CN114975192B - Can eliminate tectorial membrane device for wafer processing of bubble - Google Patents
Can eliminate tectorial membrane device for wafer processing of bubble Download PDFInfo
- Publication number
- CN114975192B CN114975192B CN202210895055.8A CN202210895055A CN114975192B CN 114975192 B CN114975192 B CN 114975192B CN 202210895055 A CN202210895055 A CN 202210895055A CN 114975192 B CN114975192 B CN 114975192B
- Authority
- CN
- China
- Prior art keywords
- fixed
- spring
- sliding
- strip
- film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention relates to the field of chip processing, in particular to a film coating device for wafer processing, which can eliminate bubbles and comprises a film coating base, a fixing frame, a water bag and a bubble removing assembly, wherein the film coating base comprises a workbench, a stretching assembly, a film frame and a conveyor belt, the workbench comprises a fixed base, a material placing disc, a first spring, a connecting piece and a tension spring, a circular hole is formed in the center of the top surface of the fixed base, strip-shaped sliding grooves are formed in two side surfaces of the fixed base, the stretching assembly comprises a sliding block, a first clamping block, a second clamping block, a positioning strip and a connecting rod, a positioning groove matched with the connecting piece to work is formed in the positioning strip, and a plurality of positioning bulges matched with the positioning strip to work are uniformly arranged on the strip surface of the conveyor belt. According to the invention, the film stretching assembly can automatically drive the film to move when a worker places the wafer on the workbench every time through the workbench, the stretching assembly, the film frame and the conveyor belt, so that the film can be covered on the wafer.
Description
Technical Field
The invention relates to the field of chip processing, in particular to a laminating device capable of eliminating bubbles for wafer processing.
Background
Wafer refers to a silicon wafer used to fabricate silicon semiconductor circuits, the starting material of which is silicon. And dissolving the high-purity polycrystalline silicon, doping the dissolved high-purity polycrystalline silicon into silicon crystal seed crystals, and slowly pulling out the silicon crystal seed crystals to form cylindrical monocrystalline silicon. After the silicon crystal bar is ground, polished, sliced, etc., a silicon wafer, i.e., a wafer, is formed. In a wafer processing process, a dicing process is usually performed to separate a wafer into a plurality of chips, and before the wafer is diced, a thin film is usually attached to the back surface of the wafer in order to protect the wafer during dicing, i.e. a dicing film is attached. In the traditional film pasting process, bubbles often exist between the wafer and the film, and at the moment, the pasted film needs to be removed for secondary film pasting, so that raw materials are wasted, and the film pasting efficiency is reduced.
Chinese patent CN109727904B discloses a film covering device for wafers, placing water drops above a wafer through a water bag, driving a film to move to the wafer through a bonding rod, driving a limiting block through an elastic block to simultaneously contact the center of the upper part of the wafer so that the film and the wafer are attached and the water drops move outwards, then the limiting block moves to the outside of the wafer and the water drops absorb bubbles to complete the film covering work, but this scheme requires a worker to continuously control the bonding rod to drive the film to move in the use process, fatigue is generated due to repeated operation of the worker, uncontrollable influence can be generated on the frequency of controlling the bonding rod to drive the film to move, and due to the precision of the processing process of the wafer, direct participation of the worker, influence is easily caused on the processing environment of the wafer, the stability of the environment is damaged, the yield of the wafer is influenced, and meanwhile, certain potential safety hazards exist at the processing end where the hand of the worker can be located for many times.
Disclosure of Invention
In view of the above, it is necessary to provide a film coating apparatus for wafer processing that can eliminate bubbles in view of the problems of the related art.
In order to solve the problems of the prior art, the invention adopts the technical scheme that:
the utility model provides a can eliminate tectorial membrane device for wafer processing of bubble, including tectorial membrane base, the mount, water pocket and bubble removal subassembly, tectorial membrane base includes the workstation, tensile subassembly, film frame and conveyer belt, the workstation includes unable adjustment base, put the thing dish, first spring, connecting piece and extension spring, unable adjustment base wholly is the cuboid form, the top surface center department of unable adjustment base has seted up the circular port, seted up rectangular spout on two sides of unable adjustment base, the length direction of rectangular spout is parallel with the length direction of unable adjustment base, put thing dish and circular port sliding fit, the sliding direction of putting the thing dish is parallel with the axis direction of circular port, first spring sets up between putting thing dish and unable adjustment base, the axis of first spring is parallel with the axis of circular port, connecting piece and putting thing dish fixed fit, the connecting piece extends to the unable adjustment base outside, the extension spring sets up in rectangular spout, the axis of the tension spring is parallel to the length direction of the long sliding groove, the stretching component comprises a sliding block, a first clamping block, a second clamping block, a positioning strip and a connecting rod, the sliding block is in sliding fit with the long sliding groove, one end of the sliding block is connected with the tension spring, the first clamping block is fixedly matched with the sliding block, the first clamping block is arranged on one surface, close to the object placing disc, of the sliding block, the second clamping block is in sliding fit with the sliding block, the sliding direction of the second clamping block is parallel to the height direction of the fixed base, the second clamping block is arranged right above the first clamping block, the positioning strip is connected with the second clamping block, the positioning strip is arranged on one surface, far away from the first clamping block, of the sliding block, a positioning groove which works in cooperation with the connecting piece is formed in the positioning strip, two ends of the connecting rod are respectively in fixed fit with the two second clamping blocks, and the film frame is arranged at one end of the fixed base in the length direction, the fixed one side of keeping away from the connecting piece that sets up at unable adjustment base of conveyer belt, the direction of transportation of conveyer belt is parallel with unable adjustment base's length direction, evenly is provided with the location arch of a plurality of cooperation location strip work on the area of conveyer belt.
Preferably, the workstation is still including removing dish and threaded rod, removes dish and circular port sliding fit, and first spring setting is being put the thing dish and is being removed between the dish, is provided with the spacing of cooperation removal dish in the circular port, and the length direction of spacing is parallel with the axis of circular port, threaded rod and the coaxial rotation setting of removal dish, threaded rod and unable adjustment base screw-thread fit.
Preferably, the number of the first springs is several, and all the first springs are uniformly arranged around the axis of the circular hole.
Preferably, the workbench further comprises a limiting ring, the limiting ring and the circular hole are coaxially arranged, the limiting ring is fixedly matched with the fixing base, and the inner diameter of the limiting ring is smaller than the maximum outer diameter of the object placing disc.
Preferably, the stretching assembly further comprises a first magnetic sheet, the first magnetic sheet is fixedly arranged on the second clamping block and far away from one surface of the film frame, and a second magnetic sheet matched with the first magnetic sheet is arranged on the fixing base.
Preferably, the stretching assembly further comprises a first limiting bolt, the first limiting bolt is fixedly matched with the sliding block, a limiting long groove matched with the first limiting bolt to work is formed in the fixed base, and the length direction of the limiting long groove is parallel to the length direction of the fixed base.
Preferably, the stretching assembly further comprises a second limiting bolt and a second spring, the second limiting bolt is fixedly matched with the sliding block, the second limiting bolt is in sliding fit with the second clamping block, the axis of the second limiting bolt is parallel to the sliding direction of the second clamping block, the second spring is arranged between the sliding block and the second clamping block, and the second spring is sleeved on the second limiting bolt.
Preferably, the stretching assembly further comprises a third limiting bolt and a third spring, the third limiting bolt is fixedly matched with the positioning strip, the third limiting bolt is in sliding fit with the second clamping block, the axis of the third limiting bolt is parallel to the sliding direction of the second clamping block, the third spring is sleeved on the third limiting bolt, and the second clamping block is arranged between the positioning strip and the third spring.
Preferably, it is protruding that fixed chassis is provided with the cylinder on the side of seting up rectangular spout, the first fixed orifices of a plurality of have evenly been seted up all around to the cylinder arch, the film frame includes the fixed plate, the roller, activity strip and fourth spring, fixed plate and the protruding normal running fit of cylinder, set up the second fixed orifices of the first fixed orifices of cooperation on the fixed plate, the both ends of roller are connected with two fixed plates respectively, activity strip and the protruding sliding fit of cylinder, the slip direction of activity strip is parallel with the bellied axis of cylinder, be provided with the first fixed orifices of cooperation on the activity strip, the fixed cylinder of second fixed orifices, the axis of fourth spring is parallel with the bellied axis of cylinder.
Preferably, the film frame further comprises a fourth limiting bolt, the fourth limiting bolt is fixedly matched with the cylindrical protrusion, the axis of the fourth limiting bolt is parallel to the axis of the cylindrical protrusion, and a fourth spring is arranged between the movable strip and the fourth limiting bolt.
This application compares in prior art's beneficial effect and is:
1. according to the invention, through the cooperation of the workbench, the stretching assembly, the film frame and the conveyor belt, a wafer is only required to be placed on the workbench, then water drops released by the water bag fall on the wafer, the film stretching assembly can automatically drive the film to move so as to enable the film to cover the wafer, a blade in the bubble removing assembly is used for cutting the film, and then the coated wafer is taken out.
2. According to the invention, the function that a worker can control the vertical distance between the object placing disc and the film according to the requirement is realized through the movable disc and the threaded rod, and the defect that the film cannot pass through the upper part of the wafer when the thickness of the wafer is changed is overcome.
