CN114871153B - Non-contact adsorption type slicing device, blanking sorting equipment and sorting system - Google Patents
Non-contact adsorption type slicing device, blanking sorting equipment and sorting system Download PDFInfo
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- CN114871153B CN114871153B CN202210496630.7A CN202210496630A CN114871153B CN 114871153 B CN114871153 B CN 114871153B CN 202210496630 A CN202210496630 A CN 202210496630A CN 114871153 B CN114871153 B CN 114871153B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/36—Sorting apparatus characterised by the means used for distribution
- B07C5/361—Processing or control devices therefor, e.g. escort memory
- B07C5/362—Separating or distributor mechanisms
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/36—Sorting apparatus characterised by the means used for distribution
- B07C5/38—Collecting or arranging articles in groups
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Abstract
The invention provides a non-contact adsorption type slicing device, blanking sorting equipment and a sorting system, which relate to the blanking technology in the field of semiconductors or photovoltaics and belong to the field of silicon wafer detection and sorting; the adsorption bottom surfaces of the adsorption modules of the adsorption separation main module, the first adsorption branch line module and the second adsorption branch line module are higher than the bottom surface of the belt driving module, so that the silicon wafers are adsorbed and transmitted to the corresponding material positions in a non-contact manner; through this application, compare in the jacking branch material and reduced the process flow, improved operating efficiency and productivity, be convenient for relate to the silicon chip of sheet product, PCB field popularization and application.
Description
Technical Field
The invention belongs to the field of silicon wafer detection and sorting, relates to a blanking sorting technology, and particularly discloses a non-contact adsorption type slicing device, blanking sorting equipment and a sorting system.
Background
Silicon wafers are widely used as important industrial raw materials for the production and manufacture of products such as solar cells and circuit boards. Therefore, before the silicon wafer is produced and shipped, the quality of the silicon wafer needs to be strictly controlled so as to ensure the quality of products such as solar cells, circuit boards and the like manufactured by the silicon wafer. The silicon wafer sorting machine is an automatic detection and sorting device integrating automation, measurement and visual flaw detection, is applied to the production flow of solar silicon wafers, and can measure and detect items such as thickness, TTV, line mark, resistivity, size, dirt, edge breakage, hidden crack and the like of original solar silicon wafer slices and cleaned original silicon wafers, automatically sort the silicon wafers into different boxes according to quality grade requirements according to a sorting menu, fully meet the quality control requirements of silicon wafer use manufacturers and is an indispensable link in production, such as a blanking sorting device and a silicon wafer intelligent sorting machine disclosed in the patent of the applicant (publication No. CN 112605010A).
With the development of carbon-neutral national planning, the solar energy industry belonging to the new energy industry will be continuously developed and expand the ratio of photovoltaic power generation to the power generation capacity of the whole country. With the improvement of the automation requirements of various silicon chip manufacturers on automatic feeding and discharging, the detection capability requirement of the equipment is greatly improved.
At present, in the process of detecting and sorting silicon wafers, sorted silicon wafers are required to be shunted to corresponding storage boxes. In the prior art, silicon wafers on a streamline need to be jacked up, and then the conveying direction of the silicon wafers is changed, so that the silicon wafers flow into corresponding storage boxes. However, the above method has a problem that since the transportation time in the industrial production is relatively accurate and continuous, when the silicon wafer is jacked up, the silicon wafer may be separated from the transportation flow line, and at this time, the silicon wafer is in a suspended state in a short time, and the transportation flow line continuously works, and when the silicon wafer falls, the silicon wafer may collide with the silicon wafer transported from the rear; secondly, the efficiency of a blanking streamline is limited by a jacking split-flow splitting mode, and the maximum capacity of a silicon wafer negative pressure jacking device adopted by the previous generation type (related patent CN 214705892U) is limited to about 8500pcs/h and is difficult to break through. In order to solve the problem, a more efficient slicing mechanism needs to be developed.
Disclosure of Invention
In order to overcome the defects of the prior art, the invention aims to provide a non-contact adsorption type slicing device, blanking sorting equipment and a sorting system, which can solve the problems.
A non-contact adsorption type slicing device comprises an adsorption sorting main module, a first adsorption branch line module and a second adsorption branch line module which are all integrated with an adsorption module and a belt driving module, wherein the bottom surfaces of the three modules are arranged in parallel, and the first adsorption branch line module and the second adsorption branch line module are arranged at two discharge ends of the adsorption sorting main module in a hanging manner; the adsorption separation main module is used for adsorbing and picking up silicon wafers conveyed by the feeding central shaft belt streamline below and conveying materials to the first adsorption branch line module or the second adsorption branch line module which is arranged on two sides in a direction perpendicular to the feeding central shaft belt streamline direction in a bidirectional selectable mode according to the silicon wafer type analysis result.
Furthermore, the slicing device also comprises a first connecting piece, a second connecting piece, a third connecting piece and a controller; the first connecting piece and the second connecting piece are connected to the third connecting piece in an adjustable relative distance mode, so that the streamline distance from the first adsorption branch line module to the second adsorption branch line module can be adjusted; the adsorption bottom surfaces of the adsorption modules arranged on the adsorption separation main module, the first adsorption branch module and the second adsorption branch module are flush, and the distance between suckers is adjustable so as to adapt to silicon wafers of different specifications; the adsorption separation main module, the first adsorption branch line module and the second adsorption branch line module are arranged in a way that the adsorption bottom surfaces of the adsorption modules are higher than the bottom surface of the belt driving module, and the adsorption separation main module conveys the silicon wafers to the first adsorption branch line module or the second adsorption branch line module under the control of the controller, so that the silicon wafers are adsorbed and transmitted to the corresponding material level in a non-contact way.
Further, adsorb and select separately fundamental mode group and include main supporting component, belt drive module and absorption module at least partly by main supporting component connects the support, the absorption bottom surface of absorption module is parallel and is higher than the belt bottom surface setting of belt drive module.
Furthermore, the transmission directions of the first adsorption branch line module and the second adsorption branch line module are opposite, and the first adsorption branch line module and the second adsorption branch line module respectively comprise a branch supporting assembly, a branch belt driving module and a branch adsorption module; the sub-belt driving module and the sub-adsorption module are connected and supported by the sub-supporting component, and the adsorption bottom surface of the sub-adsorption module is parallel to and higher than the belt bottom surface of the sub-belt driving module, so that the silicon wafer is transmitted to the corresponding material box in a non-contact adsorption manner.
The invention also discloses blanking sorting equipment which comprises a slicing device arranged on the blanking rack, a plurality of layers of material boxes arranged at two discharging ends of the slicing device, a blanking middle shaft belt streamline, a tail material box and a roof rack; the blanking middle shaft belt streamline is installed on the blanking rack along a middle axis, and the top plate frame is arranged above the blanking middle shaft belt streamline; the slicing devices are arranged at intervals along the streamline of the blanking middle shaft belt, and the tops of the slicing devices are connected to the lower surface of the top plate frame; the left end and the right end of each slicing device are respectively provided with a multi-layer material box; the tail material box is arranged right opposite to the tail end of the feeding middle shaft belt streamline and is used for bearing miscellaneous silicon wafers or undetected silicon wafers; the slicing device adopts the non-contact adsorption type slicing device.
The invention also discloses an intelligent silicon wafer sorting system which comprises the feeding equipment, the detection equipment and the discharging sorting equipment; and a material type detection device and a fragment detection device are arranged between the feeding equipment and the detection equipment and are used for detecting the type of the silicon wafer and whether the silicon wafer is broken or not, and eliminating the broken silicon wafer to prevent the broken silicon wafer from flowing into the detection equipment.
Compared with the prior art, the invention has the beneficial effects that: according to the non-contact adsorption type slicing device, the blanking sorting equipment and the sorting system, the silicon wafer is adsorbed on an upper streamline through the non-contact type sucking disc, and is transmitted to other positions through the streamline; the streamline has adjustable length and can deal with silicon wafers with different specifications; the arrangement distance of the suckers is controllable, so that stable and reliable adsorption of the silicon wafer during transmission is ensured; compared with jacking material distribution, the method reduces the process flow, improves the operation efficiency and the productivity, and is convenient for popularization and application in the fields of silicon wafers and PCBs of sheet products.
Drawings
FIG. 1 is a schematic structural view of a non-contact adsorption type sheet separation device according to the present invention;
FIGS. 2-5 are schematic views of different angles of the adsorption sorting master module;
FIGS. 6-8 are schematic diagrams of the first adsorption leg module and/or the second adsorption leg module at different angles;
FIG. 9 is a schematic view of a feed sorting apparatus;
FIG. 10 is a schematic diagram of an intelligent wafer sorting system.
In the figure:
10000. unloading sorting facilities
1000. A slicing device;
100. a main adsorption and separation module;
101. a main left vertical connecting piece; 102. a main right vertical connecting piece; 103. a main left bottom plate; 104. a main right base plate; 105. a main left rotating shaft; 106. a main right rotating shaft; 107. a main drive stepping motor; 108. a synchronous belt; 109. a belt assembly; 1091. a belt input wheel; 1092. a conveyor belt; 1093. a rotating shaft transmission wheel; 1094. a tension pulley; 110. an idler connecting plate; 111. a suction cup; 112. a vacuum tube assembly; 113. an air cleaner; 114. a vacuum valve;
200. a first adsorption branch module;
201. dividing the vertical rods; 2021. a suction cup adjusting groove; 202. dividing a bottom plate; 203. a motor plate; 204. an electromagnetic valve plate; 205. an idler separating plate; 206. a branch side plate; 207. a branch rotating shaft; 208. a double-head separate-drive motor; 209. dividing the conveyor belt; 210. a sub-driving wheel; 211. dividing an idler wheel; 212. the rotating shaft is divided into driving wheels; 213. a branch sucker; 214. a vacuum tube subassembly; 215. an in-position sensor;
300. a second adsorption branch module;
400. a first connecting member;
500. a second connecting member;
600. a third connecting member;
2000. a plurality of layers of cartridges;
3000. blanking middle shaft belt streamline;
4000. a tailing box;
5000. a roof rack;
6000. a blanking frame;
7000. a blanking transition mechanism;
8000. an emergency stop mechanism;
9000. a buzzer;
20000. a detection device;
30000. feeding equipment;
40000. a material type detection device;
50000. piece removing devices.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. All other embodiments, which can be obtained by a person skilled in the art without any inventive step based on the embodiments of the present invention, are within the scope of the present invention.
It should be understood that "system", "device", "mechanism", "unit" and/or "module" as used in this specification is a method for distinguishing different components, elements, parts or assemblies at different levels. However, other words may be substituted by other expressions if they accomplish the same purpose.
Non-contact adsorption type slicing device
A non-contact adsorption type slicing device is disclosed, referring to fig. 1-8, a slicing device 1000 comprises an adsorption sorting main module 100, a first adsorption branch module 200, a second adsorption branch module 300, a first connecting piece 400, a second connecting piece 500, a third connecting piece 600 and a controller; the adsorption separation main module 100, the first adsorption branch module 200 and the second adsorption branch module 300 all comprise a belt driving module and an adsorption module.
Arrangement relation: the first adsorption branch line module 200 and the second adsorption branch line module 300 are suspended and arranged at two discharging ends of the adsorption separation main module 100 through the first connecting piece 400, the second connecting piece 500 and the third connecting piece 600; the first connecting member 400 and the second connecting member 500 are connected to the third connecting member 600 with adjustable relative distances, so that the streamline distance from the first absorption branch module 200 to the second absorption branch module 300 can be adjusted; the adsorption bottom surfaces of the adsorption modules arranged on the adsorption separation main module 100, the first adsorption branch module 200 and the second adsorption branch module 300 are flush, and the distance between the suckers is adjustable so as to adapt to silicon wafers of different specifications.
The adsorption bottom surfaces of the adsorption modules of the adsorption separation main module 100, the first adsorption branch module 200 and the second adsorption branch module 300 are higher than the bottom surface of the belt driving module (see the height difference h in fig. 5 and 8), and the adsorption separation main module 100 conveys the silicon wafer to the first adsorption branch module 200 or the second adsorption branch module 300 under the control of the controller, so that the silicon wafer is adsorbed and conveyed to the corresponding material level in a non-contact manner.
Wherein, adsorb main module group 100 of separation includes main supporting component, belt drive module and absorption module at least partial by main supporting component joint support, absorption module's absorption bottom surface is parallel and be higher than belt drive module's belt bottom surface sets up.
Further, the main support assembly includes a main left vertical connecting member 101, a main right vertical connecting member 102, a main left bottom plate 103, a main right bottom plate 104, a main left rotating shaft 105 and a main right rotating shaft 106.
Specifically, a main left bottom plate 103 is connected to the bottom of the main left vertical connecting piece 101, and a main left rotating shaft 105 is connected to the outer side surface of the main left vertical connecting piece 101; the main right bottom plate 104 is connected to the main right bottom plate 104, and the main right rotating shaft 106 is connected to the outer side surface of the main right bottom plate 104; installing the adsorption modules on the main left bottom plate 103 and the main right bottom plate 104; the main left rotating shaft 105 and the main right rotating shaft 106 are used for supporting and connecting the belt driving module.
Further, the belt driving module includes a main driving stepping motor 107, a timing belt 108, a plurality of sets of belt assemblies 109, and a plurality of idler connection plates 110 equal in number to the sets of belt assemblies 109.
Specifically, the main driving stepping motor 107 is connected to the main left rotating shaft 105 through a timing belt 108; a plurality of groups of parallel and spaced transmission belt assemblies 109 are arranged on the main left rotating shaft 105 and the main right rotating shaft 106 in an adjustable tension manner through idler connecting plates 110; the idler connection plate 110 provided with a height adjustment groove is connected to the main left vertical connecting piece 101 or the main right vertical connecting piece 102, and the tightness of the belt assembly 109 is adjusted through the height adjustment groove.
In one example, the belt drive module includes three sets of parallel, spaced-apart belt assemblies 109.
Further, each set of belt assemblies 109 of the belt driving module includes a belt input pulley 1091, a belt 1092, two shaft transmission pulleys 1093, and three tension pulleys 1094.
Specifically, the belt input pulley 1091 is disposed at an outward extending end of the main left rotating shaft 105, two rotating shaft transmission wheels 1093 are disposed at the same position of the main left rotating shaft 105 and the main right rotating shaft 106, and three tension pulleys 1094 are disposed on the idler connecting plate 110 in adjustable positions; under the control of the controller, the main driving stepping motor 107 drives the first adsorption branch line module 200 at the left end of the transmission belt assembly 109 clockwise to transmit the silicon wafer or drives the transmission belt assembly 109 to the second adsorption branch line module 300 at the right end counterclockwise to transmit the silicon wafer.
Further, the adsorption module includes a suction cup 111, a vacuum tube assembly 112, an air cleaner 113, a vacuum valve 114, and a vacuum source (not shown) in the form of a vacuum generator or the like.
Specifically, a plurality of suction cups 111 are installed to the bottom of the main left and right base plates 103 and 104, and a vacuum source supplies vacuum to the suction cups 111 through an air cleaner 113, a vacuum valve 114, and a vacuum pipe assembly 112. The air cleaner 113 and the vacuum valve 114 are connected to outer ends of the first and second connectors 400 and 500.
Illustratively, the vacuum valve 114 includes a speed valve for adjusting the negative pressure value and a solenoid valve for adjusting the opening and closing of the air path. The vacuum tube assembly 112 includes a tube connector and a vacuum tube (not shown). Drum-shaped wheels are preferably adopted as the rotating shaft driving wheel 1093 and the tension wheel 1094.
The transmission directions of the first adsorption branch line module 200 and the second adsorption branch line module 300 are opposite, and the first adsorption branch line module and the second adsorption branch line module both comprise a branch supporting component, a branch belt driving module and a branch adsorption module; divide belt drive module and divide the absorption module by branch support component connection supports, divide the absorption bottom surface of absorption module parallel and be higher than divide belt drive module's belt bottom surface setting to this with the adsorbed transmission of silicon chip non-contact to corresponding magazine.
Further, the branch supporting component comprises a branch vertical rod 201, a branch bottom plate 202 provided with a suction cup adjusting groove 2021, a motor plate 203, an electromagnetic valve plate 204, a branch idle wheel plate 205 and two branch rotating shafts 207 which are arranged between the outer ends of branch side plates 206 on two sides of the branch bottom plate 202 through bearings. Specifically, the bottom of the branch rod 201 is mounted to the upper surface of the branch base plate 202, and the top of the branch rod 201 is connected to the bottom surface of the first connecting member 400 or the second connecting member 500.
Furthermore, the branch belt drive module comprises a double-head branch drive motor 208, a branch conveyor belt 209, a branch drive wheel 210, a branch idle wheel 211 and a rotating shaft branch drive wheel 212, every two rotating shaft branch drive wheels 212 are installed on one branch rotating shaft 207, a plurality of branch idle wheels 211 are installed on a motor plate 203 and a branch idle wheel plate 205 which are oppositely arranged, every two branch drive wheels 210 are installed at two opposite ends of the double-head branch drive motor 208, and the tension degree of the branch conveyor belt 209 is installed on the branch drive wheel 210, the branch idle wheel 211 and the rotating shaft branch drive wheel 212 in an adjustable manner.
Further, the sub-adsorption module includes a plurality of branch suction cups 213, a vacuum pipe sub-assembly 214, and an air cleaner 113 and a vacuum valve 114 shared with the adsorption sorting main module 100; the branch suckers 213 are mounted on the sucker adjusting grooves 2021 of the sub-base plate 202, which facilitates the adjustment of the distance between the branch suckers 213, thereby realizing the length of the bottom suction sections of the sub-conveyor belts 209 of the first suction branch module 200 and the second suction branch module 300, and adapting to silicon wafers of different specifications.
Wherein the bottom surface of the branch suction cup 213 is disposed higher than the transfer bottom surface of the branch transfer belt 209.
Illustratively, the sub-idle wheel 211 and the rotating shaft sub-transmission wheel 212 adopt drum-shaped wheels.
Further, an in-place sensor 215 is arranged on the outer side of the branch side plate 206 and used for sensing whether the silicon wafer is in place or not in transmission, and transmitting an in-place signal to the controller so as to control the branch suction cup 213 to break vacuum, and the silicon wafer falls into a material box below.
Unloading sorting facilities
A blanking sorting device 10000, see figure 9, comprises a slicing device 1000 arranged on a blanking frame 6000, a multi-layer material box 2000 arranged at two discharging ends of the slicing device 1000, a blanking middle shaft belt streamline 3000, a tailing box 4000 and a roof rack 5000.
Arrangement relation: a blanking middle shaft belt streamline 3000 is arranged on the blanking rack 6000 along a middle axis, and the top plate frame 5000 is arranged above the blanking middle shaft belt streamline 3000; a plurality of slicing devices 1000 are arranged at intervals along the blanking central axis belt streamline 3000, and the tops of the slicing devices are connected to the lower surface of the top plate frame 5000; the left end and the right end of each slicing device 1000 are respectively provided with a multi-layer material box 2000; the tailing box 4000 is arranged right opposite to the tail end of the feeding middle shaft belt streamline 3000 and is used for bearing miscellaneous silicon wafers or undetected silicon wafers; the slicing device 1000 is the non-contact adsorption type slicing device.
Further, unloading sorting facilities 10000 still includes unloading transition mechanism 7000, scram mechanism 8000 and bee calling organ 9000, unloading transition mechanism 7000 sets up the front end at unloading axis belt streamline 3000 for silicon chip transition that detects the upper reaches flow guides to the unloading axis belt streamline 3000 of top surface parallel and level. It is a plurality of scram 8000 sets up around unloading frame 6000, the staff of being convenient for is convenient quick when meetting emergency presses down the shut down. The buzzer 9000 is installed at the periphery of the discharging frame 6000. Not shown, an alarm such as a three-color lamp may be provided at the feeder frame 6000.
Intelligent silicon wafer sorting system
An intelligent silicon wafer sorting system, referring to fig. 10, includes a feeding device 30000, a detecting device 20000 and a discharging sorting device 10000; a material type detection device 40000 and a fragment removing device 50000 are arranged between the feeding equipment 30000 and the detection equipment 20000 and used for detecting the type of the silicon wafer and whether the silicon wafer is broken or not, removing broken silicon wafers and preventing broken silicon wafers from flowing into the detection equipment 20000.
The blanking sorting equipment 10000 of the system adopts a non-contact adsorption type slicing device 1000, so that the sorting flow slice efficiency is improved; the detection equipment 20000 integrates multiple detections, including but not limited to measurement and detection of items such as thickness, TTV, line marks, resistivity, size, dirt, edge breakage, subfissure and the like, and can increase and decrease detection items in a modularized manner according to actual needs; the fragments are removed in advance through the fragment removing device 50000, so that the overall capacity of the system is improved.
Finally, it should be noted that: the above examples are only intended to illustrate the technical solution of the present invention, but not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.
Claims (5)
1. A non-contact adsorption type slicing device is characterized in that: the slicing device (1000) comprises an adsorption sorting main module (100), a first adsorption branch module (200), a second adsorption branch module (300), a first connecting piece (400), a second connecting piece (500), a third connecting piece (600) and a controller, wherein the adsorption sorting main module (100), the first adsorption branch module, the second adsorption branch module, the first connecting piece (400), the second connecting piece (500) and the third connecting piece are all integrated with an adsorption module and a belt driving module; the bottom surfaces of the three modules (100/200/300) are arranged in a flush manner, wherein the first adsorption branch line module (200) and the second adsorption branch line module (300) are arranged at two discharge ends of the adsorption sorting main module (100) in a hanging manner; the adsorption separation main module (100) is used for adsorbing and picking up silicon wafers conveyed by a feeding central shaft belt streamline below and conveying materials to a first adsorption branch module (200) or a second adsorption branch module (300) which is arranged at two sides of the feeding central shaft belt streamline direction in a bidirectional selectable mode according to a silicon wafer type analysis result;
the first adsorption branch line module (200) and the second adsorption branch line module (300) are suspended by the first connecting piece (400), the second connecting piece (500) and the third connecting piece (600) and are arranged at two discharge ends of the adsorption sorting main module (100); the first connecting piece (400) and the second connecting piece (500) are connected to the third connecting piece (600) in an adjustable relative distance mode, so that the streamline distance from the first adsorption branch line module (200) to the second adsorption branch line module (300) is adjustable; the adsorption bottom surfaces of the adsorption modules arranged on the adsorption sorting main module (100), the first adsorption branch module (200) and the second adsorption branch module (300) are flush, and the distance between suckers is adjustable so as to adapt to silicon wafers of different specifications;
the adsorption bottom surfaces of the adsorption modules of the adsorption separation main module (100), the first adsorption branch line module (200) and the second adsorption branch line module (300) are higher than the bottom surface of the belt driving module, and the adsorption separation main module (100) conveys the silicon wafers to the first adsorption branch line module (200) or the second adsorption branch line module (300) under the control of the controller, so that the silicon wafers are adsorbed and transmitted to corresponding material positions in a non-contact manner;
the adsorption separation main module (100) comprises a main supporting component, a belt driving module and an adsorption module, wherein at least part of the belt driving module and the adsorption module are connected and supported by the main supporting component, and the adsorption bottom surface of the adsorption module is parallel to and higher than the belt bottom surface of the belt driving module;
the main supporting component comprises a main left vertical connecting piece (101), a main right vertical connecting piece (102), a main left bottom plate (103), a main right bottom plate (104), a main left rotating shaft (105) and a main right rotating shaft (106); the main left bottom plate (103) is connected to the bottom of the main left vertical connecting piece (101), and the main left rotating shaft (105) is connected to the outer side surface of the main left vertical connecting piece (101); the main right bottom plate (104) is connected to the main right bottom plate (104), and the main right rotating shaft (106) is connected to the outer side face of the main right bottom plate (104); installing the adsorption modules on the main left bottom plate (103) and the main right bottom plate (104); the main left rotating shaft (105) and the main right rotating shaft (106) are used for supporting and connecting the belt driving module;
the adsorption module comprises suckers (111), vacuum tube assemblies (112), an air filter (113), vacuum valves (114) and a vacuum source, wherein the suckers (111) are installed at the bottoms of the main left bottom plate (103) and the main right bottom plate (104), and the vacuum source provides vacuum for the suckers (111) through the air filter (113), the vacuum valves (114) and the vacuum tube assemblies (112);
the transmission directions of the first adsorption branch line module (200) and the second adsorption branch line module (300) are opposite, and the first adsorption branch line module and the second adsorption branch line module both comprise a branch supporting component, a branch belt driving module and a branch adsorption module; the sub-belt driving module and the sub-adsorption module are connected and supported by the sub-support assembly, and the adsorption bottom surface of the sub-adsorption module is parallel to and higher than the belt bottom surface of the sub-belt driving module, so that the silicon wafers are transferred to the corresponding material boxes in a non-contact adsorption manner;
the branch supporting component comprises a branch vertical rod (201), a branch bottom plate (202) provided with a sucker adjusting groove (2021), a motor plate (203), an electromagnetic valve plate (204), a branch idler wheel plate (205) and two branch rotating shafts (207) which are arranged between the outer ends of branch side plates (206) on two sides of the branch bottom plate (202) through bearings, the bottom of the branch vertical rod (201) is arranged on the upper surface of the branch bottom plate (202), and the top of the branch vertical rod (201) is connected with the bottom surface of the first connecting piece (400) or the second connecting piece (500); the belt dividing driving module comprises double-head divided driving motors (208), divided transmission belts (209), divided driving wheels (210), divided idle wheels (211) and rotating shaft divided transmission wheels (212), every two rotating shaft divided transmission wheels (212) are installed on one divided rotating shaft (207), a plurality of divided idle wheels (211) are installed on a motor plate (203) and a divided idle wheel plate (205) which are oppositely arranged, every two divided driving wheels (210) are oppositely installed at two ends of the double-head divided driving motors (208), and the divided transmission belts (209) are installed on the divided driving wheels (210), the divided idle wheels (211) and the rotating shaft divided transmission wheels (212) in a tensioning degree adjustable manner; the sub-adsorption module comprises a plurality of branch suckers (213), a vacuum pipe subassembly (214), an air filter (113) shared by the adsorption and separation main module (100) and a vacuum valve (114); the branch suckers (213) are arranged on the sucker adjusting grooves (2021) of the branch bottom plate (202), so that the distance between the branch suckers (213) can be adjusted conveniently, and the lengths of the bottom surface adsorption sections of the branch conveyor belts (209) of the first adsorption branch line module (200) and the second adsorption branch line module (300) can be adjusted to adapt to silicon wafers of different specifications.
2. The non-contact adsorption type slicing device according to claim 1, wherein: the belt driving module comprises a main driving stepping motor (107), a synchronous belt (108), a plurality of groups of transmission belt assemblies (109) and a plurality of idler connecting plates (110) with the number equal to that of the groups of the transmission belt assemblies (109); wherein the main driving stepping motor (107) is connected with the main left rotating shaft (105) through a synchronous belt (108); a plurality of groups of parallel and spaced transmission belt assemblies (109) are arranged on the main left rotating shaft (105) and the main right rotating shaft (106) in a tension-adjustable manner through idler wheel connecting plates (110); the idler wheel connecting plate (110) provided with a height adjusting groove is connected to the main left vertical connecting piece (101) or the main right vertical connecting piece (102), and the tension degree of the transmission belt assembly (109) is adjusted through the height adjusting groove.
3. The non-contact adsorption type slicing device according to claim 2, wherein: each group of the transmission belt components (109) of the belt driving module comprises a belt input wheel (1091), a transmission belt (1092), two rotating shaft transmission wheels (1093) and three tension wheels (1094); the belt input wheel (1091) is arranged at the extension end part of the main left rotating shaft (105), the two rotating shaft transmission wheels (1093) are arranged at the same position of the main left rotating shaft (105) and the main right rotating shaft (106), and the three tension wheels (1094) are arranged on the idler connecting plate (110) in an adjustable position; under the control of the controller, a main driving stepping motor (107) drives the transmission belt assembly (109) to transmit the silicon wafer to a first adsorption branch line module (200) at the left end clockwise or transmit the silicon wafer to a second adsorption branch line module (300) at the right end anticlockwise.
4. The utility model provides a unloading sorting facilities which characterized in that: the blanking sorting equipment (10000) comprises a slicing device (1000) arranged on a blanking rack (6000), a multi-layer material box (2000) arranged at two discharging ends of the slicing device (1000), a blanking middle shaft belt streamline (3000), a tailing box (4000) and a roof rack (5000); the blanking middle shaft belt streamline (3000) is installed on the blanking rack (6000) along the central axis, and the top plate frame (5000) is arranged above the blanking middle shaft belt streamline (3000); a plurality of slicing devices (1000) are arranged at intervals along the blanking central axial belt streamline (3000), and the tops of the slicing devices are connected to the lower surface of the top plate frame (5000); the left end and the right end of each slicing device (1000) are respectively provided with a multi-layer material box (2000); the tail material box (4000) is arranged right opposite to the tail end of the feeding middle shaft belt streamline (3000) and is used for bearing miscellaneous silicon wafers or undetected silicon wafers; wherein the sheet separating device (1000) adopts the non-contact adsorption type sheet separating device of any one of claims 1 to 3.
5. The utility model provides an intelligence silicon chip sorting system which characterized in that: the sorting system comprises a feeding device (30000), a detecting device (20000) and a discharging sorting device (10000) according to claim 4; and a material type detection device (40000) and a fragment removing device (50000) are arranged between the feeding equipment (30000) and the detection equipment (20000) and are used for detecting the type of the silicon wafer and whether the silicon wafer is broken or not, removing the broken silicon wafer and preventing the broken silicon wafer from flowing into the detection equipment (20000).
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210496630.7A CN114871153B (en) | 2022-05-09 | 2022-05-09 | Non-contact adsorption type slicing device, blanking sorting equipment and sorting system |
| PCT/CN2023/083870 WO2023216738A1 (en) | 2022-05-09 | 2023-03-24 | Non-contact suction-type wafer sorting apparatus, unloading sorting device, and sorting system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210496630.7A CN114871153B (en) | 2022-05-09 | 2022-05-09 | Non-contact adsorption type slicing device, blanking sorting equipment and sorting system |
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| Publication Number | Publication Date |
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| CN114871153A CN114871153A (en) | 2022-08-09 |
| CN114871153B true CN114871153B (en) | 2023-03-24 |
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| CN202210496630.7A Active CN114871153B (en) | 2022-05-09 | 2022-05-09 | Non-contact adsorption type slicing device, blanking sorting equipment and sorting system |
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| Country | Link |
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| CN (1) | CN114871153B (en) |
| WO (1) | WO2023216738A1 (en) |
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| CN114871153B (en) * | 2022-05-09 | 2023-03-24 | 苏州天准科技股份有限公司 | Non-contact adsorption type slicing device, blanking sorting equipment and sorting system |
| CN115318658B (en) * | 2022-10-11 | 2023-02-03 | 江苏格林保尔光伏有限公司 | Solar photovoltaic detection board separating device |
| CN116274007A (en) * | 2023-04-27 | 2023-06-23 | 苏州天准科技股份有限公司 | Double-magazine receiving device and discharging and sorting equipment |
| CN116371751A (en) * | 2023-04-27 | 2023-07-04 | 苏州天准科技股份有限公司 | Energy level expansion blanking separation equipment and method |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH085521B2 (en) * | 1990-09-13 | 1996-01-24 | 不二越機械工業株式会社 | Wafer thickness classification device |
| JP2806800B2 (en) * | 1994-06-01 | 1998-09-30 | 本田技研工業株式会社 | Sheet pasting apparatus and sheet pasting method |
| US7764366B2 (en) * | 2006-07-11 | 2010-07-27 | Besi North America, Inc. | Robotic die sorter with optical inspection system |
| CN102730400B (en) * | 2012-06-18 | 2015-04-22 | 中国电子科技集团公司第四十八研究所 | Battery piece conveying, loading and unloading system of laser edge etcher |
| CN208177899U (en) * | 2018-01-04 | 2018-12-04 | 江西宝群电子科技有限公司 | A kind of silicon chip inserting machine silicon wafer defective products detection device |
| DE102018112706B4 (en) * | 2018-05-28 | 2021-03-04 | Hennecke Systems Gmbh | Wafer line and method for conveying wafers |
| CN212310119U (en) * | 2020-04-03 | 2021-01-08 | 无锡森顿智能科技有限公司 | Silicon wafer detection sorting machine |
| CN111482374B (en) * | 2020-04-03 | 2023-12-29 | 无锡森顿智能科技有限公司 | Silicon wafer detection and sorting machine and sorting method thereof |
| CN111468425A (en) * | 2020-05-12 | 2020-07-31 | 无锡尚品高自动化设备有限公司 | Silicon wafer crystal flower sorting machine |
| CN212085034U (en) * | 2020-06-10 | 2020-12-04 | 无锡奥特维科技股份有限公司 | Silicon wafer collecting box and silicon wafer grading collecting device |
| CN215430337U (en) * | 2021-01-11 | 2022-01-07 | 无锡奥特维科技股份有限公司 | Rectangular silicon wafer discharging device and sorting machine |
| CN114871153B (en) * | 2022-05-09 | 2023-03-24 | 苏州天准科技股份有限公司 | Non-contact adsorption type slicing device, blanking sorting equipment and sorting system |
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| WO2023216738A1 (en) | 2023-11-16 |
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