CN114865431A - Temperature control system for internal devices of dry ice air-cooled laser - Google Patents
Temperature control system for internal devices of dry ice air-cooled laser Download PDFInfo
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- CN114865431A CN114865431A CN202210352553.8A CN202210352553A CN114865431A CN 114865431 A CN114865431 A CN 114865431A CN 202210352553 A CN202210352553 A CN 202210352553A CN 114865431 A CN114865431 A CN 114865431A
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- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 title claims abstract description 47
- 235000011089 carbon dioxide Nutrition 0.000 title claims abstract description 47
- 239000013078 crystal Substances 0.000 claims abstract description 99
- 238000001816 cooling Methods 0.000 claims abstract description 24
- 239000004065 semiconductor Substances 0.000 claims abstract description 11
- 238000009413 insulation Methods 0.000 claims abstract description 8
- 238000005057 refrigeration Methods 0.000 claims abstract description 8
- 230000017525 heat dissipation Effects 0.000 claims description 14
- 239000004519 grease Substances 0.000 claims description 5
- 229910052738 indium Inorganic materials 0.000 claims description 5
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims description 5
- 229910052751 metal Inorganic materials 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 5
- 229920001296 polysiloxane Polymers 0.000 claims description 5
- 239000010425 asbestos Substances 0.000 claims description 2
- 238000005086 pumping Methods 0.000 claims description 2
- 229910052895 riebeckite Inorganic materials 0.000 claims description 2
- 230000005855 radiation Effects 0.000 claims 2
- 229910001369 Brass Inorganic materials 0.000 claims 1
- -1 aluminum-acetone Chemical compound 0.000 claims 1
- 230000033228 biological regulation Effects 0.000 claims 1
- 239000010951 brass Substances 0.000 claims 1
- 230000020169 heat generation Effects 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
- 230000000694 effects Effects 0.000 abstract description 5
- 230000005540 biological transmission Effects 0.000 abstract description 3
- 238000010521 absorption reaction Methods 0.000 description 8
- 238000000034 method Methods 0.000 description 4
- 230000001276 controlling effect Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- 238000000859 sublimation Methods 0.000 description 3
- 230000008022 sublimation Effects 0.000 description 3
- 238000009423 ventilation Methods 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000001105 regulatory effect Effects 0.000 description 2
- 230000007704 transition Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/02—Constructional details
- H01S3/04—Arrangements for thermal management
- H01S3/0405—Conductive cooling, e.g. by heat sinks or thermo-electric elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/02—Constructional details
- H01S3/04—Arrangements for thermal management
- H01S3/0404—Air- or gas cooling, e.g. by dry nitrogen
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/02—Constructional details
- H01S3/04—Arrangements for thermal management
- H01S3/0407—Liquid cooling, e.g. by water
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/02—Constructional details
- H01S3/04—Arrangements for thermal management
- H01S3/042—Arrangements for thermal management for solid state lasers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/14—Thermal energy storage
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- Electromagnetism (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Optics & Photonics (AREA)
- Lasers (AREA)
Abstract
The invention discloses a temperature control system for an internal device of a dry ice air-cooled laser, which is used for respectively controlling the temperature of different crystals in the laser based on dry ice phase change and comprises an LD laser diode, an air-cooled component, a first crystal, a second crystal, a heat sink, a semiconductor refrigeration piece, a heat pipe, a dry ice storage cavity, a vent, a heat insulation layer, a temperature sensor, an electric valve and a microprocessor; the first crystal is a laser working crystal, the second crystal is other crystals in the laser, the side surface of each crystal is wrapped with a heat sink, the heat sinks of the two crystals are isolated by a heat insulation layer, a temperature sensor senses the surface temperature of the heat sink and converts the surface temperature into an electric signal to be sent to a microprocessor, the microprocessor controls an electric valve, and the electric valve controls the air volume of an air cooling system, so that the heat exchange effect is controlled, the system is maintained in a reasonable temperature range, the matching degree of the two crystals is improved, and the beam quality of the laser and the transmission efficiency of the laser are further improved.
Description
Technical Field
The invention relates to a laser technology, belongs to the field of heat dissipation technology and temperature control of lasers, and particularly relates to a solid laser dry ice air cooling temperature control system.
Background
Laser instrument is at the working process, and the crystal absorbs the energy of pump beam and generates heat easily, and a large amount of heat can lead to crystal internal energy to distribute unevenly, and then influences the output performance of laser instrument, for satisfying output light requirement, the laser instrument is inside often chooses for use two or two different crystals more than to cooperate the laser output who realizes satisfying the demand. Therefore, efficient temperature control techniques are an important support for advancing the development of lasers.
At present, the adopted laser temperature control system mainly comprises two main methods of water cooling and air cooling. The air cooling method is a common heat dissipation method for the laser. The heat generated by the heating crystal is transferred to the heat sink, and the heat is conducted away by utilizing forced convection. Although the heat transfer coefficient of forced convection is improved to a certain extent compared with that of natural convection, the limited heat transfer coefficient is still an important reason for restricting the development of air cooling heat dissipation.
The temperature control devices of the solid laser have many types, but most of the temperature control devices only aim at the laser crystal or control the temperature of the resonant cavity, and do not consider the temperature matching problem caused by the inconsistency of a series of thermal effects and heat conduction rates of the working crystal and other crystals, so that the plurality of crystals in the resonant cavity of the laser generate the working mismatching problem, the output power and the beam quality of the laser are reduced, and therefore, a temperature control system capable of respectively controlling the temperature of the laser crystal and other crystals in the laser is urgently needed to be provided.
Disclosure of Invention
Aiming at the problems in the temperature control technology of the existing laser, the invention aims to provide a temperature control system for an internal device of a dry ice air-cooled laser, which combines forced convection with phase change and heat absorption of the dry ice, respectively controls the temperature of a plurality of crystals in the laser, and respectively controls the temperature of different crystals accurately by combining a semiconductor refrigeration piece, thereby effectively solving the problems in the prior art.
In order to achieve the purpose, the temperature control system for the internal device of the dry ice air-cooled laser comprises an LD laser diode, an air-cooled component, a crystal 1, a crystal 2, a heat sink, a heat pipe, a semiconductor refrigeration piece, a dry ice storage cavity, a heat insulation layer, a ventilation opening, a temperature sensor, an electric valve and a microprocessor, wherein the first crystal is a working crystal of the laser, the second crystal is other crystals in the laser, the side surfaces of the two crystals are respectively wrapped with the heat sink, dry ice is placed in the dry ice storage cavity, the dry ice storage cavity is matched with the air-cooled component, and airflow generated by the air-cooled component flows through the dry ice storage cavity to dissipate heat.
The heat dissipation system also comprises a control assembly, wherein the control assembly comprises a microprocessor, a temperature sensor and an electric valve, and the electric valve is arranged between the dry ice storage cavity and the air cooling assembly and can control the air cooling assembly to generate air flow to enter the dry ice storage cavity; the temperature sensor is arranged on the heat sink surface of the laser, and the microprocessor is in data connection with the temperature sensor and adjusts and controls the electric valve.
Further, the air-cooling assembly includes a fan.
The heat dissipation scheme provided by the invention is additionally provided with a temperature control scheme, the temperature of the laser heat sink is monitored through a temperature sensor, the temperature is further converted into an electric signal and fed back to the microprocessor, the microprocessor controls the electric valve to adjust the air speed and the flow, the heat dissipation of the fan is organically combined with the phase change heat absorption of the dry ice, and the temperature of an air medium in the cavity is reduced based on the phase change heat absorption principle, so that the effect of enhancing heat transfer is achieved.
And an LD laser diode is used for end pumping on the light-transmitting end face of one side of the first crystal so as to ensure that enough output power is realized.
The surface of the heat sink is welded on the surface of the first crystal and the surface of the second crystal by indium metal respectively.
The refrigerating surface of the semiconductor refrigerating sheet is connected with the heat sink by heat-conducting silicone grease.
Therefore, the heat generated by the first crystal and the second crystal is transferred from the metal indium to the top surface of the heat sink and then to the bottom surface of the heat sink, then the electric valve of the air cooling system is controlled by the microprocessor, the temperatures of the two crystals are respectively regulated through the phase change of the dry ice, and then the two crystals are transferred to the working environment through the cooling fan.
The first crystal is a gain medium of the solid laser, the second crystal is other crystals in the laser, most of the traditional lasers carry out temperature control on the laser crystal and other crystals at the same time, but the heat effect and the heat conduction speed of different crystals are different. Therefore, the temperature of the laser crystal and other crystals is controlled separately by dry ice phase change, the heat sinks of the crystals are separated by the heat insulating layer, the heat sinks of the crystals are not influenced, the matching degree of the laser working crystal and other crystals is improved, and the conversion efficiency and the beam quality of laser are improved.
Compared with the prior art, the invention has the following beneficial effects.
1. Compared with the temperature control of a single laser resonant cavity, the laser resonant cavity temperature control device has the advantages that the laser crystal and other crystals are respectively subjected to temperature control by utilizing the separated dry ice storage cavity, so that different crystals can be kept at the optimal working temperature during working, the loss caused by temperature mismatching is reduced, and the transmission efficiency of laser in the resonant cavity and the beam quality of laser are improved.
2. Compare in traditional water-cooling heat dissipation, this scheme adopts the mode that dry ice phase transition and air-cooling combined together, carries out independent temperature control to heat sink and crystal through control assembly, derives the heat that the laser instrument produced through radiator fan, has greatly improved the matching nature of two crystals.
Drawings
Fig. 1 is a structural diagram of the present invention for controlling the temperature of crystal 1 and crystal 2 by dry ice phase transition.
Fig. 2 is a schematic diagram of the temperature conduction control of the present invention.
In the figure: 1. air cooling components a, 2, electric valves a, 3, dry ice storage cavities a, 4, a heat dissipation device 5, heat pipes a, 6, temperature sensors a, 7, semiconductor refrigeration pieces a, 8, heat conduction silicone grease 9, heat sinks a, 10, crystals a, 11, metal indium, 12, semiconductor refrigeration pieces b, 13, temperature sensors b, 14, heat pipes b, 15, dry ice storage cavities b, 16, electric valves b, 17, air cooling components b, 18, the air cooling assembly c, 19, the electric valve c, 20, the dry ice storage cavity c, 21, the heat pipe c, 22, the temperature sensor c, 23, the semiconductor refrigeration piece c, 24, the heat sink b, 25, the crystal b, 26, the semiconductor refrigeration piece d, 27, the temperature sensor d, 28, the heat pipe d, 29, the dry ice storage cavity d, 30, the electric valve d, 31, the air cooling assembly d, 32, the heat insulation layer 33, the ventilation opening a, 34 and the ventilation opening b.
Detailed Description
In order to make the technical means for realizing the invention easy to understand, the invention is further explained below with the accompanying drawings.
According to the scheme, the dry ice phase change heat absorption and the air cooling system are organically combined, so that the space structure of the laser heat dissipation system is optimized, and heat sink of the laser can be directly dissipated by utilizing dry ice sublimation heat absorption. And the heat sink of the laser is cooled by utilizing the sublimation and heat absorption of the dry ice and the convection of the fan. The external circuit is used for controlling the temperature of the semiconductor refrigerating sheet, and further, the temperature of different crystals is accurately controlled.
As shown in fig. 1 and 2, the present invention provides a temperature control system for performing dry ice phase change heat dissipation and temperature control on a laser crystal and other crystals inside a laser, respectively, including: crystal a, crystal b, heat sink, dry ice storage cavity, air cooling component, cooling fan, control component. In order to ensure the temperature matching between the crystal a and the crystal b, the temperature needs to be controlled from multiple aspects and by multiple means, and the specific implementation mode is as follows:
the crystal a10 of the invention is Nd: YVO 4 The crystal is used as a laser working substance, the optimal working temperature is 30.0-36.0 ℃, the crystal b25 is a KTP crystal and is used for generating frequency doubling laser, and the optimal working temperature is 21.0-22.9 ℃.
YVO is the Nd 4 The side surfaces of the crystal 10 and the KTP crystal 25 are welded with high-thermal-conductivity heat sinks by using metal indium, the temperature between the two heat sinks is isolated by using an asbestos heat-insulating film 23, and the thickness of the heat-insulating layer is 2-3 mm.
Thermal contact resistance is reduced between the heat sinks 9 and 24 and the temperature sensors 6, 13, 22 and 27 in a mode of coating heat-conducting silicone grease, and the thickness of the heat-conducting silicone grease coating is 0.1-0.3 mm.
According to the invention, the temperature sensors 6, 13, 22 and 27 are used for respectively monitoring the temperatures of the laser heat sinks 9 and 24, the laser heat sinks are further converted into electric signals to be fed back to respective microprocessors, the microprocessors respectively control respective electric valves, the air speed flow is regulated, the heat dissipation of the fan is combined with the phase change and heat absorption of the dry ice, and the temperature of an air medium in the cavity is reduced.
Different from the prior art, in the embodiment, the temperature sensors 6, 13, 22 and 27 measure the temperatures of the heat sinks 9 and 24, and feed the measured temperatures back to the microprocessor to adjust the respective electric valves, so that the Nd: YVO 4 The temperature of the crystal is controlled to be 30.0-36.0 ℃, and the temperature of the KTP crystal is controlled to be 21.0-22.9 ℃.
As shown in fig. 2, temperature sensors 1, 2 measure the temperature of heat sink 1, 2 respectively, and feed back microcontroller 1, 2 with the form of the signal of telecommunication respectively, microcontroller 1, 2 adjust motorised valve 1, 2 respectively, and then control air-cooled subassembly 1, 2, carry out sublimation heat absorption cooling to dry ice 1, 2 through the control to the wind speed, derive the heat through radiator fan at last, can separately control crystal 1 and crystal 2 from this, thereby improved the transmission efficiency of laser in the resonant cavity and output laser beam quality.
The invention is also suitable for temperature control of a laser comprising a plurality of crystals, and each crystal is controlled at the optimal working temperature so as to ensure that the effect of the laser is optimal.
The output power of the frequency-doubled solid-state laser is 198mW, and the size of the whole frequency-doubled solid-state laser is 50mm 80mm 160 mm.
Claims (6)
1. The utility model provides a dry ice air-cooled laser inside device temperature control system which characterized in that: the device comprises an LD laser diode, an air cooling component, a first crystal, a second crystal, a heat sink, a semiconductor refrigeration sheet, a heat pipe, a dry ice storage cavity, a vent, a heat insulation layer, a heat radiation fan, a temperature sensor, an electric valve and a microprocessor; the Laser Diode (LD) laser diode is a pumping source of the laser, the air cooling component is a wind power source of dry ice phase change in the laser, the first crystal is a laser crystal of the laser, the second crystal is other crystals in the laser, heat sinks are wrapped on the side surfaces of the first crystal and the second crystal, dry ice is stored in the dry ice storage cavity, the heat pipe transfers heat in the cavity, the temperature sensor senses the surface temperature of the heat sink, the heat sink is converted into an electric signal and then the electric signal is sent to the microprocessor, the microprocessor controls the electric valve, and the electric valve controls the air volume of the air cooling system; the external circuit controls the semiconductor refrigerating sheet to accurately control the temperature of the heat sink. The heat dissipation fan is used for guiding out the heat generated in the cavity;
one end face of the first crystal is pumped by using a laser diode, and the other end face of the first crystal is used for carrying out frequency doubling, frequency selection or Q regulation on the laser output by using a second crystal; the heat sinks are respectively wrapped on the side surfaces of the first crystal and the second crystal, the temperature is separated by the heat insulation layer between the two heat sinks, and the heat sinks between the heat sinks and the crystals are welded with the two crystals by using metal indium;
the heat pipe is an aluminum-acetone heat pipe;
the heat insulation layer is an asbestos heat insulation film;
the refrigerating surface of the refrigerating piece exchanges temperature with the heat sink through the heat-conducting silicone grease, and the cavity where the heat-radiating surface is located is connected with the dry ice storage cavity through the heat pipe.
The heat sink leads heat out of the laser through the heat dissipation fan.
2. A dry ice air-cooled laser internal device temperature control system as claimed in claim 1, wherein the heat dissipation system further comprises a control component, the control component comprises a microprocessor, a temperature sensor and an electric valve, the electric valve is arranged between the dry ice storage cavity and the air-cooled component, and can control the air-cooled component to generate an air flow to enter the dry ice storage cavity; the temperature sensor is arranged on the laser heat sink, and the microprocessor is in data connection with the temperature sensor and adjusts and controls the electric valve.
3. A dry ice air-cooled laser internal device temperature control system as claimed in claim 1, wherein: the heat generation quantity and the heat conduction speed of each crystal are different when the crystal works, and the two crystals are respectively controlled to be in a temperature working state, so that the matching degree between the two crystals is improved; the heat generated by the crystal is conducted out by the heat radiation fan.
4. A dry ice air-cooled laser internal device temperature control system as claimed in claim 1, wherein: the heat sink is a high heat conduction type heat sink with a heat conduction coefficient larger than that of the crystal, and the material is brass.
5. A dry ice air-cooled laser internal device temperature control system as claimed in claim 1, wherein: the LD laser diode, the first crystal, the second crystal, the heat sink and the dry ice storage cavity are tightly packaged together.
6. A dry ice air-cooled laser internal device temperature control system as claimed in claim 1 wherein the air-cooled assembly includes a fan.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210352553.8A CN114865431B (en) | 2022-04-05 | 2022-04-05 | Temperature control system for internal device of dry ice air-cooled laser |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210352553.8A CN114865431B (en) | 2022-04-05 | 2022-04-05 | Temperature control system for internal device of dry ice air-cooled laser |
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| CN114865431A true CN114865431A (en) | 2022-08-05 |
| CN114865431B CN114865431B (en) | 2024-07-02 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN118137268A (en) * | 2024-02-23 | 2024-06-04 | 安徽华创鸿度光电科技有限公司 | High-stability heat sink device for slab solid laser crystal |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3970960A (en) * | 1974-01-31 | 1976-07-20 | Bell Telephone Laboratories, Incorporated | Broadly tunable continuous-wave laser using color centers |
| US20110134947A1 (en) * | 2008-08-11 | 2011-06-09 | X.D.M. Ltd. | Laser assembly and method and system for its operation |
| CN104124605A (en) * | 2014-07-02 | 2014-10-29 | 中国电子科技集团公司第十一研究所 | Cooling device of high-power solid laser |
| CN108233156A (en) * | 2018-02-10 | 2018-06-29 | 北京工业大学 | A kind of cooling system based on slab laser |
| CN111478159A (en) * | 2020-04-12 | 2020-07-31 | 北京工业大学 | Temperature control system for internal device of solid laser |
| CN112886369A (en) * | 2021-03-01 | 2021-06-01 | 应急管理部上海消防研究所 | Compact dry ice air-cooled laser heat dissipation system and method |
-
2022
- 2022-04-05 CN CN202210352553.8A patent/CN114865431B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3970960A (en) * | 1974-01-31 | 1976-07-20 | Bell Telephone Laboratories, Incorporated | Broadly tunable continuous-wave laser using color centers |
| US20110134947A1 (en) * | 2008-08-11 | 2011-06-09 | X.D.M. Ltd. | Laser assembly and method and system for its operation |
| CN104124605A (en) * | 2014-07-02 | 2014-10-29 | 中国电子科技集团公司第十一研究所 | Cooling device of high-power solid laser |
| CN108233156A (en) * | 2018-02-10 | 2018-06-29 | 北京工业大学 | A kind of cooling system based on slab laser |
| CN111478159A (en) * | 2020-04-12 | 2020-07-31 | 北京工业大学 | Temperature control system for internal device of solid laser |
| CN112886369A (en) * | 2021-03-01 | 2021-06-01 | 应急管理部上海消防研究所 | Compact dry ice air-cooled laser heat dissipation system and method |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN118137268A (en) * | 2024-02-23 | 2024-06-04 | 安徽华创鸿度光电科技有限公司 | High-stability heat sink device for slab solid laser crystal |
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| CN114865431B (en) | 2024-07-02 |
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