as will now become apparent to those skilled in the art without departing from the scope of the invention. Therefore, although the present invention has been described in greater detail by the above embodiments, the present invention is not limited to the above embodiments, and may include other equivalent embodiments without departing from the spirit of the present invention, and the scope of the present invention is determined by the scope of the appended claims.
Claims (10)
1. A method for manufacturing a PCB is characterized by comprising the following steps:
providing a multilayer copper-clad substrate, and drilling a through hole (1) on the multilayer copper-clad substrate;
spraying a mixed coating (6) containing photosensitive resin and conductive particles on the wall of the through hole (1);
a light guide piece (100) extends into the through hole (1), and is shot into a detection light (10) and an irradiation light (20) through the light guide piece (100), the detection light (10) detects a copper-coated layer in the through hole (1), and the irradiation light (20) exposes at least two preset mixed coatings (6) between the copper-coated layers;
removing the unexposed mixed coating (6) on the wall of the through hole (1);
forming a conductive layer (7) on the exposed mixed dope (6).
2. The method for fabricating a PCB according to claim 1, wherein the irradiating light (20) exposes the mixed paint (6) between the copper-clad layers, comprising the steps of:
the light guide member (100) gradually extends into the through hole (1);
the detection light (10) detects a first preset copper-clad layer;
the irradiation light (20) is incident into the light guide member (100), and the irradiation light (20) emitted through the light guide member (100) rotates around the axial direction of the through hole (1);
the detection light (10) detects a second preset copper-clad layer, and the light guide piece (100) stops extending into the through hole (1).
3. The method for manufacturing a PCB according to claim 2, wherein the irradiating light (20) emitted by the light guide member (100) rotates around the axis direction of the through hole (1), and the method comprises the following steps:
the light guide member (100) rotates around the axis direction of the through hole (1).
4. The method for manufacturing a PCB according to claim 2, wherein the detecting light (10) detects the first predetermined copper-clad layer, and after the irradiating light (20) is injected into the light guide (100), the method further comprises the following steps:
the light guide (100) is suspended from penetrating into the through hole (1);
the irradiation light (20) emitted by the light guide (100) rotates at least one circle around the axial direction of the through hole (1);
the light guide (100) continues deeper into the through-hole (1).
5. The method for manufacturing a PCB according to claim 2, wherein after the detection light (10) detects the second predetermined copper-clad layer, the method further comprises the following steps:
the irradiation light (20) emitted by the light guide member (100) rotates at least one circle around the axis direction of the through hole (1).
6. Method for manufacturing a PCB according to claim 1, characterized in that forming the conductive layer (7) on the exposed hybrid paint (6), comprises in particular the steps of:
depositing a copper layer on the exposed hybrid paint (6);
thickening the copper layer deposited on the hole wall of the through hole (1) through electroplating.
7. The method for manufacturing a PCB according to claim 1, wherein the light guide member (100) is an optical fiber, the optical fiber is provided with a first light path (110) and a second light path (120) which are arranged in parallel along an axial direction thereof, the probe light (10) is incident along the first light path (110), and the irradiation light (20) is incident along the second light path (120).
8. The method for manufacturing the PCB according to claim 7, wherein a reflection part (101) is provided at an end of the optical fiber, the probe light (10) is emitted in a first direction after being reflected by the reflection part (101), the irradiation light (20) is emitted in a second direction after being reflected by the reflection part (101), and the first direction and the second direction are different from each other.
9. The method of claim 8, wherein the first direction is opposite to the second direction in a projection direction of the cross section of the optical fiber.
10. The method for manufacturing a PCB according to claim 8, wherein the reflecting part (101) is provided as a groove structure, the cross section of the groove structure is provided as an isosceles right triangle, and the probe light (10) and the illumination light (20) are respectively reflected by two right-angled sides of the groove structure and then emitted in opposite directions.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210750450.7A CN114980537A (en) | 2022-06-28 | 2022-06-28 | Manufacturing method of PCB |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210750450.7A CN114980537A (en) | 2022-06-28 | 2022-06-28 | Manufacturing method of PCB |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114980537A true CN114980537A (en) | 2022-08-30 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210750450.7A Pending CN114980537A (en) | 2022-06-28 | 2022-06-28 | Manufacturing method of PCB |
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| Country | Link |
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| CN (1) | CN114980537A (en) |
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- 2022-06-28 CN CN202210750450.7A patent/CN114980537A/en active Pending
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