CN109727904A - Wafer film covering device - Google Patents
Wafer film covering device Download PDFInfo
- Publication number
- CN109727904A CN109727904A CN201811624489.4A CN201811624489A CN109727904A CN 109727904 A CN109727904 A CN 109727904A CN 201811624489 A CN201811624489 A CN 201811624489A CN 109727904 A CN109727904 A CN 109727904A
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- sleeve
- wafer
- film
- overlay film
- pedestal
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The present invention relates to chip manufacture fields, specifically disclose wafer film covering device, including overlay film pedestal, and overlay film pedestal is equipped with for the fixed fixing groove to overlay film wafer, and the periphery of fixing groove is equipped with the annular groove that a circle is arranged concentrically with fixing groove；The top of overlay film pedestal is equipped with film-covering mechanism, film-covering mechanism includes the extension sleeve at middle part, the top of extension sleeve is equipped with water pocket, the bottom of extension sleeve is equipped with weeper, it is hinged with multiple compression assemblies that can be radially slided in the middle part of wafer on extension sleeve, limit actuator is connected between compression assemblies and extension sleeve.The present invention solves the problems, such as to be easy to appear bubble to existing during wafer pad pasting in the prior art.
Description
Technical field
The present invention relates to chip manufacture fields, and in particular to wafer film covering device.
Background technique
Wafer refers to silicon wafer used in silicon semiconductor production of integrated circuits, since its shape is circle, therefore referred to as wafer.
It is can be processed on wafer and is fabricated to various circuit component structures, usually by wafer circuit face, that is, complete the side of chip functions
Referred to as positive, in addition one side is the back side.In wafer fabrication processes, it is typically passed through cutting process, before wafer cutting, is
Protect wafer that would generally attach thin film at the back side of wafer in cutting crystal wafer, i.e. attaching cutting film.Traditional pad pasting
Technique, film are arranged in rolls, and film is constantly released after film roll rotation, and the area of film is greater than the area of wafer.By film
After being attached to crystal column surface, holds or cut film along the edge of wafer using manipulator clamping blade, will exceed wafer
Extra film excision, to complete the technique in crystal column surface pad pasting.
But during above-mentioned pad pasting, due to pad pasting operator exert a force size difference, will cause often wafer with
There are bubbles between film.It then needs to remove the film pasted after bubble occurs in crystal column surface, then carries out secondary pad pasting, no
Only waste raw material and reduce the efficiency of pad pasting.
Summary of the invention
The invention is intended to provide wafer film covering device, to solve to hold to existing during wafer pad pasting in the prior art
Easily there is the problem of bubble.
In order to achieve the above objectives, technical scheme is as follows: wafer film covering device, including overlay film pedestal, overlay film
Pedestal is equipped with for the fixed fixing groove to overlay film wafer, and the periphery of fixing groove is equipped with the ring that a circle is arranged concentrically with fixing groove
Shape slot；The top of overlay film pedestal is equipped with film-covering mechanism, and film-covering mechanism includes the extension sleeve at middle part, and the top of extension sleeve is equipped with
Water pocket, the bottom of extension sleeve are equipped with weeper, and multiple extruding that can be radially slided in the middle part of wafer are hinged on extension sleeve
Component is connected with limit actuator between compression assemblies and extension sleeve.
The principle and beneficial effect of the technical program are: overlay film pedestal plays the work of integrated support in the technical program
With the wafer that the fixing groove in overlay film pedestal is used to treat overlay film is accommodated and fixed；Water before wafer overlay film, in water pocket
It can drip on wafer along weeper, then attach to film on the wafer for having dripped water droplet, overlay film component is used for coated with film
Wafer is squeezed, so that film is fitted closely with wafer.Extension sleeve is located at due to extension sleeve after the film attaching
Portion, extension sleeve can squeeze the center of wafer first during pushing film, so that the water droplet at crystal circle center is to the periphery
Diffusion, compression assemblies are used to further squeeze wafer coated with film, continue water droplet squeezing propulsion to wafer outer rim,
Finally water is discharged, during water discharge, the bubble generated when can receive wafer overlay film in water moving process makes bubble quilt
Discharge avoided in the prior art to the problem of being easy to appear bubble existing during wafer pad pasting.Limit actuator is used for
It limits compression assemblies and squeezes the end point for excluding bubble and water, it can be achieved that automatically determining along the stroke that wafer slides.
