CN214848515U - Wafer pad pasting device of compatible multiple size - Google Patents
Wafer pad pasting device of compatible multiple size Download PDFInfo
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- CN214848515U CN214848515U CN202121292433.0U CN202121292433U CN214848515U CN 214848515 U CN214848515 U CN 214848515U CN 202121292433 U CN202121292433 U CN 202121292433U CN 214848515 U CN214848515 U CN 214848515U
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- 238000009434 installation Methods 0.000 claims abstract description 22
- 238000000926 separation method Methods 0.000 claims abstract description 5
- 239000006260 foam Substances 0.000 claims description 15
- 238000005520 cutting process Methods 0.000 claims description 9
- 230000000903 blocking effect Effects 0.000 claims description 5
- 238000010030 laminating Methods 0.000 claims 5
- 230000000694 effects Effects 0.000 abstract description 14
- 238000000034 method Methods 0.000 abstract description 8
- 230000006978 adaptation Effects 0.000 abstract description 2
- 244000309464 bull Species 0.000 abstract description 2
- 238000012536 packaging technology Methods 0.000 abstract description 2
- 235000012431 wafers Nutrition 0.000 description 41
- 230000001681 protective effect Effects 0.000 description 7
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 238000004804 winding Methods 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000005096 rolling process Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The utility model discloses a wafer pad pasting device of compatible multiple size relates to integrated circuit packaging technology field, specifically is a wafer pad pasting device of compatible multiple size, including top box body, bottom installation piece and installation tray, the place ahead fixedly connected with handle of top box body, the upper surface of top box body is provided with the warning light, one side fixedly connected with separation blade of top box body, and the sliding tray has been seted up to the lower surface of top box body, the first hydraulic stem of inside wall fixedly connected with of sliding tray. This wafer pad pasting device of compatible multiple size through the setting of combination piece, makes this wafer pad pasting device of compatible multiple size possess the effect of being convenient for change the mould, sets up through the cooperation of bottom installation piece, installation tray, combination piece, bull stick, combination fixture block and combination spring, and the in-process that uses can quick assembly disassembly installation tray to play the effect of being convenient for change the not mould of equidimension, reached the purpose of the not wafer of adaptation unidimensional.
Description
Technical Field
The utility model relates to an integrated circuit packaging technology field specifically is a wafer pad pasting device of compatible multiple size.
Background
The wafer refers to a silicon wafer used for manufacturing a silicon semiconductor integrated circuit, and is called a wafer because the shape is circular; various circuit element structures can be processed on a silicon wafer to form an integrated circuit product with specific electrical functions. In the process of packaging an integrated circuit, a wafer is often thinned, so that a side film is required to be attached to the surface of the wafer to protect the surface of a chip, so that the chip on the wafer cannot be contaminated or scratched by foreign matters.
However, the existing film pasting device can only paste a film on a single-size wafer, and cannot realize the replacement of a die or the replacement and switching of the die, which is very complicated, and thus needs to be improved.
SUMMERY OF THE UTILITY MODEL
Technical problem to be solved
Not enough to prior art, the utility model provides a wafer pad pasting device of compatible multiple size has solved the problem that proposes in the above-mentioned background art.
(II) technical scheme
In order to achieve the above purpose, the utility model discloses a following technical scheme realizes: a wafer film pasting device compatible with various sizes comprises a top box body, a bottom mounting block and a mounting tray, wherein a handle is fixedly connected to the front of the top box body, a warning lamp is arranged on the upper surface of the top box body, a blocking piece is fixedly connected to one side of the top box body, a sliding groove is formed in the lower surface of the top box body, a first hydraulic rod is fixedly connected to the inner side wall of the sliding groove, a sliding block is fixedly connected to one end of the first hydraulic rod, one side of the sliding block is slidably connected with the inner side wall of the sliding groove, a first mounting groove is formed in the lower surface of the top box body, a first switch is fixedly connected to the inner top wall of the first mounting groove, a second switch is fixedly connected to the inner side wall of the sliding groove, the rear of the bottom mounting block is rotatably connected with the rear of the top box body, a combination groove is formed in the upper surface of the bottom mounting block, and a combination block is inserted in the combination groove, a clamping groove is formed in one side of the combined block, a rotating hole is formed in the front of the bottom mounting block, a rotating rod is inserted into the rotating hole, and a combined clamping block is fixedly connected to one end of the rotating rod.
