CN114930530A - 一种三维铁电存储器、制作方法及电子设备 - Google Patents
一种三维铁电存储器、制作方法及电子设备 Download PDFInfo
- Publication number
- CN114930530A CN114930530A CN202080092634.8A CN202080092634A CN114930530A CN 114930530 A CN114930530 A CN 114930530A CN 202080092634 A CN202080092634 A CN 202080092634A CN 114930530 A CN114930530 A CN 114930530A
- Authority
- CN
- China
- Prior art keywords
- layer
- voltage lines
- memory
- ferroelectric
- columns
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000015654 memory Effects 0.000 title claims abstract description 257
- 238000004519 manufacturing process Methods 0.000 title abstract description 21
- 238000002955 isolation Methods 0.000 claims abstract description 131
- 229910052751 metal Inorganic materials 0.000 claims abstract description 88
- 239000002184 metal Substances 0.000 claims abstract description 88
- 239000000758 substrate Substances 0.000 claims abstract description 70
- 238000000034 method Methods 0.000 claims abstract description 61
- 239000000463 material Substances 0.000 claims abstract description 52
- 238000005530 etching Methods 0.000 claims abstract description 43
- 239000004020 conductor Substances 0.000 claims description 86
- 229910021420 polycrystalline silicon Inorganic materials 0.000 claims description 61
- 238000003860 storage Methods 0.000 claims description 58
- 229920005591 polysilicon Polymers 0.000 claims description 48
- 239000002019 doping agent Substances 0.000 claims description 40
- 229910052710 silicon Inorganic materials 0.000 claims description 38
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 36
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 36
- 229910000449 hafnium oxide Inorganic materials 0.000 claims description 34
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 33
- 239000010703 silicon Substances 0.000 claims description 33
- 229910052782 aluminium Inorganic materials 0.000 claims description 28
- 239000010949 copper Substances 0.000 claims description 27
- 239000012777 electrically insulating material Substances 0.000 claims description 26
- 229910001925 ruthenium oxide Inorganic materials 0.000 claims description 26
- WOCIAKWEIIZHES-UHFFFAOYSA-N ruthenium(iv) oxide Chemical compound O=[Ru]=O WOCIAKWEIIZHES-UHFFFAOYSA-N 0.000 claims description 26
- HTXDPTMKBJXEOW-UHFFFAOYSA-N dioxoiridium Chemical compound O=[Ir]=O HTXDPTMKBJXEOW-UHFFFAOYSA-N 0.000 claims description 24
- 229910000457 iridium oxide Inorganic materials 0.000 claims description 24
- MZLGASXMSKOWSE-UHFFFAOYSA-N tantalum nitride Chemical compound [Ta]#N MZLGASXMSKOWSE-UHFFFAOYSA-N 0.000 claims description 24
- 239000010936 titanium Substances 0.000 claims description 24
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 20
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 claims description 15
- 229910052802 copper Inorganic materials 0.000 claims description 15
- 229910052721 tungsten Inorganic materials 0.000 claims description 15
- 229910052688 Gadolinium Inorganic materials 0.000 claims description 13
- 229910052727 yttrium Inorganic materials 0.000 claims description 13
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 12
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 claims description 12
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 12
- IVHJCRXBQPGLOV-UHFFFAOYSA-N azanylidynetungsten Chemical compound [W]#N IVHJCRXBQPGLOV-UHFFFAOYSA-N 0.000 claims description 12
- 229910017052 cobalt Inorganic materials 0.000 claims description 12
- 239000010941 cobalt Substances 0.000 claims description 12
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims description 12
- 229910052741 iridium Inorganic materials 0.000 claims description 12
- GKOZUEZYRPOHIO-UHFFFAOYSA-N iridium atom Chemical compound [Ir] GKOZUEZYRPOHIO-UHFFFAOYSA-N 0.000 claims description 12
- 229910052746 lanthanum Inorganic materials 0.000 claims description 12
- 229910052759 nickel Inorganic materials 0.000 claims description 12
- 229910052697 platinum Inorganic materials 0.000 claims description 12
- 229910052707 ruthenium Inorganic materials 0.000 claims description 12
- 229910052719 titanium Inorganic materials 0.000 claims description 12
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims description 12
- 239000010937 tungsten Substances 0.000 claims description 12
- 230000000149 penetrating effect Effects 0.000 claims description 9