It further, further include rack, extension sleeve includes the first sleeve of rotation connection on the rack, is slided in first sleeve
Dynamic to be connected with second sleeve, the bottom of second sleeve is connected with sealing plate, and the center bottom of sealing plate is equipped with elastomer block, sealing plate
Support spring is connected between first sleeve.
Rack plays the role of support, and support spring plays support first sleeve and the when extension sleeve does not push wafer
The effect of two sleeves；When extension sleeve pushes wafer, after second sleeve contacts the surface of the wafer of overlay film, second sleeve can phase
To first sleeve to the Slideslip close to first sleeve, so that the length of extension sleeve reduces, the elastomer block in the middle part of sealing plate
For accurately being squeezed the position dripped on wafer, and since elastomer block has elasticity, elastomer block also has certain
Buffer function avoids the damage of wafer.
Further, compression assemblies include multiple pressure rams for being hinged on first sleeve outer wall, and the bottom end of pressure ram is movable
It is connected with crushing block, open slot is equipped in crushing block, electric telescopic rod is equipped in open slot, the end of electric telescopic rod is solid
It is connected to cutter.
When reducing extension sleeve length after the wafer of laminated film-covered under extension sleeve, it is hinged on first sleeve outer wall
Pressure ram can be radially slided along the middle part of wafer to wafer outer rim under the limitation of limit actuator, when the extruding for squeezing boom end
Block slides into when being detached from and be located in annular groove with wafer, electric telescopic rod elongation, so that cutter stretch out open slot, to extra
Film cut, realize the process of automatic cutting deburring after wafer overlay film.
Further, limit actuator includes the first sleeve being rotatably connected on pressure ram, is slidably connected in first sleeve
There is the second casing, the second casing is rotatably connected on the outer wall of second sleeve far from one end of first sleeve, the bottom of first sleeve
The control switch for driving electric telescopic rod flexible is equipped on the inside of portion, the top outer rim of the second casing is connected with pressable control
The limited block of switch.
After extension sleeve length reduces, pressure ram and crushing block in the middle part of wafer into wafer outer rim sliding process,
First sleeve can opposite second cannula slide, after pressure ram, which slides into wafer outer rim, to be completed to squeeze, first sleeve slides into the
When limited block and control switch on two casings offset, limited block squeezes control switch, so that electric telescopic rod is powered, cutter
Extra film is cut, has achieved the effect that film extrusion terminates carry out synchronous with cutting.
Further, the side wall that crushing block is equipped with open slot is equipped with inclined-plane.
After crushing block is slided along wafer, crushing block can be detached from wafer outer rim and slide in annular groove, herein mistake
Cheng Zhong, the inclined-plane on crushing block can extrude extra film, so that extra film is bonded with the inner wall of annular groove, facilitate cutting
The cutting of knife.
Further, the lower section of overlay film pedestal is equipped with header tank, and the annular groove is equipped with multiple leakage holes, leakage hole and collection
Conduit is communicated between water tank.
After the water droplet on wafer is squeezed out, water can be flow in annular groove, and uniformly be flow to from leakage hole via conduit
It is collected in header tank, avoids the waste of water resource.
Further, the side of overlay film pedestal is equipped with the roll shaft of rotation connection on the rack, is removably connected on roll shaft thin
Film roll, overlay film pedestal are equipped with the feeding mechanism for pulling film.
Roll shaft is used to support film roll, and feeding mechanism is used to carry out automatic feed to film roll, easy to operate.
Further, feeding mechanism includes two conveyer belts being arranged on overlay film pedestal both sides, affixed on conveyer belt
There are multiple fixed blocks, interval and the bonding bar of film contacts are connected between the fixed block of two conveyer belts.
For bonding bar for adhering to film end, conveyer belt is mobile for driving fixed block and bonding bar, works as bonding
After bar adhering film, conveyer belt is mobile to will drive bonding bar movement, so that the film of bonding bar adherency is drawn under a stretching force
Out, film realizes the automatic adherency of film, the degree of automation against the mobile surface that can be attached to wafer automatically of bonding bar
It is high.
Detailed description of the invention
Fig. 1 is the main view of wafer film covering device in the embodiment of the present invention；
Fig. 2 is the top view of overlay film pedestal in Fig. 1；
Fig. 3 is the enlarged drawing in Fig. 1 at A1；
Fig. 4 is the enlarged drawing in Fig. 1 at A2.