Optionally, one side fixedly connected with of separation blade is spacing spring, and spacing piece of one end fixedly connected with of spacing spring, one side fixedly connected with fixing bolt of spacing piece, sliding through hole has been seted up to one side of separation blade, fixing bolt runs through sliding through hole.
Optionally, the spout has been seted up to one side of sliding block, and the inside wall sliding connection of spout has the elevator, and the last fixed surface of elevator is connected with lifting spring, lifting spring's one end and the interior roof fixed connection of spout, one side of elevator rotates and is connected with the pivot, and the surface of pivot has cup jointed the foam cylinder, cutting blade has been cup jointed to the surface of pivot.
Optionally, the first switch is electrically connected with the first hydraulic rod through a wire, and the second switch is electrically connected with the warning light through a wire.
Optionally, the upper surface of combination piece and the lower fixed surface of installation tray are connected, the spacing groove has been seted up to the upper surface of installation tray, and spacing hole groove has been seted up to the inside wall of spacing groove, and the inside in spacing hole groove is provided with the second hydraulic stem, the one end fixedly connected with splint of second hydraulic stem, the bottom mounting groove has been seted up to the inner diapire of combination groove, and the inner diapire fixedly connected with third switch of bottom mounting groove, the inner diapire fixedly connected with fourth switch of combination groove, third switch and fourth switch all lead to light wire electric connection with the second hydraulic stem.
Optionally, one side of the combined clamping block is fixedly connected with a combined spring, one end of the combined spring is fixedly connected with the inner side wall of the combined groove, and the other end of the rotating rod is fixedly connected with an operation block.
(III) advantageous effects
The utility model provides a wafer pad pasting device of compatible multiple size possesses following beneficial effect:
1. this wafer pad pasting device of compatible multiple size through the setting of combination piece, makes this wafer pad pasting device of compatible multiple size possess the effect of being convenient for change the mould, sets up through the cooperation of bottom installation piece, installation tray, combination piece, bull stick, combination fixture block and combination spring, and the in-process that uses can quick assembly disassembly installation tray to play the effect of being convenient for change the not mould of equidimension, reached the purpose of the not wafer of adaptation unidimensional.
2. This wafer pad pasting device of compatible multiple size, setting through first hydraulic stem makes this wafer pad pasting device of compatible multiple size possess the effect of automatic pad pasting, through first hydraulic stem, the sliding block, the elevator, the lift spring, foam roller and cutting blade's cooperation sets up, the in-process that uses can carry out the pad pasting operation to the wafer surface automatically, and roll through foam roller reduces the bubble between pad pasting and the wafer, thereby has played the effect that improves pad pasting efficiency and pad pasting quality.
Drawings
FIG. 1 is a schematic perspective view of the present invention;
FIG. 2 is a schematic sectional view of the top view structure of the present invention;
FIG. 3 is a schematic sectional view of the top box of the present invention showing a side view;
fig. 4 is a schematic side view of the bottom mounting block of the present invention.
In the figure: 1. a top box body; 2. a bottom mounting block; 3. installing a tray; 4. a handle; 5. a warning light; 6. a baffle plate; 7. a limiting spring; 8. a limiting sheet; 9. fixing the bolt; 10. a first hydraulic lever; 11. a slider; 12. a lifting block; 13. a lift spring; 14. a rotating shaft; 15. a foam roller; 16. a cutting blade; 17. a first switch; 18. a second switch; 19. combining the blocks; 20. a second hydraulic rod; 21. a splint; 22. a third switch; 23. a rotating rod; 24. combining the fixture blocks; 25. a combination spring; 26. and a fourth switch.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments.
Referring to fig. 1 to 4, the present invention provides a technical solution: a wafer film pasting device compatible with various sizes comprises a top box body 1, a bottom mounting block 2 and a mounting tray 3, a handle 4 is fixedly connected in front of the top box body 1, a warning lamp 5 is arranged on the upper surface of the top box body 1, a blocking piece 6 is fixedly connected to one side of the top box body 1, a limiting spring 7 is fixedly connected to one side of the blocking piece 6, a limiting piece 8 is fixedly connected to one end of the limiting spring 7, a fixing bolt 9 is fixedly connected to one side of the limiting piece 8, a sliding through hole is formed in one side of the blocking piece 6, the fixing bolt 9 penetrates through the sliding through hole, a sliding groove is formed in the lower surface of the top box body 1, a first hydraulic rod 10 is fixedly connected to the inner side wall of the sliding groove, a sliding block 11 is fixedly connected to one end of the first hydraulic rod 10, one side of the sliding block 11 is slidably connected to the inner side wall of the sliding groove, a sliding groove is formed in one side of the sliding block 11, and a lifting block 12 is slidably connected to the inner side wall of the sliding groove, the upper surface of the lifting block 12 is fixedly connected with a lifting spring 13, one end of the lifting spring 13 is fixedly connected with the inner top wall of the sliding groove, one side of the lifting block 12 is rotatably connected with a rotating shaft 14, a foam roller 15 is sleeved on the outer surface of the rotating shaft 14, a cutting blade 16 is sleeved on the outer surface of the rotating shaft 14, and through the arrangement of the first hydraulic rod 10, the wafer film pasting device compatible with various sizes has the effect of automatic film pasting, through the matching arrangement of the first hydraulic rod 10, the sliding block 11, the lifting block 12, the lifting spring 13, the foam roller 15 and the cutting blade 16, the film pasting operation can be automatically carried out on the surface of the wafer in the using process, bubbles between the film pasting and the wafer are reduced through the rolling of the foam roller 15, so that the effects of improving the film pasting efficiency and the film pasting quality are achieved, the first mounting groove is formed in the lower surface of the top box body 1, the inner top wall of the first mounting groove is fixedly connected with a first switch 17, the inner side wall of the sliding groove is fixedly connected with a second switch 18, a first switch 17 is electrically connected with a first hydraulic rod 10 through a lead, the second switch 18 is electrically connected with a warning lamp 5 through a lead, the rear part of the bottom mounting block 2 is rotatably connected with the rear part of the top box body 1, the upper surface of the bottom mounting block 2 is provided with a combined groove, the combined groove is internally inserted with a combined block 19, one side of the combined block 19 is provided with a clamping groove, the upper surface of the combined block 19 is fixedly connected with the lower surface of the mounting tray 3, the upper surface of the mounting tray 3 is provided with a limiting groove, the inner side wall of the limiting groove is provided with a limiting hole groove, the inner part of the limiting hole groove is provided with a second hydraulic rod 20, one end of the second hydraulic rod 20 is fixedly connected with a clamping plate 21, the inner bottom mounting groove is formed in the inner bottom wall of the combined groove, the inner bottom wall of the bottom mounting groove is fixedly connected with a third switch 22, and the inner bottom wall of the combined groove is fixedly connected with a fourth switch 26, the third switch 22 and the fourth switch 26 are both electrically connected with the second hydraulic rod 20 through optical wires, a rotating hole is arranged in front of the bottom mounting block 2, a rotating rod 23 is inserted in the rotating hole, one end of the rotating rod 23 is fixedly connected with a combined clamping block 24, one side of the combined clamping block 24 is fixedly connected with a combined spring 25, one end of the combined spring 25 is fixedly connected with the inner side wall of the combined groove, the other end of the rotating rod 23 is fixedly connected with an operating block, through the arrangement of the combination block 19, the wafer film sticking device compatible with various sizes has the effect of facilitating the replacement of the die, through the matching arrangement of the bottom mounting block 2, the mounting tray 3, the combination block 19, the rotating rod 23, the combination clamping block 24 and the combination spring 25, the tray 3 can be quickly assembled and disassembled in the using process, so that the effect of conveniently replacing moulds with different sizes is achieved, and the purpose of adapting to wafers with different sizes is achieved.
When the protective film winding device is used, the limiting piece 8 is pulled outwards, the limiting piece 8 drives the fixing pins 9 to move outwards and stretches the limiting spring 7, so that gaps among the fixing pins 9 are enlarged, then the protective film winding drum is sleeved on the outer surface of the fixing pins 9, the limiting piece 8 is released, the limiting spring 7 is restored to drive the limiting piece 8 and the fixing pins 9 to move inwards to fix the protective film winding drum, then a wafer is placed in a limiting groove formed above the mounting tray 3, the lower part of the wafer is contacted with the third switch 22, the third switch 22 starts the second hydraulic rod 20, the second hydraulic rod 20 extends to drive the clamping plate 21 to move forwards to clamp one side of the wafer so as to fix the wafer, then the protective film is pulled outwards, the handle 4 is held to rotate downwards, so that the top box body 1 is covered above the mounting tray 3, the upper surface of the mounting tray 3 is contacted with the first switch 17, the first hydraulic rod 10 is started by the first switch 17, the first hydraulic rod 10 extends to drive the sliding block 11 to move forwards, the sliding block 11 drives the lifting block 12 and the rotating shaft 14 to move forwards, the rotating shaft 14 moves forwards to drive the foam roller 15 and the cutting blade 16 to roll forwards, the foam roller 15 rolls from the upper surface of the wafer to enable the rotating shaft 14 to move upwards, the rotating shaft 14 drives the lifting block 12 to move upwards, the lifting block 12 compresses the lifting spring 13, one side of the foam roller 15 is enabled to be tightly attached to the upper surface of the wafer, the foam roller 15 rolls forwards to discharge air between a protective film and the wafer to avoid bubbles from forming below the protective film, the protective film is cut off when the cutting blade 16 rolls forwards, the foam roller 15 moves forwards to contact the second switch 18, the second switch 18 starts the warning lamp 5 to enable the warning lamp 5 to light up to remind a worker that film attaching is completed, the handle 4 is lifted upwards to lift the top box body 1, and when the wafer needs to be taken down, the fourth switch 26 is pressed downwards, the fourth switch 26 starts the second hydraulic rod 20 to contract, and then the wafer is pulled up from one side to be taken out, when the wafer with different sizes needs to be pasted, when the installation tray 3 with different sizes is replaced, the rotating rod 23 is rotated, the rotating rod 23 drives the combined clamping block 24 to rotate, the combined clamping block 24 is moved out of the clamping groove at one side of the combined block 19 and compresses the combined spring 25, then the installation tray 3 is taken up upwards for replacement, the combination block 19 below the new installation tray 3 is aligned with the combination groove on the upper surface of the bottom installation block 2 and clamped downwards, the combination block 19 extrudes the combination clamping block 24 to enable the combination clamping block 24 to rotate towards one side, the combination clamping block 24 compresses the combination spring 25, when the combination block 19 moves to the lower part of the combination groove, the combination spring 25 restores to drive the combination clamping block 24 to clamp the combination block 19 in the clamping groove again, so that the installation tray 3 is fixed and is convenient to replace.
The utility model discloses a theory of operation and beneficial effect: the wafer film pasting device compatible with various sizes has the effect of facilitating the replacement of a die by arranging the combination block 19, the installation tray 3 can be quickly disassembled and assembled in the use process by arranging the bottom installation block 2, the installation tray 3, the combination block 19, the rotating rod 23, the combination fixture block 24 and the combination spring 25 in a matching way, so that the effect of facilitating the replacement of dies with different sizes is achieved, the purpose of adapting to wafers with different sizes is achieved, the wafer film pasting device compatible with various sizes has the effect of automatic film pasting by arranging the first hydraulic rod 10, and the film pasting operation can be automatically carried out on the surface of the wafer in the use process by arranging the first hydraulic rod 10, the sliding block 11, the lifting block 12, the lifting spring 13, the foam roller 15 and the cutting blade 16 in a matching way, and the bubble between the film and the wafer is reduced through the rolling of the foam roller 15, thereby playing the role of improving the film sticking efficiency and the film sticking quality.
The above, only be the concrete implementation of the preferred embodiment of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art is in the technical scope of the present invention, according to the technical solution of the present invention and the utility model, the concept of which is equivalent to replace or change, should be covered within the protection scope of the present invention.
Claims (6)
1. The utility model provides a wafer pad pasting device of compatible multiple size, includes top box body (1), bottom installation piece (2) and installation tray (3), its characterized in that: the front of the top box body (1) is fixedly connected with a handle (4), the upper surface of the top box body (1) is provided with a warning lamp (5), one side of the top box body (1) is fixedly connected with a blocking piece (6), the lower surface of the top box body (1) is provided with a sliding groove, the inner side wall of the sliding groove is fixedly connected with a first hydraulic rod (10), one end of the first hydraulic rod (10) is fixedly connected with a sliding block (11), one side of the sliding block (11) is slidably connected with the inner side wall of the sliding groove, the lower surface of the top box body (1) is provided with a first mounting groove, the inner top wall of the first mounting groove is fixedly connected with a first switch (17), the inner side wall of the sliding groove is fixedly connected with a second switch (18), the rear of the bottom mounting block (2) is rotatably connected with the rear of the top box body (1), the upper surface of the bottom mounting block (2) is provided with a combined groove, a combination block (19) is inserted into the combination groove, a clamping groove is formed in one side of the combination block (19), a rotary hole is formed in the front of the bottom mounting block (2), a rotary rod (23) is inserted into the rotary hole, and a combination clamping block (24) is fixedly connected to one end of the rotary rod (23).
2. The wafer laminating device compatible with multiple sizes of the wafer as claimed in claim 1, wherein: spacing spring (7) of one side fixedly connected with of separation blade (6), spacing piece (8) of one end fixedly connected with of spacing spring (7), one side fixedly connected with fixing bolt (9) of spacing piece (8), the slip through-hole has been seted up to one side of separation blade (6), fixing bolt (9) run through the slip through-hole.
3. The wafer laminating device compatible with multiple sizes of the wafer as claimed in claim 1, wherein: the spout has been seted up to one side of sliding block (11), and the inside wall sliding connection of spout has elevator (12), and the last fixed surface of elevator (12) is connected with lift spring (13), the one end of lift spring (13) and the interior roof fixed connection of spout, one side of elevator (12) is rotated and is connected with pivot (14), and foam cylinder (15) have been cup jointed to the surface of pivot (14), cutting blade (16) have been cup jointed to the surface of pivot (14).
4. The wafer laminating device compatible with multiple sizes of the wafer as claimed in claim 1, wherein: the first switch (17) is electrically connected with the first hydraulic rod (10) through a lead, and the second switch (18) is electrically connected with the warning lamp (5) through a lead.
5. The wafer laminating device compatible with multiple sizes of the wafer as claimed in claim 1, wherein: the upper surface of combination piece (19) and the lower fixed surface of installation tray (3) are connected, the spacing groove has been seted up to the upper surface of installation tray (3), and spacing hole groove has been seted up to the inside wall of spacing groove, and the inside in spacing hole groove is provided with second hydraulic stem (20), and one end fixedly connected with splint (21) of second hydraulic stem (20), the bottom mounting groove has been seted up to the inner bottom wall in combination groove, and the inner bottom wall fixedly connected with third switch (22) in bottom mounting groove, the inner bottom wall fixedly connected with fourth switch (26) in combination groove, third switch (22) and fourth switch (26) all pass through wire electric connection with second hydraulic stem (20).
6. The wafer laminating device compatible with multiple sizes of the wafer as claimed in claim 1, wherein: one side of the combined clamping block (24) is fixedly connected with a combined spring (25), one end of the combined spring (25) is fixedly connected with the inner side wall of the combined groove, and the other end of the rotating rod (23) is fixedly connected with an operation block.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121292433.0U CN214848515U (en) | 2021-06-09 | 2021-06-09 | Wafer pad pasting device of compatible multiple size |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121292433.0U CN214848515U (en) | 2021-06-09 | 2021-06-09 | Wafer pad pasting device of compatible multiple size |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214848515U true CN214848515U (en) | 2021-11-23 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121292433.0U Active CN214848515U (en) | 2021-06-09 | 2021-06-09 | Wafer pad pasting device of compatible multiple size |
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| Country | Link |
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| CN (1) | CN214848515U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114361094A (en) * | 2022-03-15 | 2022-04-15 | 三河建华高科有限责任公司 | Efficient feeding transmission device suitable for stacking wafers |
| CN117524929A (en) * | 2023-11-03 | 2024-02-06 | 池州市广郁电子科技有限公司 | Wafer dicing device for semiconductor packaging processing |
-
2021
- 2021-06-09 CN CN202121292433.0U patent/CN214848515U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114361094A (en) * | 2022-03-15 | 2022-04-15 | 三河建华高科有限责任公司 | Efficient feeding transmission device suitable for stacking wafers |
| CN114361094B (en) * | 2022-03-15 | 2022-06-03 | 三河建华高科有限责任公司 | Efficient feeding transmission device suitable for stacking wafers |
| CN117524929A (en) * | 2023-11-03 | 2024-02-06 | 池州市广郁电子科技有限公司 | Wafer dicing device for semiconductor packaging processing |
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Address after: 214000, Floor 1-2, Building 3, Xiakewan Chuangzhi Park, No. 215 Qingtong Road, Qingyang Town, Jiangyin City, Wuxi City, Jiangsu Province Patentee after: Jiangsu General Semiconductor Co.,Ltd. Country or region after: China Address before: Room a130-10, 1st floor, building 2, entrepreneurship center, No.96 Ruida Road, Zhengzhou high tech Industrial Development Zone, Henan Province, 450000 Patentee before: Henan general intelligent equipment Co.,Ltd. Country or region before: China |