- LIVNPJMFVYWSIS-UHFFFAOYSA-N silicon monoxide Chemical compound [Si-]#[O+] LIVNPJMFVYWSIS-UHFFFAOYSA-N 0.000 claims description 9
- WSMQKESQZFQMFW-UHFFFAOYSA-N 5-methyl-pyrazole-3-carboxylic acid Chemical compound CC1=CC(C(O)=O)=NN1 WSMQKESQZFQMFW-UHFFFAOYSA-N 0.000 claims description 8
- VNSWULZVUKFJHK-UHFFFAOYSA-N [Sr].[Bi] Chemical compound [Sr].[Bi] VNSWULZVUKFJHK-UHFFFAOYSA-N 0.000 claims description 8
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 claims description 8
- 229910002113 barium titanate Inorganic materials 0.000 claims description 8
- 229910052797 bismuth Inorganic materials 0.000 claims description 8
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 claims description 8
- UIWYJDYFSGRHKR-UHFFFAOYSA-N gadolinium atom Chemical compound [Gd] UIWYJDYFSGRHKR-UHFFFAOYSA-N 0.000 claims description 8
- WIHZLLGSGQNAGK-UHFFFAOYSA-N hafnium(4+);oxygen(2-) Chemical compound [O-2].[O-2].[Hf+4] WIHZLLGSGQNAGK-UHFFFAOYSA-N 0.000 claims description 8
- 239000011810 insulating material Substances 0.000 claims description 8
- FZLIPJUXYLNCLC-UHFFFAOYSA-N lanthanum atom Chemical compound [La] FZLIPJUXYLNCLC-UHFFFAOYSA-N 0.000 claims description 8
- HFGPZNIAWCZYJU-UHFFFAOYSA-N lead zirconate titanate Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ti+4].[Zr+4].[Pb+2] HFGPZNIAWCZYJU-UHFFFAOYSA-N 0.000 claims description 8
- GQYHUHYESMUTHG-UHFFFAOYSA-N lithium niobate Chemical compound [Li+].[O-][Nb](=O)=O GQYHUHYESMUTHG-UHFFFAOYSA-N 0.000 claims description 8
- 150000002736 metal compounds Chemical class 0.000 claims description 8
- VSZWPYCFIRKVQL-UHFFFAOYSA-N selanylidenegallium;selenium Chemical compound [Se].[Se]=[Ga].[Se]=[Ga] VSZWPYCFIRKVQL-UHFFFAOYSA-N 0.000 claims description 8
- 229910052712 strontium Inorganic materials 0.000 claims description 8
- CIOAGBVUUVVLOB-UHFFFAOYSA-N strontium atom Chemical compound [Sr] CIOAGBVUUVVLOB-UHFFFAOYSA-N 0.000 claims description 8
- VWQVUPCCIRVNHF-UHFFFAOYSA-N yttrium atom Chemical compound [Y] VWQVUPCCIRVNHF-UHFFFAOYSA-N 0.000 claims description 8
- 229910000859 α-Fe Inorganic materials 0.000 claims description 8
- 229910013641 LiNbO 3 Inorganic materials 0.000 claims description 6
- 238000000926 separation method Methods 0.000 claims description 6
- 239000011159 matrix material Substances 0.000 claims description 3
- 238000010586 diagram Methods 0.000 description 22
- 230000005684 electric field Effects 0.000 description 13
- 230000006870 function Effects 0.000 description 8
- 125000006850 spacer group Chemical group 0.000 description 8
- 229910052581 Si3N4 Inorganic materials 0.000 description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 6
- 238000000151 deposition Methods 0.000 description 6
- 230000010287 polarization Effects 0.000 description 6
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical group N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 6
- 229910052814 silicon oxide Inorganic materials 0.000 description 6
- 230000004888 barrier function Effects 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 5
- 229910052717 sulfur Inorganic materials 0.000 description 5
- 229910052726 zirconium Inorganic materials 0.000 description 5
- 230000007797 corrosion Effects 0.000 description 4
- 238000005260 corrosion Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 150000002500 ions Chemical class 0.000 description 4
- 239000003990 capacitor Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 230000005669 field effect Effects 0.000 description 3
- 239000010408 film Substances 0.000 description 3
- 230000010354 integration Effects 0.000 description 3
- 238000001039 wet etching Methods 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000013500 data storage Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 208000023414 familial retinal arterial macroaneurysm Diseases 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 229910003327 LiNbO3 Inorganic materials 0.000 description 1
- 229910000577 Silicon-germanium Inorganic materials 0.000 description 1
- LEVVHYCKPQWKOP-UHFFFAOYSA-N [Si].[Ge] Chemical compound [Si].[Ge] LEVVHYCKPQWKOP-UHFFFAOYSA-N 0.000 description 1
- 238000013473 artificial intelligence Methods 0.000 description 1
- 238000013528 artificial neural network Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000001312 dry etching Methods 0.000 description 1