Specific embodiment
It is further described below by specific embodiment:
Appended drawing reference in Figure of description includes: overlay film pedestal 1, fixing groove 2, annular groove 3, water pocket 4, rack 5, first
Sleeve 6, elastomer block 8, support spring 9, pressure ram 10, crushing block 11, open slot 12, electric telescopic rod 13, is cut at second sleeve 7
Cutter 14, the second casing 16, control switch 17, limited block 18, inclined-plane 19, header tank 20, leakage hole 21, is led first sleeve 15
Pipe 22, roll shaft 23, film roll 24, conveyer belt 25, fixed block 26, bonding bar 27.
Embodiment is substantially as shown in Fig. 1: wafer film covering device, including rack 5, is fixedly connected with overlay film in rack 5
Pedestal 1, overlay film pedestal 1 are equipped with for the fixed circular fixing groove 2 to overlay film wafer, and the periphery of fixing groove 2 is equipped with a circle
The annular groove 3 being arranged concentrically with fixing groove 2.
The top of overlay film pedestal 1 is equipped with film-covering mechanism, and film-covering mechanism includes extension sleeve, and the top of extension sleeve, which is equipped with, to be used
In the cylinder for pushing extension sleeve, cylinder is fixed in rack 5.Extension sleeve includes be rotatably connected on cylinder piston rod
One sleeve 6 slidably connects second sleeve 7 in first sleeve 6, and the bottom of second sleeve 7 is connected with sealing plate, the bottom of sealing plate
End middle part is connected with elastomer block 8, and support spring 9 is connected between sealing plate and first sleeve 6.The top of first sleeve 6 is equipped with
The bottom of water pocket 4, second sleeve 7 is equipped with weeper, and water pipe (not shown), water pipe are connected between water pocket 4 and weeper
Diameter be 0.1mm.
Hinged there are two pressure ram 10 in first sleeve 6, two pressure rams 10 are symmetrical centered on the axis of first sleeve 6
Setting, the bottom end of pressure ram 10 are connected with crushing block 11, as shown in connection with fig. 4, open slot 12 are equipped in crushing block 11,
Affixed electric telescopic rod 13 in open slot 12, the electric telescopic rod 13 in the present embodiment are common in the art electronic stretch
Contracting loop bar, this will not be repeated here for structure.The end of electric telescopic rod 13 is connected with cutter 14, and crushing block 11 is equipped with open slot 12
Side wall is arranged to inclined-plane 19.
As shown in connection with fig. 3, pressure ram 10 is rotatably connected to first sleeve 15, and second set is slidably connected in first sleeve 15
Pipe 16, the second casing 16 are rotatably connected on the outer wall of second sleeve 7 far from one end of first sleeve 15, the bottom of first sleeve 15
It is equipped with the control switch 17 for driving electric telescopic rod 13 flexible on the inside of portion, the top outer rim of the second casing 16 is connected with can be by
Press the limited block 18 of control switch 17.
The lower section of overlay film pedestal 1 be equipped with header tank 20, annular groove 3 be equipped with multiple leakage holes 21, leakage hole 21 with catchment
Conduit 22 is communicated between case 20.As shown in connection with fig. 2, the right side of overlay film pedestal 1 is equipped with the roll shaft being rotatably connected in rack 5
23, film roll 24 is removably connected on roll shaft 23, overlay film pedestal 1 is equipped with the feeding mechanism for pulling film.Feeder
Structure includes two conveyer belts 25 being arranged on the upper and lower both sides of overlay film pedestal 1, and affixed on conveyer belt 25 there are two fixed blocks
26, the fixed block 26 on two conveyer belts 25 is correspondingly arranged, be connected between the fixed block 26 of two conveyer belts 25 interval with
The bonding bar 27 of film contacts, the side of conveyer belt 25 are equipped with the driving motor for driving conveyer belt 25.
Specific implementation process is as follows: firstly, the wafer to overlay film is placed in the fixing groove 2 of overlay film pedestal 1, and making wafer
The back side upward, the water in water pocket 4 can be fallen to from crystal circle center from weeper.The free end of film roll 24 is pulled manually, and
The free end of film roll 24 is sticked on bonding bar 27.Driving motor is then opened, conveyer belt 25 is under the drive of driving motor
Mobile, the movement of conveyer belt 25 will drive fixed block 26 and bonding bar 27 moves from right to left, and bonding bar 27 is moved from right to left
To be bonded in film on bonding bar 27 in the process by pulling force to the left so that film from partial exfoliation on film roll 24 simultaneously
Glued bar 27, which hauls, to be moved to the left, so that it is covered on the top of wafer, after film is covered on the top of wafer, driving motor
In shutdown status, conveyer belt 25 is no longer moved.
At this point, extension sleeve moves down under the promotion of cylinder, support spring 9 is in elongation state.Work as extension sleeve
7 bottom end of second sleeve elastomer block 8 and wafer on film contacts after, cylinder, which continues to press on first sleeve 6, can make first set
Cylinder 6 and the sliding close to each other of second sleeve 7, so that the extension sleeve length that first sleeve 6 and second sleeve 7 are constituted reduces, this
When support spring 9 be in compressive state, and elastomer block 8 can push the middle part of wafer coated with film, so that elastomer block 8 will be in wafer
The water droplet in portion squeezes around, and pressure ram 10 is also at the position in the middle part of wafer at this time.
Limit driving is equipped with since extension sleeve length reduces, and between the first sleeve 6 and pressure ram 10 of extension sleeve
Part, so that pressure ram 10 is in opposite first sleeve 6 inclined state outward.Therefore, after extension sleeve length reduces, the
One sleeve 6 will drive pressure ram 10 and move down, and be fixed in the length due to compression bar 10, and pressure ram 10 is with respect to first set
Cylinder 6 tilts outward, after pressure ram 10 and crystal column surface contact, continues to push then pressure ram 10 and crushing block 11 can be along wafer
Middle part is slided to wafer outer rim, so that the water droplet in the middle part of wafer is squeezed briquetting 11 and pushes to wafer outer rim.In the process, first
Casing 15 the second casing 16 can slide relatively, and after pressure ram 10, which slides into wafer outer rim, to be completed to squeeze, water droplet is extruded into ring
In shape slot 3, the bubble generated when can receive wafer overlay film in water moving process is discharged bubble, avoids in the prior art
To the problem of being easy to appear bubble existing during wafer pad pasting.And crushing block 11 can be detached from from crystal column surface and slide to annular
In slot 3, and uniformly it flow in header tank 20 and is collected via conduit 22 from leakage hole 21.Annular groove 3 is slided in crushing block 11
In the process, extra film extrusion can be attached on the inner wall of annular groove 3 by the inclined-plane 19 on crushing block 11.At this point, first set
The limited block 18 that pipe 15 just slides on the second casing 16 offsets with control switch 17, and limited block 18 squeezes control switch 17,
So that electric telescopic rod 13 is powered, electric telescopic rod 13 extends, so that cutter 14 skid off the opening of open slot 12 and to extra
Film cut.
Then operator removes wafer coated with film, next wafer for needing overlay film is replaced, at this point, weeper is rigid
Good to drip again, driving motor restarting, bonding bar 27 continues to the right to draw film, repeats aforesaid operations, crystalline substance can be realized
Round continuous coating process.
What has been described above is only an embodiment of the present invention, the common sense such as well known specific technical solution and/or characteristic in scheme
It does not describe excessively herein.It should be pointed out that for those skilled in the art, before not departing from technical solution of the present invention
It puts, several modifications and improvements can also be made, these also should be considered as protection scope of the present invention, these all will not influence this
Invent the effect and patent practicability implemented.The scope of protection required by this application should be based on the content of the claims,
The records such as the specific embodiment in specification can be used for explaining the content of claim.
Claims (8)
1. wafer film covering device, it is characterised in that: including overlay film pedestal, the overlay film pedestal is equipped with for fixed to overlay film
The fixing groove of wafer, the periphery of fixing groove are equipped with the annular groove that a circle is arranged concentrically with fixing groove；The top of overlay film pedestal is equipped with
Film-covering mechanism, the film-covering mechanism include the extension sleeve at middle part, and the top of extension sleeve is equipped with water pocket, the bottom of extension sleeve
Equipped with weeper, it is hinged with multiple compression assemblies that can be radially slided in the middle part of the wafer on extension sleeve, compression assemblies and flexible
Limit actuator is connected between sleeve.
2. wafer film covering device according to claim 1, it is characterised in that: it further include rack, the extension sleeve packet
The first sleeve of rotation connection on the rack is included, slidably connects second sleeve in first sleeve, the bottom of second sleeve is affixed
There is sealing plate, the center bottom of the sealing plate is equipped with elastomer block, support spring is connected between sealing plate and first sleeve.
3. wafer film covering device according to claim 2, it is characterised in that: the compression assemblies include multiple be hinged on
The pressure ram of first sleeve outer wall, the bottom end of pressure ram are connected with crushing block, and open slot is equipped in crushing block, opening
Electric telescopic rod is equipped in slot, the end of electric telescopic rod is connected with cutter.
4. wafer film covering device according to claim 3, it is characterised in that: the limit actuator includes rotation connection
First sleeve on pressure ram slidably connects the second casing, the one end of the second casing far from first sleeve in first sleeve
It is rotatably connected on the outer wall of second sleeve, the bottom inside of first sleeve is equipped with the control for driving electric telescopic rod flexible
Switch, the top outer rim of the second casing are connected with the limited block of pressable control switch.
5. wafer film covering device according to claim 3 or 4, it is characterised in that: the crushing block is equipped with open slot
Side wall is equipped with inclined-plane.
6. wafer film covering device according to claim 5, it is characterised in that: the lower section of the overlay film pedestal, which is equipped with, catchments
Case, the annular groove are equipped with multiple leakage holes, conduit are communicated between leakage hole and header tank.
7. wafer film covering device according to claim 6, it is characterised in that: the side of the overlay film pedestal is equipped with rotation
Roll shaft on the rack is connected, film roll is removably connected on roll shaft, overlay film pedestal is equipped with the feeding for pulling film
Mechanism.
8. wafer film covering device according to claim 7, it is characterised in that: the feeding mechanism includes being arranged in overlay film
Two conveyer belts on pedestal both sides, are connected with multiple fixed blocks on conveyer belt, solid between the fixed block of two conveyer belts
It is connected to interval and the bonding bar of film contacts.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811624489.4A CN109727904B (en) | 2018-12-28 | 2018-12-28 | Film coating device for wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811624489.4A CN109727904B (en) | 2018-12-28 | 2018-12-28 | Film coating device for wafer |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109727904A true CN109727904A (en) | 2019-05-07 |
| CN109727904B CN109727904B (en) | 2020-08-21 |
Family
ID=66297494
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811624489.4A Active CN109727904B (en) | 2018-12-28 | 2018-12-28 | Film coating device for wafer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109727904B (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111688351A (en) * | 2020-07-17 | 2020-09-22 | 周余英 | Clamping device for printing and coating process |
| CN114975192A (en) * | 2022-07-28 | 2022-08-30 | 深圳市星国华先进装备科技有限公司 | Can eliminate tectorial membrane device for wafer processing of bubble |
| CN115384883A (en) * | 2022-10-27 | 2022-11-25 | 佛山市川东磁电股份有限公司 | Film-coated packaging equipment for processing thermopile sensor chip |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040035525A1 (en) * | 2001-04-18 | 2004-02-26 | Isao Yokokawa | Production method for bonded substrates |
| CN103538339A (en) * | 2013-10-16 | 2014-01-29 | 袁少山 | Film pasting method of automobile protection films |
| CN106428745A (en) * | 2016-10-26 | 2017-02-22 | 江苏比微曼智能科技有限公司 | Adsorbing type film sticking mechanism |
-
2018
- 2018-12-28 CN CN201811624489.4A patent/CN109727904B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040035525A1 (en) * | 2001-04-18 | 2004-02-26 | Isao Yokokawa | Production method for bonded substrates |
| CN103538339A (en) * | 2013-10-16 | 2014-01-29 | 袁少山 | Film pasting method of automobile protection films |
| CN106428745A (en) * | 2016-10-26 | 2017-02-22 | 江苏比微曼智能科技有限公司 | Adsorbing type film sticking mechanism |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111688351A (en) * | 2020-07-17 | 2020-09-22 | 周余英 | Clamping device for printing and coating process |
| CN114975192A (en) * | 2022-07-28 | 2022-08-30 | 深圳市星国华先进装备科技有限公司 | Can eliminate tectorial membrane device for wafer processing of bubble |
| CN114975192B (en) * | 2022-07-28 | 2022-12-13 | 深圳市星国华先进装备科技有限公司 | Can eliminate tectorial membrane device for wafer processing of bubble |
| CN115384883A (en) * | 2022-10-27 | 2022-11-25 | 佛山市川东磁电股份有限公司 | Film-coated packaging equipment for processing thermopile sensor chip |
| CN115384883B (en) * | 2022-10-27 | 2023-02-03 | 佛山市川东磁电股份有限公司 | Film-coated packaging equipment for processing thermopile sensor chip |
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| Publication number | Publication date |
|---|---|
| CN109727904B (en) | 2020-08-21 |
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