CN109727904B

CN109727904B - Film coating device for wafer

Info

Publication number: CN109727904B
Application number: CN201811624489.4A
Authority: CN
Inventors: 黄晓波; 罗云红
Original assignee: Anhui Longxin Microtechnology Co ltd
Current assignee: Anhui Longxin Microtechnology Co ltd
Priority date: 2018-12-28
Filing date: 2018-12-28
Publication date: 2020-08-21
Anticipated expiration: 2038-12-28
Also published as: CN109727904A

Abstract

The invention relates to the field of chip processing, and particularly discloses a film covering device for a wafer, which comprises a film covering base, wherein a fixing groove for fixing the wafer to be covered with a film is arranged on the film covering base, and a circle of annular grooves which are concentric with the fixing groove are formed in the periphery of the fixing groove; the top of tectorial membrane base is equipped with tectorial membrane mechanism, and tectorial membrane mechanism includes the telescope tube at middle part, and telescope tube's top is equipped with the water pocket, and telescope tube's bottom is equipped with the hole of dripping, and articulated on the telescope tube have a plurality of can follow the radial gliding extrusion subassembly in wafer middle part, swing joint has spacing driving piece between extrusion subassembly and the telescope tube. The invention solves the problem that bubbles are easy to appear in the process of pasting the film on the wafer in the prior art.

Description

Film coating device for wafer

Technical Field

The invention relates to the field of chip processing, in particular to a film covering device for a wafer.

Background

The wafer is a silicon wafer used for manufacturing a silicon semiconductor integrated circuit, and is called a wafer because it has a circular shape. Various circuit element structures can be manufactured on a wafer, and the circuit surface of the wafer, i.e. the surface that performs the function of a chip, is generally called a front surface, and the other surface is a back surface. In a wafer processing process, a dicing process is usually performed, and before dicing the wafer, a thin film, i.e., a dicing film, is usually attached to the back surface of the wafer in order to protect the wafer during dicing. In the traditional film pasting process, a film is arranged in a coiled mode, the film is continuously discharged after the film coil rotates, and the area of the film is larger than that of a wafer. After the film is attached to the surface of the wafer, the film is cut along the edge of the wafer by holding the blade with hands or by using a manipulator, and the redundant film which exceeds the wafer is cut off, so that the process of attaching the film to the surface of the wafer is completed.

However, in the above-mentioned film-attaching process, bubbles often exist between the wafer and the film due to the difference in the magnitude of the force applied by the film-attaching operator. When bubbles appear on the surface of the wafer, the attached film needs to be removed, and then the film is attached for the second time, so that raw materials are wasted, and the film attaching efficiency is reduced.

Disclosure of Invention

The invention aims to provide a film laminating device for a wafer, which is used for solving the problem that bubbles are easy to appear in the process of laminating a film on the wafer in the prior art.

In order to achieve the purpose, the technical scheme of the invention is as follows: the film covering device for the wafer comprises a film covering base, wherein a fixing groove for fixing the wafer to be film covered is formed in the film covering base, and a circle of annular groove which is concentric with the fixing groove is formed in the periphery of the fixing groove; the top of tectorial membrane base is equipped with tectorial membrane mechanism, and tectorial membrane mechanism includes the telescope tube at middle part, and telescope tube's top is equipped with the water pocket, and telescope tube's bottom is equipped with the hole of dripping, and articulated on the telescope tube have a plurality of can follow the radial gliding extrusion subassembly in wafer middle part, swing joint has spacing driving piece between extrusion subassembly and the telescope tube.

The principle and the beneficial effects of the technical scheme are as follows: in the technical scheme, the film covering base plays a role of integral support, and the fixing groove in the film covering base is used for accommodating and fixing the wafer to be covered with the film; before the wafer is coated with the film, water in the water bag can drip on the wafer along the water dripping holes, then the film is attached to the wafer on which water drops are dripped, and the film coating assembly is used for extruding the wafer after film coating, so that the film is tightly attached to the wafer. The telescopic sleeve is attached at the film back, because the telescopic sleeve is located the middle part, the telescopic sleeve can extrude the center of wafer at first at the in-process of pushing down the film, make the water droplet of wafer center department to peripheral diffusion, the extrusion subassembly is used for carrying out further extrusion to the wafer after the tectorial membrane, continue to push the water droplet to the extrusion of wafer outer fringe and impel, finally discharge water, at the in-process of water discharge, the bubble that produces when the water removes the in-process and can take in the wafer tectorial membrane, make the bubble discharged, the problem of the bubble appears easily among the prior art to the wafer tectorial membrane in-process has been avoided. The limiting driving piece is used for limiting the sliding stroke of the extrusion assembly along the wafer, and the end point of removing bubbles and water by extrusion can be automatically determined.

Further, still include the frame, the telescope tube is including rotating the first sleeve of connection in the frame, and sliding connection has the second sleeve in the first sleeve, and the telescopic bottom rigid coupling of second has the closing plate, and the bottom middle part of closing plate is equipped with the elastic block, and the rigid coupling has supporting spring between closing plate and the first sleeve.

The rack plays a role in supporting, and the support spring plays a role in supporting the first sleeve and the second sleeve when the telescopic sleeve does not press the wafer; when the wafer is pressed down to the telescopic sleeve, the second sleeve can slide to one side near the first sleeve relatively to the first sleeve after the second sleeve contacts the surface of the wafer of tectorial membrane for telescopic sleeve's length reduces, and the elastic block at closing plate middle part is used for carrying out accurate extrusion to the position that drips on the wafer, and because the elastic block has elasticity, the elastic block still has certain cushioning effect, avoids the damage of wafer.

Further, the extrusion subassembly includes a plurality of stripper bars that articulate at first sleeve outer wall, and the equal swing joint in bottom of stripper bar has the extrusion piece, all is equipped with the open slot in the extrusion piece, all is equipped with electric telescopic handle in the open slot, and electric telescopic handle's tip rigid coupling has the cutting knife.

When the length of the telescopic sleeve is reduced after the telescopic sleeve presses the coated wafer downwards, the extrusion rod hinged to the outer wall of the first sleeve can slide radially to the outer edge of the wafer along the middle of the wafer under the limitation of the limiting driving piece, and when the extrusion block at the end part of the extrusion rod slides to be separated from the wafer and located in the annular groove, the electric telescopic rod extends to enable the cutting knife to extend out of the open groove, so that redundant films are cut, and the process of automatically cutting and trimming the coated wafer is realized.

Further, the limiting driving piece comprises a first sleeve connected to the extrusion rod in a rotating mode, a second sleeve is connected to the inside of the first sleeve in a sliding mode, one end, far away from the first sleeve, of the second sleeve is connected to the outer wall of the second sleeve in a rotating mode, a control switch used for driving the electric telescopic rod to stretch out and draw back is arranged on the inner side of the bottom of the first sleeve, and a limiting block capable of pressing the control switch is fixedly connected to the outer edge of the top of the second sleeve.

After telescopic sleeve length reduces, the extrusion stem and the extrusion piece are at the in-process that slides to the wafer outer fringe along the wafer middle part, and first sleeve pipe can slide relative second sleeve pipe, and after the extrusion stem slides the wafer outer fringe and accomplishes the extrusion, when the stopper that first sleeve pipe slided on the second sleeve pipe offsets with control switch, stopper extrusion control switch for electric telescopic handle circular telegram, the cutting knife cuts unnecessary film, has reached the effect that the film extrusion was ended and the cutting goes on in step.

Furthermore, the side wall of the extrusion block provided with the open slot is provided with an inclined plane.

After the extrusion block slides along the wafer, the extrusion block can be separated from the outer edge of the wafer and slide into the annular groove, and in the process, the inclined plane on the extrusion block can extrude redundant films, so that the redundant films are attached to the inner wall of the annular groove, and the cutting of the cutting knife is facilitated.

Further, a water collecting tank is arranged below the film covering base, a plurality of water leakage holes are formed in the annular groove, and a guide pipe is communicated between each water leakage hole and the water collecting tank.

When the water drops on the wafer are extruded out, the water flows into the annular groove and flows into the water collecting tank from the water leakage hole through the guide pipe system to be collected, and waste of water resources is avoided.

Furthermore, one side of the film covering base is provided with a roll shaft which is rotatably connected to the rack, the roll shaft is detachably connected with a film roll, and the film covering base is provided with a feeding mechanism for pulling the film.

The roller is used for supporting the film roll, and feeding mechanism is used for carrying out automatic feed to the film roll, convenient operation.

Further, feeding mechanism is including setting up two conveyer belts on tectorial membrane base both sides portion, and equal rigid coupling has a plurality of fixed blocks on the conveyer belt, and the rigid coupling has the bonding rod of intermittent type and film contact between the fixed block of two conveyer belts.

The adhesive linkage is used for carrying out the adhesion to the film tip, and the conveyer belt is used for driving fixed block and adhesive linkage to remove, and after adhesive linkage adhesion film, the conveyer belt removes and can drive the adhesive linkage and remove for the film of adhesive linkage adhesion is pulled out under the pulling force effect, and the film can be attached on the surface of wafer voluntarily to the removal of adhesive linkage, has realized the automatic adhesion of film, and degree of automation is high.

Drawings

FIG. 1 is a front view of a film covering device for a wafer according to an embodiment of the present invention;

FIG. 2 is a top view of the coated base of FIG. 1;

FIG. 3 is an enlarged view taken at A1 in FIG. 1;

fig. 4 is an enlarged view at a2 in fig. 1.

Detailed Description

The following is further detailed by way of specific embodiments:

reference numerals in the drawings of the specification include: tectorial membrane base 1, fixed slot 2, ring channel 3, water pocket 4, frame 5, first sleeve 6, second sleeve 7, elastic block 8, supporting spring 9, extrusion ram 10, extrusion block 11, open slot 12, electric telescopic handle 13, cutting knife 14, first sleeve 15, second sleeve 16, control switch 17, stopper 18, inclined plane 19, header tank 20, the hole 21 that leaks, pipe 22, roller 23, film book 24, conveyer belt 25, fixed block 26, bonding pole 27.

The embodiment is basically as shown in the attached figure 1: tectorial membrane device for wafer, including frame 5, fixedly connected with tectorial membrane base 1 on the frame 5 is equipped with the circular shape fixed slot 2 that is used for fixed treating the tectorial membrane wafer on the tectorial membrane base 1, and the periphery of fixed slot 2 is equipped with the ring channel 3 of round and the concentric setting of fixed slot 2.

The top of tectorial membrane base 1 is equipped with tectorial membrane mechanism, and tectorial membrane mechanism includes telescopic tube, and telescopic tube's top is equipped with the cylinder that is used for pushing down telescopic tube, and the cylinder rigid coupling is in frame 5. The telescopic sleeve includes that the first sleeve 6 of rotation connection on the cylinder piston pole, and sliding connection has second sleeve 7 in the first sleeve 6, and the bottom rigid coupling of second sleeve 7 has the closing plate, and the bottom middle part rigid coupling of closing plate has elastic block 8, and the rigid coupling has supporting spring 9 between closing plate and the first sleeve 6. The top of the first sleeve 6 is provided with a water bag 4, the bottom of the second sleeve 7 is provided with a water dripping hole, a water pipe (not shown in the figure) is connected between the water bag 4 and the water dripping hole, and the diameter of the water pipe is 0.1 mm.

Articulated on the first sleeve 6 have two extrusion stems 10, and two extrusion stems 10 use the axis of first sleeve 6 to set up as central symmetry, and the equal swing joint in bottom of extrusion stem 10 has a recipient 11, combines fig. 4 to show, all is equipped with open slot 12 in the recipient 11, and equal rigid coupling electric telescopic handle 13 in the open slot 12, and electric telescopic handle 13 in this embodiment is common electric telescopic loop bar among the prior art, and the structure is not repeated here. The end of the electric telescopic rod 13 is fixedly connected with a cutting knife 14, and the side wall of the extrusion block 11 provided with the open slot 12 is set to be an inclined plane 19.

Referring to fig. 3, the extrusion rod 10 is rotatably connected with a first sleeve 15, a second sleeve 16 is slidably connected in the first sleeve 15, one end of the second sleeve 16, which is far away from the first sleeve 15, is rotatably connected to the outer wall of the second sleeve 7, a control switch 17 for driving the electric telescopic rod 13 to stretch and retract is arranged on the inner side of the bottom of the first sleeve 15, and a limit block 18 capable of pressing the control switch 17 is fixedly connected to the outer edge of the top of the second sleeve 16.

A water collecting tank 20 is arranged below the film covering base 1, a plurality of water leakage holes 21 are arranged on the annular groove 3, and a guide pipe 22 is communicated between the water leakage holes 21 and the water collecting tank 20. Referring to fig. 2, a roller shaft 23 rotatably connected to the frame 5 is disposed on the right side of the film covering base 1, a film roll 24 is detachably connected to the roller shaft 23, and a feeding mechanism for pulling a film is disposed on the film covering base 1. Feeding mechanism is including setting up two conveyer belts 25 on tectorial membrane base 1 upper and lower both sides portion, and equal rigid coupling has two fixed blocks 26 on the conveyer belt 25, and fixed block 26 on two conveyer belts 25 all corresponds the setting, and the rigid coupling has intermittent type and film contact's bonding pole 27 between the fixed block 26 of two conveyer belts 25, and one side of conveyer belt 25 is equipped with the driving motor who is used for driving conveyer belt 25.

The specific implementation process is as follows: firstly, a wafer to be coated is placed in the fixing groove 2 of the coating base 1, the back of the wafer faces upwards, and water in the water bag 4 falls to the center of the wafer from the water dripping hole. The free end of the film roll 24 is manually pulled and glued to the glue bar 27. Then the driving motor is started, the conveyor belt 25 is driven by the driving motor to move, the conveyor belt 25 moves to drive the fixing block 26 and the bonding rod 27 to move from right to left, the bonding rod 27 enables the film bonded on the bonding rod 27 to be subjected to leftward pulling force in the process of moving from right to left, the film partially falls off from the film roll 24 and is pulled by the bonding rod 27 to move leftward, so that the film is covered above the wafer, after the film is covered above the wafer, the driving motor is in a stop state, and the conveyor belt 25 does not move any more.

At this time, the telescopic sleeve is pushed by the cylinder to move downward, and the support spring 9 is in an extended state. After the elastic block 8 at the bottom end of the second sleeve 7 of the telescopic sleeve is in contact with the film on the wafer, the cylinder continues to push the first sleeve 6 to enable the first sleeve 6 and the second sleeve 7 to be close to each other and slide, so that the length of the telescopic sleeve formed by the first sleeve 6 and the second sleeve 7 is reduced, the supporting spring 9 is in a compression state at the moment, the elastic block 8 presses down the middle part of the wafer after the film is coated, the elastic block 8 extrudes the water drops in the middle part of the wafer all around, and the extrusion rod 10 is also located at the position in the middle part of the wafer at the moment.

Because telescopic sleeve length reduces, and be equipped with spacing driving piece between telescopic sleeve's first sleeve 6 and the extrusion pole 10 for extrusion pole 10 is in the state of the outside slope of relative first sleeve 6. Therefore, after the length of the telescopic sleeve is reduced, the first sleeve 6 can drive the extrusion rod 10 to move downwards, and after the length of the compression rod 10 is fixed and the extrusion rod 10 inclines outwards relative to the first sleeve 6, the extrusion rod 10 and the extrusion block 11 can slide towards the outer edge of the wafer along the middle part of the wafer by continuously pressing downwards after the extrusion rod 10 is contacted with the surface of the wafer, so that water drops in the middle part of the wafer are pushed towards the outer edge of the wafer by the extrusion block 11. In the process, the first sleeve 15 slides relative to the second sleeve 16, when the extrusion rod 10 slides to the outer edge of the wafer to complete extrusion, water drops are extruded into the annular groove 3, bubbles generated in the process of laminating the wafer can be absorbed by water in the moving process, the bubbles are discharged, and the problem that bubbles are easy to generate in the process of laminating the wafer in the prior art is solved. The pressing block 11 is detached from the wafer surface and slides into the annular groove 3, and flows from the water leakage hole 21 to the water collection tank 20 through the conduit 22 to be collected. During the process that the extrusion block 11 slides to the annular groove 3, the inclined surface 19 on the extrusion block 11 presses and attaches the redundant film on the inner wall of the annular groove 3. At this time, the first sleeve 15 just slides to the limit block 18 on the second sleeve 16 to abut against the control switch 17, the limit block 18 extrudes the control switch 17, so that the electric telescopic rod 13 is powered on, the electric telescopic rod 13 extends, and the cutting knife 14 slides out of the opening of the open slot 12 and cuts redundant films.

Then the operator takes the coated wafer down, changes the next wafer needing coating, at this moment, the water dripping hole just drips again, the driving motor restarts, the bonding rod 27 continues to pull the film to the right, and the continuous coating process of the wafer can be realized by repeating the above operations.

The foregoing is merely an example of the present invention and common general knowledge in the art of designing and/or characterizing particular aspects and/or features is not described in any greater detail herein. It should be noted that, for those skilled in the art, without departing from the technical solution of the present invention, several variations and modifications can be made, which should also be regarded as the protection scope of the present invention, and these will not affect the effect of the implementation of the present invention and the practicability of the patent. The scope of the claims of the present application shall be determined by the contents of the claims, and the description of the embodiments and the like in the specification shall be used to explain the contents of the claims.

Claims

1. The laminating device for the wafer is characterized in that: the laminating machine comprises a rack and a laminating base, wherein a fixing groove for fixing a wafer to be laminated is arranged on the laminating base, and a circle of annular groove concentric with the fixing groove is formed in the periphery of the fixing groove; a film coating mechanism is arranged above the film coating base and comprises a telescopic sleeve in the middle, a water bag is arranged at the top of the telescopic sleeve, a water dripping hole is formed in the bottom of the telescopic sleeve, a plurality of extrusion assemblies capable of sliding along the radial direction of the middle part of the wafer are hinged to the telescopic sleeve, and a limiting driving piece is movably connected between each extrusion assembly and the telescopic sleeve; the telescopic sleeve comprises a first sleeve which is rotatably connected to the rack, a second sleeve is connected in the first sleeve in a sliding mode, a sealing plate is fixedly connected to the bottom of the second sleeve, an elastic block is arranged in the middle of the bottom end of the sealing plate, and a supporting spring is fixedly connected between the sealing plate and the first sleeve; the extrusion subassembly includes a plurality of stripper bars that articulate at first sleeve outer wall, and the equal swing joint in bottom of stripper bar has the extrusion piece, all is equipped with the open slot in the extrusion piece, all is equipped with electric telescopic handle in the open slot, and electric telescopic handle's tip rigid coupling has the cutting knife.

2. The film coating apparatus for wafer as claimed in claim 1, wherein: the limiting driving piece comprises a first sleeve connected to the extrusion rod in a rotating mode, a second sleeve is connected to the inside of the first sleeve in a sliding mode, one end, far away from the first sleeve, of the second sleeve is connected to the outer wall of the second sleeve in a rotating mode, a control switch used for driving the electric telescopic rod to stretch is arranged on the inner side of the bottom of the first sleeve, and a limiting block capable of pressing the control switch is fixedly connected to the outer edge of the top of the second sleeve.

3. The film covering device for wafers according to claim 2, wherein: the side wall of the extrusion block, which is provided with an open slot, is provided with an inclined plane.

4. The film covering device for wafers according to claim 3, wherein: the lower portion of the film covering base is provided with a water collecting tank, the annular groove is provided with a plurality of water leakage holes, and a guide pipe is communicated between the water leakage holes and the water collecting tank.

5. The film coating apparatus for wafer as claimed in claim 4, wherein: one side of the film covering base is provided with a roll shaft which is rotatably connected to the rack, the roll shaft is detachably connected with a film roll, and the film covering base is provided with a feeding mechanism for pulling the film.

6. The film covering device for wafers according to claim 5, wherein: feeding mechanism is including setting up two conveyer belts on tectorial membrane base both sides portion, and equal rigid coupling has a plurality of fixed blocks on the conveyer belt, and the rigid coupling has the bonding pole of intermittent type and film contact between the fixed block of two conveyer belts.