- 230000014509 gene expression Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000012774 insulation material Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C11/21—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements
- G11C11/22—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using ferroelectric elements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B51/00—Ferroelectric RAM [FeRAM] devices comprising ferroelectric memory transistors
- H10B51/20—Ferroelectric RAM [FeRAM] devices comprising ferroelectric memory transistors characterised by the three-dimensional arrangements, e.g. with cells on different height levels
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Semiconductor Memories (AREA)
Abstract
本申请提供了一种三维铁电存储器的制作方法,该方法能够在保证三维铁电存储器具有较好的耐久性,同时又能降低三维铁电存储器制作过程中的刻蚀难度。该方法包括:在衬底上形成堆叠层,该堆叠层包括堆叠且交替设置的隔离层和牺牲层;在堆叠层中设置多列第一电压线,在多列第一电压线中任意相邻的两列第一电压线之间设置隔离凹槽;刻蚀掉堆叠层中的牺牲层,并形成与隔离层堆叠且交替设置的金属层以得到存储层,金属层包括铁电层和多个第二电压线,铁电层包围多个第二电压线和多列第一电压线位于金属层的部分,以使金属层中形成MFM结构,保证了该三维铁电存储器的耐久性。同时由于牺牲层为易腐蚀的材料,从而可以降低制作过程中的刻蚀难度。
Description
PCT国内申请,说明书已公开。
Claims (23)
- PCT国内申请,权利要求书已公开。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/CN2020/093504 WO2021237730A1 (zh) | 2020-05-29 | 2020-05-29 | 一种三维铁电存储器、制作方法及电子设备 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN114930530A true CN114930530A (zh) | 2022-08-19 |
Family
ID=78745396
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202080092634.8A Pending CN114930530A (zh) | 2020-05-29 | 2020-05-29 | 一种三维铁电存储器、制作方法及电子设备 |
Country Status (2)
Country | Link |
---|---|
CN (1) | CN114930530A (zh) |
WO (1) | WO2021237730A1 (zh) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN117241589A (zh) * | 2022-06-02 | 2023-12-15 | 华为技术有限公司 | 铁电存储器及其制备方法、电子设备 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9941299B1 (en) * | 2017-05-24 | 2018-04-10 | Sandisk Technologies Llc | Three-dimensional ferroelectric memory device and method of making thereof |
CN109786390B (zh) * | 2017-11-13 | 2022-12-20 | 萨摩亚商费洛储存科技股份有限公司 | 三维储存元件及其制造方法 |
KR102538701B1 (ko) * | 2018-02-22 | 2023-06-01 | 에스케이하이닉스 주식회사 | 강유전성 메모리 장치 및 그 구동 방법 |
CN108550575B (zh) * | 2018-04-13 | 2019-05-31 | 长江存储科技有限责任公司 | 三维存储器的制备方法及沟槽底部刻蚀方法 |
CN110071117B (zh) * | 2019-04-28 | 2021-05-11 | 中国科学院微电子研究所 | 一种三维nand型铁电存储器、制作方法及操作方法 |
-
2020
- 2020-05-29 CN CN202080092634.8A patent/CN114930530A/zh active Pending
- 2020-05-29 WO PCT/CN2020/093504 patent/WO2021237730A1/zh active Application Filing
Also Published As
Publication number | Publication date |
---|---|
WO2021237730A1 (zh) | 2021-12-02 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TW201826268A (zh) | 個別地包含一電容器及一垂直延伸電晶體之記憶體單元陣列,形成記憶體單元陣列之一層之方法及形成個別地包含一電容器及一垂直延伸電晶體之記憶體單元陣列之方法 | |
US7732851B2 (en) | Method for fabricating a three-dimensional capacitor | |
US11049864B2 (en) | Apparatuses including capacitor structures, and related memory devices, electronic systems, and methods | |
KR100360592B1 (ko) | 반도체 장치 및 그 제조 방법 | |
CN115988875A (zh) | 一种3d堆叠的半导体器件及其制造方法、电子设备 | |
JP2009295255A (ja) | 半導体記憶装置 | |
CN114930530A (zh) | 一种三维铁电存储器、制作方法及电子设备 | |
JP4545133B2 (ja) | 半導体記憶装置及びその製造方法 | |
CN217544619U (zh) | 存储单元及存储器 | |
WO2022110009A1 (zh) | 一种存储器件及其制造方法、电子设备 | |
US20230067612A1 (en) | Pocket integration process for embedded memory | |
EP3806155A1 (en) | Multi-bit resistive random access memory cell and forming method thereof | |
US9542990B2 (en) | Semiconductor memory device and method for accessing the same | |
CN116420436A (zh) | 具有垂直沟道的垂直三维存储器 | |
WO2022110218A1 (zh) | 一种铁电存储器及电子设备 | |
WO2022141020A1 (zh) | 一种存储器件、电子设备 | |
TWI233663B (en) | Semiconductor device including ferroelectric capacitors and fabricating method thereof | |
CN219437502U (zh) | 半导体器件 | |
KR100373361B1 (ko) | 유전체와 전극 사이에 산화장벽막을 갖는 캐패시터 형성 방법 | |
US11895831B2 (en) | Manufacturing method for memory and memory | |
US20240298452A1 (en) | Ferroelectric memory device with stacked capacitors and manufacturing method thereof | |
US20230053447A1 (en) | Semiconductor memory devices with wrapped word lines | |
US10937690B2 (en) | Selective dielectric deposition | |
US20240164107A1 (en) | Three-dimensional ferroelectric field effect transistor random access memory devices and fabricating methods thereof | |
US20100133597A1 (en) | Semiconductor memory device and manufacturing method thereof |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination |