CN114942686A - Heat dissipation device and case - Google Patents
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- CN114942686A CN114942686A CN202210680440.0A CN202210680440A CN114942686A CN 114942686 A CN114942686 A CN 114942686A CN 202210680440 A CN202210680440 A CN 202210680440A CN 114942686 A CN114942686 A CN 114942686A
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 100
- 238000012545 processing Methods 0.000 claims abstract description 41
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 40
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 5
- 229910052802 copper Inorganic materials 0.000 claims description 5
- 239000010949 copper Substances 0.000 claims description 5
- 239000000463 material Substances 0.000 claims description 4
- 238000004519 manufacturing process Methods 0.000 abstract description 8
- 230000009286 beneficial effect Effects 0.000 abstract 1
- 230000005855 radiation Effects 0.000 abstract 1
- 230000006870 function Effects 0.000 description 7
- 230000000694 effects Effects 0.000 description 5
- 238000001514 detection method Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 230000006872 improvement Effects 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 238000010521 absorption reaction Methods 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 230000008901 benefit Effects 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 238000009776 industrial production Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
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- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/18—Packaging or power distribution
- G06F1/183—Internal mounting support structures, e.g. for printed circuit boards, internal connecting means
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
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Abstract
The invention provides a heat sink and a chassis, the heat sink includes: the system comprises a control module, a radiator and a fan, wherein the input end of the control module is used for being connected with a central processing unit of a target computer, the first output end of the control module is connected with the radiator, and the second output end of the control module is connected with the fan; the control module is used for reading the real-time temperature or the service efficiency of the central processing unit, if the real-time temperature is smaller than a preset temperature threshold value and the service efficiency is smaller than a preset efficiency threshold value, a first heat dissipation signal is sent to the radiator, and if the real-time temperature is not larger than the preset temperature threshold value and the service efficiency is not larger than the preset efficiency threshold value, the first heat dissipation signal is sent to the radiator, and a second heat dissipation signal is sent to the fan; the radiator is used for starting heat dissipation according to the first heat dissipation signal; the fan is used for starting heat dissipation according to the second heat dissipation signal. The invention realizes the gradient intelligent heat radiation mode of the processor, not only effectively radiates heat, protects the normal operation of the processor and the mainboard, but also effectively utilizes production resources, and is beneficial to saving additional cost.
Description
Technical Field
The invention relates to the technical field of electronic equipment, in particular to a heat dissipation device and a chassis.
Background
With the rapid development and continuous progress of computer technology, the use of computer technology in industrial production can greatly improve the industrial production efficiency and reduce the manual production cost, thereby improving the economic benefit of enterprises, and the development of computer technology plays an irreplaceable role in industry. At present, industrial computers are not only applied to management and control of production processes, but also applied to the fields of environmental protection, highways, automatic driving and the like.
In the existing production, the heat dissipation of the processor of the embedded industrial mainboard mainly comprises an active type heat dissipation mode and a passive type heat dissipation mode, the active type heat dissipation mode is usually adopted independently in the prior art, but the active type heat dissipation mode is adopted independently, the heat dissipation effect is limited, the cost is high, and the current requirements cannot be met perfectly.
Disclosure of Invention
The invention provides a heat dissipation device and a chassis, and mainly aims to improve the heat dissipation effect of a computer.
In a first aspect, an embodiment of the present invention provides a heat dissipation apparatus, including: the system comprises a control module, a radiator and a fan, wherein the input end of the control module is used for being connected with a central processing unit of a target computer, the first output end of the control module is connected with the radiator, and the second output end of the control module is connected with the fan;
the control module is used for reading the real-time temperature or the service efficiency of the central processing unit, if the real-time temperature is smaller than a preset temperature threshold value and the service efficiency is smaller than a preset efficiency threshold value, a first heat dissipation signal is sent to the radiator, and if the real-time temperature is not smaller than the preset temperature threshold value and the service efficiency is not smaller than the preset efficiency threshold value, the first heat dissipation signal is sent to the radiator, and a second heat dissipation signal is sent to the fan;
the radiator is used for starting heat dissipation according to the first heat dissipation signal;
the fan is used for starting heat dissipation according to the second heat dissipation signal.
Preferably, the fan further comprises a rotating speed control module, a second output end of the control module is connected with the fan through the rotating speed control module, the control module sends the real-time temperature to the rotating speed control module through the second output end, and the rotating speed control module outputs current according to the real-time temperature or the service efficiency, so that the fan determines the rotating speed of the fan according to the current.
Preferably, the rotation speed control module comprises a BIOS management unit and a PWM circuit, wherein an input end of the BIOS management unit is connected to the second output end of the control module, an output end of the BIOS management unit is connected to an input end of the PWM circuit, and an output end of the PWM circuit is connected to the fan;
the BIOS management unit is used for reading the real-time temperature or the use efficiency;
the PWM circuit is used for outputting current according to the real-time temperature or the using efficiency.
Preferably, the rotation speed control module comprises a BIOS management unit, wherein an input end of the BIOS management unit is connected to the second output end of the control module, and an output end of the BIOS management unit is connected to the fan;
the BIOS management unit is used for sending a BIOS program write operation command containing the radiator type information and storing the BIOS program in the central processing unit;
the central processing unit is used for reading the BIOS program and selecting the heat dissipation parameters corresponding to the type of the heat dissipater according to the reading result so as to rotate the fan.
Preferably, the heat sink is made of red copper material.
Preferably, the heat sink includes a heat absorbing plate, a heat exchanging body is disposed on the heat absorbing plate, a first heat exchanging channel and a second heat exchanging channel are disposed in the heat exchanging body, and the first heat exchanging channel and the second heat exchanging channel are symmetrically disposed and are not communicated;
the heat exchanger is characterized in that a first water inlet and a second water inlet are arranged in the middle of one side of the heat exchanger body in parallel, the first water inlet is communicated with the first heat exchange channel, the second water inlet is communicated with the second heat exchange channel, a first water outlet and a second water outlet are arranged in the middle of the other side of the heat exchanger body in parallel, the first water outlet is communicated with the first heat exchange channel, and the second water outlet is communicated with the second heat exchange channel.
Preferably, the heat sink is disposed on a main board of the target computer in parallel with the fan, so that the wind blown by the fan blows toward the heat sink in parallel.
Preferably, the real-time temperature of the central processing unit is read in the control module through a SUPER IO chip.
In a second aspect, an embodiment of the present invention provides a chassis, including the heat dissipation device provided in the first aspect.
According to the heat dissipation device and the case provided by the invention, the real-time temperature of the central processing unit is read through the control module, when the real-time temperature of the central processing unit is not high or the use efficiency is low, only one heat dissipation mode of the heat sink is adopted, when the real-time temperature of the central processing unit is high or the use efficiency is high, the heat dissipation of the single heat sink cannot meet the heat dissipation requirement, two heat dissipation modes of the heat sink and the fan are adopted at the same time, the disadvantages of the two heat dissipation modes of the heat sink and the fan are effectively avoided and reduced, through the effectively combined structural improvement, the gradient type intelligent heat dissipation mode of the processor is realized, the heat dissipation is effective, the normal operation of the processor and a mainboard is protected, meanwhile, the production resources are effectively utilized, the additional cost is saved, the improvement of the production efficiency can be promoted, and the applicability is high.
Drawings
Fig. 1 is a schematic structural diagram of a heat dissipation device according to an embodiment of the present invention;
fig. 2 is a schematic structural diagram of a chassis according to an embodiment of the present invention.
Description of the drawings:
1, a control module; 2, a radiator;
3, a fan; 4, a central processing unit;
5, a heat dissipation device; and 6, a case.
The implementation, functional features and advantages of the objects of the present invention will be further explained with reference to the accompanying drawings.
Detailed Description
It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
In the description of the present invention, it is to be understood that the terms "central," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "circumferential," "radial," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the present application and for simplicity in description, and are not intended to indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and are therefore not to be considered limiting of the present application.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present application, "a plurality" means two or more unless specifically limited otherwise.
Fig. 1 is a schematic structural diagram of a heat dissipation device according to an embodiment of the present invention, as shown in fig. 1, the heat dissipation device includes: the system comprises a control module 1, a radiator 2 and a fan 3, wherein the input end of the control module 1 is used for being connected with a central processing unit 4 of a target computer, the first output end of the control module 1 is connected with the radiator 2, and the second output end of the control module 1 is connected with the fan 3;
the control module 1 is configured to read a real-time temperature or a utilization efficiency of the central processing unit 4, and send a first heat dissipation signal to the heat sink 2 if the real-time temperature is less than a preset temperature threshold and the utilization efficiency is less than a preset efficiency threshold, otherwise send the first heat dissipation signal to the heat sink 2 and send a second heat dissipation signal to the fan 3;
the radiator 2 is used for starting heat dissipation according to the first heat dissipation signal;
and the fan 3 is used for starting heat dissipation according to the second heat dissipation signal.
Specifically, the heat dissipation device comprises a control module 1, a radiator 2 and a fan 3, wherein the control module 1 comprises an input end, a first output end and a second output end, the input end of the control module 1 is connected with a central processing unit 4 of a target computer, the target computer is a computer needing heat dissipation, the first output end of the control module 1 is connected with the radiator 2, and the second output end is connected with the fan 3. When the heat dissipation device is used for dissipating heat of a target computer, the control module 1 firstly reads the real-time temperature or the use efficiency of the central processing unit 4, the central processing unit 4 generally has the functions of monitoring the temperature and the use efficiency, in the concrete implementation, the control module 1 firstly sends a temperature detection signal and efficiency detection information to the central processing unit 4, and after the central processing unit 4 receives the temperature detection signal and the efficiency detection signal, the real-time temperature and the use efficiency of the central processing unit 4 are read and then sent to the control module 1. The control module 1 compares the real-time temperature with a preset temperature threshold value, and simultaneously compares the service efficiency with a preset efficiency threshold value, if the real-time temperature is less than the preset temperature threshold value, it indicates that the temperature of the central processing unit 4 is not too high, or if the service efficiency is less than the preset efficiency threshold value, it indicates that the utilization rate of the central processing unit 4 is not high, under a general condition, the utilization rate is not high, the central processing unit 4 generates heat and is not too high, and the two conditions can both indicate that the temperature of the central processing unit 4 is not high, therefore, only an active heat dissipation mode, namely the heat dissipation of the heat dissipation device 2 is used, the control module 1 sends a first heat dissipation signal to the heat dissipation device 2, and controls the heat dissipation device 2 to dissipate heat. If the real-time temperature is not less than the preset temperature threshold or the service efficiency is not less than the preset efficiency threshold, it indicates that the temperature of the central processing unit 4 is too high, and the utilization rate of the central processing unit 4 is too high, two heat dissipation methods are required to perform heat dissipation together, so that when the control module 1 sends the first heat dissipation signal to the heat sink 2, the second heat dissipation signal is also sent to the fan 3, and the heat sink 2 and the fan 3 start heat dissipation at the same time. In the embodiment of the present invention, both the preset temperature threshold and the preset efficiency threshold may be determined according to actual conditions, and the embodiment of the present invention is not specifically limited herein. In the embodiment of the present invention, the control module 1 is a device having a certain automatic control function, and may be a control circuit formed by assembling various components, or may be an integrated control chip, such as a single chip microcomputer, an FPGA, and the like, which is not specifically limited herein. The radiator 2 may be a device integrating heat transfer and heat dissipation, may be formed by assembling itself, or may be a product designed in the market, including various heat dissipation methods such as hydraulic heat dissipation, water cooling heat dissipation, and the like.
According to the heat dissipation device provided by the invention, the real-time temperature of the central processing unit 4 is read through the control module 1, when the real-time temperature of the central processing unit 4 is not high or the use efficiency is low, only one heat dissipation mode of the heat sink 2 is adopted, when the real-time temperature of the central processing unit 4 is high or the use efficiency is high, the heat dissipation of the single heat sink 2 cannot meet the heat dissipation requirement, and meanwhile, two heat dissipation modes of the heat sink 2 and the fan 3 are adopted, so that the disadvantages of the two heat dissipation modes of the heat sink 2 and the fan 3 are effectively avoided, and through the structural improvement of effective combination, the gradient type intelligent heat dissipation mode of the processor is realized, so that the heat dissipation is effective, the normal operation of the processor and a mainboard is protected, meanwhile, the production resources are effectively utilized, the extra cost is saved, the improvement of the production efficiency can be promoted, and the applicability is high.
On the basis of the above embodiment, preferably, the system further includes a rotation speed control module 1, a second output end of the control module 1 is connected to the fan 3 through the rotation speed control module 1, wherein the control module 1 sends the real-time temperature to the rotation speed control module 1 through the second output end, and the rotation speed control module 1 outputs current according to the real-time temperature, so that the fan 3 determines the rotation speed of the fan 3 according to the current.
Specifically, the heat dissipation device further includes a rotation speed control module 1, one end of the rotation speed control module 1 is connected to the second output end of the control module 1, and the other end of the rotation speed control module 1 is connected to the fan 3, that is, the control module 1 is connected to the fan 3 through the rotation speed control module 1. In the specific implementation process, the control module 1 firstly sends the real-time temperature or the service efficiency to the rotating speed control module 1, and the rotating speed control module 1 determines to output the current with the corresponding magnitude according to the magnitude of the real-time temperature or the magnitude of the service efficiency. Generally speaking, real-time temperature and current magnitude, and usage efficiency and current magnitude are in positive correlation, and the higher the temperature is, the larger the current output by the rotation speed control module 1 is, the higher the usage efficiency is, the larger the current output by the rotation speed control module 1 is, and the faster the rotation speed of the fan 3 is. In the embodiment of the present invention, the rotation speed control module 1 is a device having a certain automatic control function, and may be a control circuit formed by assembling various components, or may be an integrated control chip, such as a single chip microcomputer, an FPGA, or the like, which is not specifically limited herein.
In the embodiment of the invention, the rotating speed of the fan 3 is determined according to the real-time temperature or the use efficiency, so that the rotating speed of the fan 3 is related to the real-time temperature or the use efficiency, and when the real-time temperature is higher or the use efficiency is higher, the rotating speed of the fan 3 is higher, and the cooling effect is better.
On the basis of the above embodiment, preferably, the rotation speed control module 1 includes a BIOS management unit and a PWM circuit, wherein an input end of the BIOS management unit is connected to the second output end of the control module 1, an output end of the BIOS management unit is connected to an input end of the PWM circuit, and an output end of the PWM circuit is connected to the fan 3;
the BIOS management unit is used for reading the real-time temperature or the use efficiency;
the PWM circuit is used for outputting current according to the real-time temperature or the size of the use efficiency.
As an optional embodiment, the rotation speed control module 1 in the embodiment of the present invention is composed of a BIOS management unit and a PWM circuit, where one end of the BIOS management unit is connected to the second end of the control module 1, and the other end of the BIOS management unit is connected to the PWM circuit. The BIOS is a basic input and output system, is a set of programs solidified on a ROM chip on the mainboard in the computer, stores the most important basic input and output programs of the computer, a self-test program after power-on and a system self-starting program, can read and write specific information set by the system from the CMOS, and has the main function of providing the bottommost and most direct hardware setting and control for the computer. The BIOS management unit reads the real-time temperature or the usage efficiency from the central processing unit 4, and sends the real-time temperature or the usage efficiency to the PWM circuit, and the PWM circuit adjusts the duty ratio in the pulse direct current according to the real-time temperature or the usage efficiency, thereby adjusting the magnitude of the final output current. A PWM (Pulse Width Modulation) control analog circuit using digital output is a very effective technique, which can control the speed of a motor, the heat output of a heater, etc. with energy saving; the principle of operation of PWM is to pulse dc current, with each pulse varying for an amount of "on" time, to control the amount of current flowing in the fan 3, with the longer the pulse is on, the greater the amount of current flowing in the fan 3.
On the basis of the above embodiment, preferably, the rotation speed control module 1 includes a BIOS management unit, wherein an input end of the BIOS management unit is connected to the second output end of the control module 1, and an output end of the BIOS management unit is connected to the fan 3;
the BIOS management unit is used for sending a BIOS program write operation command containing the type information of the radiator 2 and storing the BIOS program in the central processing unit 4;
the central processing unit 4 is configured to read the BIOS program, and select a heat dissipation parameter corresponding to the type of the heat sink 2 according to a result of the read operation, and rotate the fan 3 at a speed.
As an optional embodiment, in the embodiment of the present invention, the central processing unit 4 obtains the type information of the heat sink 2 by reading a BIOS program stored in a memory of the central processing unit 4, the central processing unit 4 selects a heat dissipation parameter corresponding to the type of the heat sink 2 according to the obtained type information of the heat sink 2, the heat dissipation parameter is associated with the real-time temperature or the usage efficiency of the central processing unit 4, when the real-time temperature or the usage efficiency is in a certain interval, the heat dissipation parameter corresponding to the interval is searched, and then the rotation speed of the fan 3 is adjusted according to the heat dissipation parameter.
On the basis of the above embodiment, the heat sink 2 is preferably a heat sink 2 made of red copper material.
On the basis of the above embodiment, it is preferable that the heat sink 2 is provided on the main board of the target computer in parallel with the fan 3 so that the wind blown by the fan 3 is blown in parallel to the heat sink 2.
In the embodiment of the invention, the radiator 2 is a red copper radiator 2, red copper material is adopted, the tooth sheets are very thin, the corresponding quantity is large, the heat dissipation effect is excellent, and the CPU 4 can be ensured to perform passive heat dissipation at the utilization rate of below 10 percent; the fan 3 adopts the turbofan 3 with concentrated wind beams and large wind pressure, the wind direction of the turbofan 3 is blown to the teeth of the radiator 2 in parallel to take away hot air among the teeth so as to increase the heat dissipation efficiency.
On the basis of the above embodiment, preferably, the heat sink 2 includes a heat absorbing plate, a heat exchanging body is disposed on the heat absorbing plate, a first heat exchanging channel and a second heat exchanging channel are disposed in the heat exchanging body, and the first heat exchanging channel and the second heat exchanging channel are symmetrically disposed and are not communicated with each other;
the heat exchanger comprises a heat exchange body and is characterized in that a first water inlet and a second water inlet are arranged in the middle of one side of the heat exchange body in parallel, the first water inlet is communicated with a first heat exchange channel, the second water inlet is communicated with a second heat exchange channel, a first water outlet and a second water outlet are arranged in the middle of the other side of the heat exchange body in parallel, the first water outlet is communicated with the first heat exchange channel, and the second water outlet is communicated with the second heat exchange channel.
The heat radiator 2 provided by the embodiment of the invention comprises a heat absorption plate, wherein a heat exchange body is arranged on the heat absorption plate, a sealing cover is detachably arranged on the top of the heat exchange body, and the heat absorption plate, the heat exchange body and the sealing cover can be made of aluminum alloy materials.
A first heat exchange channel and a second heat exchange channel are arranged in the heat exchange body, and the first heat exchange channel and the second heat exchange channel are symmetrically arranged and are not communicated. The middle part of one side of the heat exchange body is provided with a first water inlet and a second water inlet which are respectively communicated with the first heat exchange channel and the second heat exchange channel in parallel, the middle part of the other side of the heat exchange body is provided with a first water outlet and a second water outlet which are respectively communicated with the first heat exchange channel and the second heat exchange channel in parallel, the first water inlet and the second water inlet are connected to the same water inlet tee joint, the first water outlet and the second water outlet are connected to the same water outlet tee joint, and two heat exchange channels with mutually noninterfered water flows are formed through the structure. The first heat exchange channel comprises a first continuously-bent heat exchange channel close to one side of the first water inlet and a first transverse heat exchange channel close to one side of the first water outlet, and the second heat exchange channel comprises a second continuously-bent heat exchange channel close to one side of the second water inlet and a second transverse heat exchange channel close to one side of the second water outlet.
In the radiator 2 provided by the embodiment of the invention, the channels on the two sides respectively and independently complete heat exchange with the heat absorbing plate, so that the components needing heat dissipation in the computer case are quickly cooled, and compared with a single channel, the arrangement mode of the two channels reduces the stroke of the heat exchange liquid by nearly half, ensures that the heat exchange liquid can also exert good heat exchange effect on the components positioned at the tail end of the channels, and greatly improves the heat dissipation efficiency on the whole.
On the basis of the above embodiment, preferably, the real-time temperature of the central processing unit 4 is read in the control module 1 through a SUPER IO chip.
Specifically, in the embodiment of the present invention, the SUPER IO chip reads the real-time temperature of the central processing unit 4, and the BIOS management unit outputs different levels of PWM currents by using the PWM circuit according to the read real-time temperature, so as to control the rotation speed of the fan 3 according to the magnitude of the current.
It should be noted that, if the real-time temperature of the cpu 4 decreases, the control module 1 may decrease the rotation speed of the fan 3, and when the real-time temperature decreases to a certain degree, the fan 3 is turned off, so that the active heat dissipation mode is performed by using only the heat sink 2 for heat dissipation.
The modules in the heat dissipation can be implemented in whole or in part by software, hardware, and a combination thereof. The modules can be embedded in a hardware form or independent from a processor in the computer device, and can also be stored in a memory in the computer device in a software form, so that the processor can call and execute operations corresponding to the modules.
Fig. 2 is a schematic structural diagram of a chassis according to an embodiment of the present invention, and as shown in fig. 2, the chassis 6 includes the heat dissipation device 5 provided above. It should be noted that the case is used as a part of computer accessories, and has a main function of placing and fixing the computer accessories, and plays a role in supporting and protecting.
It will be apparent to those skilled in the art that, for convenience and brevity of description, only the above-mentioned division of the functional units and modules is illustrated, and in practical applications, the above-mentioned function distribution may be performed by different functional units and modules according to needs, that is, the internal structure of the apparatus is divided into different functional units or modules to perform all or part of the above-mentioned functions.
The above-mentioned embodiments are only used for illustrating the technical solutions of the present invention, and not for limiting the same; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; such modifications and substitutions do not substantially depart from the spirit and scope of the embodiments of the present invention, and are intended to be included within the scope of the present invention.
Claims (9)
1. A heat dissipating device, comprising: the control system comprises a control module, a radiator and a fan, wherein the input end of the control module is used for being connected with a central processing unit of a target computer, the first output end of the control module is connected with the radiator, and the second output end of the control module is connected with the fan;
the control module is used for reading the real-time temperature or the service efficiency of the central processing unit, if the real-time temperature is smaller than a preset temperature threshold value and the service efficiency is smaller than a preset efficiency threshold value, a first heat dissipation signal is sent to the radiator, and if the real-time temperature is not larger than the preset temperature threshold value and the service efficiency is not larger than the preset efficiency threshold value, the first heat dissipation signal is sent to the radiator, and a second heat dissipation signal is sent to the fan;
the radiator is used for starting heat dissipation according to the first heat dissipation signal;
the fan is used for starting heat dissipation according to the second heat dissipation signal.
2. The heat dissipation device of claim 1, further comprising a speed control module, wherein a second output of the control module is connected to the fan through the speed control module, wherein the control module sends the real-time temperature or the usage efficiency to the speed control module through the second output, and the speed control module outputs a current according to the real-time temperature, so that the fan determines a fan speed according to the current.
3. The heat dissipation device of claim 2, wherein the rotational speed control module comprises a BIOS management unit and a PWM circuit, wherein an input of the BIOS management unit is connected to the second output of the control module, an output of the BIOS management unit is connected to an input of the PWM circuit, and an output of the PWM circuit is connected to the fan;
the BIOS management unit is used for reading the real-time temperature or the use efficiency;
the PWM circuit is used for outputting current according to the real-time temperature or the size of the use efficiency.
4. The heat dissipation device of claim 2, wherein the speed control module comprises a BIOS management unit, wherein an input of the BIOS management unit is connected to the second output of the control module, and an output of the BIOS management unit is connected to the fan;
the BIOS management unit is used for sending a BIOS program write operation command containing the radiator type information and storing the BIOS program in the central processing unit;
the central processing unit is used for reading the BIOS program and selecting the heat dissipation parameters corresponding to the type of the heat dissipater according to the reading result so as to rotate the fan.
5. The heat dissipating device of claim 1, wherein the heat sink is a heat sink made of red copper material.
6. The heat dissipating device of claim 1, wherein the heat sink comprises a heat absorbing plate, a heat exchanging body is disposed on the heat absorbing plate, a first heat exchanging channel and a second heat exchanging channel are disposed in the heat exchanging body, and the first heat exchanging channel and the second heat exchanging channel are symmetrically disposed and are not communicated;
the heat exchanger is characterized in that a first water inlet and a second water inlet are arranged in the middle of one side of the heat exchanger body in parallel, the first water inlet is communicated with the first heat exchange channel, the second water inlet is communicated with the second heat exchange channel, a first water outlet and a second water outlet are arranged in the middle of the other side of the heat exchanger body in parallel, the first water outlet is communicated with the first heat exchange channel, and the second water outlet is communicated with the second heat exchange channel.
7. The heat dissipating device according to claim 1, wherein the heat sink is provided on a main board of the target computer in parallel with the fan, so that the wind blown by the fan blows in parallel to the heat sink.
8. The heat dissipation device of claim 1, wherein the real-time temperature of the cpu is read by an overload chip in the control module.
9. A cabinet comprising the heat dissipating device of any one of claims 1 to 8.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210680440.0A CN114942686A (en) | 2022-06-16 | 2022-06-16 | Heat dissipation device and case |
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| CN202210680440.0A CN114942686A (en) | 2022-06-16 | 2022-06-16 | Heat dissipation device and case |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN203502892U (en) * | 2013-07-23 | 2014-03-26 | 深圳市集和诚科技开发有限公司 | Heat dissipating system suitable for industrial computer processor |
| CN104597983A (en) * | 2013-10-30 | 2015-05-06 | 中国长城计算机深圳股份有限公司 | Regulation method of revolving speed of computer and mainboard system |
| CN106445027A (en) * | 2016-09-18 | 2017-02-22 | 安徽爱她有果电子商务有限公司 | Intelligent adjusting method and controlling system of computer fan revolving speed |
| CN213958000U (en) * | 2020-11-25 | 2021-08-13 | 河北瑞发汽车散热器有限公司 | Double-return-stroke efficient computer water-cooling radiator |
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- 2022-06-16 CN CN202210680440.0A patent/CN114942686A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN203502892U (en) * | 2013-07-23 | 2014-03-26 | 深圳市集和诚科技开发有限公司 | Heat dissipating system suitable for industrial computer processor |
| CN104597983A (en) * | 2013-10-30 | 2015-05-06 | 中国长城计算机深圳股份有限公司 | Regulation method of revolving speed of computer and mainboard system |
| CN106445027A (en) * | 2016-09-18 | 2017-02-22 | 安徽爱她有果电子商务有限公司 | Intelligent adjusting method and controlling system of computer fan revolving speed |
| CN213958000U (en) * | 2020-11-25 | 2021-08-13 | 河北瑞发汽车散热器有限公司 | Double-return-stroke efficient computer water-cooling radiator |
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