3. The invention realizes the function of ensuring the stability of the object placing disc by limiting the quantity and the position of the first springs, and solves the defect that the object placing disc shakes when the first springs work due to the existence of the movable disc.
4. The invention realizes the function of limiting the moving range of the object placing disc through the limiting ring, and solves the defect that the object placing disc can be separated from a circular hole.
5. The first magnetic sheet and the second magnetic sheet realize the function of limiting the maximum moving position of the sliding block, and the defect that the sliding block can continuously slide back and forth after moving to the end far away from the film frame is overcome.
Drawings
FIG. 1 is a perspective view of the entirety of the present application;
FIG. 2 is a perspective view of the entirety of the present application;
FIG. 3 is a front view of the present application in its entirety;
FIG. 4 is a first perspective view of the coated base of the present application;
FIG. 5 is a second perspective view of the film covered mount of the present application;
FIG. 6 is a perspective exploded view of the film covered base of the present application;
FIG. 7 is a perspective schematic view of a table of the present application;
FIG. 8 is a first exploded perspective view of the table of the present application;
FIG. 9 is a second exploded perspective view of the table of the present application;
FIG. 10 is a schematic perspective view of a stretching assembly of the present application;
FIG. 11 is an exploded isometric view of the tension assembly of the present application;
FIG. 12 is a schematic perspective view of a film frame of the present application;
fig. 13 is an exploded perspective view of the film frame of the present application.
The reference numbers in the figures are:
1-a film-covered base;
2-a workbench; 2 a-a stationary base; 2a 1-circular hole; 2a 2-a strip chute; 2a 3-a spacing bar; 2a 4-a second magnetic sheet; 2a 5-limit elongated slot; 2a 6-cylindrical protrusion; 2a 7-first fixation hole; 2 b-placing plate; 2 c-a first spring; 2 d-connecting piece; 2 e-a tension spring; 2 f-moving the tray; 2 g-threaded rod; 2 h-a limiting ring;
3-stretching the assembly; 3 a-a slider; 3 b-a first clamping block; 3 c-a second clamping block; 3 d-a positioning strip; 3 e-a connecting rod; 3 f-a first magnetic sheet; 3 g-a first limit bolt; 3 h-a second limit bolt; 3 i-a second spring; 3 j-a third limit bolt; 3 k-a third spring;
4-a film frame; 4 a-a fixing plate; 4a 1-a second fixation hole; 4 b-a roll shaft; 4 c-a movable bar; 4c 1-stationary cylinder; 4 d-a fourth spring; 4 e-a fourth limit bolt;
5, a conveyor belt;
6, fixing a frame;
7-water bag;
8-removing the bubble component.
Detailed Description
For further understanding of the features and technical means of the present invention, as well as the specific objects and functions attained by the present invention, the present invention will be described in further detail with reference to the accompanying drawings and detailed description.
As shown in fig. 1 to 13, the present application provides:
a film covering device capable of eliminating bubbles for wafer processing comprises a film covering base 1, a fixing frame 6, a water bag 7 and a bubble removing assembly 8, wherein the film covering base 1 comprises a workbench 2, a stretching assembly 3, a film frame 4 and a conveyor belt 5, the workbench 2 comprises a fixed base 2a, a storage disc 2b, a first spring 2c, a connecting piece 2d and a tension spring 2e, the whole fixed base 2a is in a cuboid shape, a circular hole 2a1 is formed in the center of the top surface of the fixed base 2a, strip sliding grooves 2a2 are formed in two side surfaces of the fixed base 2a, the length direction of the strip sliding grooves 2a2 is parallel to the length direction of the fixed base 2a, the storage disc 2b is in sliding fit with the circular hole 2a1, the sliding direction of the storage disc 2b is parallel to the axial direction of the circular hole 2a1, the first spring 2c is arranged between the storage disc 2b and the fixed base 2a, the axial line of the first spring 2c is parallel to the axial line of the circular hole 2a1, the connecting piece 2d is fixedly matched with the storage disc 2b, the connecting piece 2d extends to the outside of the fixed base 2a, the tension spring 2e is arranged in the long sliding groove 2a2, the axis of the tension spring 2e is parallel to the length direction of the long sliding groove 2a2, the stretching component 3 comprises a sliding block 3a, a first clamping block 3b, a second clamping block 3c, a positioning strip 3d and a connecting rod 3e, the sliding block 3a is in sliding fit with the long sliding groove 2a2, one end of the sliding block 3a is connected with the tension spring 2e, the first clamping block 3b is in fixed fit with the sliding block 3a, the first clamping block 3b is arranged on one surface of the sliding block 3a close to the object placing disc 2b, the second clamping block 3c is in sliding fit with the sliding block 3a, the sliding direction of the second clamping block 3c is parallel to the height direction of the fixed base 2a, the second clamping block 3c is arranged right above the first clamping block 3b, the positioning strip 3d is connected with the second clamping block 3c, the positioning strip 3d is arranged on one surface of the sliding block 3a far away from the first clamping block 3b, set up the constant head tank of cooperation connecting piece 2d work on location strip 3d, the both ends of connecting rod 3e respectively with two second grip blocks 3c fixed coordination, film frame 4 sets up the one end at unable adjustment base 2a length direction, 5 fixed settings of conveyer belt keep away from the one side of connecting piece 2d at unable adjustment base 2a, the direction of transportation of conveyer belt 5 is parallel with unable adjustment base 2 a's length direction, it is protruding to evenly be provided with the location of a plurality of cooperation location strip 3d work on the band face of conveyer belt 5.
Based on the above embodiment, the technical problem that this application wants to solve is that need the continuous control of staff to glue the pole and drive the film and remove in the use, not only need not to carry out unnecessary operation many times like this and influence whole machining efficiency the while staff's hand can be in processing end department many times and have certain potential safety hazard. Therefore, the wafer is placed on the object placing disc 2b by the staff, at the moment, the object placing disc 2b compresses the first spring 2c to move downwards due to the weight change, the connecting piece 2d fixedly matched with the object placing disc 2b drives the positioning strip 3d to move downwards, so that the second clamping block 3c approaches to the first clamping block 3b to clamp one end of the film arranged on the film frame 4, the downward moving positioning strip 3d contacts with the positioning bulge on the conveyor belt 5, so that the whole stretching assembly 3 drives the film to move to cover the whole wafer, the water bag 7 releases water drops to fall on the wafer when the wafer is placed on the object placing disc 2b, then the film covers above the wafer, the linear driving device in the bubble removing assembly 8 pushes the elastic block to move downwards to approach to the wafer so that the film is attached to the wafer, and at the moment, the elastic block and the limiting block are both contacted with the surface of the film, then the linear driving device continues to work to enable the limiting block to move towards the outside of the wafer and simultaneously push water drops on the wafer to absorb water bubbles until the limiting block moves into the annular groove, a blade in the bubble removing component 8 cuts the film, when a worker takes out the wafer with the film covering, the object placing disc 2b moves back to the original position under the action of the first spring 2c, the connecting component 2d drives the positioning strip 3d to move upwards so that the positioning strip 3d is separated from the contact with the conveyor belt 5, and the tension spring 2e works so that the whole stretching component 3 returns to the original position to wait for the next work, compared with the prior art, the workbench 2, the stretching component 3, the film frame 4 and the conveyor belt 5 are matched to enable the wafer to be placed on the workbench 2 only, then the water bag 7 releases water drops on the wafer, and the film stretching component 3 can automatically drive the film to move so that the film covers the wafer, and the blade in the bubble subassembly 8 that removes cuts the film, then take out the wafer after the tectorial membrane can, this operation accessible arm fixed point is accomplished, only need the arm fixed point to place the wafer and take out, practice thrift to wafer tectorial membrane in-process arm or artificial operation process, and only need the arm carry out the repetitive operation can cooperate the device to accomplish putting into of wafer, tectorial membrane and the process of taking out, very big reduction operation flow, the work efficiency is improved, also can replace the multi-flow manual operation among the prior art through the intervention of arm, the impurity of human bringing in the wafer course of working is avoided causing the influence to the processing of wafer, the yields of wafer processing is improved.
The film stretching assembly 3 can automatically drive the film to move each time a wafer is placed on the worktable 2, so that the film covers the wafer.
Further, as shown in fig. 6 to 9:
Based on the above embodiments, the technical problem to be solved by the present application is that the thickness of the wafer may change to cause the thin film not to pass through the wafer. For this reason, thereby this application makes removal dish 2f remove the control through rotatory threaded rod 2g and puts the level of thing dish 2b, compares in prior art, and the cooperation of removal dish 2f and threaded rod 2g of this application makes the staff can put the perpendicular interval between thing dish 2b and the film according to the demand control.
Further, as shown in fig. 8 to 9:
the number of the first springs 2c is several, and all the first springs 2c are uniformly arranged around the axis of the circular hole 2a1.
Based on the above embodiments, the present application is intended to solve the technical problem that the existence of the moving plate 2f causes the object placing plate 2b to shake when the first spring 2c works. For this reason, this application makes through setting up a plurality of evenly distributed's first spring 2c and puts the atress balance between thing dish 2b and the removal dish 2f, compares in prior art, and the thing dish 2b of putting of this application is through quantity and the position assurance that prescribes a limit to first spring 2c and puts the stability of thing dish 2 b.
Further, as shown in fig. 6 to 9:
Based on the above embodiment, the object placing plate 2b may be separated from the circular hole 2a1. For this reason, this application stops to remove after contacting spacing ring 2h through putting thing dish 2b and removing certain distance, compares in prior art, and this application's spacing ring 2h is injectd the range of motion of thing dish 2 b.
Further, as shown in fig. 6 to 11:
stretching subassembly 3 still includes first magnetic sheet 3f, and the fixed one side of keeping away from film frame 4 that sets up on second grip block 3c of first magnetic sheet 3f is provided with second magnetic sheet 2a4 of cooperation first magnetic sheet 3f on unable adjustment base 2a.
Based on the above embodiments, the technical problem to be solved by the present application is that the sliding block 3a may continuously slide back and forth after moving to the end far away from the film frame 4. Therefore, the position of the sliding block 3a is fixed by the first magnetic sheet 3f and the second magnetic sheet 2a4 after the sliding block 3a moves to a certain distance, and compared with the prior art, the maximum moving position of the sliding block 3a is limited by the first magnetic sheet 3f and the second magnetic sheet 2a4.
Further, as shown in fig. 6 to 8 and 11:
the stretching assembly 3 further comprises a first limiting bolt 3g, the first limiting bolt 3g is fixedly matched with the sliding block 3a, a limiting long groove 2a5 matched with the first limiting bolt 3g to work is formed in the fixed base 2a, and the length direction of the limiting long groove 2a5 is parallel to the length direction of the fixed base 2a.
Based on the above embodiments, the technical problem that the present application intends to solve is that the sliding block 3a may be separated from the fixed base 2a. Therefore, when the sliding block 3a slides, the first limiting bolt 3g is always clamped in the limiting long groove 2a5 to keep the sliding block 3a in contact with the fixed base 2a, and compared with the prior art, the first limiting bolt 3g and the limiting long groove 2a5 are matched to ensure the connection stability of the sliding block 3a and the fixed base 2a, so that the defect that the sliding block 3a can be separated from the fixed base 2a is overcome.
Further, as shown in fig. 6, 10 to 11:
the stretching assembly 3 further comprises a second limiting bolt 3h and a second spring 3i, the second limiting bolt 3h is fixedly matched with the sliding block 3a, the second limiting bolt 3h is in sliding fit with the second clamping block 3c, the axis of the second limiting bolt 3h is parallel to the sliding direction of the second clamping block 3c, the second spring 3i is arranged between the sliding block 3a and the second clamping block 3c, and the second limiting bolt 3h is sleeved with the second spring 3 i.
Based on the above-mentioned embodiment, the technical problem that the present application intends to solve is that the second clamping block 3c may be disengaged from the sliding block 3a during the movement. For this reason, this application moves certain distance back through second grip block 3c and contact back second grip block 3c stop moving with second spacing bolt 3h, compares in prior art, and the cooperation of the second spacing bolt 3h of this application and second spring 3i is injectd the range of movement of second grip block 3c, has solved the defect that second grip block 3c probably breaks away from with sliding block 3a at the removal in-process.
Further, as shown in fig. 6, 10 to 11:
the stretching assembly 3 further comprises a third limiting bolt 3j and a third spring 3k, the third limiting bolt 3j is fixedly matched with the positioning strip 3d, the third limiting bolt 3j is in sliding fit with the second clamping block 3c, the axis of the third limiting bolt 3j is parallel to the sliding direction of the second clamping block 3c, the third spring 3k is sleeved on the third limiting bolt 3j, and the second clamping block 3c is arranged between the positioning strip 3d and the third spring 3 k.
Based on the above embodiments, the technical problem that the present application intends to solve is that the bubble removing assembly 8 will drive the positioning bar 3d to move downward again when working, thereby colliding with the second clamping block 3 c. For this reason, thereby this application will compress when moving down once more through location strip 3d third spring 3k and make location strip 3d and second grip block 3c take place relative movement, compare in prior art, the cooperation of the third spacing bolt 3j of this application and third spring 3k makes and can take place relative slip between location strip 3d and the second grip block, thereby solved and can drive location strip 3d once more and move down thereby the defect of conflict takes place with second grip block 3c when removing bubble subassembly 8 during operation.
Further, as shown in fig. 6, 8 and 12 to 13:
be provided with the protruding 2a6 of cylinder on the side that rectangular spout 2a2 was seted up to fixed chassis, the first fixed orifices 2a7 of a plurality of has evenly been seted up all around to the protruding 2a6 of cylinder, film frame 4 includes fixed plate 4a, roller 4b, activity strip 4c and fourth spring 4d, fixed plate 4a and the protruding 2a6 normal running fit of cylinder, the second fixed orifices 4a1 of the first fixed orifices 2a7 of cooperation is seted up on fixed plate 4a, roller 4 b's both ends are connected with two fixed plates 4a respectively, activity strip 4c and the protruding 2a6 sliding fit of cylinder, the slip direction of activity strip 4c is parallel with the axis of the protruding 2a6 of cylinder, be provided with the first fixed orifices 2a7 of cooperation on the activity strip 4c, the fixed cylinder 4c1 of second fixed orifices 4a1, the axis of fourth spring 4d is parallel with the axis of the protruding 2a6 of cylinder.
Based on the above embodiments, the technical problem that the present application intends to solve is that merely changing the horizontal height of the object placing plate 2b is not enough to satisfy the covering of wafers with different thicknesses. For this reason, this application is through accomplishing the level adjustment of film in inserting cylindrical protrusion 2a6 to first fixed orifices 2a7 and second fixed orifices 4a1 behind the rotatory fixed plate 4a, compare in prior art, the fixed plate 4a of this application, roller 4b, the cooperation of activity strip 4c and fourth spring 4d makes the level of film adjust as required, thereby the cooperation adjusts the level of opposition thing dish 2b, the tectorial membrane can all be carried out to the wafer that satisfies different thickness, the defect of the wafer tectorial membrane that has only leaned on the level that changes the thing dish to satisfy different thickness has been solved.
Further, as shown in fig. 6, 8, 12 to 13:
the film frame 4 further comprises a fourth limiting bolt 4e, the fourth limiting bolt 4e is fixedly matched with the cylindrical protrusion 2a6, the axis of the fourth limiting bolt 4e is parallel to the axis of the cylindrical protrusion 2a6, and a fourth spring 4d is arranged between the movable strip 4c and the fourth limiting bolt 4 e.
Based on the above-described embodiment, the technical problem that the present application intends to solve is that the movable bar 4c may be disconnected from the fixed cylinder 4c 1. For this reason, thereby this application will stop to remove through the contact of activity strip 4c after removing the certain distance with fourth spacing bolt 4e, compare in prior art, the fourth spacing bolt 4e of this application is injectd activity strip 4 c's moving direction, avoids producing between activity strip 4c and the fixed cylinder 4c1 and breaks away from.
The above examples only show one or more embodiments of the present invention, and the description is specific and detailed, but not construed as limiting the scope of the present invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (10)
1. A film covering device capable of eliminating bubbles for wafer processing comprises a film covering base (1), a fixing frame (6), a water bag (7) and a bubble removing assembly (8), and is characterized in that the film covering base (1) comprises a workbench (2), a stretching assembly (3), a film frame (4) and a conveyor belt (5);
the workbench (2) comprises a fixed base (2 a), an object placing disc (2 b), a first spring (2 c), a connecting piece (2 d) and a tension spring (2 e), the whole fixed base (2 a) is cuboid, a circular hole (2 a 1) is formed in the center of the top surface of the fixed base (2 a), strip sliding chutes (2 a 2) are formed in two side surfaces of the fixed base (2 a), the length direction of the strip sliding chutes (2 a 2) is parallel to that of the fixed base (2 a), the object placing disc (2 b) is in sliding fit with the circular hole (2 a 1), the sliding direction of the object placing disc (2 b) is parallel to the axial direction of the circular hole (2 a 1), the first spring (2 c) is arranged between the object placing disc (2 b) and the fixed base (2 a), the axial line of the first spring (2 c) is parallel to the axial line of the circular hole (2 a 1), the connecting piece (2 d) is in fixed fit with the object placing disc (2 b), the connecting piece (2 d) extends to the fixed base (2 a), the outer portion of the fixed base (2 a), and the outer portion of the sliding chutes (2 e) is parallel to the axial line of the strip sliding chutes (2 a2 e);
the stretching assembly (3) comprises a sliding block (3 a), a first clamping block (3 b), a second clamping block (3 c), a positioning strip (3 d) and a connecting rod (3 e), the sliding block (3 a) is in sliding fit with the long sliding groove (2 a 2), one end of the sliding block (3 a) is connected with the tension spring (2 e), the first clamping block (3 b) is in fixed fit with the sliding block (3 a), the first clamping block (3 b) is arranged on one surface, close to the object placing disc (2 b), of the sliding block (3 a), the second clamping block (3 c) is in sliding fit with the sliding block (3 a), the sliding direction of the second clamping block (3 c) is parallel to the height direction of the fixed base (2 a), the second clamping block (3 c) is arranged right above the first clamping block (3 b), the positioning strip (3 d) is connected with the second clamping block (3 c), the positioning strip (3 d) is arranged on the sliding block (3 a) far away from the first clamping block (3 b), two positioning grooves (3 d) which are matched with the connecting rod (3 d) are formed in the working end of the connecting rod (3 d), and two positioning grooves (3 e) which are respectively matched with the second clamping block (3 e);
the film frame (4) is arranged at one end of the fixed base (2 a) in the length direction;
conveyer belt (5) are fixed to be set up in unable adjustment base (2 a) the one side of keeping away from connecting piece (2 d), and the direction of transportation of conveyer belt (5) is parallel with the length direction of unable adjustment base (2 a), evenly is provided with the location arch of a plurality of cooperation location strip (3 d) work on the band face of conveyer belt (5).
2. The bubble-eliminating film coating device for wafer processing as claimed in claim 1, wherein the table (2) further comprises a moving plate (2 f) and a threaded rod (2 g);
remove dish (2 f) and circular port (2 a 1) sliding fit, first spring (2 c) set up and put between thing dish (2 b) and the removal dish (2 f), be provided with spacing (2 a 3) that the cooperation removed dish (2 f) in circular port (2 a 1), the length direction of spacing (2 a 3) is parallel with the axis of circular port (2 a 1), threaded rod (2 g) and the coaxial rotation setting of removal dish (2 f), threaded rod (2 g) and unable adjustment base (2 a) screw-thread fit.
3. The bubble-eliminating film covering device for wafer processing as recited in claim 2, wherein the number of the first springs (2 c) is several, and all the first springs (2 c) are uniformly arranged around the axis of the circular hole (2 a 1).
4. The bubble-eliminating film covering device for wafer processing as claimed in claim 3, wherein the worktable (2) further comprises a limiting ring (2 h);
spacing ring (2 h) and circular port (2 a 1) coaxial setting, spacing ring (2 h) and unable adjustment base (2 a) fixed fit, the internal diameter of spacing ring (2 h) is less than the biggest external diameter of putting thing dish (2 b).
5. A bubble-eliminating film covering device for wafer processing according to claim 4, characterized in that the stretching assembly (3) further comprises a first magnetic sheet (3 f);
the first magnetic sheet (3 f) is fixedly arranged on one surface, far away from the film frame (4), of the second clamping block (3 c), and the second magnetic sheet (2 a 4) matched with the first magnetic sheet (3 f) is arranged on the fixed base (2 a).
6. The film covering device capable of eliminating bubbles for wafer processing as claimed in claim 5, wherein the stretching assembly (3) further comprises a first limit bolt (3 g);
the first limiting bolt (3 g) is fixedly matched with the sliding block (3 a), a limiting long groove (2 a 5) which is matched with the first limiting bolt (3 g) to work is formed in the fixed base (2 a), and the length direction of the limiting long groove (2 a 5) is parallel to the length direction of the fixed base (2 a).
7. The film covering device for wafer processing capable of eliminating bubbles as claimed in claim 6, wherein the stretching assembly (3) further comprises a second limit bolt (3 h) and a second spring (3 i);
second spacing bolt (3 h) and sliding block (3 a) fixed fit, second spacing bolt (3 h) and second grip block (3 c) sliding fit, the axis of second spacing bolt (3 h) is parallel with the slip direction of second grip block (3 c), second spring (3 i) set up between sliding block (3 a) and second grip block (3 c), second spring (3 i) cover is established on second spacing bolt (3 h).
8. The film covering device for wafer processing capable of eliminating bubbles as claimed in claim 7, wherein the stretching assembly (3) further comprises a third limit bolt (3 j) and a third spring (3 k);
third spacing bolt (3 j) and location strip (3 d) fixed coordination, third spacing bolt (3 j) and second grip block (3 c) sliding fit, the axis of third spacing bolt (3 j) is parallel with the slip direction of second grip block (3 c), third spring (3 k) cover is established on third spacing bolt (3 j), second grip block (3 c) set up between location strip (3 d) and third spring (3 k).
9. The film covering device capable of eliminating bubbles for wafer processing according to claim 8, wherein a cylindrical protrusion (2 a 6) is arranged on the side surface of the fixed bottom frame where the long sliding groove (2 a 2) is formed, a plurality of first fixing holes (2 a 7) are uniformly formed around the cylindrical protrusion (2 a 6), and the film frame (4) comprises a fixed plate (4 a), a roller shaft (4 b), a movable strip (4 c) and a fourth spring (4 d);
fixed plate (4 a) and protruding (2 a 6) normal running fit of cylinder, set up second fixed orifices (4 a 1) of the first fixed orifices of cooperation (2 a 7) on fixed plate (4 a), the both ends of roller (4 b) are connected with two fixed plates (4 a) respectively, activity strip (4 c) and protruding (2 a 6) sliding fit of cylinder, the slip direction of activity strip (4 c) is parallel with the axis of the protruding (2 a 6) of cylinder, be provided with the first fixed orifices of cooperation (2 a 7) on activity strip (4 c), fixed cylinder (4 c 1) of second fixed orifices (4 a 1), the axis of fourth spring (4 d) is parallel with the axis of the protruding (2 a 6) of cylinder.
10. The film covering device capable of eliminating bubbles for wafer processing according to claim 9, wherein the film frame (4) further comprises a fourth limit bolt (4 e);
fourth spacing bolt (4 e) and cylindrical protrusion (2 a 6) fixed fit, the axis of fourth spacing bolt (4 e) is parallel with the axis of cylindrical protrusion (2 a 6), and fourth spring (4 d) sets up between activity strip (4 c) and fourth spacing bolt (4 e).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210895055.8A CN114975192B (en) | 2022-07-28 | 2022-07-28 | Can eliminate tectorial membrane device for wafer processing of bubble |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210895055.8A CN114975192B (en) | 2022-07-28 | 2022-07-28 | Can eliminate tectorial membrane device for wafer processing of bubble |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN114975192A CN114975192A (en) | 2022-08-30 |
| CN114975192B true CN114975192B (en) | 2022-12-13 |
Family
ID=82970221
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210895055.8A Active CN114975192B (en) | 2022-07-28 | 2022-07-28 | Can eliminate tectorial membrane device for wafer processing of bubble |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114975192B (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011091121A (en) * | 2009-10-20 | 2011-05-06 | Csun Mfg Ltd | Wafer laminator dry film transmission mechanism |
| CN109727904A (en) * | 2018-12-28 | 2019-05-07 | 安徽龙芯微科技有限公司 | Wafer film covering device |
| CN112397421A (en) * | 2020-11-16 | 2021-02-23 | 太仓联科工业设计有限公司 | Automatic film pasting equipment for surface of semiconductor wafer |
| CN112992728A (en) * | 2021-02-04 | 2021-06-18 | 广州市乐薇商贸有限公司 | Automatic material loading wafer pad pasting equipment |
| CN214875777U (en) * | 2021-06-11 | 2021-11-26 | 河南通用智能装备有限公司 | Wafer film covering device |
-
2022
- 2022-07-28 CN CN202210895055.8A patent/CN114975192B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011091121A (en) * | 2009-10-20 | 2011-05-06 | Csun Mfg Ltd | Wafer laminator dry film transmission mechanism |
| CN109727904A (en) * | 2018-12-28 | 2019-05-07 | 安徽龙芯微科技有限公司 | Wafer film covering device |
| CN112397421A (en) * | 2020-11-16 | 2021-02-23 | 太仓联科工业设计有限公司 | Automatic film pasting equipment for surface of semiconductor wafer |
| CN112992728A (en) * | 2021-02-04 | 2021-06-18 | 广州市乐薇商贸有限公司 | Automatic material loading wafer pad pasting equipment |
| CN214875777U (en) * | 2021-06-11 | 2021-11-26 | 河南通用智能装备有限公司 | Wafer film covering device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN114975192A (en) | 2022-08-30 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN108381881B (en) | Material grabbing and self-adaptive efficient loading and unloading device | |
| CN105818285A (en) | Silicon rod squarer | |
| CN212070819U (en) | Wafer laser scribing cutting machine with general function | |
| CN217497687U (en) | Blanking transmission system for sand mold casting mold | |
| CN114975192B (en) | Can eliminate tectorial membrane device for wafer processing of bubble | |
| US3727282A (en) | Semiconductor handling apparatus | |
| CN116364619B (en) | Chip wafer pad pasting cuts device | |
| CN212021269U (en) | Silicon wafer wire cutting machine | |
| CN205631055U (en) | Silicon rod squaring machine | |
| CN212762160U (en) | Edge cutting device for steel plate production | |
| CN211492895U (en) | Battery pad pasting equipment | |
| CN213380954U (en) | Grinder for crystal processing | |
| CN209871645U (en) | Automatic material receiving and discharging tray device | |
| JP3625408B2 (en) | Machining method using multi-wire saw | |
| CN217496921U (en) | Adjustable wafer placing box | |
| JP6953788B2 (en) | Wafer manufacturing method and holding jig | |
| CN204869040U (en) | Circuit board cutting machine | |
| CN213412228U (en) | Board collection device that divides of V cutting machine | |
| CN218364332U (en) | Jig for mold production | |
| CN218984263U (en) | Fold material plastic equipment | |
| CN221264090U (en) | Slicing device for circuit board processing | |
| CN213845451U (en) | Terminal gluing equipment | |
| CN216329265U (en) | Wafer slitting tool | |
| CN210969461U (en) | Efficient cutting device for diamond single crystal evolution | |
| CN114643650B (en) | Ring removing workbench for TAIKO wafer processing |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |